TW200735232A - Integrated module of ejector pin for chip detachment - Google Patents

Integrated module of ejector pin for chip detachment

Info

Publication number
TW200735232A
TW200735232A TW095107233A TW95107233A TW200735232A TW 200735232 A TW200735232 A TW 200735232A TW 095107233 A TW095107233 A TW 095107233A TW 95107233 A TW95107233 A TW 95107233A TW 200735232 A TW200735232 A TW 200735232A
Authority
TW
Taiwan
Prior art keywords
ejector pin
integrated module
chip
chip detachment
base
Prior art date
Application number
TW095107233A
Other languages
Chinese (zh)
Other versions
TWI295825B (en
Inventor
Diann-Fang Lin
Original Assignee
King Yuan Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by King Yuan Electronics Co Ltd filed Critical King Yuan Electronics Co Ltd
Priority to TW95107233A priority Critical patent/TWI295825B/en
Priority to JP2006244316A priority patent/JP2007243137A/en
Publication of TW200735232A publication Critical patent/TW200735232A/en
Application granted granted Critical
Publication of TWI295825B publication Critical patent/TWI295825B/en

Links

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

This invention discloses an integrated module of ejector pin for chip detachment. The integrated module includes several ejector pins, a base, and a pedestal. The base is formed on the pedestal, the ejector pins are formed on the base, and an edge is formed on the top of each ejector pin. The edges will form a horizontal contact plane to contact the chip while the module is rising to lift the chip.
TW95107233A 2006-03-03 2006-03-03 Integrated module of ejector pin for chip detachment TWI295825B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW95107233A TWI295825B (en) 2006-03-03 2006-03-03 Integrated module of ejector pin for chip detachment
JP2006244316A JP2007243137A (en) 2006-03-03 2006-09-08 Ejector pin module for chip take-out assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95107233A TWI295825B (en) 2006-03-03 2006-03-03 Integrated module of ejector pin for chip detachment

Publications (2)

Publication Number Publication Date
TW200735232A true TW200735232A (en) 2007-09-16
TWI295825B TWI295825B (en) 2008-04-11

Family

ID=38588330

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95107233A TWI295825B (en) 2006-03-03 2006-03-03 Integrated module of ejector pin for chip detachment

Country Status (2)

Country Link
JP (1) JP2007243137A (en)
TW (1) TWI295825B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI500098B (en) * 2011-03-18 2015-09-11 Gallant Micro Machining Co Ltd Sticky crystal machine
TWI717775B (en) * 2019-06-26 2021-02-01 日月光半導體製造股份有限公司 Needle device for die

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI427713B (en) * 2008-10-23 2014-02-21 Gallant Prec Machining Co Ltd Seperation method for a chip from tape film and a chip pickup method
TWI483332B (en) * 2011-07-29 2015-05-01 Inotera Memories Inc Wafer chuck unit, lift pin holder for wafer chuck unit, and wafer processing system
TWI685046B (en) * 2017-03-24 2020-02-11 日商新川股份有限公司 Picking device and picking method
CN113148611B (en) * 2021-03-27 2023-04-28 深圳市智立方自动化设备股份有限公司 Efficient double-station full-automatic chip arrangement system

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI500098B (en) * 2011-03-18 2015-09-11 Gallant Micro Machining Co Ltd Sticky crystal machine
TWI717775B (en) * 2019-06-26 2021-02-01 日月光半導體製造股份有限公司 Needle device for die

Also Published As

Publication number Publication date
JP2007243137A (en) 2007-09-20
TWI295825B (en) 2008-04-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees