TW200735232A - Integrated module of ejector pin for chip detachment - Google Patents
Integrated module of ejector pin for chip detachmentInfo
- Publication number
- TW200735232A TW200735232A TW095107233A TW95107233A TW200735232A TW 200735232 A TW200735232 A TW 200735232A TW 095107233 A TW095107233 A TW 095107233A TW 95107233 A TW95107233 A TW 95107233A TW 200735232 A TW200735232 A TW 200735232A
- Authority
- TW
- Taiwan
- Prior art keywords
- ejector pin
- integrated module
- chip
- chip detachment
- base
- Prior art date
Links
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Die Bonding (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
This invention discloses an integrated module of ejector pin for chip detachment. The integrated module includes several ejector pins, a base, and a pedestal. The base is formed on the pedestal, the ejector pins are formed on the base, and an edge is formed on the top of each ejector pin. The edges will form a horizontal contact plane to contact the chip while the module is rising to lift the chip.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW95107233A TWI295825B (en) | 2006-03-03 | 2006-03-03 | Integrated module of ejector pin for chip detachment |
JP2006244316A JP2007243137A (en) | 2006-03-03 | 2006-09-08 | Ejector pin module for chip take-out assembly |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW95107233A TWI295825B (en) | 2006-03-03 | 2006-03-03 | Integrated module of ejector pin for chip detachment |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200735232A true TW200735232A (en) | 2007-09-16 |
TWI295825B TWI295825B (en) | 2008-04-11 |
Family
ID=38588330
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW95107233A TWI295825B (en) | 2006-03-03 | 2006-03-03 | Integrated module of ejector pin for chip detachment |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2007243137A (en) |
TW (1) | TWI295825B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI500098B (en) * | 2011-03-18 | 2015-09-11 | Gallant Micro Machining Co Ltd | Sticky crystal machine |
TWI717775B (en) * | 2019-06-26 | 2021-02-01 | 日月光半導體製造股份有限公司 | Needle device for die |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI427713B (en) * | 2008-10-23 | 2014-02-21 | Gallant Prec Machining Co Ltd | Seperation method for a chip from tape film and a chip pickup method |
TWI483332B (en) * | 2011-07-29 | 2015-05-01 | Inotera Memories Inc | Wafer chuck unit, lift pin holder for wafer chuck unit, and wafer processing system |
TWI685046B (en) * | 2017-03-24 | 2020-02-11 | 日商新川股份有限公司 | Picking device and picking method |
CN113148611B (en) * | 2021-03-27 | 2023-04-28 | 深圳市智立方自动化设备股份有限公司 | Efficient double-station full-automatic chip arrangement system |
-
2006
- 2006-03-03 TW TW95107233A patent/TWI295825B/en not_active IP Right Cessation
- 2006-09-08 JP JP2006244316A patent/JP2007243137A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI500098B (en) * | 2011-03-18 | 2015-09-11 | Gallant Micro Machining Co Ltd | Sticky crystal machine |
TWI717775B (en) * | 2019-06-26 | 2021-02-01 | 日月光半導體製造股份有限公司 | Needle device for die |
Also Published As
Publication number | Publication date |
---|---|
JP2007243137A (en) | 2007-09-20 |
TWI295825B (en) | 2008-04-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |