CN220420559U - Carrier and adsorption structure - Google Patents

Abstract

The present application relates to the field of chip processing technologies, and in particular, to a carrier and an adsorption structure having the carrier. In this application, the arrangement of each holding tank is consistent with the arrangement of each wafer, the inside of holding tank is provided with the absorption hole, can realize the batch absorption to the wafer after aiming at the wafer with the holding tank like this, helps improving the speed that the absorption structure adsorbed the wafer, and then has accelerated the production progress. In this application, through in advance with the arrangement of holding tank and a plurality of the arrangement of wafer is unanimous, the size of holding tank is greater than the size of wafer forms first fault-tolerant region, and first fault-tolerant region can prevent the change of the position of wafer, prevents that the wafer from being located the scope of corresponding holding tank, aligns a wafer through observing the holding tank like this after, and other wafers are automatic aligns corresponding holding tank, has improved the precision of adsorption structure adsorption wafer.

Description

Carrier and adsorption structure

Technical Field

The present application relates to the field of chip processing technologies, and in particular, to a carrier and an adsorption structure having the carrier.

Background

A Light-Emitting Diode (LED) has self-luminous display characteristics, is an all-solid-state LED, has characteristics of long service life, high brightness, and low power consumption, and can be applied to extreme environments such as high temperature or radiation. The individual LED sizes below 50 μm are referred to as Micro-LEDs.

The chip is generally manufactured by grinding and cutting a wafer to divide the wafer into a plurality of dies, then grabbing the dies by a manipulator for cleaning, and forming functional chips through the steps of die attach, wire bonding, encapsulation, dicing, and the like. In the process, the wafer is grabbed by the manipulator and then is cleaned by the cleaning equipment, and the operation mode has higher requirements on the speed and the precision of the manipulator.

Disclosure of Invention

The application provides a carrier and adsorption structure, and this application is realized like this:

in a first aspect, embodiments of the present application provide a carrier, the carrier including a board, an upper surface of the board being provided with a plurality of receiving slots, the receiving slots being configured to receive a wafer, the receiving slots being larger than a size of the wafer and forming a first fault tolerant area, the receiving slots being recessed into the upper surface of the board;

the arrangement mode of each containing groove is consistent with the arrangement mode of a plurality of wafers, and the containing grooves are used for containing the wafers in batches;

the inside of holding tank is provided with the absorption hole, the absorption hole link up the lower surface of plate body, the absorption hole is in the lower surface of plate body is used for with air exhaust device's suction nozzle intercommunication.

In some embodiments, the receiving slot is rectangular in shape, the wafer is rectangular in shape, and a second fault tolerance area is provided at an included angle of the receiving slot.

In some embodiments, one of the adsorption holes is provided in the interior of each of the receiving grooves, and the adsorption hole is located in a middle region of the receiving groove.

In some embodiments, a plurality of the adsorption holes are provided in the interior of each of the accommodating grooves, and the plurality of the adsorption holes are located in the middle region of the accommodating groove as a whole.

In some embodiments, two adsorption holes are provided in the interior of each of the accommodating grooves, and the two adsorption holes are arranged along the length direction of the accommodating groove.

In some embodiments, four adsorption holes are provided in each of the receiving grooves, two of the adsorption holes are arranged along a length direction of the receiving groove, and the other two of the adsorption holes are arranged along a width direction of the receiving groove.

In some embodiments, the upper surface of the plate body is provided with protrusions, and the protrusions are staggered with respect to the receiving grooves.

In some embodiments, the lower surface of the plate body is provided with a fixing groove, and the fixing groove is used for being connected with the air extracting device.

In some embodiments, the lower surface of the plate body is provided with a groove, the groove is recessed into the lower surface of the plate body, the adsorption holes are all positioned in the groove at the lower surface part of the plate body, and the groove is used for being in sealing connection with the suction nozzle of the air extraction device.

In a second aspect, embodiments of the present application provide an adsorption structure comprising:

the carrier of any one of the first aspects; and

and the suction nozzle of the air extractor is communicated with the adsorption hole arranged on the carrier.

The beneficial effects that this application some embodiments bring are:

the arrangement mode of each holding groove is consistent with the arrangement mode of each wafer, and the inside of each holding groove is provided with the adsorption hole, so that the holding groove can realize the batch adsorption of the wafers after aligning the wafers, the speed of adsorbing the wafers by the adsorption structure is improved, the production progress is accelerated, and the production cost is reduced.

Through in advance with the arrangement mode of holding tank and a plurality of the arrangement mode of wafer is unanimous, the size of holding tank is greater than the size of wafer forms first fault-tolerant region, and first fault-tolerant region can prevent the change of the position of wafer, prevents that the wafer from being located outside the scope of corresponding holding tank, through observing that one holding tank aligns a wafer like this, other wafers are automatic aligns corresponding holding tank, has improved the precision of adsorption structure adsorption wafer, has reduced the wafer damage probability that leads to because of the adsorption precision, promotes wafer production yield.

The contained angle department of holding tank is provided with the second fault-tolerant region, has reduced or has prevented to produce the bump in contained angle department when placing the wafer in the holding tank, has reduced the required precision of adsorption structure adsorption wafer, has reduced the damage probability of wafer, promotes wafer production yield. And the wafer can be prevented or reduced from being bumped at the included angle after being placed in the accommodating groove, so that the damage probability of the wafer is reduced, and the production yield of the wafer is improved.

The upper surface of the plate body is provided with the protrusions, so that the wafer damage caused by collision between the wafer and the upper surface of the plate body when the accommodating groove is aligned to the wafer can be prevented.

Through all setting up the absorption hole in the recess with the lower surface part of plate body, can communicate a plurality of absorption holes through a suction nozzle, on the one hand reduced required suction nozzle quantity, on the other hand can make each absorption hole have basically the same suction, realized the homogeneity of each absorption hole suction, prevent that individual wafer from falling from the container inslot because of the adsorption affinity is not enough, reduced the damage probability of wafer, promoted wafer production yield.

Each holding tank's inside all is provided with one the absorption hole, the absorption hole is located the middle part region of holding tank. The adsorption hole is basically adsorbed in the middle area of the wafer, so that the wafer is prevented from falling off from the adsorption hole due to self gravity, the damage probability of the wafer is reduced, and the wafer production yield is improved.

It should be understood that the description of this section is not intended to identify key or critical features of the embodiments of the application or to delineate the scope of the application. Other features of the present application will become apparent from the description that follows. The above, as well as additional objectives, advantages, and features of the present application will become apparent to those skilled in the art from the following detailed description of a specific embodiment of the present application when read in conjunction with the accompanying drawings.

Drawings

Some specific embodiments of the present application will be described in detail hereinafter by way of example and not by way of limitation with reference to the accompanying drawings, which serve to better understand the present solution and are not to be construed as limiting the present application. The same reference numbers will be used throughout the drawings to refer to the same or like parts or portions. It will be appreciated by those skilled in the art that the drawings are not necessarily drawn to scale. In the accompanying drawings:

FIG. 1 is a schematic diagram of a carrier according to some embodiments of the present application;

FIG. 2 is a top view of a carrier according to some embodiments of the present application, showing an upper surface of the carrier;

FIG. 3 is a cross-sectional view taken along line A-A of FIG. 2;

FIG. 4 is a side view of a carrier according to some embodiments of the present application;

FIG. 5 is a bottom view of a carrier according to some embodiments of the present application, showing a lower surface of the carrier;

FIG. 6 is a schematic diagram of the positional relationship between the accommodating groove and the wafer according to some embodiments of the present application, wherein the accommodating groove is provided with one, two and four adsorption holes, and the adsorption hole structures with three dimensions are shown;

fig. 7 is a schematic diagram illustrating a positional relationship between a receiving groove and a wafer according to some embodiments of the present application.

Description of main reference numerals:

10-a carrier;

11-a receiving groove;

12-adsorption holes;

13-bulge;

14-grooves;

15-a first fault tolerant area;

16-a second fault tolerant area;

19-plate body

20-wafer.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application, in which many details of the embodiments of the present application are included to facilitate understanding, and the described embodiments are only possible technical implementations of the present application, and should be considered as merely exemplary, not all implementations possible. Also, for the sake of clarity and conciseness, descriptions of well-known functions and constructions are omitted in the following description.

The terms "first," "second," and the like in this application are used for distinguishing between similar objects and not for describing a particular sequential or chronological order. It is to be understood that the terms so used are interchangeable under appropriate circumstances and that the objects identified by the terms "first", "second", etc. are generally one type and do not limit the number of objects, for example, the first object may be one or more. The terms "upper," "lower," "high," "low," and "having" are used herein with reference to fig. 2, and are used primarily for purposes of better describing the present application and embodiments thereof, and are not intended to limit the indicated device, element, or component to a particular orientation or to be constructed and operated in a particular orientation. The term "plurality" shall mean two as well as more than two. In this application, "or/and", "and/or" means at least one of the objects, and "or" means one of the objects.

Before introducing the technical solution of the present application, an exemplary application scenario of the technical solution of the embodiment of the present application is first described.

In a wafer, there are usually a plurality of chips 20 connected together, and the process of separating each chip 20 is called dicing or dicing, and during dicing, contaminants such as dust, oil dirt, etc. are generated and attached to the surface of the chips 20, and the contaminants are removed under the condition of ensuring the quality of the product in the next step, and a cleaning solution is generally used for cleaning. The cleaning liquid can be one or more of glutamine, nitrilotriacetic acid, ethylenediamine tetraacetic acid, cyclohexane tetraacetic acid, diethylenetriamine pentaacetic acid and triethylenetetramine hexaacetic acid. In this process, the wafer 20 needs to be grasped by a robot arm to transfer the wafer 20 to the cleaning apparatus, and this operation mode and the requirements on the speed and precision of the robot arm are high.

In view of the above, according to a first aspect of the present application, there is provided a carrier 10, the carrier 10 including a plate 19, an upper surface of the plate 19 being provided with a plurality of receiving grooves 11, the receiving grooves 11 being for receiving wafers 20, the receiving grooves 11 being larger in size than the wafers 20 and forming a first fault-tolerant area 15, the receiving grooves 11 being recessed into the upper surface of the plate 19;

wherein, the arrangement mode of each containing groove 11 is consistent with the arrangement mode of a plurality of wafers 20, and the containing grooves 11 are used for containing a plurality of wafers 20 in batches;

wherein, the inside of holding tank 11 is provided with absorption hole 12, absorption hole 12 link up the lower surface of plate body 19, absorption hole 12 is used for with air extraction device's suction nozzle intercommunication at the lower surface of plate body 19.

In this application, the upper surface of plate 19 is provided with a plurality of holding tanks 11, each holding tank 11's arrangement is unanimous with a plurality of wafer 20's arrangement, the inside of holding tank 11 is provided with adsorption port 12, can realize adsorbing wafer 20's batch after aiming at wafer 20 with holding tank 11 like this, has improved the speed that adsorption structure adsorbed wafer 20, and then has accelerated the production progress. In this application, through in advance with the arrangement mode of holding tank 11 with a plurality of the arrangement mode of wafer 20 is unanimous, the size of holding tank 11 is greater than the size of wafer 20 forms first fault-tolerant area 15, and first fault-tolerant area 15 is used for preventing the change of the position of wafer 20, prevents that wafer 20 is located the scope of corresponding holding tank 11, like this through observing after one holding tank 11 aligns a wafer 20, the corresponding holding tank 11 of other wafer 20 automatic alignment, has improved the precision of adsorption structure adsorption wafer 20. The first fault tolerant area 15 is the area of the accommodating groove 11 minus the area of the wafer 20, and the first fault tolerant area 15 can be obtained by changing the positions of the wafers 20 accumulated during the production process, for example, vibration during the production process causes the alignment positions of the wafers 20 to be different from those of the wafers 20 designed in advance, resulting in the change of the positions of the wafers 20.

In a specific application scenario, after the wafer is cut, a plurality of wafers 20 of the full-page are formed, and the arrangement mode of the accommodating groove 11 is consistent with the arrangement mode of the plurality of wafers 20 of the full-page, the carrier 10 of the application is helpful to realize the adsorption of the wafers 20 of the full-page.

Generally, the shape of the wafer 20 is rectangular, in this application, the shape of the accommodating groove 11 is designed to be rectangular so as to accommodate the wafer 20 more smoothly, and the inventor finds that when the accommodating groove 11 is rectangular, the wafer 20 is placed in the accommodating groove 11 and after the wafer 20 is placed in the accommodating groove 11, the wafer 20 is easy to collide at the included angle, which increases the probability of damaging the wafer 20 and causes the wafer 20 to be not firmly adsorbed. In some embodiments, as shown in fig. 1, 2 and 6, the receiving groove 11 is generally rectangular in design. As shown in fig. 7, the wafer 20 is rectangular overall, and the second fault-tolerant area 16 is disposed at the included angle of the accommodating groove 11, so that collision generated at the included angle when the wafer 20 is placed in the accommodating groove 11 is reduced or prevented, the precision required by the adsorption structure to adsorb the wafer 20 is reduced, and the damage probability of the wafer 20 is reduced. Similarly, the collision of the wafer 20 at the included angle after being placed in the accommodating groove 11 is reduced or prevented, and the damage probability of the wafer 20 is reduced.

In some embodiments, as shown in fig. 1-4, the upper surface of the plate 19 is provided with protrusions 13, and the protrusions 13 are disposed offset from the receiving grooves 11. For example, the height of the protrusions 13 is substantially identical to the height of the wafer 20, so that damage to the wafer 20 caused by collision of the wafer 20 with the upper surface of the plate 19 when the accommodating groove 11 is aligned with the wafer 20 can be prevented. In the figure, the protrusions 13 are cylindrical, the number of the protrusions 13 is two, and the two protrusions 13 are provided at positions on the upper surface diagonal line of the plate body 19. In other embodiments, the number of protrusions 13 may be increased to further prevent rattling of the receiving groove 11 when it is aligned with the wafer 20.

In some embodiments, as shown in fig. 5, the lower surface of the plate 19 is provided with a fixing groove for connection with the air extraction device. For example, the air extractor is provided with a post, for example, extending into the fixing groove to complete the connection of the carrier 10 and the air extractor. For example, the fixing groove is a bolt hole, a bolt is provided on the air extractor, and the connection between the carrier 10 and the air extractor is completed through the bolt and the bolt hole.

In some embodiments, as shown in fig. 3 and 5, the lower surface of the plate 19 is provided with a groove 14, the groove 14 is recessed into the lower surface of the plate 19, the suction holes 12 are located in the groove 14 at the lower surface of the plate 19, and the groove 14 is used for sealing connection with the suction nozzle of the air extraction device. In this application, through setting up the absorption hole 12 in the lower surface part of plate 19 all in recess 14, can communicate a plurality of absorption holes 12 through a suction nozzle, on the one hand reduced required suction nozzle quantity, on the other hand can make each absorption hole 12 have basically the same suction, realized the homogeneity of each absorption hole 12 suction, prevent that individual wafer 20 from falling from holding groove 11 because of the adsorption affinity is not enough.

Fig. 6 is a schematic diagram of the positional relationship between the accommodating groove 11 and the wafer 20 according to some embodiments of the present application, in which the accommodating groove 11 is provided with one, two, and four suction holes 12, respectively, and three sizes of suction holes 12 are shown, in which the suction holes 12 of each row have the same size, the suction holes 12 of each column have the same number, and the sizes of the suction holes 12 decrease from top to bottom. It should be noted that wafer 20 does not form any part of this application and is discussed only for the purpose of more fully disclosing and/or claiming the present application.

In the first column shown in fig. 6, one of the suction holes 12 is provided in the interior of each of the accommodating grooves 11, and the suction hole 12 is located in the middle region of the accommodating groove 11. Such a suction hole 12 is substantially sucked to a central region of a wafer 20, preventing the wafer 20 from falling off from the suction hole 12 due to its own weight.

Each accommodating groove 11 is provided with a plurality of adsorption holes 12, the adsorption holes 12 are integrally located in the middle area of the accommodating groove 11, the adsorption force of the wafer 20 is increased by increasing the number of the adsorption holes 12, and the wafer 20 is prevented from falling off from the adsorption holes 12.

For example, in the second column shown in fig. 6, two adsorption holes 12 are provided in each of the accommodating grooves 11, the two adsorption holes 12 are integrally located in a middle region of the accommodating groove 11, and the two adsorption holes 12 are aligned along a length direction of the accommodating groove 11 to increase the adsorption stability of the wafer 20. In the drawing, each suction hole 12 has substantially the same distance from the same groove wall of the accommodation groove 11 to achieve more uniform suction of the wafer 20.

For example, in the second column shown in fig. 6, four suction holes 12 are provided in each of the accommodating grooves 11, two suction holes 12 are arranged in the longitudinal direction of the accommodating groove 11, and the other two suction holes 12 are arranged in the width direction of the accommodating groove 11, which also has a function of more uniformly sucking the wafer 20.

It should be noted that, in the case of no conflict, the embodiments and features of the embodiments in the present application may be combined with each other, and the present application schematically provides some combined embodiments to illustrate possible combinations:

example 1:

the carrier 10, the carrier 10 includes the plate 19, the upper surface of plate 19 is provided with a plurality of holding tank 11, holding tank 11 is sunken the upper surface of plate 19, holding tank 11 overall design is rectangle, holding tank 11 is used for holding wafer 20, the size of holding tank 11 is greater than the size of wafer 20 and forms first fault-tolerant area 15, and the contained angle department of holding tank 11 is provided with second fault-tolerant area 16. The inside of holding tank 11 is provided with absorption hole 12, absorption hole 12 link up the lower surface of plate body 19, the lower surface of plate body 19 is provided with recess 14, recess 14 is sunken in the lower surface of plate body 19, absorption hole 12 is in the lower surface part of plate body 19 all is located in recess 14, recess 14 is used for with air exhaust device's suction nozzle sealing connection. The arrangement of the receiving grooves 11 corresponds to the arrangement of the plurality of wafers 20, and the plurality of receiving grooves 11 are used for receiving a plurality of wafers 20 in batch, for example, in fig. 1, 5*8, for a total of forty receiving grooves 11, and forty wafers 20 can be received at a time. The upper surface of plate 19 is provided with protruding 13, protruding 13 stagger the holding tank 11 sets up, protruding 13 highly is the same with the height of wafer 20 basically, protruding 13 is cylindric, protruding 13 quantity is two, and two protruding 13 set up in the upper surface diagonal of plate 19. The lower surface of the plate 19 is provided with a fixing groove, the fixing groove is used for being connected with the air extractor, in particular, the air extractor is provided with a stand column, and the stand column stretches into the fixing groove to complete connection of the carrier 10 and the air extractor.

The present embodiment has the following effects:

the arrangement mode of each accommodating groove 11 is consistent with the arrangement mode of each wafer 20, and the inside of each accommodating groove 11 is provided with the adsorption holes 12, so that the accommodating grooves 11 can realize batch adsorption of the wafers 20 after aligning with the wafers 20, the speed of adsorbing the wafers 20 by the adsorption structure is improved, the production progress is accelerated, and the production cost is reduced.

Through the arrangement mode of the accommodating grooves 11 and the arrangement mode of the wafers 20 are consistent in advance, the size of the accommodating grooves 11 is larger than that of the wafers 20 to form a first fault-tolerant area 15, the first fault-tolerant area 15 can prevent the position of the wafers 20 from changing, and the wafers 20 are prevented from being positioned out of the range of the corresponding accommodating grooves 11, so that after one accommodating groove 11 is aligned to one wafer 20 through observation, the other wafers 20 are automatically aligned to the corresponding accommodating grooves 11, the accuracy of adsorbing the wafers 20 by the adsorption structure is improved, the damage probability of the wafers 20 caused by the adsorption accuracy is reduced, and the production yield of the wafers 20 is improved.

The second fault-tolerant area 16 is arranged at the included angle of the accommodating groove 11, so that the collision generated at the included angle when the wafer 20 is placed in the accommodating groove 11 is reduced or prevented, the precision required by the adsorption structure to adsorb the wafer 20 is reduced, the damage probability of the wafer 20 is reduced, and the production yield of the wafer 20 is improved. Likewise, the collision of the wafer 20 at the included angle after being placed in the accommodating groove 11 can be reduced or prevented, the damage probability of the wafer 20 is reduced, and the production yield of the wafer 20 is improved.

The upper surface of the plate 19 is provided with the protrusions 13, so that the wafer 20 is prevented from being damaged due to collision between the wafer 20 and the upper surface of the plate 19 when the accommodating groove 11 is aligned with the wafer 20.

Through setting up the absorption hole 12 in recess 14 in the lower surface part of plate 19, can communicate a plurality of absorption holes 12 through a suction nozzle, on the one hand reduced required suction nozzle quantity, on the other hand can make each absorption hole 12 have basically the same suction, realized the homogeneity of each absorption hole 12 suction, prevented that individual wafer 20 from falling in holding tank 11 because of the adsorption affinity is not enough, reduced wafer 20's damage probability, promoted wafer 20's production yield.

Each accommodating groove 11 is internally provided with one adsorption hole 12, and the adsorption hole 12 is positioned in the middle area of the accommodating groove 11. Such a suction hole 12 is substantially sucked to a central area of a wafer 20, preventing the wafer 20 from falling off from the suction hole 12 due to its own weight, reducing the damage probability of the wafer 20, and improving the production yield of the wafer 20.

Embodiments of the second aspect of the present application also provide an adsorption structure comprising the carrier 10 of any one of the first aspect, and an air extractor connected to the carrier 10, wherein a suction nozzle of the air extractor is in communication with an adsorption hole 12 arranged on the carrier 10. The adsorption structure has the technical effects of any one of the technical solutions of the first aspect, and will not be described herein. In some embodiments, the adsorption structure is a robot.

In the present application, the carrier 10 and the adsorption structure may be selected to be made of a material resistant to the cleaning liquid according to the components of the cleaning liquid, so that the carrier 10 and the adsorption structure are prevented from being damaged. For example, a metal material, a plastic material, or a combination of both materials may be selected.

In this application, the carrier 10 may be designed according to the arrangement of the wafers 20, the accommodating groove 11 is formed by grooving in a machining manner, the adsorption holes 12 are machined in the groove, and the formed carrier 10 may be used for batch transfer of a plurality of wafers 20 in a corresponding arrangement manner.

The use method of the schematic adsorption structure comprises the following steps:

the process of taking the tablets comprises the following steps: moving the adsorption structure to a slice taking starting position; the adsorption structure obtains a slice taking command; the adsorption structure executes a chip taking command, the carrier 10 at the tail end of the adsorption structure is aligned to the wafer 20, and the suction nozzle of the suction device generates suction, so that the wafer 20 is adsorbed in the accommodating groove 11, and chip taking is completed;

the cleaning process comprises the following steps: the adsorption structure obtains a cleaning command; the adsorption structure executes a cleaning command to transfer the grasped wafer 20 to the cleaning apparatus; the subsequent cleaning equipment cleans and dries the wafer 20.

Thus, embodiments of the present application have been described in detail with reference to the accompanying drawings. It should be noted that, in the drawings or the text of the specification, implementations not shown or described are all forms known to those of ordinary skill in the art, and not described in detail.

The above description is only a partial example of the present application and the description of the technical principles applied, and is not intended to limit the present application in any way. It will be appreciated by persons skilled in the art that the scope of the disclosure referred to in this application is not limited to the specific combinations of features described above, but it is intended to cover other embodiments in which any combination of features described above or equivalents thereof is possible without departing from the spirit of the disclosure. Such as the above-mentioned features and the technical features disclosed in the present application (but not limited to) having similar functions are replaced with each other to form a technical solution, which is also within the scope of protection of the present application.

Claims (10)

1. The carrier is characterized by comprising a plate body, wherein the upper surface of the plate body is provided with a plurality of accommodating grooves, the accommodating grooves are used for accommodating wafers, the size of the accommodating grooves is larger than that of the wafers, a first fault-tolerant area is formed, and the accommodating grooves are recessed into the upper surface of the plate body;

the arrangement mode of each containing groove is consistent with the arrangement mode of a plurality of wafers, and the containing grooves are used for containing the wafers in batches;

the inside of holding tank is provided with the absorption hole, the absorption hole link up the lower surface of plate body, the absorption hole is in the lower surface of plate body is used for with air exhaust device's suction nozzle intercommunication.

2. The carrier of claim 1, wherein:

the whole rectangle that is of holding tank, the wafer is whole to be rectangle, the contained angle department of holding tank is provided with the second fault-tolerant region.

3. The carrier of claim 1, wherein:

each holding tank's inside all is provided with one the absorption hole, the absorption hole is located the middle part region of holding tank.

4. The carrier of claim 1, wherein:

every the inside of holding tank all is provided with a plurality of the absorption hole, a plurality of the absorption hole is located as a whole the middle part region of holding tank.

5. The carrier of claim 4, wherein:

every the inside of holding tank all is provided with two adsorb the hole, two adsorb the hole is followed the length direction of holding tank arranges.

6. The carrier of claim 4, wherein:

four adsorption holes are formed in each containing groove, two adsorption holes are arranged in the length direction of each containing groove, and the other two adsorption holes are arranged in the width direction of each containing groove.

7. The carrier of claim 1, wherein:

the upper surface of the plate body is provided with a bulge, and the bulge is staggered with the accommodating groove.

8. The carrier of claim 1, wherein:

the lower surface of the plate body is provided with a fixing groove, and the fixing groove is used for being connected with the air extractor.

9. The carrier of claim 1, wherein:

the lower surface of the plate body is provided with a groove, the groove is recessed into the lower surface of the plate body, the adsorption holes are positioned in the groove at the lower surface of the plate body, and the groove is used for being in sealing connection with the suction nozzle of the air extractor.

10. An adsorption structure, comprising:

the carrier of any one of claims 1-9;

and the suction nozzle of the air extractor is communicated with the adsorption hole arranged on the carrier.