CN101295626A - Method and device for peeling chip and adhesive film - Google Patents

Abstract

The invention provides a method for stripping a chip and a glue film, which comprises the following steps: providing a wafer which is adhered on an adhesive film, wherein the wafer is provided with a plurality of chips; moving the chip to be stripped to a positioning position and fixing the chip; and separating the adhesive film from the chip to be stripped from the outside to the inside in a ring shape by an acting force. By utilizing the method, the invention further provides a chip and adhesive film stripping device, which is mainly used for bearing a chip to be stripped, then under the condition of fixing the chip, the stripping device is gradually separated from the adhesive film adhered to the chip to be stripped in an annular shape from outside to inside, and the adhesive film is gradually acted on the adhesive film adhered to the chip to be stripped through an acting force, so that the adhesive film is gradually separated from the chip to be stripped.

Description

Method and device for stripping chip and adhesive film

technical field

The invention relates to a stripping method and device, in particular to a method and a device for peeling off a film from a chip by using the force generated by vacuum negative pressure to peel off the film piece by piece.

Background technique

The existing chip ejection device is shown in FIG. 1A, which is composed of ejector pin 101 and pick-and-place head 102. The purpose of this device is to separate the chip 900 from the adhered surface of film 902, so as to facilitate the pick-and-place head 102 to pick up. Chip 900. As shown in FIG. 2A and FIG. 2B , the figures are a top view and a schematic cross-sectional view of a wafer. There are multiple chips 900 on the wafer 90 , and the multiple chips 900 are adhered on a film 902 . However, the technology in FIG. 1A is easy to damage the chip because the thimble will produce stress concentration on the chip. In addition, the technology shown in FIG. 1A is only applicable to chips with a chip thickness of more than 3 mils.

As for the thickness of the chip below 3mil, it needs to be ejected in a non-needle bed ejection method. The current non-ejector device is shown in Figure 1B, which is the technology disclosed in the US Patent No. 4,990,051. The figure is an existing one. Schematic diagram of the non-thimble chip and film peeling device. In this embodiment, the chip is ejected onto the pick-and-place head 112 through a two-stage action. That is, in the first stage, the ejection mechanism 111 is used to eject the chip 900 to a specific position; and then in the second stage, the ejector pin 110 is used to eject the chip 900 . Although this embodiment can be applied to chips below 3mil, it can also reduce the problem of stress concentration produced by the prior art shown in Figure 1A, but the technology cannot be applied to chips of different sizes, so when the chip size changes At the same time, it is necessary to replace the ejection mechanism with a different size, which reduces the production efficiency and virtually increases the production cost.

Based on the above, there is an urgent need for a method and device for peeling off a chip from an adhesive film to solve the problems in the prior art.

Contents of the invention

The main purpose of the present invention is to provide a chip and adhesive film peeling method, which uses the force generated by the vacuum negative pressure to peel off the film adhered to the chip piece by piece, so that it is gradually separated from the chip, so as to reduce and concentrate the stress. The purpose of avoiding damage to the chip during the peeling process.

The secondary purpose of the present invention is to provide a device for stripping the chip from the adhesive film, which uses a mechanism that can be lowered step by step to make the force generated by the vacuum negative pressure peel off the film adhered to the chip, so that the chip is separated from the film to reduce concentration. stress, for the purpose of avoiding damage to the chip during the lift-off process.

Another secondary object of the present invention is to provide a device for peeling off the chip and the adhesive film, which can adjust the height of the chip and the carrier to control the peeling height.

Another secondary purpose of the present invention is to provide a chip and adhesive film peeling device, which has a multi-stage peeling mechanism to adapt to different crystal plane sizes, avoiding the need to replace different sizes when the size changes in the prior art problem with the stripping device.

In order to achieve the above object, the present invention provides a chip and adhesive film peeling method, which includes the following steps: (a) providing a wafer, which is adhered on an adhesive film, the wafer has a plurality of chips ; (b) move the chip to be peeled to a position, and fix the chip; and (c) make the adhesive film ring-shaped and separate from the chip to be peeled from the outside to the inside by a force. Wherein said acting force is a vacuum suction.

In order to achieve the above object, the present invention further provides a chip and adhesive film peeling method, which includes the following steps: (a) providing a wafer, which is adhered on an adhesive film, and the wafer has a plurality of chip; (b) move the chip to be peeled off to a peeling device; (c) fix the chip to be peeled off, and provide an active force on the adhesive film; and (d) make the peeling device loop And gradually break away from the adhesive film adhered to the chip to be peeled off from the outside to the inside, so that the force gradually acts on the adhesive film adhered to the chip to be peeled off, so that the adhesive film is gradually separated The chip to be peeled off. Wherein said acting force is a vacuum suction.

Preferably, the chip and adhesive film peeling method further includes the following steps: (e) when the adhesive film is in line contact with the device to be peeled off, taking out the chip to be peeled off; and (f) Repeat steps (b) to (f).

In order to achieve the above object, the present invention further provides a chip and adhesive film peeling device, comprising: a bearing base with an accommodating space, the upper surface of the bearing base has an opening and a plurality of negative Pressing hole, the opening is connected with the accommodating space; a stripping unit, which is arranged in the accommodating space, and one end of the stripping unit has a contact portion, which extends out of the accommodating space The opening is accommodated in the opening, and a first through hole is further opened in the contact portion; a base body is arranged in the accommodation space, and the base body has a top column. The top post can pass through the first through hole; and a first elastic body is sheathed on the top post, one end of the first elastic body is adjacent to the peeling unit and the other end is Adjacent to the base body.

Preferably, two ends of the base body are respectively provided with a guiding through hole. The chip and adhesive film peeling device further has a position adjustment part, including: a fixed seat, which is arranged on one side of the base body, and the fixed seat has an adjustment through hole; a pair of a guide rod, which is connected with the fixed seat, and the pair of guide rods pass through the guide through holes respectively, so that the base body can slide on the pair of guide rods; and an adjustment screw, which is Coupled with the adjustment through hole, one end of the adjustment screw abuts against the base body.

Preferably, the chip and adhesive film stripping device has at least one sub-peeling unit, which is arranged in the stripping unit, and the top of the sub-peeling unit has a sub-contact portion, which is accommodating Placed in the through hole, a second through hole is further opened inside the sub-contact portion to allow the top post to pass through. Wherein, there is a second elastic body between the sub-peeling unit and the base body.

Description of drawings

1A and 1B are schematic diagrams of existing chip and film stripping devices;

FIG. 2A and FIG. 2B are wafer top views and cross-sectional schematic diagrams;

Fig. 3 is a schematic flow chart of the first embodiment of the peeling method of the chip and the adhesive film of the present invention;

Fig. 4 is the schematic flow chart of the second embodiment of the peeling method of the chip and the adhesive film of the present invention;

5A and 5B are three-dimensional exploded and cross-sectional schematic diagrams of the first preferred embodiment of the chip and film peeling device of the present invention;

Fig. 6 is a schematic top view of the carrier body in the chip and film peeling device of the present invention;

7 is a schematic diagram of the height between the peeling unit and the surface of the supporting base in the chip and film peeling device of the present invention;

8A to 8I are schematic diagrams of the implementation process of the chip and film peeling device of the present invention.

Explanation of reference signs: 101-ejector; 102-pick-and-place head; 110-thimble; 111-ejector mechanism; 112-pick-and-place head; Film peeling method; 30~34-steps; 4-chip and film peeling device; 40-carrying base; 400-accommodating space; 401-surface; 402-opening; 403-negative pressure hole; Groove; 41-peeling unit; 410-contact portion; 411-first through hole; 412-plate body; 413-first fixing through hole; 414-first protrusion; 42-base body; 421-round hole; 422-fixing rod; 423-guiding through hole; 43-first elastic body; 44-sub-peeling unit; 440-sub-contact portion; 441-second through hole; ; 443-the second convex part; 45-the second elastic body; 46-position adjustment part; 460-fixed seat; 4601-adjustment through hole; -the third elastic body; 48-tie rod; 480-rod body; 481-concave body; 4810-groove; 49-cover body; 5-suction nozzle; 90-wafer; - force; 92 - vacuum suction; h - height.

Detailed ways

In order to have a further cognition and understanding of the features, purpose and functions of the present invention, the relevant detailed structure and design concept of the device of the present invention will be described below, so that the characteristics of the present invention can be understood, and the detailed description is as follows :

Please refer to FIG. 3 , which is a schematic flow chart of the first embodiment of the peeling method of the chip and the adhesive film of the present invention. The method includes the following steps: first, step 20 is performed, providing a wafer, which is adhered on an adhesive film, and has a plurality of chips on the wafer. The structure of the wafer is shown in FIG. 2A and FIG. 2B , and will not be repeated here. Returning to FIG. 3 , proceed to step 21, moving the chip to be peeled to a position, and fixing the chip. In the fixing method in step 21, a suction nozzle can be used to abut against the chip to be peeled off, so as to fix the position of the chip.

After step 21, proceed to step 22, which is to act on the adhesive film by a force, so that the adhesive film is separated from the chip to be peeled from the outside to the inside in a ring shape. In this embodiment, the action force is provided by a vacuum negative pressure, and the vacuum negative pressure acts on the film, so that the film begins to peel off from the periphery of the chip.

Please refer to FIG. 4 , which is a schematic flow chart of the second embodiment of the peeling method of the chip and the adhesive film of the present invention. In this embodiment, the method includes the following steps: firstly, step 30 is performed to provide a wafer, which is adhered on an adhesive film, and the wafer has a plurality of chips. Then proceed to step 31 , move the chip to be peeled to a peeling device, and the peeling device can leave the film step by step. Next, proceed to step 32 , fixing the chip to be peeled off, and providing a force on the adhesive film. Then, make the peeling device ring-shaped and gradually break away from the adhesive film adhered to the chip to be peeled from the outside to the inside, so that the active force gradually acts on the adhesive film adhered to the chip to be peeled off. on, so that the adhesive film is gradually detached from the chip to be peeled off. Then, proceed to step 33 , when the adhesive film is in line contact with the device to be peeled off, take out the chip to be peeled off. Finally, step 31 to step 33 are repeated to peel off the plurality of chips from the film to take out the plurality of chips.

Next, an embodiment of the peeling device in FIG. 4 will be described. Please refer to FIG. 5A and FIG. 5B , which are perspective exploded and cross-sectional diagrams of the first preferred embodiment of the chip and film peeling device of the present invention. The chip and film peeling device 4 has a supporting base 40 , a peeling unit 41 , a base 42 and a first elastic body 43 . The carrying base 40 has an accommodating space 400, the upper surface 401 of the carrying base 40 can provide a carrying wafer, and an opening 402 is provided, and the opening 402 is connected with the accommodating The spaces 400 are connected. As shown in Figure 6, the surface 401 of the bearing base 40 has a plurality of negative pressure holes 403, in order to increase the effect of vacuum negative pressure, the surface 401 of the bearing base 40 has a plurality of grooves 404, 405 It communicates with the negative pressure hole 403 .

The stripping unit 41 is disposed in the accommodating space 400 , and one end of the stripping unit 41 has a contact portion 410 extending out of the accommodating space 400 and accommodated in the opening 402 Inside, the stripping unit 41 further defines a first through hole 411 , which runs through the entire stripping unit 41 and presents an opening on the contact portion 410 . The end surface of the contact portion 410 is in contact with the film. The base body 42 is disposed in the accommodating space 400 , the base body 42 has a prop 420 , and the prop 420 can pass through the first through hole 411 . The end surface of the prop 420 passing through the first through hole 411 is an arc surface, which can form a line contact with the film. The first elastic body 43 is sheathed on the top post 420, one end of the first elastic body 43 is adjacent to the inner wall of the stripping unit 41 and the other end is adjacent to the base body 42 next to each other. Two boards 412 are respectively arranged on two sides of the stripping unit 41 .

At least one sub-stripping unit 44 can be further arranged inside the peeling unit 41, and its front end has a sub-contact portion 440. In this embodiment, the end face of the sub-contact portion 440 is the end face of the contact portion 410. Cut neatly and in contact with the film. Through the combination of the peeling unit 41 and the at least one sub-stripping unit 44 , the contact portion 410 and the at least one sub-contact portion 440 can form multiple peeling stages during the whole peeling process. The central area of the sub-stripping unit 44 has a second through hole 441 for allowing the top post 420 to pass through. Also, a second elastic body 45 is disposed between the sub-peeling unit 44 and the base body 42 . The second elastic body 45 is sleeved on the top column 420 and accommodated in the first elastic body 43 . One end of the second elastic body 45 abuts against the inner wall of the sub-peeling unit 44 , and the other end abuts against the base body 42 .

In order to control the moving strokes of the peeling unit 41 and the sub-stripping unit 44, a round hole 421 is provided on the top column 420 to provide a fixed rod 422 to pass through. Two sides of the top column 420 . In addition, a first fixing through hole 413 is defined on both sides of the peeling unit 41 , and a second fixing through hole 442 is defined on both sides of the at least one sub-stripping unit 44 . The two ends of the fixing rod 422 on both sides of the top column 420 respectively pass through the first fixing through hole 413 and the second fixing through hole 442 to limit the movement of the stripping unit 41 and the sub-stripping unit 44 itinerary.

In order to adjust the initial positions of the peeling unit 41 and the sub-stripping unit 44, a position adjustment part 46 is provided on the lower side of the base body 42, which has a fixing seat 460, a pair of guide rods 461, a Adjusting screw 462 and a fixing nut 463 . The fixing base 460 is disposed on one side of the base body 42 , and the fixing base 460 further has an adjustment through hole 4601 . The pair of guide rods 461 is connected with the fixed seat 460, and the pair of guide rods 461 respectively pass through the guide through holes 423 on the base body 42, so that the base body 42 can be positioned on the pair of guide rods. Slide on rod 461. The adjustment screw 462 is coupled with the adjustment through hole 4601 and fixed by the fixing nut 463 , and one end of the adjustment screw 462 abuts against the base body 42 . In addition, a third elastic body 47 is arranged in the accommodating space 400 , one end of the third elastic body 47 abuts against the base body 42 and the other end abuts against the bearing base body 40 against the inner wall. Through the position adjustment part 46, the position of the base body 42 can be adjusted, and then the position of the contact part 41 and the sub-contact part 44 can be adjusted, and the distance between the end faces of the contact part 41 and the sub-contact part 44 can be changed. The height h of the bearing base surface 401 (as shown in FIG. 7 ).

In order to control the action of the peeling unit 41 , the present invention uses a pull rod 48 to drive the whole peeling unit 41 to move downward. The pull rod 48 has a rod body 480 and a concave body 481 . The concave body 481 is connected to one end of the rod body 480, and the two sides of the concave body 481 respectively have a groove 4810, so as to engage with the plates 412 on both sides of the stripping unit 41 respectively. . Then a cover 49 is provided on the bottom of the bearing base 40 to provide a combination of fixing the entire chip and the components in the film peeling device.

Please refer to FIG. 8A to FIG. 8I , which are schematic diagrams of the implementation process of the chip and film peeling device of the present invention. First, as shown in FIG. 8A, when the chip 901 to be peeled moves onto the carrier body 40, the end surface of the contact portion 410 of the peeling unit 41 and the sub-contact portion 440 of the sub-peeling unit 44 and the film at the bottom of the chip 901 902 corresponds. Next, as shown in FIG. 8B , the suction nozzle 5 above the chip 901 to be peeled off moves downward and uses vacuum suction 92 to fix the chip 901 . Next, as shown in FIG. 8C , a vacuum negative pressure is provided. At this time, the negative pressure provides a force 91 on the film 902 at the bottom of the chip 901 through the negative pressure hole 403 , so that the film at the corner of the chip 901 is peeled off in advance. Then as shown in FIG. 8D , then through the aforementioned pull rod 480, a downward pulling force is generated to act on the plates 412 (shown in FIG. 5A ) on both sides of the stripping unit 41 to pull the stripping unit 41 to move downward. . When the peeling unit 41 moves downward, the thin film above the contact portion 410 of the peeling unit 41 is subjected to vacuum negative pressure, so that the thin film under the chip 901 is detached from the chip 901 .

As shown in FIG. 8E , since the inner side wall of the peeling unit 41 has a first protrusion 414 , the outer wall of the sub-stripping unit 44 also has a second protrusion 443 . Therefore, when the stripping unit 41 descends to a specific position, the first convex portion 414 will abut against the second convex portion 443, and drive the sub-peeling unit 44 down, so that the sub-peeling unit 44 is disengaged. The thin film 902 under the chip 901 further makes the force generated by the vacuum negative pressure act on the thin film 902 , so that the thin film 902 that was in contact with the sub-peeling unit 44 is also detached from the chip 901 . After the peeling unit 41 and the sub-stripping unit 44 are separated from the thin film 902 , only the end surface above the top post 420 is left in contact with the thin film 902 at the bottom of the chip 901 . Since the end surface above the prop 420 is arc-shaped, the prop 420 is in line contact with the film 902 at this stage. Next, as shown in FIG. 8F , the suction nozzle 5 is used to take out the chip 901 , and at the same time, the vacuum negative pressure 91 is released. Next, as shown in FIG. 8G, FIG. 8H and FIG. 8I, the peeling unit 41 and the sub-stripping unit 44 return to their original positions through the elastic force of the second elastic body 45 and the first elastic body 43 respectively, to complete The entire procedure of peeling off the chip to leave the film. All the chips are taken out by repeatedly executing the procedures shown in FIG. 8A to FIG. 8I .

In the embodiment of Fig. 5A, a peeling unit and a sub-peeling unit are used in combination. On the actual occasion, as long as there is a structure of a peeling unit, the purpose of the present invention to be separated from the chip and the film can be achieved, that is, using the peeling unit The combination with the top pillar can achieve the purpose of peeling off the chip. In another embodiment, according to the sub-stripping unit and the design principle of the stripping unit, a plurality of sub-stripping units may be provided in the stripping unit to adapt to different chip sizes.

The above descriptions are only preferred embodiments of the present invention, and should not be used to limit the scope of the present invention. That is, all equivalent changes and modifications made according to the claims of the present invention will still not lose the gist of the present invention, nor depart from the spirit and scope of the present invention, so all should be regarded as further implementation status of the present invention.

Based on the above, the peeling method and device of the chip and the adhesive film of the present invention can not only effectively reduce the phenomenon of stress concentration during the peeling process to avoid chip damage, but also be applicable to different chip sizes, so as to avoid the need to replace the existing technology from time to time Problems with other sizes of strippers. Therefore, the needs of the industry can be met, thereby improving the competitiveness of the industry.

Claims (10)

1. A method for stripping a chip from an adhesive film, characterized in that it comprises the following steps: a. providing a wafer, which is adhered on an adhesive film, the wafer has a plurality of chips; b. moving the chip to be peeled off to a position, and fixing the chip; and c. With a force, the adhesive film is separated from the chip to be peeled off in a ring shape and from the outside to the inside. 2. A method for stripping a chip from an adhesive film, characterized in that it comprises the following steps: a. providing a wafer, which is adhered on an adhesive film, the wafer has a plurality of chips; b. Move the chip to be stripped to a stripping device; c. fixing the chip to be peeled off, and providing a force on the adhesive film; and d. Make the peeling device ring-shaped and gradually break away from the adhesive film adhered to the chip to be peeled from the outside to the inside, so that the active force gradually acts on the adhesive film adhered to the chip to be peeled off , so that the adhesive film is gradually separated from the chip to be peeled off. 3. The chip and adhesive film peeling method as claimed in claim 2, which further comprises the following steps: e. When the adhesive film is in line contact with the device to be peeled off, take out the chip to be peeled off; and f. Go back to step b and repeat steps b to f. 4. A chip and adhesive film peeling device, characterized in that it comprises: A bearing base body, which has an accommodating space, the upper surface of the bearing base body has an opening and a plurality of negative pressure holes, and the openings communicate with the accommodating space; A stripping unit, which is arranged in the accommodating space, one end of the stripping unit has a contact portion, which extends out of the accommodating space and is accommodated in the opening, and the contact portion is further A first through hole is provided; a base body, which is arranged in the accommodating space, the base body has a top post, and the top post passes through the first through hole; and A first elastic body is sheathed on the top column, one end of the first elastic body is adjacent to the stripping unit and the other end is adjacent to the base body. 5. The chip and adhesive film peeling device according to claim 4, characterized in that: the two sides of the peeling unit are further connected with a plate body, and the chip and adhesive film peeling device further has a pull bar, which is Fastened with the plates on both sides of the peeling unit, wherein the pull rod further has: a rod; and A concave body, which is connected to one end of the rod body, has a groove on both sides of the concave body, so as to engage with the plate body respectively. 6. The device for stripping the chip and the adhesive film according to claim 4, characterized in that: two ends of the base body are respectively provided with a guiding through hole. 7. The chip and adhesive film peeling device according to claim 6, characterized in that: it further has a position adjustment part, including: A fixed seat, which is arranged on one side of the base body, and has an adjustment through hole on the fixed seat; A pair of guide rods, which are connected to the fixed seat, the pair of guide rods respectively pass through the guide through holes, and the base body slides on the pair of guide rods; an adjustment screw, which is coupled with the adjustment through hole, and one end of the adjustment screw is against the base body; and A third elastic body is arranged in the accommodating space, one end of the third elastic body abuts against the base body and the other end abuts against the inner wall of the bearing base body. 8. The chip and adhesive film peeling device as claimed in claim 4, characterized in that: the two sides of the peeling unit respectively have a first fixing through hole, and the top column further has a fixing rod, and its two ends respectively pass through the first fixing through holes. 9. The chip and adhesive film peeling device according to claim 4 or 8, characterized in that: it further has at least one sub-peeling unit, which is arranged in the peeling unit, and the top of the sub-peeling unit has A sub-contact part, which is accommodated in the first through hole, a second through hole for the top post to pass through is further opened inside the sub-contact part, and the two sides of the sub-stripping unit have respectively A second fixing through hole. In addition, there is a second elastic body between the sub-peeling unit and the base body. 10. The chip and adhesive film peeling device according to claim 4, characterized in that: the top of the top column is an arc surface.

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