CN101295626A - Method and device for stripping chip from glue film - Google Patents
Method and device for stripping chip from glue film Download PDFInfo
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- CN101295626A CN101295626A CNA2007100976254A CN200710097625A CN101295626A CN 101295626 A CN101295626 A CN 101295626A CN A2007100976254 A CNA2007100976254 A CN A2007100976254A CN 200710097625 A CN200710097625 A CN 200710097625A CN 101295626 A CN101295626 A CN 101295626A
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- chip
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- peel
- stripping
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Abstract
The invention provides a chip and glue film peeling method, including the following steps of: providing a wafer which is stuck on the glue film and is provided with a plurality of chips; moving the chip needing to be peeled to a fixed position and fixing the chip; leading the glue film to separate from the chip needing to be peeled from the outside to the inside annularly by an acting force. The invention discloses a chip and glue film peeling device by utilizing the method which mainly provides to bear the chip needing to be peeled, then leads the peeling device to be separated from the outside to the inside annularly from the glue film stuck with the chip to be peeled and gradually acts on the glue film stuck with the chip to be peeled by an acting force so as to lead the glue film to gradually separate from the chip to be peeled.
Description
Technical field
The present invention relates to a kind of stripping means and device, relate in particular to a kind of a kind of chip and glued membrane stripping means and device thereof that utilizes active force that negative pressure of vacuum produces to break away from chip with stripping film piecemeal.
Background technology
The existing chip liftout attachment is shown in Figure 1A, and it is by thimble 101 and pick and place 102 institutes and forms, and this device purpose makes chip 900 separate with the face that film 902 sticks together, and is beneficial to follow-up 102 an absorption chip 900 that pick and place.Shown in Fig. 2 A and Fig. 2 B, described figure is that wafer is overlooked and cross-sectional schematic.Have many pieces of chips 900 on the described wafer 90, described many pieces of chips 900 are to be attached on the film 902.But the technology of Figure 1A is concentrated effect because thimble can produce stress to chip, therefore easy damage chip.In addition, the technology of Figure 1A also only can be applicable to the chip that chip thickness 3mil is above.
Need to eject as for the chip thickness below the 3mil with non-needle-bar pushing method, present non-push pin device is just like shown in Figure 1B, and it is U.S. bulletin patent US.Pat.No.4,990,051 disclosed technology, described figure is the chip and the film peeling apparatus schematic diagram of existing non-thimble-type.In the present embodiment, seeing through two stage start ejects chip to picking and placeing on 112.That is the phase I ejects chip 900 to an ad-hoc location with ejecting mechanism 111 earlier; In second stage, with thimble 110 chip 900 is ejected again then.Though present embodiment can be applied to the following chip of 3mil, also can reduce the problem of concentrating as the stress that prior art produced of Figure 1A, but described technology but can't be applicable to the chip of different size size, therefore when chip size changes, must change different size ejecting mechanisms, so change and reduce production efficiency, increased production cost virtually.
Comprehensively above-mentioned, therefore needing a kind of chip and glued membrane stripping means and device thereof badly solves the problem that prior art produces.
Summary of the invention
Main purpose of the present invention provides a kind of chip and glued membrane stripping means, it is that the active force that produces by negative pressure of vacuum is to peel off the film that is attached on the chip piecemeal, make it break away from chip gradually, reach and reduce and concentrated stress, avoid the purpose of defective chip in stripping process.
Secondary objective of the present invention provides a kind of chip and glued membrane stripping off device, it is to peel off the film that is attached on the chip by the active force that the mechanism that can descend piecemeal produces negative pressure of vacuum, make chip break away from film and reach the minimizing concentrated stress, avoid the purpose of defective chip in stripping process.
Another secondary objective of the present invention provides a kind of chip and glued membrane stripping off device, and it is to adjust chip and the height that carries pedestal, peels off height with control.
Another secondary objective of the present invention provides a kind of chip and glued membrane stripping off device, and it is the mechanism for stripping with multistage, to adapt to different crystal face sizes, avoids in the prior art, because size is when changing, and must change the problem of the stripping off device of different size.
To achieve the above object, the invention provides a kind of chip and glued membrane stripping means, it is to include the following step: a wafer (a) is provided, and it is to be attached on the glued membrane, and described wafer has a plurality of chips; (b) move on chip to a location of desiring to peel off, and fixing described chip; And, make described glued membrane break away from the described chip of desiring to peel off with ring-type and ecto-entad (c) by an active force.Wherein said active force is a pull of vacuum.
To achieve the above object, the present invention more provides a kind of chip and glued membrane stripping means, and it is to include the following step: a wafer (a) is provided, and it is to be attached on the glued membrane, and described wafer has a plurality of chips; (b) move on chip to a stripping off device of desiring to peel off; (c) the fixing described chip of desiring to peel off, and provide an active force on described glued membrane; And (d) make described stripping off device break away from the glued membrane that sticks together mutually with the described chip of desiring to peel off gradually with annular and ecto-entad, so that described active force acts on the glued membrane that sticks together mutually with the described chip of desiring to peel off gradually, and make described glued membrane break away from the described chip of desiring to peel off gradually.Wherein said active force is a pull of vacuum.
Preferably, described chip and glued membrane stripping means, it is more to include the following step: (e) when described glued membrane and described desire stripping off device present line and contact, take out the described chip of desiring to peel off; And (f) repeated execution of steps (b) to (f).
To achieve the above object, the present invention more provides a kind of chip and glued membrane stripping off device, comprising: a carrying pedestal, and it is to have an accommodation space, the upper surface of described carrying pedestal has a perforate and a plurality of negative pressure hole, and described perforate is to be connected with described accommodation space; One peels off the unit, and it is to be arranged in the described accommodation space, and a described end of peeling off the unit has a contact site, and it is to extend described accommodation space and be placed in the described perforate, more offers one first through hole in the described contact site; One base body, it is to be arranged in the described accommodation space, and described base body has a fore-set, and described fore-set is to pass through described first through hole; And one first elastomer, it is sheathed on the described fore-set, and described first an elastomeric end is to peel off that the unit abuts mutually and the other end is to abut mutually with described base body with described.
Preferably, the two ends of described base body offer a guiding through hole more respectively.Described chip and glued membrane stripping off device, it is to have more adjustment part, a position, comprising: a holder, it is a side that is arranged at described base body, has more one on the described holder and adjusts through hole; Pair of guide rods, it is to be connected with described holder, described is respectively by described guiding through hole to guide rod, and described base body can be slided on to guide rod in described; And one adjust spiral shell, and it is to connect by chance mutually with described adjustment through hole, and an end of described adjustment spiral shell is to lean with described base body.
Preferably, described chip and glued membrane stripping off device, it is to have more at least one son to peel off the unit, it is to be arranged at described peeling off in the unit, the top that described son is peeled off the unit has a sub-contact site, it is to be placed in the described through hole, and the inside of described sub-contact site more offers one second through hole and passes through so that described fore-set to be provided.Wherein said son is peeled off and is had more one second elastomer between unit and the described base body.
Description of drawings
Figure 1A and Figure 1B are existing chip and film peeling apparatus schematic diagram;
Fig. 2 A and Fig. 2 B are that wafer is overlooked and cross-sectional schematic;
Fig. 3 is chip of the present invention and the glued membrane stripping means first embodiment schematic flow sheet;
Fig. 4 is chip of the present invention and the glued membrane stripping means second embodiment schematic flow sheet;
Fig. 5 A and Fig. 5 B are three-dimensional decomposition of chip of the present invention and film peeling apparatus first preferred embodiment and generalized section;
Fig. 6 is the carrying pedestal schematic top plan view in chip of the present invention and the film peeling apparatus;
Fig. 7 is the high-level schematic between unit and the load bearing seat surface of peeling off in chip of the present invention and the film peeling apparatus;
Fig. 8 A to Fig. 8 I is chip of the present invention and film peeling apparatus implementing procedure schematic diagram.
Description of reference numerals: 101-thimble; 102-picks and places head; The 110-thimble; The 111-ejecting mechanism; 112-picks and places head; 2-chip and the glued membrane side of peeling off; 20～22-step; 3-chip and the glued membrane side of peeling off; 30～34-step; 4-chip and film peeling apparatus; 40-carries pedestal; The 400-accommodation space; The 401-surface; The 402-perforate; The 403-negative pressure hole; 404,405-groove; 41-peels off the unit; The 410-contact site; 411-first through hole; The 412-plate body; 413-first fixed via; 414-first protuberance; The 42-base body; The 420-fore-set; The 421-circular hole; The 422-fixed lever; 423-guides through hole; 43-first elastomer; 44-peels off the unit; The sub-contact site of 440-; 441-second through hole; 442-second fixed via; 443-second protuberance; 45-second elastomer; Adjustment part, 46-position; The 460-holder; 4601-adjusts through hole; 461-is to guide rod; 462-adjusts spiral shell; The 463-hold-doun nut; 47-the 3rd elastomer; The 48-pull bar; The 480-body of rod; The 481-concave body; The 4810-groove; The 49-lid; The 5-suction nozzle; The 90-wafer; 900,901s-chip; The 902-film; The 91-active force; The 92-pull of vacuum; The h-height.
Embodiment
In order feature of the present invention, purpose and function to be had further cognitive and to understand, hereinafter the spy describes the relevant thin bilge construction of device of the present invention and the theory reason of design, so that can understand characteristics of the present invention, detailed description is presented below:
See also shown in Figure 3ly, described figure is chip of the present invention and the glued membrane stripping means first embodiment schematic flow sheet.Described method is to include the following step: at first carry out step 20, a wafer is provided, it is to be attached on the glued membrane, is to have a plurality of chips on the described wafer.The structure of described wafer is not given unnecessary details at this shown in Fig. 2 A and Fig. 2 B.Return shown in Figure 3ly, next carry out step 21, move on chip to a location of desiring to peel off, and fixing described chip.Fixed form in the step 21 can be resisted against on the chip of desiring to peel off by a suction nozzle, with the position of fixing described chip.
After the step 21, carry out step 22 again, it is to act on the glued membrane by an active force, makes described glued membrane break away from the described chip of desiring to peel off with ring-type and ecto-entad.In the present embodiment, described active force is to provide by a negative pressure of vacuum, acts on the film by negative pressure of vacuum, makes film begin by beginning to peel off around the chip.
See also shown in Figure 4ly, described figure is chip of the present invention and the glued membrane stripping means second embodiment schematic flow sheet.In the present embodiment, described method is to include the following step: at first carry out step 30, a wafer is provided, it is to be attached on the glued membrane, and described wafer has a plurality of chips.Carry out step 31 then, move on chip to a stripping off device of desiring to peel off, described stripping off device can segmentation progressively leave film.Then, carry out step 32, the fixing described chip of desiring to peel off, and provide an active force on described glued membrane.Then, make described stripping off device break away from the glued membrane that sticks together mutually with the described chip of desiring to peel off gradually with annular and ecto-entad again, so that described active force acts on the glued membrane that sticks together mutually with the described chip of desiring to peel off gradually, and make described glued membrane break away from the described chip of desiring to peel off gradually.Then, carry out step 33 again, when described glued membrane and described desire stripping off device present line and contact, take out the described chip of desiring to peel off.Repeat step 31 at last again to step 33, described a plurality of chips are peeled off by described film, and taken out described a plurality of chip.
Next the execution mode of the stripping off device in the key diagram 4.See also shown in Fig. 5 A and Fig. 5 B, described figure is three-dimensional decomposition of chip of the present invention and film peeling apparatus first preferred embodiment and generalized section.Described chip and film peeling apparatus 4 have a carrying pedestal 40, and peel off unit 41, a base body 42 and one first elastomer 43.Described carrying pedestal 40, it is to have an accommodation space 400, and the upper surface 401 of described carrying pedestal 40 can provide the carrying wafer, and offers a perforate 402, and described perforate 402 is to be connected with described accommodation space 400.As shown in Figure 6, have a plurality of negative pressure holes 403 on the surface 401 of described carrying pedestal 40, in order to increase the effect of negative pressure of vacuum, the surface 401 of described carrying pedestal 40 has more a plurality of grooves 404,405 and is connected with described negative pressure hole 403.
The described unit 41 of peeling off, it is to be arranged in the described accommodation space 400, a described end of peeling off unit 41 has a contact site 410, it is to extend described accommodation space 400 and be placed in the described perforate 402, described peeling off more offers one first through hole 411 in the unit 41, it is to run through whole to peel off unit 41 and present opening on described contact site 410.The end face of described contact site 410 is to contact with film.Described base body 42, it is to be arranged in the described accommodation space 400, and described base body 42 has a fore-set 420, and described fore-set 420 is to pass through described first through hole 411.Described fore-set 420 is an arc surface by the end face of described first through hole 411, and it is can form line with described film to contact.Described first elastomer 43, it is sheathed on the described fore-set 420, and an end of described first elastomer 43 is to abut mutually with the described inwall of peeling off unit 41 and the other end is to abut mutually with described base body 42.Described both sides of peeling off unit 41 are respectively arranged with a plate body 412.
In described inside of peeling off unit 41 at least one height can be set more and peel off unit 44, its front end has a sub-contact site 440, and in the present embodiment, the end face of described sub-contact site 440 is that the end face with described contact site 410 trims, and contacts with film.Peel off the combination that unit 41 and described at least one height are peeled off unit 44 by described, can be so that contact site 410 and described at least one sub-contact site 440 in whole stripping process, form a plurality of stripping bench.Described son is peeled off 44 central areas, unit and is had one second through hole 441, can provide described fore-set 420 to pass through.Peel off at described son equally and also be provided with one second elastomer 45 between unit 44 and the described base body 42.Described second elastomer 45 is to be sheathed on the described fore-set 420 and to be placed within described first elastomer 43.One end of described second elastomer 45 leans mutually with the inwall that described son is peeled off unit 44, and leans with the other end and described base body 42.
In order to control the described shift motion that unit 41 and described son are peeled off unit 44 of peeling off, more offer a circular hole 421 on the described fore-set 420, so that being provided, passes through by a fixed lever 422, and the two ends of described fixed lever 422 are the both sides respectively at described fore-set 420.In addition, described both sides of peeling off unit 41 offer one first fixed via 413 respectively, and described at least one son is peeled off the both sides of unit 44 and also offered one second fixed via 442.Fixed lever 422 two ends of the both sides of described fore-set 420 are to pass through described first fixed via 413 and described second fixed via 442 respectively, peel off the stroke that unit 44 moves to limit to the described unit 41 of peeling off with described son.
In order to adjust the described initial position that unit 41 and described son are peeled off unit 44 of peeling off, the downside of described base body 42 more is provided with adjustment part, a position 46, and it is to have a holder 460, pair of guide rods 461, an adjustment spiral shell 462 and a hold-doun nut 463.Described holder 460, it is a side that is arranged at described base body 42, has more one on the described holder 460 and adjusts through hole 4601.Described to guide rod 461, it is to be connected with described holder 460, and described is respectively by the guiding through hole 423 on the base body 42 to guide rod 461, and described base body 42 can be slided on to guide rod 461 in described.Described adjustment spiral shell 462, its be with described adjustment through hole 4601 mutually idol connect and utilize described hold-doun nut 463 to be fixed, an end of described adjustment spiral shell 462 is to lean with described base body 42.In addition, one the 3rd elastomer 47, it is to be arranged in the described accommodation space 400, described the 3rd elastomer 47 is to lean with an end and described base body 42 and lean with the inwall of the other end and described carrying pedestal 40.By adjustment part, described position 46, can adjust the position of described base body 42, and then adjust the position of described contact site 41 and described sub-contact site 44, and change the height h (as shown in Figure 7) of described contact site 41 and the described load bearing seat of sub-contact site 44 end face distances surface 401.
In order to control the action of peeling off unit 41, the present invention drives the whole unit 41 of peeling off by a pull bar 48 to move downward.Described pull bar 48 has a body of rod 480 and a concave body 481.Described concave body 481, it is to be connected with an end of the described body of rod 480, the both sides of described concave body 481 have a groove 4810 respectively, to be interlocked with the described plate body 412 of peeling off 41 both sides, unit respectively.By a lid 49, be arranged at the bottom of described carrying pedestal 40 again, so that the combination of components in the fixedly entire chip and film peeling apparatus to be provided.
See also shown in Fig. 8 A to Fig. 8 I, described figure is chip of the present invention and film peeling apparatus implementing procedure schematic diagram.At first shown in Fig. 8 A, when the chip of desiring to peel off 901 moves on the carrying pedestal 40, it is corresponding that the described contact site 410 of peeling off unit 41 and described son are peeled off the film 902 of the end face of sub-contact site 440 of unit 44 and chip 901 bottoms.Then shown in Fig. 8 B, the suction nozzle 5 of chip 901 tops that desire to peel off this moment moves down and utilizes pull of vacuum 92 fixing described chips 901.Next, consult shown in Fig. 8 C, negative pressure of vacuum is provided, this moment, negative pressure provided active force 91 on the film 902 of described chip 901 bottoms by negative pressure hole 403, made the film of chip 901 corners peel off in advance.Then shown in Fig. 8 D, then see through aforesaid pull bar 480, produce downward tension, move down to spur the described unit 41 of peeling off in the described plate body 412 (shown in Fig. 5 A) of peeling off 41 both sides, unit.When described when peeling off unit 41 and moving down, formerly be subjected to the effect of negative pressure of vacuum prior to the described film of peeling off contact site 410 tops of unit 41, make the film of chip 901 belows break away from described chip 901.
Shown in Fig. 8 E, owing to have one first protuberance 414 on the described internal side wall of peeling off unit 41, and described son is peeled off on the outer wall of unit 44 and is also had one second protuberance 443.Therefore when described when peeling off unit 41 and dropping to ad-hoc location, described first protuberance 414 can lean with described second protuberance 443, peel off unit 44 declines and drive described son, make described son peel off the film 902 that unit 44 breaks away from described chip 901 belows, and then make active force that negative pressure of vacuum produces on described film 902, make and originally peel off unit 44 contacted films 902 with described son and also break away from chip 901.When described peel off unit 41 and son and peel off unit 44 and break away from described film 902 after, this moment, the end face of only remaining described fore-set 420 tops contacted with the film 902 of described chip 901 bottoms.Because the end face of described fore-set 420 tops is to present circular-arcly, therefore described fore-set 420 is to present the line state of contact with described film 902 in this stage.Then, shown in Fig. 8 F, and described suction nozzle 5 is taken out described chip 901, and simultaneously negative pressure of vacuum 91 is removed.Then, shown in Fig. 8 G, Fig. 8 H and Fig. 8 I, the described unit 41 peeled off is peeled off unit 44 with described son and is returned back to original position by the elastic force involution of second elastomer 45 and first elastomer 43 respectively, to finish the whole program that chip leaves film of peeling off.See through the program of execution graph 8A to Fig. 8 I repeatedly, so that all chips are taken out.
Be to utilize one to peel off unit and son to peel off the unit combined among the embodiment of Fig. 5 A, as long as implementing have a structure of peeling off the unit just can reach the purpose that the present invention will break away from chip and film on the occasion, that is utilize described combination of peeling off unit and fore-set, can reach the purpose of peeling off chip.In another embodiment, also can peel off the unit and peel off the design principle of unit, a plurality of sons are set in the unit peel off the unit described peeling off, to be suitable for different chip size sizes according to son.
The above only is preferred embodiment of the present invention, when can not with the restriction scope of the invention.Promptly the equalization of doing according to claim of the present invention generally changes and modifies, and will not lose main idea of the present invention place, does not also break away from the spirit and scope of the present invention, and the former capital should be considered as further enforcement situation of the present invention.
Comprehensively above-mentioned, chip of the present invention and glued membrane stripping means and device thereof not only can effectively reduce phenomenon that in stripping process stress concentrates to avoid the chip breakage, more go for the chip size of different range, need change the problem of the stripping off device of other sizes frequently to avoid prior art.Therefore can satisfy the demand of industry, and then improve the competitiveness of described industry.
Claims (10)
1, a kind of chip and glued membrane stripping means is characterized in that, include the following step:
A., one wafer is provided, and it is to be attached on the glued membrane, and described wafer has a plurality of chips;
B. move on chip to a location of desiring to peel off, and fixing described chip; And
C. by an active force, make described glued membrane break away from the described chip of desiring to peel off with ring-type and ecto-entad.
2, a kind of chip and glued membrane stripping means is characterized in that, include the following step:
A., one wafer is provided, and it is to be attached on the glued membrane, and described wafer has a plurality of chips;
B. move on chip to a stripping off device of desiring to peel off;
C. fix the described chip of desiring to peel off, and provide an active force on described glued membrane; And
D. make described stripping off device break away from the glued membrane that sticks together mutually with the described chip of desiring to peel off gradually with annular and ecto-entad, so that described active force acts on the glued membrane that sticks together mutually with the described chip of desiring to peel off gradually, and make described glued membrane break away from the described chip of desiring to peel off gradually.
3, chip as claimed in claim 2 and glued membrane stripping means, it is more to include the following step:
E. when described glued membrane and described desire stripping off device present line and contact, take out the described chip of desiring to peel off; And
F. return step b repeated execution of steps b to f.
4, a kind of chip and glued membrane stripping off device is characterized in that, comprising:
One carrying pedestal, it is to have an accommodation space, and the upper surface of described carrying pedestal has a perforate and a plurality of negative pressure hole, and described perforate is to be connected with described accommodation space;
One peels off the unit, and it is to be arranged in the described accommodation space, and a described end of peeling off the unit has a contact site, and it is to extend described accommodation space and be placed in the described perforate, more offers one first through hole in the described contact site;
One base body, it is to be arranged in the described accommodation space, and described base body has a fore-set, and described fore-set is by described first through hole; And
One first elastomer, it is sheathed on the described fore-set, and described first an elastomeric end is to peel off that the unit abuts mutually and the other end is to abut mutually with described base body with described.
5, chip as claimed in claim 4 and glued membrane stripping off device, it is characterized in that: described both sides of peeling off the unit more are connected with a plate body, it is to have more a pull bar for described chip and glued membrane stripping off device, and it is to be interlocked with the described plate body of peeling off the both sides, unit, and wherein said pull bar has more:
One body of rod; And
One concave body, it is to be connected with an end of the described body of rod, the both sides of described concave body have a groove respectively, to be interlocked with described plate body respectively.
6, chip as claimed in claim 4 and glued membrane stripping off device is characterized in that: the two ends of described base body offer a guiding through hole more respectively.
7, chip as claimed in claim 6 and glued membrane stripping off device is characterized in that: it is to have more adjustment part, a position, comprising:
One holder, it is a side that is arranged at described base body, has more one on the described holder and adjusts through hole;
Pair of guide rods, it is to be connected with described holder, and described is respectively by described guiding through hole to guide rod, and described base body slides on to guide rod in described;
One adjusts spiral shell, and it is to connect by chance mutually with described adjustment through hole, and an end of described adjustment spiral shell is to lean with described base body; And
One the 3rd elastomer, it is to be arranged in the described accommodation space, described the 3rd elastomer is to lean with an end and described base body and lean with the inwall of the other end and described carrying pedestal.
8, chip as claimed in claim 4 and glued membrane stripping off device is characterized in that: described both sides of peeling off the unit have one first fixed via respectively, have more a fixed lever on the described fore-set, and its two ends are respectively by described first fixed via.
9, as claim 4 or 8 described chips and glued membrane stripping off device, it is characterized in that: it is to have more at least one son to peel off the unit, it is to be arranged at described peeling off in the unit, the top that described son is peeled off the unit has a sub-contact site, it is to be placed in described first through hole, the inside of described sub-contact site more offers second through hole that supplies described fore-set to pass through, the both sides that described son is peeled off the unit have one second fixed via respectively, in addition, described son is peeled off and is had more one second elastomer between unit and the described base body.
10, chip as claimed in claim 4 and glued membrane stripping off device is characterized in that: the top of described fore-set is an arc surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100976254A CN101295626A (en) | 2007-04-24 | 2007-04-24 | Method and device for stripping chip from glue film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100976254A CN101295626A (en) | 2007-04-24 | 2007-04-24 | Method and device for stripping chip from glue film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101295626A true CN101295626A (en) | 2008-10-29 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007100976254A Pending CN101295626A (en) | 2007-04-24 | 2007-04-24 | Method and device for stripping chip from glue film |
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| Country | Link |
|---|---|
| CN (1) | CN101295626A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101752204B (en) * | 2008-12-19 | 2011-06-29 | 均豪精密工业股份有限公司 | Method for separating chip and rubber film and chip removal method |
| CN113526118A (en) * | 2021-07-27 | 2021-10-22 | 中电鹏程智能装备有限公司 | Quick and reliable heat conduction material separating mechanism |
| CN113670815A (en) * | 2021-10-22 | 2021-11-19 | 南京日托光伏新能源有限公司 | Tensile test method for solder paste and core plate of MWT component |
-
2007
- 2007-04-24 CN CNA2007100976254A patent/CN101295626A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101752204B (en) * | 2008-12-19 | 2011-06-29 | 均豪精密工业股份有限公司 | Method for separating chip and rubber film and chip removal method |
| CN113526118A (en) * | 2021-07-27 | 2021-10-22 | 中电鹏程智能装备有限公司 | Quick and reliable heat conduction material separating mechanism |
| CN113670815A (en) * | 2021-10-22 | 2021-11-19 | 南京日托光伏新能源有限公司 | Tensile test method for solder paste and core plate of MWT component |
| CN113670815B (en) * | 2021-10-22 | 2022-02-18 | 南京日托光伏新能源有限公司 | Tensile test method for solder paste and core plate of MWT component |
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