TWI723583B - A die ejecting apparatus - Google Patents

A die ejecting apparatus Download PDF

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Publication number
TWI723583B
TWI723583B TW108137147A TW108137147A TWI723583B TW I723583 B TWI723583 B TW I723583B TW 108137147 A TW108137147 A TW 108137147A TW 108137147 A TW108137147 A TW 108137147A TW I723583 B TWI723583 B TW I723583B
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Taiwan
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demolding
support member
tubes
mold
module
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TW108137147A
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Chinese (zh)
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TW202015878A (en
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李喜澈
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南韓商細美事有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/01—Means for holding or positioning work
    • B26D7/018—Holding the work by suction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)

Abstract

This present invention is related to a die ejecting apparatus, and the die ejecting apparatus of the present invention includes the following elements. An ejecting module has a duct and a plurality of stripping tubes, and the stripping tubes are formed in a manner of surrounding the duct from the outer side to the inner side sequentially. A shell is adapted to accommodate the ejecting module, and the shell has an opening which the stripping tubes projects through and upward. A driving unit drives the stripping tubes in a vertical direction, and the stripping tubes are projected upward through the springs after the stripping tubes are moved downward by the driving unit. The stripping tubes projecting upward are moved downward from the outer side to the inner side sequentially, so that the stripping tubes are released from the edge portion of the molds.

Description

模具脫模裝置 Mold release device

本發明涉及模具脫模裝置，更詳細地，涉及在半導體製備工序中從基板分離模具的模具脫模裝置。 The present invention relates to a mold release device, and more specifically, to a mold release device that separates a mold from a substrate in a semiconductor manufacturing process.

通常，半導體器件透過重複進行一連串的製備工序來形成於用作半導體基板的矽晶片。形成有上述多個半導體器件的晶片可透過切割工序分割為多個模具，上述多個模具可透過焊接工序焊接於基板。 Generally, semiconductor devices are formed on silicon wafers used as semiconductor substrates by repeating a series of manufacturing processes. The wafer on which the plurality of semiconductor devices are formed can be divided into a plurality of molds through a dicing process, and the plurality of molds can be welded to the substrate through a soldering process.

用於執行上述模具焊接工序的裝置可包括：拾取模組，從分割為上述多個模具的晶片拾取上述多個模具並分離；以及焊接模組，用於向基板附著拾取的模具。上述拾取模組可包括：工作檯單元，用於支撐附著有上述晶片的晶片環；切割裝置，來能夠沿著垂直方向移動的方式設置，來從被上述工作檯單元支撐的晶片選擇性地分離模具；以及拾取單元，從上述晶片拾取上述模具並附著於基板。 The apparatus for performing the mold welding process may include: a pick-up module for picking up and separating the plurality of molds from the wafer divided into the plurality of molds; and a welding module for attaching the picked-up mold to the substrate. The pick-up module may include: a table unit for supporting the wafer ring to which the above-mentioned wafer is attached; and a cutting device arranged to be movable in a vertical direction to selectively separate the wafer supported by the table unit A mold; and a pickup unit that picks up the mold from the wafer and attaches it to the substrate.

通常，上述模具脫模裝置可包括：切割單元，沿著垂直方向推開上述模具，來從切割膠帶分離上述模具；罩，用於收容上述切割單元；驅動部，使上述切割單元沿著垂直方向移動；以及本體，用於收容上述驅動部。與如上所述的模具脫模裝置有關的例在韓國授權專利第10-0975500號中揭示。 Generally, the mold release device may include: a cutting unit that pushes the mold apart in a vertical direction to separate the mold from the dicing tape; a cover for accommodating the cutting unit; and a driving part that makes the cutting unit along the vertical direction Move; and the main body for accommodating the above-mentioned driving part. An example related to the mold release device described above is disclosed in Korean Patent No. 10-0975500.

但是，最近，隨著形成於晶片的模具的大小多樣化且厚度逐漸變薄，為了應對此趨勢，需要新形態的模具切割方法及裝置。尤其，在具有數十微米(μm)左右的厚度且具有大約15×10mm以上且40×30mm為止的大小的大型模具的情況下，上述模具與上述切割膠帶之間的粘結力相對大，因此，在模具切割過程中，可發生上述模具受損或不會被上述拾取單元拾取的拾取不良。 However, recently, as the size of the mold formed on the wafer is diversified and the thickness gradually becomes thinner, in order to cope with this trend, a new form of mold cutting method and apparatus is required. In particular, in the case of a large mold having a thickness of about tens of micrometers (μm) and a size of about 15×10 mm or more and 40×30 mm, the adhesive force between the mold and the dicing tape is relatively large, so During the mold cutting process, the above-mentioned mold may be damaged or the pick-up failure that will not be picked up by the above-mentioned pick-up unit may occur.

本發明的目的在於，提供可在與大型模具有關的模具切割過程中可解決如模具的受損、拾取不良等的問題的新形態的模具脫模裝置。 The object of the present invention is to provide a mold release device of a new form that can solve problems such as damage to the mold and poor pick-up during the mold cutting process related to large molds.

用於實現上述目的的本發明實施例的模具脫模裝置包括：脫模模組，具有導管和多個脫模管，上述多個脫模管以重重包圍上述導管外側的形態形成；外殼，用於收容上述脫模模組，具有使上述多個脫模管向上方突出的開口；以及驅動部，沿著垂直方向驅動上述多個脫模管，上述多個脫模管透過上述驅動部下降後透過多個彈簧向上方突出，在向上述上方突出的上述多個脫模管中，從配置於外側的脫模管開始依次下降來從上述模具分離，且從邊緣部分開始分離。 The mold demolding device of the embodiment of the present invention for achieving the above-mentioned object includes: a demolding module having a duct and a plurality of demolding tubes, the plurality of demolding tubes are formed in a form that surrounds the outer side of the duct; The demolding module is housed and has an opening that causes the plurality of demolding tubes to protrude upward; and a driving part that drives the plurality of demolding tubes in a vertical direction, and the plurality of demolding tubes are lowered through the driving part The plurality of springs protrude upward through a plurality of springs, and among the plurality of mold release pipes protruding upward, the mold release pipes arranged on the outside are sequentially lowered to be separated from the mold and separated from the edge portion.

並且，上述脫模模組還包括：引導支撐部件，在上述導管的下端部沿著水平方向彎曲延伸；多個支撐部件，在上述多個脫模管的下端部沿著水平方向彎曲延伸來依次層疊於上述引導支撐部件的上部；上述多個彈簧，配置於各個依次層疊的上述多個支撐部件的下部，分別隔開並支撐依次層疊的上述多個支撐部件；以及高度限制單元，用於限制上述多個支撐部件各自的上升高度，在位於上述多個支撐部件中的配置於最頂端的支撐部件下部的多個支撐部件及上述引導支撐部件形成垂直方向的開口部，在 配置於上述最頂端的支撐部件的下部面所形成的驅動部件貫通上述開口部來與上述驅動部相連接。 In addition, the demolding module further includes: a guide support member bent and extended in the horizontal direction at the lower end of the pipe; and a plurality of support members bent and extended in the horizontal direction at the lower end of the plurality of demolding tubes to be sequentially bent and extended in the horizontal direction. Laminated on the upper part of the guide support member; the plurality of springs are arranged at the lower part of each successively laminated plurality of support members to separate and support the successively laminated plurality of support members; and a height restricting unit for restricting The rising height of each of the plurality of support members is formed by the plurality of support members located at the lower part of the support member at the topmost among the plurality of support members and the guide support member forming an opening in the vertical direction. The drive member formed on the lower surface of the support member arranged at the top end penetrates the opening portion and is connected to the drive portion.

並且，在上述多個彈簧中，越是用於支撐配置於上方的支撐部件的彈簧，彈力可越減少。 In addition, among the above-mentioned plurality of springs, the more the spring for supporting the supporting member arranged above, the more the elastic force can be reduced.

並且，上述高度限制單元可用於限制多個支撐部件之間的隔開間隔。 In addition, the above-mentioned height restriction unit may be used to restrict the spacing between the plurality of support members.

並且，可在上述外殼的內側面設置有用於限制上述脫模模組的下方移動的擋止部。 In addition, a stopper for restricting downward movement of the demolding module may be provided on the inner surface of the housing.

本發明實施例的模具脫模裝置以多級驅動多個脫模管，因此，可從切割膠帶以沒有損傷的方式分離大型尺寸的模具，可防止不被拾取單元拾取的拾取不良。 The mold demolding device of the embodiment of the present invention drives a plurality of demolding tubes in multiple stages, therefore, large-sized molds can be separated from the dicing tape without damage, and picking failures that are not picked up by the picking unit can be prevented.

設置於本發明實施例的模具脫模裝置的多個脫模管利用具有互不相同的彈力的彈簧突出，從配置於外圍的脫模管依次下降，因此，無需設置額外的使脫模管突出且從配置於外圍的脫模管開始依次下降的額外的複雜的驅動裝置。 The multiple ejection tubes provided in the mold ejection device of the embodiment of the present invention protrude by springs having different elastic forces and descend sequentially from the ejection tubes arranged on the periphery. Therefore, there is no need to provide additional ejection tubes to protrude. And an extra complicated driving device that descends sequentially from the demolding tube arranged on the periphery.

設置於本發明實施例的模具脫模裝置的模具脫模模組被彈簧驅動，因此，具有永久性。 The mold demolding module set in the mold demolding device of the embodiment of the present invention is driven by a spring, so it is permanent.

10:晶片 10: chip

20:模具 20: Mould

30:框架 30: frame

32:切割膠帶 32: Cutting tape

40:工作檯 40: workbench

42:夾具 42: Fixture

44:擴張環 44: expansion ring

50:拾取裝置 50: Pickup device

100:模具脫模裝置 100: Mold release device

110:外殼 110: shell

111:本體部 111: body part

112:罩 112: Hood

113:開口 113: opening

114:多個真空孔 114: Multiple vacuum holes

120:脫模模組 120: demolding module

121:第一脫模器 121: The first stripper

122:第二脫模器 122: second stripper

123:第三脫模器 123: The third stripper

124:第四脫模器 124: The fourth stripper

121a:第一脫模管 121a: The first demoulding tube

122a:第二脫模管 122a: The second demolding tube

123a:第三脫模管 123a: The third stripping tube

124a:第四脫模管 124a: The fourth demoulding tube

121b:第一支撐部件 121b: The first support member

122b:第二支撐部件 122b: second support member

123b:第三支撐部件 123b: The third support member

124b:第四支撐部件 124b: The fourth support member

125:引導脫模器 125: Guide stripper

125a:導管 125a: Catheter

125b、135b:引導支撐部件 125b, 135b: guide support parts

126、126a、126b:高度限制單元 126, 126a, 126b: height restriction unit

127:彈簧 127: Spring

127a:第一彈簧 127a: first spring

127b:第二彈簧 127b: second spring

127c:第三彈簧 127c: third spring

127d:第四彈簧 127d: fourth spring

128:開口部 128: opening

129:驅動部件 129: drive parts

130:驅動部 130: Drive

132:頭部 132: Head

134:驅動軸 134: drive shaft

137:擋止部 137: Stop

圖1為用於說明本發明一實施例的模具脫模裝置的簡要結構圖。 Fig. 1 is a schematic configuration diagram for explaining a mold release device according to an embodiment of the present invention.

圖2為用於說明圖1所示的模具脫模裝置的剖視圖。 Fig. 2 is a cross-sectional view for explaining the mold release device shown in Fig. 1.

圖3為用於說明圖2所示的脫模模組的立體圖。 Fig. 3 is a perspective view for explaining the demolding module shown in Fig. 2.

圖4a至圖4b為從互不相同的角度觀察的設置於切割模組的高度固定部件的剖視圖。 4a to 4b are cross-sectional views of the height fixing member provided in the cutting module viewed from different angles.

圖4c至圖4d為從互不相同的角度觀察的設置於切割模組的彈簧的剖視圖。 4c to 4d are cross-sectional views of the spring provided in the cutting module viewed from different angles.

圖5a至圖5f為用於說明圖2所示的脫模模組的動作過程的動作狀態圖。 5a to 5f are operation state diagrams for explaining the operation process of the demolding module shown in FIG. 2.

圖6為用於說明根據圖5a至圖5f所示的脫模模組的動作過程的模具的分離過程的動作狀態圖。 Fig. 6 is an action state diagram for explaining the separation process of the mold according to the action process of the demolding module shown in Figs. 5a to 5f.

以下，本發明參照示出本發明實施例的所附圖示進行更加詳細的說明。然而，本發明並不局限於由下文說明的實施例來構成，可具體化為與此不同的各種形態。下述實施例並非用於完整地完成本發明，而是使本發明所屬領域中具通常知識者能更完整地理解本發明的範圍。 Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings showing embodiments of the present invention. However, the present invention is not limited to being constituted by the embodiments described below, and can be embodied in various forms different from this. The following embodiments are not used to completely complete the present invention, but to enable those with ordinary knowledge in the field to which the present invention belongs to more fully understand the scope of the present invention.

當說明一個要素配置於另一要素或與另一要素相連接時，上述要素可直接配置於上述另一要素或與上述另一要素直接連接，或者兩者之間可具有其他要素或層。與此不同地是，當說明一個要素直接配置於另一要素或與另一要素直接連接時，兩者之間沒有其他要素。為了說明如各要素、組成、區域、層和/或部分的各項目，可使用第一、第二、第三等術語，但上述項目並不局限於這些術語。 When it is described that an element is arranged on or connected to another element, the aforementioned element may be directly arranged on or directly connected to the other element, or there may be other elements or layers between the two. The difference is that when it is described that an element is directly arranged on or directly connected to another element, there is no other element between the two. In order to describe each item such as each element, composition, region, layer, and/or part, terms such as first, second, and third may be used, but the above-mentioned items are not limited to these terms.

在下述內容中使用的專業術語僅用於說明特定實施例，並不限定本發明。並且，除非另行定義，包括技術術語及科學術語的所有術語的含義與本發明所屬技術領域的普通技術人員所理解的含義相同。如在常規詞典中限定的上述術語在相關技術和本發明說明的文脈中具有與它們一致的含義，除非明確定義，不應解釋為理想或過於形式上的含義。 The technical terms used in the following content are only used to describe specific embodiments and do not limit the present invention. Moreover, unless otherwise defined, the meanings of all terms including technical terms and scientific terms are the same as understood by those of ordinary skill in the technical field to which the present invention belongs. The above-mentioned terms as defined in conventional dictionaries have meanings consistent with them in the context of related technologies and the description of the present invention, and unless clearly defined, they should not be interpreted as ideal or excessively formal meanings.

參照本發明的理想實施例的簡要圖解說明本發明的實施例。藉此，可從上述圖解的形狀充分預測變化，例如製造方法和/或允許誤差的變化。因此，本發明實施例的並不局限於透過圖解說明的區域的特定形狀來說明，而是包括形狀的偏差，在附圖中說明的區域僅為簡要的區域，這些形狀並不用於說明區域的準確形狀，並且，並不限定本發明的範圍。 The embodiment of the present invention will be explained with reference to a brief illustration of the ideal embodiment of the present invention. With this, it is possible to sufficiently predict changes, such as changes in manufacturing methods and/or allowable errors, from the above-illustrated shape. Therefore, the embodiments of the present invention are not limited to the description through the specific shape of the illustrated area, but include the deviation of the shape. The area illustrated in the drawing is only a brief area, and these shapes are not used to describe the area. The shape is accurate and does not limit the scope of the present invention.

圖1為用於說明本發明一實施例的模具脫模裝置的簡要結構圖。 Fig. 1 is a schematic configuration diagram for explaining a mold release device according to an embodiment of the present invention.

參照圖1，本發明一實施例的模具脫模裝置100可較佳地用於如下的模具焊接工序，即，從由多個模具20形成的晶片分離上述多個模具20並焊接於如引線框或印刷電路板等的基板。上述晶片10可透過切割工序分割為多個模具20，能夠以附著於切割膠帶32的狀態提供。在此情況下，上述切割膠帶32可安裝於安裝框架30，上述安裝框架30的直徑大於上述晶片10的直徑。 1, the mold release device 100 according to an embodiment of the present invention can be preferably used in the following mold welding process, that is, the plurality of molds 20 are separated from the wafer formed by the plurality of molds 20 and welded to, for example, a lead frame Or printed circuit boards and other substrates. The above-mentioned wafer 10 can be divided into a plurality of molds 20 through a dicing process, and can be provided in a state of being attached to the dicing tape 32. In this case, the dicing tape 32 may be installed on the mounting frame 30, and the diameter of the mounting frame 30 is larger than the diameter of the wafer 10.

上述安裝框架30可被配置於工作檯40的夾具42把持，上述切割膠帶32的邊緣部位可被配置於上述工作檯40的擴張環44支撐。為擴張上述切割膠帶32，上述夾具42可向垂直下方移動上述安裝框架30，藉此，上述切割膠帶32可被上述擴張環44擴張。最終，即可擴張附著於上述切割膠帶32的多個模具20之間的間隔。 The mounting frame 30 can be held by a clamp 42 arranged on the table 40, and the edge portion of the dicing tape 32 can be supported by an expansion ring 44 arranged on the table 40. In order to expand the dicing tape 32, the clamp 42 can move the mounting frame 30 vertically downward, whereby the dicing tape 32 can be expanded by the expansion ring 44. Finally, the space between the dies 20 attached to the dicing tape 32 can be expanded.

為從上述切割膠帶32分離上述多個模具20，可在上述工作檯40的下部設置使上述多個模具20選擇性地上升的模具脫模裝置100，可在上述工作檯40的上部設置用於拾取透過上述模具脫模裝置100上升的模具20的拾取裝置50。 In order to separate the plurality of molds 20 from the dicing tape 32, a mold release device 100 that selectively raises the plurality of molds 20 may be provided at the lower part of the worktable 40, and may be provided on the upper part of the worktable 40 for The pick-up device 50 picks up the mold 20 raised through the mold release device 100 described above.

上述模具脫模裝置100可用於從上述切割膠帶32切割上述多個模具20。 The mold release device 100 may be used to cut the plurality of molds 20 from the dicing tape 32.

圖2為用於說明圖1所示的模具脫模裝置的簡要剖視圖，圖3為用於說明圖2所示的脫模模組的立體圖，圖4a至圖4b為從互不相同的角度觀察設置於切割模組的高度固定部件的剖視圖，圖4c至圖4d為從互不相同的角度觀察設置於切割模組的彈簧的剖視圖。 2 is a schematic cross-sectional view for explaining the mold release device shown in FIG. 1, FIG. 3 is a perspective view for explaining the mold release module shown in FIG. 2, and FIGS. 4a to 4b are viewed from different angles A cross-sectional view of the height fixing member provided in the cutting module. FIGS. 4c to 4d are cross-sectional views of the spring provided in the cutting module viewed from different angles.

參照圖2至圖4d，本發明一實施例的模具脫模裝置100包括外殼110、脫模模組120以及驅動部130。 Referring to FIGS. 2 to 4d, the mold demolding device 100 according to an embodiment of the present invention includes a housing 110, a demolding module 120 and a driving part 130.

外殼110包括本體部111以及罩112。 The housing 110 includes a main body 111 and a cover 112.

本體部111的上部及下部呈開放狀，用於收容脫模模組120。本體部111的上部與罩112相結合。從本體部111的下部插入脫模模組120，可被能夠裝拆的擋止部137固定。擋止部137在外殼110的本體部111的內側面限制脫模模組120向下方的移動。例如，擋止部137可以為以能夠裝拆的方式設計的卡環。可透過能夠裝拆的擋止部137容易組裝及分離脫模模組120。 The upper and lower parts of the main body 111 are open, and are used for accommodating the demolding module 120. The upper part of the main body 111 is combined with the cover 112. The demolding module 120 is inserted from the lower part of the main body 111 and can be fixed by a stopper 137 that can be attached and detached. The stopper 137 restricts the downward movement of the demolding module 120 on the inner surface of the main body 111 of the housing 110. For example, the stopper 137 may be a snap ring designed to be detachable. The demolding module 120 can be easily assembled and separated through the stopper 137 that can be assembled and disassembled.

罩112設置於本體部111的上部。可包括：開口113，使脫模模組120的多個脫模管121a、122a、123a、124a向上方突出；以及多個真空孔114，形成於開口113的周圍。如一例，開口113可呈四邊形或圓形。 The cover 112 is provided on the upper part of the main body 111. It may include: an opening 113 to allow the plurality of demolding tubes 121a, 122a, 123a, 124a of the demolding module 120 to protrude upward; and a plurality of vacuum holes 114 formed around the opening 113. As an example, the opening 113 may be quadrilateral or circular.

脫模模組120包括引導脫模器125、多個脫模器121、122、123、124、多個彈簧127以及多個高度限制單元126。 The demolding module 120 includes a guiding demolder 125, a plurality of demolders 121, 122, 123, 124, a plurality of springs 127, and a plurality of height restriction units 126.

多個脫模器121、122、123、124包括多個脫模管121a、122a、123a、124a以及在多個脫模管的下端部沿著水平方向彎曲延伸的支撐部件121b、122b、123b、124b。支撐部件121b、122b、123b、124b依次層疊，在位於最頂端的第一支撐部件121b的下部面向下方突出的驅動部件129貫通第二支撐部件122b、第三支撐部件123b、第四支撐部件124b及形成於引導支撐部件125b的開口部128來與驅動部130相連接。 The plurality of demolders 121, 122, 123, 124 include a plurality of demolding tubes 121a, 122a, 123a, 124a and supporting members 121b, 122b, 123b, 124b. The support members 121b, 122b, 123b, and 124b are sequentially stacked, and the driving member 129 protruding downward from the lower surface of the first support member 121b located at the top end penetrates the second support member 122b, the third support member 123b, the fourth support member 124b, and The opening portion 128 formed in the guide support member 125b is connected to the driving portion 130.

驅動部130可包括配置於本體部111的內部來與上述脫模模組120相結合並傳遞驅動力的驅動軸134。在此情況下，可在驅動軸134的上部設置頭部132。頭部132可透過設置磁石來與從位於最頂端的第一支撐部件121b延伸的驅動部件相結合。藉此，驅動軸134可向第一支撐部件121b傳遞朝向上方或下方的驅動力。 The driving part 130 may include a driving shaft 134 disposed inside the main body 111 to be combined with the demolding module 120 and transmit driving force. In this case, a head 132 may be provided on the upper part of the drive shaft 134. The head 132 can be combined with a driving part extending from the first support part 121b located at the top end by arranging a magnet. Thereby, the driving shaft 134 can transmit the driving force upward or downward to the first support member 121b.

雖未圖式，驅動部130可包括用於提供上述驅動力的動力提供部(未圖示)，上述動力提供部可利用馬達、氣缸、動力傳遞要素等來以各種方法構成。 Although not shown in the drawings, the drive unit 130 may include a power supply unit (not shown) for supplying the above-mentioned driving force, and the power supply unit can be constructed in various ways using a motor, an air cylinder, a power transmission element, and the like.

以下，將詳細說明脫模模組120。在附圖中，繪示出四個脫模器，但並不限定於此。例如，在模具的大小大的情況下，脫模器的數量增加，在模具的大小小的情況下，脫模器的數量可減少。 Hereinafter, the demolding module 120 will be described in detail. In the drawings, four ejectors are shown, but they are not limited thereto. For example, in the case where the size of the mold is large, the number of strippers increases, and in the case where the size of the mold is small, the number of strippers can be reduced.

脫模模組120包括引導脫模器125、多個脫模器121、122、123、124、多個彈簧127以及多個高度限制單元126。 The demolding module 120 includes a guiding demolder 125, a plurality of demolders 121, 122, 123, 124, a plurality of springs 127, and a plurality of height restriction units 126.

引導脫模器125包括：導管125a；以及引導支撐部件125b，從導管125a沿著水平方向彎曲並以規定長度延伸形成。在導管125a中，可向管內部提供負壓來吸附切割膠帶32。並且，在導管125a中，可在切割過程最後步驟向管內部提供正壓來從切割膠帶32分離模具的中心部分。 The guide stripper 125 includes a duct 125a; and a guide support member 125b, which is bent in the horizontal direction from the duct 125a and extends with a predetermined length. In the duct 125a, negative pressure may be provided to the inside of the tube to suck the dicing tape 32. Also, in the duct 125a, a positive pressure may be applied to the inside of the tube in the final step of the cutting process to separate the center part of the mold from the cutting tape 32.

第一脫模器121、第二脫模器122、第三脫模器123、第四脫模器124包括：第一脫模管121a、第二脫模管122a、第三脫模管123a、第四脫模管124a；以及第一支撐部件121b、第二支撐部件122b、第三支撐部件123b、第四支撐部件124b，分別從第一脫模管121a、第二脫模管122a、第三脫模管123a、第四脫模管124a的下端部沿著水平方向彎曲形成，來沿著垂直方向層疊於引導支撐部件125b的上部。在此情況下，第一脫模管121a、第二 脫模管122a、第三脫模管123a、第四脫模管124a以如下的形態形成，即，以導管125a為中心重重包圍導管125a的外側。 The first stripper 121, the second stripper 122, the third stripper 123, and the fourth stripper 124 include: a first stripper tube 121a, a second stripper tube 122a, a third stripper tube 123a, The fourth demolding tube 124a; and the first support member 121b, the second support member 122b, the third support member 123b, and the fourth support member 124b, respectively, from the first demolding tube 121a, the second demolding tube 122a, and the third The lower end portions of the demolding tube 123a and the fourth demolding tube 124a are bent in the horizontal direction, and are stacked on the upper part of the guide support member 125b in the vertical direction. In this case, the first demolding tube 121a, the second The demolding tube 122a, the third demolding tube 123a, and the fourth demolding tube 124a are formed in such a manner that the outer side of the duct 125a is heavily surrounded with the duct 125a as the center.

具體地，第三脫模管123a包圍第四脫模管124a的外側，上述第四脫模管124a包圍導管125a的外側。並且，第二脫模管122a包圍第三脫模管123a的外側。並且，第一脫模管121a包圍第二脫模管122a的外側。當驅動軸134下降或上升時，多個脫模管各自的上端部的高度相互一致。 Specifically, the third demolding tube 123a surrounds the outer side of the fourth demolding tube 124a, and the above-mentioned fourth demolding tube 124a surrounds the outer side of the duct 125a. In addition, the second demolding pipe 122a surrounds the outside of the third demolding pipe 123a. In addition, the first demolding tube 121a surrounds the outside of the second demolding tube 122a. When the drive shaft 134 descends or rises, the heights of the respective upper ends of the plurality of demolding tubes coincide with each other.

引導支撐部件125b在導管125a的下端部沿著水平方向彎曲來沿著外側方向延伸形成。 The guide support member 125b is bent in the horizontal direction at the lower end of the pipe 125a to extend in the outer direction.

並且，第一支撐部件121b、第二支撐部件122b、第三支撐部件123b、第四支撐部件124b分別在第一脫模管121a、第二脫模管122a、第三脫模管123a、第四脫模管124a的下端部沿著水平方向彎曲來沿著外側方向延伸形成。 In addition, the first support member 121b, the second support member 122b, the third support member 123b, and the fourth support member 124b are respectively mounted on the first demolding tube 121a, the second demolding tube 122a, the third demolding tube 123a, and the fourth demolding tube 123a. The lower end of the mold release pipe 124a is bent in the horizontal direction to extend in the outer direction.

沿著水平方向延伸形成的支撐部件121b、122b、123b、124b具有沿著垂直方向相互層疊於引導支撐部件125b的上部的結構。 The support members 121b, 122b, 123b, and 124b formed to extend in the horizontal direction have a structure in which they are stacked on top of the guide support member 125b in the vertical direction.

具體地，從包圍導管125a的第四脫模管124a延伸的第四支撐部件124b配置於引導支撐部件125b的上部。並且，從包圍第四脫模管124a的第三脫模管123a延伸的第三支撐部件123b配置於上述第四支撐部件124b的上部。並且，從包圍第三脫模管123a的第二脫模管122a延伸的第二支撐部件122b配置於上述第三支撐部件123b的上部。並且，從包圍第二脫模管122a的第一脫模管121a延伸的第一支撐部件121b配置於第二支撐部件122b的上部。 Specifically, the fourth support member 124b extending from the fourth demolding tube 124a surrounding the duct 125a is arranged on the upper portion of the guide support member 125b. In addition, the third supporting member 123b extending from the third demolding tube 123a surrounding the fourth demolding tube 124a is arranged above the fourth supporting member 124b. In addition, the second supporting member 122b extending from the second demolding tube 122a surrounding the third demolding tube 123a is arranged above the third supporting member 123b. In addition, the first supporting member 121b extending from the first demolding tube 121a surrounding the second demolding tube 122a is arranged on the upper portion of the second supporting member 122b.

在位於在最頂端配置的第一支撐部件121b的下部的多個支撐部件122b、123b、124b及上述引導支撐部件125b形成垂直方向的開口部128，在 第一支撐部件121b的下部面突出形成的驅動部件129貫通上述開口部128來與上述驅動部的頭部132相連接。 The plurality of support members 122b, 123b, 124b and the guide support member 125b located below the first support member 121b arranged at the top end form an opening 128 in the vertical direction. The driving member 129 formed to protrude from the lower surface of the first support member 121b penetrates the opening 128 and is connected to the head 132 of the driving unit.

參照圖4c及圖4d，多個彈簧127配置於相鄰的多個支撐部件121b、122b、123b、124b、125b之間來從配置於下部的支撐部件隔開支撐配置於上部的支撐部件。 4c and 4d, the plurality of springs 127 are arranged between the adjacent plurality of supporting members 121b, 122b, 123b, 124b, 125b to support the supporting member arranged on the upper part apart from the supporting member arranged on the lower part.

第一彈簧127a、第二彈簧127b、第三彈簧127c、第四彈簧127d可由多個構成。可在多個支撐部件的上面或下面形成槽，來配置彈簧127。並且，在從脫模模組120的上部觀察的情況下，多個彈簧127可分別設置於互不干涉的位置。多個彈簧127越配置於上方，可增加或減少彈力。 The first spring 127a, the second spring 127b, the third spring 127c, and the fourth spring 127d may be composed of multiple ones. The spring 127 may be arranged by forming grooves on the upper or lower surface of a plurality of supporting members. In addition, when viewed from the upper part of the demolding module 120, the plurality of springs 127 may be respectively provided at positions that do not interfere with each other. The more the springs 127 are arranged above, the elastic force can be increased or decreased.

第一彈簧127a配置於第一支撐部件121b與第二支撐部件122b之間來從第二支撐部件122b隔開支撐第一支撐部件121b。並且，第二彈簧127b配置於第二支撐部件122b與第三支撐部件123b之間來從第三支撐部件123b隔開支撐第二支撐部件122b。並且，第三彈簧127c配置於第三支撐部件123b與第四支撐部件124b之間來從第四支撐部件124b隔開支撐第三支撐部件123b。並且，第四彈簧127d配置於第四支撐部件124b與引導支撐部件125b之間來從引導支撐部件125b隔開支撐第四支撐部件124b。 The first spring 127a is disposed between the first support member 121b and the second support member 122b to support the first support member 121b apart from the second support member 122b. In addition, the second spring 127b is disposed between the second support member 122b and the third support member 123b, and supports the second support member 122b while being separated from the third support member 123b. In addition, the third spring 127c is arranged between the third support member 123b and the fourth support member 124b to support the third support member 123b in a distance from the fourth support member 124b. In addition, the fourth spring 127d is disposed between the fourth support member 124b and the guide support member 125b to support the fourth support member 124b in a distance from the guide support member 125b.

在多個彈簧127a、127b、127c、127d中，越配置於上方來支撐支撐部件的彈簧，彈力越減少。配置於最頂端的第一彈簧127a的彈力最弱，配置於最底端的第四彈簧127d的彈力最強。即，彈力從第一彈簧127a至第四彈簧127d順序變強。 Among the plurality of springs 127a, 127b, 127c, and 127d, the more the spring that supports the support member is arranged above, the elastic force decreases. The elastic force of the first spring 127a arranged at the top end is the weakest, and the elastic force of the fourth spring 127d arranged at the bottom end is the strongest. That is, the elastic force becomes stronger sequentially from the first spring 127a to the fourth spring 127d.

與支撐部件121b、122b、123b、124b相連接的脫模管121a、122a、123a、124a透過驅動部130下降，並透過彈力互不相同的多個彈簧127向上部方向發射來突出。在此情況下，多個脫模管幾乎同時突出。 The demolding pipes 121a, 122a, 123a, and 124a connected to the supporting members 121b, 122b, 123b, 124b are lowered by the driving part 130, and projected upward by a plurality of springs 127 having different elastic forces. In this case, multiple demolding tubes protrude almost simultaneously.

之後，在驅動部130下降的情況下，被彈力最弱的彈簧127a支撐的第一支撐部件121b最先下降，來與第二支撐部件122b相接觸。之後，以彈力弱的彈簧順序，第二支撐部件122b下降來與第三支撐部件123b相接觸，第三支撐部件123b下降來與第四支撐部件124b相接觸，第四支撐部件124b下降來與引導支撐部件125b相接觸。藉此，從位於最外圍的第一脫模管121a依次下降，位於中心部分的第四脫模管124a最後下降。因此，從切割膠帶32的最外圍分離模具20。 After that, when the driving unit 130 descends, the first support member 121b supported by the spring 127a with the weakest elastic force descends first to come into contact with the second support member 122b. After that, in a spring sequence with weak elasticity, the second support member 122b descends to contact the third support member 123b, the third support member 123b descends to contact the fourth support member 124b, and the fourth support member 124b descends to contact the guide. The supporting members 125b are in contact with each other. Thereby, it descends sequentially from the first demolding pipe 121a located at the outermost periphery, and the fourth demolding pipe 124a located at the central part descends last. Therefore, the mold 20 is separated from the outermost periphery of the dicing tape 32.

具體地，根據驅動部130的下降來使驅動部件129下降的情況如下。 Specifically, the case where the driving member 129 is lowered according to the lowering of the driving unit 130 is as follows.

到被彈力最弱的彈簧127a支撐的位於最頂端的第一支撐部件121b和配置於下部的第二支撐部件122b之間消失為止，分別維持第二支撐部件122b與第三支撐部件123b之間的間隔、第三支撐部件123b與第四支撐部件124b之間的間隔、第四支撐部件124b與引導支撐部件125b之間的間隔。 Until the gap between the first support member 121b at the top end supported by the spring 127a with the weakest elasticity and the second support member 122b arranged in the lower part disappears, the gap between the second support member 122b and the third support member 123b is maintained. The interval, the interval between the third support member 123b and the fourth support member 124b, and the interval between the fourth support member 124b and the guide support member 125b.

之後，在第一支撐部件121b與第二支撐部件122b相接觸的狀態下，第二支撐部件122b與第三支撐部件123b之間的間隔逐漸變小。之後，在第一支撐部件121b、第二支撐部件122b、第三支撐部件123b相接觸的狀態下，第三支撐部件123b與第四支撐部件124b之間的間隔逐漸變小。之後，被彈力最強的彈簧127d支撐的位於最底端的第四支撐部件124b，最後與引導支撐部件125b相接觸。 After that, in a state where the first support member 121b and the second support member 122b are in contact, the interval between the second support member 122b and the third support member 123b gradually becomes smaller. After that, in a state where the first support member 121b, the second support member 122b, and the third support member 123b are in contact, the interval between the third support member 123b and the fourth support member 124b gradually decreases. After that, the fourth support member 124b at the bottom end supported by the spring 127d with the strongest elastic force is finally in contact with the guide support member 125b.

即，若以脫模管121a、122a、123a、124a為基準觀察，則配置於最外側及外圍的第一脫模管121a下降，之後，以第二脫模管122a、第三脫模管123a、第四脫模管124a的順序下降。 That is, when viewed on the basis of the demolding tubes 121a, 122a, 123a, and 124a, the first demolding tube 121a arranged on the outermost side and the periphery descends, and then the second demolding tube 122a, the third demolding tube 123a , The order of the fourth demolding pipe 124a descends.

根據上述順序，從切割膠帶分離模具，上述模具從邊緣開始分離。 According to the above sequence, the mold is separated from the dicing tape, and the mold is separated from the edge.

在多個彈簧127越配置於上方，彈簧的彈力越減少的情況下，從配置於外圍的脫模管依次下降驅動，並可從模具的邊緣開始分離，從而可防止模具受損。 When the plurality of springs 127 are arranged above, the elastic force of the springs decreases, the ejection pipes arranged on the periphery are sequentially lowered and driven, and can be separated from the edge of the mold, thereby preventing damage to the mold.

參照圖4a至圖4b，設置於切割模組的高度限制單元126可將支撐部件121b、122b、123b、124b固定於引導支撐部件135b或固定於在下端配置的支撐部件。在從脫模模組120的上部觀察的情況下，各個高度固定單元136可設置於互不干涉的位置。 4a to 4b, the height restriction unit 126 provided in the cutting module can fix the support members 121b, 122b, 123b, 124b to the guide support member 135b or to the support member disposed at the lower end. When viewed from the upper part of the demolding module 120, the respective height fixing units 136 may be arranged in positions that do not interfere with each other.

高度限制單元126限制多個支撐部件的突出並上升的高度。例如，高度限制單元126可以為在本體形成有頭部的螺絲。並且，高度限制單元126可以為插入方式的螺絲。在插入方式的情況下，與上部支撐部件的下部面形成為一體來貫通形成於下部支撐部件的貫通孔並隔著規定間隔固定。 The height restriction unit 126 restricts the protrusion and rising height of the plurality of support members. For example, the height restriction unit 126 may be a screw with a head formed on the body. In addition, the height restriction unit 126 may be an insertion screw. In the case of the insertion method, it is formed integrally with the lower surface of the upper support member, penetrates the through hole formed in the lower support member, and is fixed at a predetermined interval.

圖4a所示的高度限制單元126a限制可在第三支撐部件123b與第四支撐部件124b之間隔開的間隔，圖4b所示的高度限制單元126b限制可在第一支撐部件121b與第二支撐部件122b之間隔開的間隔。雖未圖示，還設置用於限制引導支撐部件125b與第四支撐部件124b之間間隔的高度限制單元，和用於限制第三支撐部件123b與第二支撐部件122b之間間隔的高度限制單元。 The height restriction unit 126a shown in FIG. 4a restricts the interval that can be separated between the third support member 123b and the fourth support member 124b, and the height restriction unit 126b shown in FIG. 4b restricts the distance between the first support member 121b and the second support member 121b. The interval between the parts 122b. Although not shown, a height restricting unit for restricting the interval between the guide support member 125b and the fourth support member 124b, and a height restricting unit for restricting the interval between the third support member 123b and the second support member 122b are also provided .

尤其，在將形成有多個臺階的螺絲用作高度限制單元126的情況下，可利用多個臺階一次性限制多個支撐部件121b、122b、123b、124b之間的隔開間隔。 In particular, in the case where a screw formed with a plurality of steps is used as the height restriction unit 126, the plurality of steps can be used to restrict the spacing between the plurality of support members 121b, 122b, 123b, and 124b at one time.

圖5a至圖5f為用於說明圖2所示的脫模模組的動作過程的動作狀態圖，圖6為示出根據模具脫模裝置的動作的模具的分離過程的圖。 5a to 5f are operation state diagrams for explaining the operation process of the demolding module shown in FIG. 2, and FIG. 6 is a diagram showing the separation process of the mold according to the operation of the mold demolding device.

圖5a及圖6的(a)部分為示出最頂端支撐部件121b的驅動部件129透過驅動部130下降來壓接第一彈簧127a、第二彈簧127b、第三彈簧127c、 第四彈簧127d的狀態且多個支撐部件121b、122b、123b、124b相接觸的狀態的圖。在此情況下，向脫模管121a、122a、123a、124a和導管125a提供負壓。 Figures 5a and 6(a) show that the driving member 129 of the topmost support member 121b is lowered by the driving part 130 to press the first spring 127a, the second spring 127b, the third spring 127c, A diagram showing the state of the fourth spring 127d and the state where the plurality of support members 121b, 122b, 123b, and 124b are in contact. In this case, negative pressure is supplied to the demolding tubes 121a, 122a, 123a, 124a and the duct 125a.

圖5b及圖6的(b)部分為示出透過第一彈簧127a、第二彈簧127b、第三彈簧127c、第四彈簧127d的彈力來使脫模管121a、122a、123a、124a向上方突出的狀態的圖。在此情況下，模具的邊緣部分透過突出的脫模管121a、122a、123a、124a分離。在此情況下，向脫模管121a、122a、123a、124a和導管125a提供負壓。 Figures 5b and 6(b) show that the ejection tubes 121a, 122a, 123a, 124a protrude upward through the elastic forces of the first spring 127a, the second spring 127b, the third spring 127c, and the fourth spring 127d Diagram of the state. In this case, the edge portion of the mold is separated through the protruding demolding tubes 121a, 122a, 123a, 124a. In this case, negative pressure is supplied to the demolding tubes 121a, 122a, 123a, 124a and the duct 125a.

參照圖5c至圖5f和圖6的(c)部分至圖6的(f)部分，具有最弱的彈力的第一彈簧127a最先被壓接並使位於外圍的第一脫模管121a最先下降驅動。之後，具有第二弱的彈力的第二彈簧127b被壓接來使第二脫模管122a下降驅動。之後，第三彈簧127c被壓接來使第三脫模管123a下降驅動。之後，第四彈簧127d被壓接來使第四脫模管124a下降驅動。即，從配置於外圍的脫模管下降驅動並從模具的邊緣開始分離。在此情況下，向脫模管121a、122a、123a、124a和導管125a提供負壓。 5c to FIG. 5f and part (c) of FIG. 6 to part (f) of FIG. 6, the first spring 127a having the weakest elastic force is first crimped and the first demolding tube 121a located at the periphery is the most Drive down first. After that, the second spring 127b having the second weak elastic force is crimped to drive the second demolding tube 122a down. After that, the third spring 127c is crimped to drive the third demolding tube 123a down. After that, the fourth spring 127d is crimped to drive the fourth demolding tube 124a down. That is, it is driven down from the demolding tube arranged on the periphery and separated from the edge of the mold. In this case, negative pressure is supplied to the demolding tubes 121a, 122a, 123a, 124a and the duct 125a.

參照圖5f及圖6的(g)部分，在脫模管121a、122a、123a、124a均下降的狀態下，最終向導管內部提供正壓，來分離模具的中心部。向脫模管121a、122a、123a、124a提供負壓。 Referring to Fig. 5f and Fig. 6(g), in a state where the demolding pipes 121a, 122a, 123a, and 124a are all lowered, a positive pressure is finally applied to the inside of the duct to separate the center part of the mold. Negative pressure is provided to the demolding tubes 121a, 122a, 123a, 124a.

本發明實施例的模具脫模裝置以多級驅動多個脫模管，因此，可從切割膠帶以不損傷的方式分離大型尺寸的模具，並可防止不被拾取單元拾取的拾取不良。 The mold demolding device of the embodiment of the present invention drives a plurality of demolding tubes in multiple stages, therefore, large-sized molds can be separated from the dicing tape in a non-damaging manner, and picking failures that are not picked up by the picking unit can be prevented.

設置於本發明實施例的模具脫模裝置的多個脫模管利用具有互不相同的彈力的彈簧突出並以配置於外圍的脫模管依次下降，因此，無需設 置使脫模管突出並從配置於外圍的脫模管開始依次下降的額外的複雜的驅動裝置。 The multiple ejection tubes provided in the mold ejection device of the embodiment of the present invention are protruded by springs having different elastic forces and are sequentially lowered by the ejection tubes arranged on the periphery. Therefore, there is no need to provide An additional complicated driving device is provided that makes the ejector tube protrude and descends sequentially from the ejector tube arranged on the periphery.

設置於本發明實施例的模具脫模裝置的模具脫模模組透過彈簧驅動，因此，具有永久性。 The mold demolding module set in the mold demolding device of the embodiment of the present invention is driven by a spring, so it is permanent.

以上，參照附圖更加詳細地說明了本發明的實施例，本發明並不局限於這種實施例，可在不超出本發明的技術思想的範圍內以各種方式變形實施。因此，在本發明中揭示的實施例用於說明本發明的技術思想，並不限定本發明的技術思想，本發明的技術思想的範圍並不被這種實施例限定。因此，以上所記述的實施例在所有方面僅為例示，並不限定本發明。本發明的保護範圍需通過發明要求保護範圍解釋，屬等同範圍內的所有技術思想包括於本發明的專利範圍。 Above, the embodiments of the present invention have been described in more detail with reference to the accompanying drawings. The present invention is not limited to such embodiments, and can be implemented in various ways without departing from the scope of the technical idea of the present invention. Therefore, the embodiments disclosed in the present invention are used to illustrate the technical ideas of the present invention, and do not limit the technical ideas of the present invention, and the scope of the technical ideas of the present invention is not limited by such embodiments. Therefore, the embodiments described above are merely illustrative in all aspects and do not limit the present invention. The protection scope of the present invention needs to be explained through the protection scope of the invention, and all technical ideas within the equivalent scope are included in the patent scope of the present invention.

120:脫模模組 120: demolding module

121:第一脫模器 121: The first stripper

122:第二脫模器 122: second stripper

123:第三脫模器 123: The third stripper

124:第四脫模器 124: The fourth stripper

125:引導脫模器 125: Guide stripper

121a:第一脫模管 121a: The first demoulding tube

122a:第二脫模管 122a: The second demolding tube

123a:第三脫模管 123a: The third stripping tube

124a:第四脫模管 124a: The fourth demoulding tube

125a:導管 125a: Catheter

121b:第一支撐部件 121b: The first support member

122b:第二支撐部件 122b: second support member

123b:第三支撐部件 123b: The third support member

124b:第四支撐部件 124b: The fourth support member

125b:引導支撐部件 125b: Guide support part

126:高度限制單元 126: height limit unit

127:彈簧 127: Spring

128:開口部 128: opening

129:驅動部件 129: drive parts

Claims (4)

一種模具脫模裝置，用於從切割膠帶分離模具，其中，包括：脫模模組，具有導管和多個脫模管，上述多個脫模管以重重包圍上述導管外側的形態形成；外殼，用於收容上述脫模模組，具有使上述多個脫模管向上方突出的開口；以及驅動部，沿著垂直方向驅動上述多個脫模管；上述多個脫模管透過上述驅動部下降後透過多個彈簧向上方突出，在向上述上方突出的上述多個脫模管中，從配置於外側的脫模管開始依次下降來從上述模具的邊緣部分開始分離；上述脫模模組還包括：引導支撐部件，在上述導管的下端部沿著水平方向彎曲延伸；多個支撐部件，在上述多個脫模管的下端部沿著水平方向彎曲延伸來依次層疊於上述引導支撐部件的上部；上述多個彈簧，配置於各個依次層疊的上述多個支撐部件的下部，分別隔開並支撐依次層疊的上述多個支撐部件；以及高度限制單元，用於限制上述多個支撐部件各自的上升高度，限制多個支撐部件之間的隔開間隔。 A mold demolding device for separating a mold from a dicing tape, comprising: a demolding module having a duct and a plurality of demolding tubes, the plurality of demolding tubes are formed in a form that surrounds the outer side of the duct; a housing, For accommodating the demolding module, it has an opening that causes the plurality of demolding tubes to protrude upward; and a driving part that drives the plurality of demolding tubes in a vertical direction; the plurality of demolding tubes descend through the driving part Then, it protrudes upward through a plurality of springs. Among the plurality of ejection tubes protruding upward, the ejection tubes arranged on the outside are sequentially lowered and separated from the edge of the mold; the ejection module is also It includes: a guide support member bent and extended in the horizontal direction at the lower end of the pipe; a plurality of support members bent and extended in the horizontal direction at the lower end of the plurality of demolding pipes to be sequentially stacked on the upper part of the guide support member The plurality of springs are arranged at the lower part of each of the plurality of support members that are stacked in sequence, and respectively separate and support the plurality of support members that are stacked in sequence; and a height restriction unit for limiting the rise of each of the plurality of support members The height limits the spacing between multiple supporting members. 如請求項1之模具脫模裝置，其中，在位於上述多個支撐部件中的配置於最頂端的支撐部件下部的多個支撐部件及上述引導支撐部件形成垂直方向的開口部，在配置於上述最頂端的支撐部件的下部面所形成的驅動部件貫通上述開口部來與上述驅動部相連接。 The mold release device according to claim 1, wherein the plurality of support members located at the lower part of the support member at the topmost among the plurality of support members and the guide support member form an opening in the vertical direction, which The drive member formed on the lower surface of the topmost support member penetrates the opening portion and is connected to the drive portion. 如請求項1之模具脫模裝置，其中，在上述多個彈簧中，越是用於支撐配置於上方的支撐部件的彈簧，彈力越減少。 The mold release device according to claim 1, wherein among the plurality of springs, the more the spring used to support the supporting member disposed above, the more the elastic force decreases. 如請求項1之模具脫模裝置，其中，在上述外殼的內側面設置有用於限制上述脫模模組的下方移動的擋止部。 The mold demolding device of claim 1, wherein a stopper for restricting the downward movement of the demolding module is provided on the inner side of the housing.
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