TWI606505B - Die ejecting method, die ejecting unit, die pick-up method, and die pick-up apparatus - Google Patents

Description

Grain ejector method, crystal ejector unit, crystal topping method and crystal grain top Take device

The invention provides a die ejection method, a die ejector unit, a die topping method and a die plucking device. More particularly, the present invention relates to a method for ejecting a die from a dicing tape, wherein the wafer is divided into a plurality of dies, and the wafer is attached to a dicing tape, and a die is ejected. The unit is used to implement the foregoing method, a die topping method for picking up the die from the dicing tape, and a die ejector device comprising a die ejector unit and for taking the die from the dicing tape.

In general, a semiconductor device can be formed on a wafer as a semiconductor substrate by repeatedly performing a continuous manufacturing process. Subsequently, the semiconductor device can be divided via a dicing process, and the semiconductor device is bonded to a substrate via a die bonding process.

The apparatus for performing a die bonding process may include a die bonding device for dividing a wafer into a plurality of dies to take a die and attach the selected die The substrate bonding device may include a platform unit, a die ejector unit and a topping unit, wherein the platform unit is used to support one of the wafer rings attached to the wafer, and the die ejector unit Moving vertically to selectively separate a die from the wafer supported by the platform unit, the take-up unit is used to pick up the die from the wafer.

In the die ejector unit, when the grain thickness is gradually reduced, one of the ejector pins included in the die ejector unit is actually in contact with the die, so A physical impact is caused on the grains. Therefore, for example, damage that may occur in the rupture of the crystal grains will cause an error in the crystal grains.

The present invention provides a method of crystallizing the crystal which can prevent the impact of a grain.

The present invention also provides a die ejector unit that prevents a grain from being impacted.

The present invention also provides a method of crystal grain picking which can prevent the impact of a grain.

The present invention also provides a die ejector device that prevents the impact of a grain.

According to an exemplary embodiment, a die ejector method includes: vacuum-adsorbing a dicing tape as a whole, wherein a wafer is divided into at least one die having an edge region and a central region attached to the dicing tape; Relatively raising a first region of one of the dicing tapes corresponding to the edge regions of the dies relative to the other regions; and blowing air to a second region of one of the dicing tapes corresponding to the central region of the dies to utilize An air stream separates the grains from the dicing tape.

Air blowing includes supplying air with increasing pressure toward the outside of the center of the second region of the self-cutting tape.

Relatively raising the first region of the dicing tape relative to other regions may include closing the second region of the dicing tape to form a closed region to direct air flow.

The relative elevation of the first region of the dicing tape relative to the other regions can be performed using a lifting element having a fluid passageway having an upwardly increasing diameter fluid passage for directing air flow.

According to another exemplary embodiment, a die ejector unit is provided for ejecting a die from a dicing tape, and the wafer at one of the dicing tapes is divided into at least one die having an edge region and a central region. . The die ejector unit includes a body, a lifting element and an air blowing member. In general, the body includes a hollow and an adsorption hole, the shape of the hollow corresponds to the shape of the crystal grain, and the adsorption hole is configured for vacuum adsorption of the cutting tape. The lifting element is vertically disposed in the hollow of the body and has a fluid passage therein. The lifting element is configured to raise a first region of the cutting tape corresponding to an edge region of the die. The air blowing member is configured to blow air over the second region of one of the cutting tapes corresponding to a central region of the die via a fluid passage of the lifting member.

The fluid passage of the lifting element can include an upwardly increasing diameter.

The air blowing member may further comprise an air supply source and an air supply line configured to supply air to the fluid passage of the lifting element, the air supply line being configured to allow the fluid passage and the air supply source of the lifting element Connected to each other. Wherein, the die ejector unit further comprises a vacuum absorbing member configured to adsorb the dicing tape via the fluid passage of the lifting member, wherein the vacuum absorbing member comprises a vacuum absorbing line and a vacuum absorbing source, and the vacuum The adsorption line is branched from the air supply line, the vacuum adsorption source is connected to the vacuum adsorption line, and the vacuum adsorption line is configured to adsorb the cutting tape through the fluid passage of the lifting element. Second area.

The adsorption hole of the body may have a ring shape.

According to another exemplary embodiment, a die topping method includes: supporting a dicing tape, wherein one of the dicing tapes is divided into at least one die having an edge region and a central region; and vacuum absorbing the die upward; In general, vacuum-cutting the dicing tape; relatively raising a first region of one of the dicing tapes corresponding to the edge regions of the dies relative to other regions; blowing air to the dicing tape corresponding to the central region of the dies One of the second regions is used to separate the die from the dicing tape using an air stream; and the die is taken from the dicing tape. Here, the blowing of air includes supplying air having an increasing pressure toward the outside of the center of the second region of the self-cut tape.

Further, the vacuum suction dicing tape as a whole is performed after the crystal grains are adsorbed upward.

According to still another exemplary embodiment, a die ejector device includes a platform unit, a die ejector unit, and a ejector unit. The platform unit is configured to support a dicing tape and a wafer ring, and the wafer is cut into a plurality of dies on one of the dicing tapes, and the dicing tape is attached to the wafer ring. The die ejector unit is disposed under the wafer supported by the platform unit, and the die ejector unit is vertically movable to selectively separate the plurality of dies from the dicing tape. The ejector unit is configured to take at least one die selected by the die ejector unit. The die ejector unit comprises a body, a lifting element and an air blowing member, wherein the overall body comprises a hollow and an adsorption hole, the hollow shape corresponds to the shape of the die, and the adsorption hole is configured for vacuum suction. Attaching a cutting tape, the lifting element is vertically disposed in the hollow of the body and has a fluid passage therein; the lifting element is configured to raise a first region of the cutting tape corresponding to the edge region of the die; the air blowing component is A fluid passageway through the lifting element is configured to blow air over a second region of one of the cutting tapes corresponding to a central region of the die.

The embodiments shown in the present invention will be described in detail below with reference to the accompanying drawings. However, the invention may be embodied in many different forms and should not be construed as being limited to the embodiments. Rather, the invention is to be considered as illustrative and complete and the scope of the invention is fully disclosed to those skilled in the art. For the sake of clarity, the dimensions and relative dimensions of the layers and regions in the drawings may be described in an enlarged manner.

It will be understood that when an element or layer is "on" or "on" or "connected" to another element or layer, the element or layer can be Elements or layers may be directly connected to another element or layer, or may be presented between elements or layers. In contrast, when an element is referred to as “directly on,” or “directly on,” or “directly connected to,” or “directly connected to” another element or layer. The same reference symbols in the text refer to the same elements. The term "and/or" as used herein includes any and all combinations of one or more of the associated items.

It should be understood that although the first, second, and third are used herein Or <RTI ID=0.0>>>""""""" These terms are only used to distinguish one element, component, region, layer or segment to another region, layer or segment. Therefore, one of the first elements, a first member, a first region, a first layer, or a first segment discussed below may be referred to as a second component, a second component, without departing from the teachings of the present invention. a member, a second region, a second layer, or a second segment.

The terms "lower", "upper", and the like, as used herein, are used to refer to one of the elements or features depicted in the drawings. Make an easy-to-narrative description. It will be understood that the spatially relative terms are used to encompass different orientations of the device in use or operation. For example, elements and/or features that are described as "below" or "beneath" other elements in the <RTIgt; "above" or feature in "other elements." Therefore, the "below" in the examples may be included above and below. The device may be oriented (rotated 90 degrees or rotated in other orientations) by other methods and described in relation to the spatially relative descriptive symbols used herein.

The specific terminology used herein is for the purpose of illustration and description The singular forms "a", "an", and "the" are used in the <RTI ID=0.0> </ RTI> </ RTI> <RTIgt; It should be further understood that the terms "comprises" and/or are used in the specification. "comprising," specifies the characteristics, complete things, The existence of steps, operations, elements, and/or components, but does not exclude the presence or addition of one or more other features, complete items, steps, operations, components, components and/or groups thereof.

All terms used herein, including technical and scientific terms, have the meaning as commonly understood by one of ordinary skill in the art to which the invention pertains, unless otherwise defined. It should be understood that unless the terms are explicitly defined herein, the meaning of the terms defined in the commonly used dictionary should be interpreted as being consistent with the meaning of the content of the related art, and these Words should not be interpreted as having an ideal or overly formal meaning.

The exemplary embodiments of the present invention are described herein with reference to the accompanying drawings, which are schematic representations of the preferred embodiments (and intermediate structures) of the invention. For example, variations in the shapes of the illustrations as a result of manufacturing techniques and/or tolerances are contemplated as far as the exemplary embodiments are concerned. Accordingly, the exemplary embodiments of the invention, as illustrated herein, are not to be construed as limited In essence, the regions illustrated in the figures and their shapes are not intended to illustrate the true shape of one of the regions of the device and are not intended to limit the scope of the invention.

1 is a flow chart illustrating a method of die ejecting according to an exemplary embodiment.

Referring to FIG. 1 , in a die ejector method according to an exemplary embodiment, a wafer is divided into a plurality of dies, and a wafer is attached to a dicing tape, and the dicing tape is oriented in operation S110. Vacuum adsorption. therefore, Overall, it is a flat adsorption of the dicing tape. For example, as a whole, in order to perform the vacuum adsorption process (S110), air around one of the adsorption holes defined under the dicing tape may be introduced through the adsorption hole, so that the dicing tape may be adsorbed on one body having the adsorption hole. . Referring to FIG. 4, each of the crystal grains has an edge region and a central region.

In operation S120, a first region of one of the dicing tapes corresponding to the edge regions of the dies is relatively raised relative to the other regions. For example, the first region of the dicing tape has a closed band shape. Therefore, the edge regions of the grains can be partially separated from the dicing tape.

In an exemplary embodiment, to raise the first region of the dicing tape, one of the lifting elements disposed below the first region of the dicing tape is raised. Here, when the lifting element is raised, the stress is locally concentrated on the first region of the dicing tape. The lifting element will be described in detail below.

In operation S130, air is blown onto a second region of one of the dicing tapes corresponding to a central region of the die to separate the die from the dicing tape with an air flow. That is, in operation S120, the edge region of the die is partially separable from the dicing tape, and then air is blown onto the second region of the dicing tape, thus separating the second region from the dicing tape.

According to the air blowing program of an exemplary embodiment, an air pressure may be gradually increased from the center of one of the second regions of the dicing tape toward the outer side thereof. Thus, the outermost portion of the dicing tape adjacent the second region of the first region can be separated from the dicing tape first. Successively, the die is continuously separated from the dicing tape towards the center of the second zone.

Focusing on the first region of the dicing tape can be biased by the supply The outermost portion of the second region is dispersed by the air having the highest pressure. Therefore, it is possible to avoid the occurrence of cracks in the crystal grains.

In an exemplary embodiment, when the lifting element is raised, the lifting element can close the second region of the cutting tape to form a fluid passage for directing air flow. That is, when the first region of one of the dicing tapes is relatively raised relative to other regions of the dicing tape, the inner side wall of the lifting member and the second region of the dicing tape may form a closed region. The enclosed area can be used to guide the air flow in a subsequent air blowing procedure (S130).

In an exemplary embodiment, a fluid passageway having an upwardly increasing diameter for directing air flow may be formed in the lifting element. Therefore, when the air supplied to the entire surface of the dicing tape reaches the uppermost position of the closed region, a relatively high pressure is generated at the outermost portion of the second region of the dicing tape. Thus, the outermost portion of the dicing tape adjacent the second region of the first region may be first separated from the dicing tape.

According to the die ejecting method of an exemplary embodiment, the first region of the dicing tape corresponding to the edge region of the die can be relatively raised relative to the other regions to locally separate the edge regions of the die from the dicing tape. . Subsequently, the air blowing process can be performed over the second region of the dicing tape corresponding to the central region of the die, thus separating the central region of the die from the dicing tape. Thus, the central region of the die can be separated from the dicing tape without physical contact. Additionally, an air blowing process can be performed over the second region of the dicing tape to disperse the stress concentrated in the first region of the die. Therefore, it is possible to avoid the occurrence of cracks in the first region of the dicing tape.

Figure 2 shows one of the die ejector units in accordance with an exemplary embodiment. Sectional view. Fig. 3 is a plan view showing one of the die ejecting units of Fig. 2. Figure 4 is a plan view showing one of the crystal grains of Fig. 2.

Referring to FIGS. 2, 3, and 4, a die ejector unit 100 includes a body 110, a lifting element 130, and an air blowing member 150, in accordance with an exemplary embodiment. The die ejector unit 100 is disposed under a dicing tape 20, and the wafer in which the wafer is divided into the plurality of dies 10 is attached to the dicing tape 20. The die ejector unit 100 selectively separates the dies 10 from the dicing tape 20. The die 10 can be separated by a central region 15 surrounded by an edge region 11 and an edge region 11.

The body 110 of the die ejector unit 100 is disposed below the dicing tape 20. Specifically, the body 110 of the die ejector unit 100 is disposed below the selected die 10 . A hollow 113 is defined vertically in the body 110, and the shape of the hollow 113 corresponds to the shape of the die 10. The lifting element 130 is vertically movably disposed inside the hollow 113 of the body 110.

In addition, as a whole, at least one adsorption hole 115 is defined in the body 110, thereby vacuum-adsorbing the dicing tape 20. In general, the adsorption hole 115 of the body 110 has a ring shape, whereby vacuum suction is applied to the dicing tape 20. On the other hand, the adsorption holes 115 of the body 110 may be provided in plural, and in this manner, the respective plurality of adsorption holes 115 having ring shapes may be spaced apart from each other.

The lifting element 130 is vertically movably disposed inside the hollow 113 of the body 110. A fluid passage 135 is defined in the lifting element 130. The lifting element 130 is relatively raised relative to the first region of one of the dicing tapes 20 under other regions. That is, overall, at the cutting tape 20 In one of the vacuum adsorption states, the elevated lifting element 130 relatively raises the edge region 11 of the die 10. Therefore, the edge region 11 of the die 10 corresponding to the first region of the dicing tape 20 can be partially separated from the dicing tape 20.

For example, the lifting element 130 can have a top surface that corresponds to one of the first regions of the dicing tape 20. When the lifting element 130 is raised, the edge region 11 of the die 10 corresponding to the first region of the dicing tape 20 can be selectively raised.

The air blowing member 150 is coupled to the fluid passage 135. When air is supplied over the second region of the dicing tape, the air blowing member 150 can blow air over the second region of the dicing tape. Therefore, when the edge region 11 located in the die 10 is separated from the state of one of the dicing tapes 20, the central region 15 of the die 10 can be separated from the dicing tape 20.

In an exemplary embodiment, air blowing member 150 includes an air supply source 151 and an air supply line 153.

The air supply source 151 supplies air into the fluid passage 135 of the lifting element 130. For example, the air supply source 151 can include an air pump.

The air supply line 155 can be in communication with the fluid passage 135 and the air supply source 151. A first valve member 153 can be disposed in the air supply line 155. The first valve member 153 is capable of opening the air supply line 155 to control operation of one of the air blowing members 150.

According to an exemplary embodiment, the die ejecting unit 100 further includes a vacuum adsorbing member 160, wherein the vacuum adsorbing member 160 includes a vacuum adsorption line. Road 165 and a vacuum adsorption source 161. The vacuum adsorbing member 160 is capable of adsorbing a second region of one of the dicing tapes 20. In general, when the die ejecting unit 100 is operated, the vacuum adsorbing member 150 is a vacuum suction cutting tape 20. Subsequently, one of the operations of the vacuum adsorbing member 160 is stopped after raising the lifting member 130 to relatively raise the first region of the cutting tape. Successively, air is blown to the second region of the dicing tape 20 by the operating air blowing member 150. Thus, the selected die 10 can be separated from the dicing tape 20.

For example, vacuum adsorption line 165 branches off to air supply line 155. The vacuum adsorption source 161 is disposed on one end of the vacuum adsorption line 165. The vacuum adsorption source 161 is for adsorbing the second region of the dicing tape 20 via the vacuum adsorption line 165 and the fluid passage 135 of the lifting element 130.

In an exemplary embodiment, fluid passage 134 can have an upwardly increasing diameter. Therefore, when the air blowing member 150 is operated, one of the pressures of the air in the fluid passage 135 is gradually increased from the center of one of the second regions of the cutting tape 20 toward the outside. Thus, the outermost portion of the second region of the dicing tape has a relatively high air pressure and the central portion of one of the second regions of the dicing tape has a relatively low air pressure. Therefore, the die 10 can be continuously separated from the outer side of the dicing tape toward the center of the second region thereof.

Figure 5 is a flow chart showing one of the die topping methods in accordance with an embodiment.

Referring to FIG. 5, a die topping method according to an exemplary embodiment supports a dicing tape in operation S210. For example, the dicing tape can be supported using a platform. Wafer is divided into plural One of the die wafers is attached to the dicing tape.

In operation S220, each of the crystal grains is vacuum-adsorbed upward. The crystal grains are adsorbed through the adsorption holes formed in one of the top extraction units by vacuum force to obtain the crystal grains. Therefore, the hardness of the crystal grains having a relatively thin thickness can be increased. In this way, even if a physical force is applied to the crystal grains in the subsequent die ejecting process, the cracking in the crystal grains can be prevented.

Subsequently, in operation S230, the cutting tape is vacuum-adsorbed downward. Overall, it is a flat adsorption of the dicing tape. For example, in general, in order to perform the vacuum adsorption process (S230), air formed around the adsorption holes below the dicing tape may be introduced through the adsorption holes, so that the dicing tape may be adsorbed on one of the bodies having the adsorption holes. Referring to FIG. 4, each of the crystal grains has an edge region and a central region.

In operation S240, a first region of one of the dicing tapes corresponding to the edge regions of the dies is relatively raised relative to the other regions. For example, the first region of the dicing tape has a closed band shape. Therefore, the edge regions of the grains can be partially separated from the dicing tape.

In an exemplary embodiment, to raise the first region of the dicing tape, one of the lifting elements disposed below the first region of the dicing tape is raised. The lifting element is disposed at a position corresponding to one of the first regions of the dicing tape. Here, when the lifting element is raised, the stress is locally concentrated on the first region of the dicing tape. The lifting element will be described in detail below.

In operation S250, air is blown onto a second region of one of the dicing tapes corresponding to a central region of the die to separate the die from the dicing tape with an air flow. That is, in operation S240, the edge region of the die is Partially separated from the dicing tape, and then air is blown onto the second region of the dicing tape, thereby continuously separating the second region of the dicing tape from the outermost portion toward the center of the second region.

According to the air blowing program of an exemplary embodiment, an air pressure may be gradually increased from the center of one of the second regions of the dicing tape toward the outer side thereof. Thus, the outermost portion of the dicing tape adjacent the second region of the first region can be separated from the dicing tape first. Successively, the die is continuously separated from the dicing tape towards the center of the second zone. Furthermore, the stress concentrated on the first region of the dicing tape can be dispersed by supplying the air having the highest pressure toward the outermost portion of the second region. Therefore, it is possible to avoid the occurrence of cracks in the crystal grains.

In an exemplary embodiment, when the lifting element is raised, the lifting element can close the second region of the cutting tape to form a closed area for guiding an air flow. That is, the second region of the lifting element and the dicing tape can form a closed area when the first region of one of the dicing tapes is raised relative to the other regions of the lifting element. The enclosed area can be used to guide the air flow in a subsequent air blowing procedure (S250).

In an exemplary embodiment, a fluid passage having an upwardly increasing diameter for guiding a flow of air as the lifting element is raised may be formed in the lifting element. Therefore, when the air supplied to the entire surface of the dicing tape reaches the uppermost position of the closed region, a relatively high pressure is generated at the outermost portion of the second region of the dicing tape. Thus, the outermost portion of the dicing tape adjacent the second region of the first region can be separated from the dicing tape first.

Subsequently, in the process S250, the crystal grains are taken through the dicing tape. therefore, The die picking process can be completed.

According to a die topping method of an exemplary embodiment, the first region of the dicing tape corresponding to the edge region of the die can be raised relative to the other regions to locally separate the edge regions of the die from the dicing tape. Subsequently, the air blowing process can be performed over the second region of the dicing tape corresponding to the central region of the die, thus separating the central region of the die from the dicing tape. Thus, the central region of the die can be separated from the dicing tape without physical contact. Additionally, an air blowing process can be performed over the second region of the dicing tape to disperse the stress concentrated in the first region of the die. Therefore, it is possible to avoid the occurrence of cracks in the first region of the dicing tape.

Figure 6 is a cross-sectional view showing one of the die ejector devices in accordance with an embodiment.

Referring to FIG. 6 , a die ejector device 200 includes a platform unit 280 , a die ejector unit 205 , and a ejector unit 290 .

The platform unit 280 is used to support a dicing tape 20, and the wafer attached to one of the dicing tapes 20 is divided into a plurality of dies. The platform unit 280 is used to support a wafer ring (not shown) to hold the dicing tape 20.

The die ejector unit 205 is disposed below the platform unit 280. The die ejector unit 205 separates the respective dies of the dicing tape 20.

The die ejector unit 205 includes a body 210, a lifting element 230, and an air blowing member 250. The die ejector unit 205 is disposed under the dicing tape 20, and the wafer into which the wafer is divided into a plurality of dies is attached to the dicing tape 20. The die ejector unit 205 selectively separates the die 10 from Cutting tape 20. The die 10 can be separated by a central region 15 surrounded by an edge region 11 and an edge region 11 (see Figure 4).

The body 210 is disposed below the dicing tape 20. Specifically, the body 210 of the die ejector unit 205 is disposed under the selected die 10 . A hollow 213 is defined vertically in the body 210, and the shape of the hollow 213 corresponds to the shape of the die 10. The lifting element 230 is vertically movably disposed inside the hollow 213 of the body 210.

In addition, as a whole, at least one adsorption hole 215 is defined in the body 210, thereby vacuum-adsorbing the dicing tape 20. In general, the adsorption hole 215 of the body 210 has a ring shape, whereby the dicing tape 20 is vacuum-adsorbed. On the other hand, the adsorption holes 215 of the body 210 may be provided in plural, and in this manner, the respective plurality of adsorption holes 115 having ring shapes may be spaced apart from each other.

The lifting element 230 is vertically movably disposed inside the hollow 213 of the body 210. A fluid passage 235 is defined in the lifting element 230. The lifting element 230 is raised relative to the first region of one of the dicing tapes 20 relative to other regions. That is, overall, in the state in which the dicing tape 20 is in vacuum adsorption, the elevated lifting element 230 relatively raises the edge region 11 of the die 10. Therefore, the edge region 11 of the die 10 corresponding to the first region of the dicing tape 20 can be partially separated from the dicing tape 20.

For example, the lifting element 230 can have a top surface that corresponds to one of the first regions of the dicing tape 20. When the lifting element 230 is raised, the edge region 11 of the die 10 corresponding to the first region of the dicing tape 20 can be selectively raised.

The air blowing member 250 is coupled to the fluid passage 235. When air is supplied over the second region of the dicing tape, the air blowing member 250 can blow air over the second region of the dicing tape. Therefore, when the edge region 11 of the die 10 is separated from one of the dicing tapes 20, the central region 15 of the die 10 can be separated from the dicing tape 20 by the air blowing member 250.

In an exemplary embodiment, air blowing member 250 includes an air supply source 251 and an air supply line 255.

According to an exemplary embodiment, the die ejecting unit 205 further includes a vacuum adsorbing member 260, wherein the vacuum adsorbing member 260 includes a vacuum adsorption line 265 and a vacuum adsorption source 261. Additionally, a second valve member 263 can be disposed in the air supply line 265. The vacuum adsorbing member 260 can adsorb the cutting tape 20. When the die ejecting unit 205 is operated, the vacuum adsorbing member 260 vacuum-adsorbs the second region of the dicing tape 2. Subsequently, one of the operations of the vacuum adsorbing member 260 is stopped after the lifting member 230 is raised to relatively raise the first region of the cutting tape. Successively, air is blown to the second region of the dicing tape 20 by the operating air blowing member 250. Thus, the selected die 10 can be separated from the dicing tape 20.

In an exemplary embodiment, fluid passage 235 can have an upwardly increasing diameter. Therefore, when the air blowing member 250 is operated, one of the pressures of the air in the fluid passage 235 is gradually increased from the center of one of the second regions of the cutting tape 20 toward the outside.

The jacking unit 290 is movably disposed above the platform unit 280. The topping unit 290 picks up the die 10 separated from the dicing tape 20. In addition, the topping unit 290 can be attached to the cutting tape 20 The crystal grains 10 are adsorbed to complement the hardness of the crystal grains 10.

Figures 7, 8, and 9 show cross-sectional views of one of the operation of the die pick-up device of Figure 6.

Referring to Figure 7, the platform unit 280 supports the dicing tape 20, and then the ejector unit 290 vacuum absorbing the die 10 upward. For example, the die 10 is subjected to upward vacuum adsorption via a suction hole defined by one of the top extraction units 290 using vacuum force. Therefore, the hardness of the crystal grains 10 having a relatively thin thickness can be increased. As a result, even if a physical force is applied to the die 10 in the subsequent die ejecting process, cracking in the die 10 can be prevented.

When the vacuum adsorbing member 260 is operated, the vacuum adsorbing member 260 performs upward vacuum adsorption of the cutting tape 20 via the vacuum adsorption line 265 and the fluid passage 235. Overall, the dicing tape 20 is flatly adsorbed.

Subsequently, the first region of the dicing tape 20 corresponding to the edge region of the die 10 is relatively raised relative to the other regions by raising the lifting member 230. Therefore, the edge region of the die 10 can be partially separated from the dicing tape 20.

Here, the lifting element 230 is disposed at a position corresponding to one of the first regions of the dicing tape 20. Here, when the lifting element 230 is raised, the stress is locally concentrated on the first region of the dicing tape 20.

When the air blowing member 250 is operated, an air flow is passed through the air supply line 255 and the fluid passage 235 to blow air over the second region of the dicing tape 20 corresponding to the central region of the die 10. Therefore, the lifting element 230 is raised to locally separate the edge regions of the die 10 from Cutting tape 20. Here, the operation of the vacuum adsorbing member 260 is stopped.

When the air blowing member 250 blows air over the second region of the dicing tape 20, the air pressure gradually increases from the center of the second region of the dicing tape 20 toward the outside. Therefore, the outermost portion of the dicing tape 20 adjacent to the second region of the first region can be separated from the dicing tape 20 first. Successively, the die 10 is continuously separated from the dicing tape toward the center of the second zone. The stress concentrated on the first region of the dicing tape can be dispersed by supplying the air having the highest pressure toward the outermost portion of the second region. Therefore, it is possible to avoid the occurrence of cracks in the crystal grains 10.

The ejector unit 290 takes the separated dies 10. Therefore, the die picking process can be completed.

As described above, in the die ejector method, the die ejector unit, the die ejector method, and the die ejector device according to the exemplary implementation, the first region of the dicing tape corresponding to the edge region of the die may be Raised, and then the air is blown onto the second region of the dicing tape corresponding to the central region of the die to separate the die from the dicing tape. Thus, the die can be continuously separated from the first region of the dicing tape toward the center of its second region. In addition, the use of an air blowing method to separate the crystal grains under the dicing tape prevents the crystal grains from being impacted. Therefore, it is possible to avoid the occurrence of cracks in the crystal grains.

Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention, and the present invention can be modified and retouched without departing from the spirit and scope of the present invention. protected range This is subject to the definition of the scope of the patent application.

10‧‧‧ grain

100‧‧‧ die ejector unit

11‧‧‧Edge area

110‧‧‧ body

115‧‧‧Adsorption holes

130‧‧‧ lifting element

135‧‧‧ fluid passage

15‧‧‧Central area

150‧‧‧Air blowing parts

151‧‧‧Source of air supply

153‧‧‧First valve

155‧‧‧Air supply line

160‧‧‧Vacuum Adsorbers

161‧‧‧Vacuum adsorption source

165‧‧‧vacuum adsorption line

20‧‧‧Cut Tape

200‧‧‧Cell topping device

205‧‧‧ die ejector unit

210‧‧‧ body

213‧‧‧ hollow

215‧‧‧Adsorption holes

230‧‧‧ lifting element

235‧‧‧ fluid passage

250‧‧‧Air blowing parts

251‧‧ Air source

255‧‧‧Air supply line

260‧‧‧vacuum absorber

261‧‧‧Vacuum adsorption source

263‧‧‧Second valve

265‧‧‧vacuum adsorption line

280‧‧‧ platform unit

290‧‧‧Capture unit

OFF‧‧‧Close

ON‧‧‧Open

S110, S120, S130‧‧‧ operations

S210, S220, S230, S240, S250, S260‧‧‧ operations

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings in which: FIG. 1 is a flow chart showing one of the die-out methods according to an embodiment; FIG. 2 is a view showing an embodiment according to an embodiment. a sectional view of a die ejector unit; Fig. 3 is a plan view of a die ejector unit of Fig. 2; Fig. 4 is a plan view of a die of Fig. 2; and Fig. 5 is a plan view showing a die according to an embodiment A flow chart of one of the die topping methods; FIG. 6 is a cross-sectional view showing one of the die ejector devices according to an embodiment; and FIGS. 7, 8, and 9 are the die plucking of FIG. A cross-sectional view of the operation of one of the devices.

S110‧‧‧Under vacuum adsorption of a cutting tape

S120‧‧‧ relatively elevated a first area

S130‧‧‧Blow air to a second area to separate a die from the cutting tape

Claims (12)

A method for ejecting a crystal grain, comprising: vacuum-adsorbing a dicing tape as a whole, wherein a wafer is divided into at least one die having an edge region and a central region attached to the dicing tape; relative to other regions Lowering a first region of one of the dicing tapes corresponding to the edge region of the die; and blowing air to a second region of one of the dicing tapes corresponding to the central region of the die The die is separated from the dicing tape by an air flow. The die ejecting method of claim 1, wherein the blowing of the air comprises supplying the air having an increasing pressure toward a center from a center of the second region of the cutting tape. The method of claim 3, wherein the relatively raising the first region of the dicing tape relative to other regions comprises closing the second region of the dicing tape to form a The enclosed area is directed to direct the flow of air. The method of claim 3, wherein the relative elevation of the first region of the dicing tape relative to other regions is performed using a lifting element having a fluid passage, The fluid passage having an upwardly increasing diameter is used to direct the flow of air. A die ejector unit is provided for ejecting a die from a dicing tape, and the wafer on the dicing tape is divided into at least one die having an edge region and a central region, and the die is ejected The unit includes: a body, as a whole, includes a hollow and an adsorption hole, the shape of the hollow corresponding to the shape of the die, the adsorption hole is configured to vacuum adsorb the cutting tape; and a lifting element is vertically disposed on the body a hollow channel having a fluid passage therein, the lifting element configured to selectively raise a first region of the cutting tape corresponding to the edge region of the die; and an air blowing member configured to The fluid passage through the lifting element selectively blows air over a second region of the cutting tape corresponding to the central region of the die, wherein the fluid passage of the lifting member includes an upwardly increasing diameter. The die ejector unit of claim 5, wherein the air blowing member comprises an air supply source and an air supply line, the air supply source being configured to supply air to the lifting element In the passage, the air supply line is configured to allow the fluid passage of the lifting element and the air supply source to communicate with each other. The die ejector unit of claim 6, further comprising a vacuum absorbing member configured to adsorb the dicing tape via the fluid passage of the lifting member, wherein the vacuum absorbing member comprises a vacuum adsorption line and a vacuum adsorption source branching the air supply line, the vacuum adsorption source being connected to the vacuum adsorption line, the vacuum adsorption line being configured for the fluid passage through the lifting element Adsorbing the second region of the dicing tape. The die ejector unit of claim 5, wherein The adsorption hole of the body has a ring shape. A method for culling a die includes: supporting a dicing tape, wherein a wafer of the dicing tape is divided into at least one die having an edge region and a central region; and adsorbing the die upward by vacuum; Vacuuming the dicing tape; relatively raising a first region of the dicing tape corresponding to the edge region of the die relative to other regions; blowing air to the central region corresponding to the die The dicing tape is over the second region to separate the dies from the dicing tape using an air stream; and the dies are taken from the dicing tape. The method of picking up a die according to claim 9, wherein the blowing of the air comprises supplying the air having an increasing pressure toward a center from a center of the second region of the cutting tape. The method of picking up a die according to claim 9, wherein the vacuum-adsorbing the dicing tape as a whole is performed after adsorbing the die upward. A die ejector device includes: a platform unit configured to support a dicing tape and a wafer ring, wherein a wafer of the dicing tape is divided into a plurality of dies, the dicing tape is attached to the wafer a die ejector unit disposed under the wafer supported by the platform unit, the die ejector unit being vertically movable to selectively The dies are separated from the dicing tape; and a topping unit is configured to take at least one die selected by the die ejector unit, wherein the die ejector unit comprises: a body The whole body comprises a hollow and an adsorption hole, the shape of the hollow corresponding to the shape of the crystal grain, the adsorption hole is configured to vacuum absorb the cutting tape; and a lifting element is vertically moved to the empty space of the body a fluid passageway in the center, the lifting element is configured to selectively raise a first region of the cutting tape corresponding to the edge region of the die; and an air blowing member configured to pass through The fluid passage of the lifting element selectively blows air over a second region of the cutting tape corresponding to the central region of the die, wherein the fluid passage of the lifting member includes an upwardly increasing diameter.