TWI834450B - Method for stripping die with pushing means and air control means - Google Patents

Abstract

A method for stripping die with pushing means and air control means includes the following steps: sucking a periphery of a target area of a carrier film by a periphery negative pressure, wherein a die is disposed on the target area and a surface of the die has no solder and bump; pushing the die up through the target area by a plurality of pushing members, so that a periphery of the die is separated from the periphery of the target area; Sucking a center of the target area by a center negative pressure, so that the center of the target area is curved downward and separated from a center of the die; switching the center negative pressure to a center positive pressure, blowing the center of the target area by the center positive pressure, so that the center of the target area is bulged upward and contact the center of the die; and blowing the center of the target area continuously by the center positive pressure, so that the center of the target area is continuously bulged upward and pushes the die up, and the die is separated from the target area gradually along the periphery of the die toward the center of the die. Such that, the method can reduce the influence of the viscosity of the carrier film for the die and decrease the stripping time and not have stress concentration.

Description

Grain peeling method using ejection method combined with air pressure control method

The present invention relates to a method for peeling off crystal grains, in particular to a method for peeling off crystal grains using ejection means combined with air pressure control means to separate crystal grains from a carrier film.

After the wafer is cut into a plurality of die, the die will be transferred from the carrier film to the substrate. During the transfer process, first, the support device supports the target block carrying the film; then, under ideal conditions, a plurality of pushers rise from the inside of the support device to the outside of the support device and push the die through the target block Rising, the periphery of the crystal grain is separated from the periphery of the target block, and the center of the crystal grain is separated from the center of the target block; during the process of the crystal grain rising, the crystal grain contacts the crystal bonding device, and the crystal bonding device absorbs the crystal grain ; Finally, the pushing members are lowered to the inside of the supporting device, and at the same time, the die-bonding device moves the die to the substrate.

However, when the pushing members push the die upward through the target block, if the viscosity of the carrier film is strong, the center of the target block will still stick tightly to the center of the die, but it will just fit in with the support. The device is separated. At this time, only the periphery of the die is separated from the periphery of the target block, causing the die bonding device to be unable to move the die from the carrier film.

Furthermore, when the pushing members push the die upward through the target block, if the viscosity of the carrier film is too strong, not only the center of the target block will still stick tightly to the center of the die, but also the target area will The center of the block will also stick tightly to the supporting device, causing the center of the grain to be severely bent, deformed, or even damaged.

In addition, when the push pieces push the die upward through the target block, the lift distance of the push pieces is larger, resulting in a longer peeling time between the center of the die and the center of the target block, which increases the operation time. Reduce production capacity.

In addition, when the push pieces push the die upward through the target area, the tops of the push pieces are relatively sharp, and the stress is easily excessively concentrated, causing damage to the die or damage to the carrier film and remaining on the surface of the die.

In addition, these pushing members use the carrier film to push the crystal grains upward at a faster speed, and the contact force between the crystal grains and the die-bonding device is too large, resulting in damage to the crystal grains.

The main purpose of the present invention is to provide a method for peeling off grains using ejection means combined with air pressure control means, which can reduce the influence of the viscosity of the carrier film on the grains through the lifting effect, adsorption effect and blowing effect.

Another object of the present invention is to provide a grain peeling method that uses ejection means combined with air pressure control means, which can reduce the influence of the viscosity of the carrier film on the support device through the lifting effect, adsorption effect and blowing effect.

Another object of the present invention is to provide a method for peeling off wafers using an ejection method combined with an air pressure control method, which can separate the wafers from the carrier film in a gentle manner through continuous blowing, shortening the peeling time without causing any problems. Stress concentration problem.

Another object of the present invention is to provide a method for peeling off crystal grains using ejection means combined with air pressure control means, which can allow the crystal grains to contact the crystal bonding device in a gentle manner through continuous blowing. The contact between the crystal grains and the crystal bonding device is Less powerful.

In order to achieve the aforementioned goals, the present invention provides a method for peeling off wafers using ejection means combined with air pressure control means, which includes the following steps: adsorbing the periphery of a target area of a carrier film through a peripheral negative pressure, and the target area There is a die on the block, and the surface of the die has no tin balls and no copper pillars; a plurality of pushing parts push the die up through the target block, so that the periphery of the die is separated from the periphery of the target block; A central negative pressure is used to adsorb the center of the target block, causing the center of the target block to be sunken downward and separated from the center of the die; the central negative pressure is switched to a central positive pressure, and is blown by the central positive pressure. The center of the target block causes the center of the target block to bulge upward and contacts the center of the die; and the center positive pressure continues to blow the center of the target block, causing the center of the target block to bulge upward. And the crystal grain is pushed up, and the crystal grain is gradually separated from the target block in the direction from its periphery to its center.

In some embodiments, continuously blowing the center of the target area by the central positive pressure further includes the following steps: during the rising process of the die, the die contacts a die-bonding device; the die-bond device absorbs the die grain and move the grain upward, so that the grain is completely separated from the target block.

In some embodiments, after the center of the target block is continuously blown by the center positive pressure, the following steps are further included: stopping providing the center positive pressure, and the pushing members descend, so that the center of the target block gradually It returns to a flat state, and at the same time, the die-bonding device moves the die to a substrate, and the surface of the substrate has no tin balls and no copper pillars.

In some embodiments, the step of adsorbing the periphery of the target area by the peripheral negative pressure further includes the following steps: a supporting device supports the target area of the carrier film and provides the peripheral negative pressure; wherein, the tops The step of pushing the die upward through the target block by the pusher further includes the following steps: the pushers rise from the inside of the support device to the outside of the support device, and the center of the target block is separated from the support device; Wherein, the step of adsorbing the center of the target block by the central negative pressure further includes the following steps: the supporting device provides the central negative pressure so that the center of the target block contacts the supporting device; wherein the central negative pressure switches The step of establishing the central positive pressure further includes the following steps: the supporting device switches the central negative pressure to the central positive pressure, so that the center of the target block is separated from the supporting device; wherein, the central positive pressure continues to blow The center of the target block further includes the following steps: the supporting device continues to provide the central positive pressure; and wherein the step of stopping providing the central positive pressure further includes the following steps: the supporting device stops providing the central positive pressure, and the The pushing member descends to the inside of the support device, and the air in the space between the center of the target block and the support device is discharged outward through the support device, so that the center of the target block gradually returns to a flat state and contacts the support device.

In some embodiments, the pushing members push the die upward through the target block, the step of adsorbing the center of the target block through the center negative pressure, and the center negative pressure is switched to the center positive pressure. The steps of continuously blowing the center of the target area by the central positive pressure and the steps of stopping providing the central positive pressure further include the following steps: the support device continues to provide the peripheral negative pressure, and continues to use the peripheral negative pressure. Adsorb the surrounding area of the target block.

In some embodiments, after the step of stopping providing the central positive pressure, the following steps are further included: the supporting device stops providing the peripheral negative pressure; and, moving the supporting device below another target block and supporting the other A target block is used to move the die-bonding device above another target block.

In some embodiments, the support device is provided with a plurality of first air pressure channels, a second air pressure channel, a plurality of first openings and a plurality of second openings, and the first air pressure channels are respectively connected with the first openings. , the second air pressure channel is connected with the second openings; wherein, the first air pressure channels provide the peripheral negative pressure, and the peripheral negative pressure absorbs the periphery of the target block through the first openings; wherein, the peripheral negative pressure The pushing member is disposed in the second air pressure channel and can rise or fall through the second openings; wherein the second air pressure channel provides the central negative pressure or the central positive pressure, and the central negative pressure passes through the second openings. The second opening attracts the center of the target block, and the center positive pressure blows the center of the target block through the second openings; and wherein the air in the space between the center of the target block and the supporting device depends on The air is discharged outward through the second openings and the second air pressure channel.

In some embodiments, the support device includes an outer shell and an inner shell. The inner shell is provided in the outer shell. The first air pressure channels are opened inside the outer shell. The first openings are opened at the top of the outer shell. The second air pressure channel is set inside the inner shell, and the second openings are set at the top of the inner shell.

In some embodiments, the first air pressure channels and the second air pressure channels are connected to a vacuum device, the second air pressure channel is connected to a gas supply device, and the vacuum device pumps the first air pressure channels to generate a vacuum. And provide the peripheral negative pressure, the vacuum device evacuates the second air pressure channel to generate vacuum and provide the central negative pressure, and the gas supply device blows air to the second air pressure channel to generate air flow and provide the central positive pressure.

In some embodiments, continuously blowing the center of the target area by the central positive pressure further includes the following steps: the pressure of the central positive pressure continues to increase.

The effect of the present invention is that the method of the present invention can achieve the effect of separating the periphery of the die and the periphery of the target block through the adsorption effect of the peripheral negative pressure and the lifting effect of the pushing parts, and the method of the present invention It can reduce the influence of the viscosity of the carrier film on the crystal grains through the adsorption effect of the central negative pressure and the blowing effect of the central positive pressure. Thus, even if the center of the target block contacts the center of the die, the continuous blowing effect of the central positive pressure can easily peel the center of the die away from the center of the target block without being affected by the viscosity of the carrier film.

Furthermore, the method of the present invention can reduce the influence of the viscosity of the carrier film on the support device through the lifting effect of the pushing parts, the adsorption effect of the central negative pressure, and the blowing effect of the central positive pressure. In this way, even if the center of the target block contacts the support device, the continuous blowing effect of the central positive pressure can easily peel the center of the target block from the support device without being affected by the viscosity of the carrier film, so that the crystal grains will not The problem of bending deformation occurs.

In addition, the continuous blowing effect of the central positive pressure can shorten the peeling time of the center of the grain from the center of the target block, shorten the operation time, and increase the production capacity.

In addition, the continuous blowing effect of the central positive pressure can gradually separate the center of the die from the center of the target area in a relatively gentle manner, without the problem of stress concentration, avoiding damage to the die or damage to the carrier film and remaining in the die. s surface.

In addition, the continuous blowing effect of the central positive pressure can make the center of the target block gently bulge upward. The center of the target block can slowly push the crystal grains up and contact the die-bonding device in a more gentle way, reducing the distance between the die and the solid-state device. The contact force of the crystal device is used to avoid damage to the crystal grains.

The following is a more detailed description of the embodiments of the present invention with reference to drawings and component symbols, so that those skilled in the art can implement them after reading this specification.

Figures 1A and 1B are flow charts of the method of the present invention. Figure 2 is a schematic diagram of step S10 of the method of the present invention. Figure 3 is a schematic diagram of step S20 of the method of the present invention. Figure 4 is a schematic diagram of step S30 of the method of the present invention. 5 is a schematic diagram of step S40 of the method of the present invention, and FIGS. 6 to 9 are schematic diagrams of step S50 of the method of the present invention. The present invention provides a method for peeling off grains using ejection means combined with air pressure control means, which includes the following steps:

Step S10, as shown in FIG. 1A and FIG. 2, a support device 10 supports a target area 21 of a carrier film 20, provides a peripheral negative pressure 13, and adsorbs the target area of the carrier film 20 through the peripheral negative pressure 13. The periphery 211 of 21, and there is a die 30 on the target area 21. There are no tin balls and no copper pillars on the surface of the die 30.

Step S20 , as shown in FIG. 1A and FIG. 3 , a plurality of pushing members 40 rise from the inside of the support device 10 to the outside of the support device 10 and push the die 30 up through the target block 21 so that the periphery 31 of the die 30 It is separated from the periphery 211 of the target block 21, and at the same time, the center 212 of the target block 21 is separated from the supporting device 10.

Step S30, as shown in FIG. 1A and FIG. 4, the support device 10 provides a central negative pressure 14, and uses the central negative pressure 14 to adsorb the center 212 of the target block 21, so that the center 212 of the target block 21 is depressed downward and Separated from the center 32 of the die 30 to contact the support device 10 .

Step S40, as shown in FIGS. 1A and 5 , the support device 10 switches the central negative pressure 14 to a central positive pressure 15, and uses the central positive pressure 15 to blow the center 212 of the target block 21, so that the center 212 of the target block 21 is 212 bulges upward and separates from the support device 10 to contact the center 32 of the die 30 .

Step S50, as shown in Figure 1B, Figure 6, Figure 7, Figure 8 and Figure 9, the support device 10 continues to provide the central positive pressure 15, and continues to blow the center 212 of the target block 21 through the central positive pressure 15, so that the target The center 212 of the block 21 continues to bulge upward and pushes the die 30 upward, and the die 30 gradually separates from the target block 21 from its periphery 31 toward its center 32 .

To sum up, the method of the present invention can achieve the effect of separating the periphery 31 of the die 30 from the periphery 211 of the target block 21 through the adsorption effect of the peripheral negative pressure 13 and the lifting effect of the pushing members 40. Moreover, the method of the present invention can reduce the influence of the viscosity of the carrier film 20 on the crystal grains through the adsorption effect of the central negative pressure 14 and the blowing effect of the central positive pressure 15 . Therefore, even if the center 212 of the target block 21 contacts the center 32 of the die 30 , the continuous blowing effect of the central positive pressure 15 can easily peel the center 32 of the die 30 from the center 212 of the target block 21 . It will be affected by the viscosity of the carrier film 20.

Furthermore, the method of the present invention can reduce the influence of the viscosity of the carrier film 20 on the support device 10 through the lifting effect of the pushing members 40, the adsorption effect of the central negative pressure 14, and the blowing effect of the central positive pressure 15. . Therefore, even if the center 212 of the target block 21 contacts the support device 10 , the continuous blowing effect of the central positive pressure 15 can easily peel the center 212 of the target block 21 from the support device 10 without being affected by the support film 20 The viscosity is affected, so that the crystal grain 30 does not suffer from bending deformation.

In addition, the continuous blowing effect of the central positive pressure 15 can shorten the peeling time of the center 32 of the die 30 from the center 212 of the target block 21, shorten the operation time, and increase the production capacity.

In addition, the continuous blowing effect of the central positive pressure 15 can gradually separate the center 32 of the die 30 and the center 212 of the target block 21 in a relatively gentle manner, without causing stress concentration problems and avoiding damage to the die 30 or the bearing film. 20 is damaged and remains on the surface of the crystal grain 30 .

As shown in Figure 1B, Figure 8 and Figure 9, in the preferred embodiment, in step S50, during the rising process of the die 30, the die 30 contacts a die-bonding device 50; the die-bonding device 50 absorbs the die 30 And the die 30 is moved upward, so that the die 30 is completely separated from the target block 21 . To be more specific, the continuous blowing effect of the central positive pressure 15 can cause the center 212 of the target block 21 to gently bulge upward, and the center 212 of the target block 21 can slowly push the die 30 up and contact it in a relatively gentle manner. The die-bonding device 50 reduces the contact force between the die 30 and the die-bonding device 50 to avoid damage to the die 30 . Furthermore, since the center 32 of the die 30 can be easily peeled off from the center 212 of the target block 21 , the die bonding device 50 can easily move the die 30 upward without being affected by the viscosity of the carrier film 20 .

Figures 10 and 11 are schematic diagrams of step S60 of the method of the present invention. In a preferred embodiment, the following steps are further included after step S50: step S60, as shown in FIG. 1B, FIG. 10 and FIG. 11, the supporting device 10 stops providing the central positive pressure 15, and the pushing members 40 drop to Inside the support device 10 , the air in the space between the center 212 of the target block 21 and the support device 10 is discharged outward through the support device 10 , so that the center 212 of the target block 21 gradually returns to a flat state and contacts the support device 10 , and at the same time, the die bonding device 50 moves the die 30 to a substrate 80, and the surface of the substrate 80 has no tin balls and no copper pillars.

As shown in Figures 1A, 1B, and Figures 3 to 11, in a preferred embodiment, steps S20, S30, S40, S50, and S60 further include the following steps: the support device 10 continues to provide peripheral negative pressure. 13 and the peripheral negative pressure 13 continues to adsorb the periphery 211 of the target block 21 . Thereby, the periphery 31 of the die 30 and the periphery 211 of the target block 21 can continue to be separated.

As shown in Figure 1B and Figures 6 to 9, in a preferred embodiment, step S50 further includes the following steps: the pressure of the central positive pressure 15 continues to increase. To be more clear, under the influence of the continuous increase of the central positive pressure 15 , the center 212 of the target block 21 can continue to bulge upward at a stable speed, so that the center 32 of the die 30 is in contact with the center 212 of the target block 21 Able to gradually separate at a stable speed.

Figure 12 is a schematic diagram of step S70 of the method of the present invention, and Figure 13 is a schematic diagram of step S80 of the method of the present invention. In a preferred embodiment, the following steps are further included after step S60:

Step S70, as shown in FIG. 1B and FIG. 12, the support device 10 stops providing the peripheral negative pressure 13.

Step S80, as shown in FIG. 1B and FIG. 13, move the support device 10 to below another target block 21 and support another target block 21A, and move the die bonding device 50 to above the other target block 21A. .

Specifically, since the support device 10 has stopped providing the peripheral negative pressure 13, the support device 10 no longer adsorbs the target block 21 through the peripheral negative pressure 13, and the support device 10 can move to another target block 21 smoothly. It will be affected by the surrounding negative pressure 13. At the same time, the die bonding device 50 is also aligned with the die 30 on the other target block 21A, so as to perform the transfer process on the die 30 on the other target block 21A.

As shown in FIG. 2 , in the preferred embodiment, the support device 10 includes an outer shell 11 and an inner shell 12 , and the inner shell 12 is disposed in the outer shell 11 . A plurality of first air pressure channels 111 are provided inside the housing 11 , and a plurality of first openings 112 are provided at the top of the housing 11 . The first air pressure channels 111 are respectively connected with the first openings 112 . A second air pressure channel 121 is defined inside the inner shell 12 , and a plurality of second openings 122 are defined at the top of the inner shell 12 . The second air pressure channel 121 is connected with the second openings 122 .

As shown in FIGS. 2 to 11 , the first air pressure channels 111 provide peripheral negative pressure 13 , and the peripheral negative pressure 13 adsorbs the periphery 211 of the target block 21 through the first openings 112 . As shown in FIG. 3 and FIG. 10 , the pushing members 40 are disposed in the second air pressure channel 121 and can rise or fall through the second openings 122 . As shown in Figures 4 to 9, the second air pressure channel 121 provides a central negative pressure 14 or a central positive pressure 15. The central negative pressure 14 adsorbs the center 212 of the target block 21 through the second openings 122, and the central positive pressure 15 passes through The second openings 122 blow against the center 212 of the target area 21 . As shown in FIGS. 10 and 11 , the air in the space between the center 212 of the target block 21 and the supporting device 10 is discharged outward through the second openings 122 and the second air pressure channels 121 in sequence.

Figure 14 is a schematic diagram of the connection relationship between the first air pressure channel 111, the second air pressure channel 121, the vacuum device 60 and the gas supply device 70 of the present invention. As shown in FIG. 14 , the first air pressure channels 111 and the second air pressure channels 121 are both connected to a vacuum device 60 , and the second air pressure channel 121 is connected to a gas supply device 70 . As shown in FIGS. 2 to 11 and 14 , the vacuum device 60 evacuates the first air pressure channels 111 to generate vacuum and provide peripheral negative pressure 13 . As shown in FIGS. 4 and 14 , the vacuum device 60 evacuates the second air pressure channel 121 to generate a vacuum and provide a central negative pressure 14 . As shown in FIGS. 5 to 9 and 14 , the gas supply device 70 blows air into the second air pressure channel 121 to generate air flow and provide a central positive pressure 15 .

The above are only used to explain the preferred embodiments of the present invention, and are not intended to limit the present invention in any form. Therefore, any modifications or changes related to the present invention are made under the same spirit of the invention. , should still be included in the scope of protection intended by the present invention.

10:Support device

11: Shell

111: First air pressure channel

112:First opening

12:Inner shell

121: Second air pressure channel

122:Second opening

13: Peripheral negative pressure

14: Center negative pressure

15: Center positive pressure

20: Carrier film

21,21A: Target block

211:Periphery

212:Center

30: grain

31: Surroundings

32:Center

40: Push piece

50:Crystal bonding device

60: Vacuum device

70:Gas supply device

80:Substrate

S10~S80: steps

Figures 1A and 1B are flow charts of the method of the present invention. Figure 2 is a schematic diagram of step S10 of the method of the present invention. Figure 3 is a schematic diagram of step S20 of the method of the present invention. Figure 4 is a schematic diagram of step S30 of the method of the present invention. Figure 5 is a schematic diagram of step S40 of the method of the present invention. Figures 6 to 9 are schematic diagrams of step S50 of the method of the present invention. Figures 10 and 11 are schematic diagrams of step S60 of the method of the present invention. Figure 12 is a schematic diagram of step S70 of the method of the present invention. Figure 13 is a schematic diagram of step S80 of the method of the present invention. Figure 14 is a schematic diagram of the connection relationship between the first air pressure channel, the second air pressure channel, the vacuum device and the gas supply device of the present invention.

S10~S40: steps

Claims (10)

A method of grain peeling using ejection means combined with air pressure control means, including the following steps: A peripheral negative pressure is used to adsorb the periphery of a target area of a carrier film, and the target area has a crystal grain with no tin balls and no copper pillars on the surface of the crystal grain; A plurality of pushers push the die upward through the target block, so that the periphery of the die is separated from the periphery of the target block; The center of the target block is adsorbed by a central negative pressure, causing the center of the target block to be depressed downward and separated from the center of the die; The central negative pressure is switched to a central positive pressure, and the center positive pressure blows the center of the target block, causing the center of the target block to bulge upward and contact the center of the die; and By the central positive pressure continuously blowing the center of the target block, the center of the target block continues to bulge upward and pushes the grain to rise, and the grain gradually becomes closer to the target block in the direction from its periphery to its center. separation. The grain peeling method using ejection means combined with air pressure control means as described in claim 1, wherein continuously blowing the center of the target block with the center positive pressure further includes the following steps: during the rising process of the grain , the die contacts a die-bonding device; the die-bonding device absorbs the die and moves the die upward, so that the die is completely separated from the target block. The method of grain stripping using an ejection method combined with an air pressure control method as described in claim 2, wherein after the center of the target block is continuously blown by the center positive pressure, the following steps are further included: Stop providing the center positive pressure. , and the pushing members descend, so that the center of the target area gradually returns to a flat state, and at the same time, the die-bonding device moves the die to a substrate whose surface has no tin balls and no copper pillars. The method of grain peeling using ejection means combined with air pressure control means as described in claim 3, wherein the step of adsorbing the periphery of the target block by the peripheral negative pressure further includes the following steps: a support device supports the carrier film The target block and providing the peripheral negative pressure; wherein, the step of pushing the die upward through the target block by the push pieces further includes the following steps: the push pieces rise from the inside of the support device to the Outside the support device, the center of the target block is separated from the support device; wherein, the step of adsorbing the center of the target block through the central negative pressure further includes the following steps: the support device provides the central negative pressure, so that the The center of the target block contacts the support device; wherein, the step of switching the center negative pressure to the center positive pressure further includes the following steps: the support device switches the center negative pressure to the center positive pressure, so that the center negative pressure of the target block is The center is separated from the support device; wherein, continuously blowing the center of the target block by the center positive pressure further includes the following steps: the support device continues to provide the center positive pressure; and wherein the step of stopping providing the center positive pressure further includes It includes the following steps: the supporting device stops providing the center positive pressure, and the pushing members descend to the inside of the supporting device, and the air in the space between the center of the target block and the supporting device passes through the supporting device. The center of the target block gradually returns to a flat state and contacts the supporting device. The die peeling method using ejection means combined with air pressure control means as described in claim 4, wherein the ejection pieces push the die upward through the target block and adsorb the target through the central negative pressure. The steps of centering the center of the block, switching the center negative pressure to the center positive pressure, continuously blowing the center of the target block by the center positive pressure, and stopping providing the center positive pressure all further include the following steps: the The supporting device continues to provide the peripheral negative pressure, and continues to absorb the periphery of the target block through the peripheral negative pressure. The grain peeling method using ejection means combined with air pressure control means as described in claim 5, wherein the step of stopping providing the central positive pressure further includes the following steps: the support device stops providing the peripheral negative pressure; and, The supporting device is moved below another target block and supports the other target block, and the die-bonding device is moved above the other target block. The grain peeling method using ejection means combined with air pressure control means as described in any one of claims 4 to 6, wherein the support device is provided with a plurality of first air pressure channels, a second air pressure channel, a plurality of first air pressure channels, and a plurality of first air pressure channels. openings and a plurality of second openings, the first air pressure channels are respectively connected with the first openings, and the second air pressure channels are connected with the second openings; wherein, the first air pressure channels provide the peripheral negative Pressure, the peripheral negative pressure absorbs the periphery of the target block through the first openings; wherein, the pushing members are disposed in the second air pressure channel and can rise or fall through the second openings; wherein, The second air pressure channel provides the central negative pressure or the central positive pressure. The central negative pressure absorbs the center of the target block through the second openings, and the central positive pressure blows the center of the target block through the second openings. center; and wherein the air in the space between the center of the target block and the supporting device is sequentially discharged outward through the second openings and the second air pressure channel. The grain peeling method using ejection means combined with air pressure control means as described in claim 7, wherein the support device includes an outer shell and an inner shell, the inner shell is arranged in the outer shell, and the inner shell is provided with the The first air pressure channel is provided on the top of the outer shell. The second air pressure channel is provided on the inside of the inner shell. The second openings are provided on the top of the inner shell. The die stripping method using ejection means combined with air pressure control means as described in claim 7, wherein the first air pressure channels and the second air pressure channels are both connected to a vacuum device, and the second air pressure channel is connected to a gas supply device, the vacuum device evacuates the first air pressure channels to generate a vacuum and provides the peripheral negative pressure, the vacuum device evacuates the second air pressure channels to generate a vacuum and provides the central negative pressure, and the gas supply device The second air pressure channel blows air to generate air flow and provide the central positive pressure. The grain peeling method using ejection means combined with air pressure control means as described in claim 1, wherein the continuous blowing of the center of the target block by the central positive pressure further includes the following steps: the pressure of the central positive pressure continues to increase. .

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