201011857 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種剝離裝置，尤其是指一種利用壓 •力差以辅助元件逐段快速剝離薄膜以利拾取元件之一種剝 -離方法與裝置。 【先前技術】 習用之晶粒頂出裝置如圖一 A所示，其係由頂針101 ❿ 以及取放頭102所所組成，此裝置目的在使晶粒900與薄 膜902黏著之面分離，以利於後續取放頭102吸取晶粒 900。如圖一 C與圖一 D所示，該圖係為晶圓俯視以及剖 視示意圖。該晶圓90上具有複數枚晶粒900，該複數牧 晶粒900係黏著於一薄膜902上。不過圖一 A之技術因為 頂針會對晶粒產生應力集中作用，因此容易損傷晶粒。此 外，圖一 A之技術也僅能適用於晶粒厚度3mil·以上之晶 粒。 © 至於3mil以下之晶粒厚度需以非針床頂出方式頂 ‘出，目前非頂針裝置有如圖一 B所示，其係為美國公告專 ' 利US. Pat.No. 4,990,051所揭露之技術，該圖為習用之非 頂針式之晶粒與薄膜剝離裝置示意圖。在本實施例中，透 過兩階段之作動將晶粒頂出至取放頭112上。亦即，第一 階段先以頂出機構111將晶粒900頂出至一特定位置；然 後在第二階段中，再以頂針110將晶粒900頂出。本實施 例雖可以應用於3mi 1以下之晶粒，也可以減少如圖一 A 之習用技術所產生之應力集中之問題，不過該技術卻無法 5 201011857 適用於不同尺寸大小之晶粒，因此當晶粒尺寸有變化時， 必須要更換不同之尺寸頂出機構，如此變化降低生產效 率，無形中增加了生產成本。 .綜合上述，因此亟需一種晶粒與膠膜剝離方法及其裝 置來解決習用技術所產生之問題。 【發明内容】 本發明的主要目的是提供一種剝離方法與裝置，除了 ❿ 在真空負壓所產生的吸附作用力之外，再提供正壓於膠膜 上之元件上，使拾取元件拾取黏著於膠膜上之元件時，藉 由正壓之作用可以輔助元件快速脫離膠膜。 本發明的主要目的是提供一種剝離方法與裝置，其係 可藉由掾升元件吸取側之壓力，使相鄰之元件受到一壓力 而被壓制於承載膠膜之承載台上，以避免元件肩部相互碰 撞受損之可能性。 為了達到上述之目的，本發明提供一種剝離方法，包 Ο 括有下列步驟：提供一膠膜，該膠膜上具有至少一元 * 件；提供一負壓作用於該膠膜之底面；以及拾取該至少一 • 元件的過程中，提供一正壓作用於該至少一元件上以增加 該膠膜所受之壓力差。 較佳的是，其中該膠膜所受之壓力差係大於或等於一 大氣壓。 為了達到上述之目的，本發明提供一種剝離裝置，其 包括有：一承載台，其係可提供承載一膠膜，該膠膜上具 6 201011857 該承载台更具有：一負歷空間，該負磨空 間丁知供負魔作用於該膠膜上； 提供-頂出力於對應之元件上，·一於取頂π 該承載台之上方且與該頂出元二=及其二置: 件，其係設置於該承載台上方，該烊屢‘无杜了担Λ s 元件與該祕間區域之慶力，以增加該膠之m取 孫叮2的是’該剝離震置中該拾取元件係為一吸嘴’盆 係可提供-負磨於對應之元件上以吸取 =嘴其 件更具有複數個通孔，1传可提俾古二 Μ增壓元 通孔而提供一正髮力於；壓氣流經過該複數個 力差係大於或等於=:膜之表面，使該膠膜所·^壓 較佳較，朗壓元㈣為—壓縮 件所處空間中之氣體，以增加壓力 ^後縮元 差係大於或等於-大氣壓。刀使·臈所雙之壓力 【實施方式】 為使貴審查委員能對本發明之特徵、目的 更進一步的認知與瞭解，下文特 力此有 部結構以及設計的理念原由進行細 以了解本發明之特點，詳細說明陳述如下：—委員可 請參閱圖二所示，該圖係為本發明之剝 流程示意圖。在本實施例中，該 實施例 驟:首先進行步⑽，提供 7L件。該兀件係為晶粒、玻璃、陶曼元件或者 夕 件’但不以此為限。接下來進行_41，提供 201011857 於該膠膜之底面。一般而言，膠膜係置於一承載台上，承 載台之内部可以提供負壓經由承載台上之開孔作用於膠膜 之底部。前述提供負壓之方式僅是作法之一，步驟41之精 神在於提供負壓於膠膜之底面，至於用什麼方式，並無一 定之限制。最後進行步驟42，於拾取該至少一元件的過程 中，提供一正壓作用於該至少一元件上以增加該膠膜所受 之壓力差。提供正壓一般可以利用氣流的方式，但不以此 為限。至於拾取晶片的方式在習用技術中，有很多種方式， _ 例如：利用頂針頂起元件或者是利用刮刀的方式讓元件之 邊緣與膠膜先行脫離，使得正壓可以作用於元件邊緣已脫 離之膠膜進而藉由正壓與負壓間所產生之壓力差幫助元件 脫離膠膜，然後再由拾取元件將晶片取走。拾取的方式， 並非步驟42之限制，步驟42主要是利用正壓所產生之作 用力於元件與膠膜間的缝隙，藉由正壓與負壓之壓力差所 產生之作用力輔助元件脫離膠膜。 請參閱圖三A所示，該圖為本發明之剝離裝置第一實 φ 施例示意圖。該剝離裝置2包括有一承載台22、一拾取元 件24以及一增壓元件26。該承載台22係可提供承載一載 體30，其中該載體30具有一膠膜32以及複數個設置於該 膠膜上之元件34。該元件34係為晶粒、玻璃、陶瓷元件 或者是半導體元件，但不以此為限。本實施例中，該元件 係為晶粒。該承載台22更具有一負壓空間23以及一頂出 元件25。在該承載台22承載載體30之台面上更開設有複 數個負壓孔220與該負壓空間23相連通。當負壓空間23 内產生負壓時，其真空負壓所產生之吸力可藉由該複數個 8 201011857 負壓孔220作用於該載體30底部之膠膜32上，使載體30 緊貼附於承載台22之台面。至於產生負壓之方式係屬於習 用技術，在此不作贅述。 該頂出元件25係設置於該承載台22内，該頂出元件 25 —端之頂面可提供一頂出力於對應之元件上。該拾取元 件24係設置於該承載台22之上方且與該頂出元件25相對 應，該拾取元件24係為一吸嘴或其他可產生負壓之拾取 器，其可產生負壓之作用力於對應所欲吸取之元件34上以 @ 吸取該元件34。 該增壓元件26，其係設置於該承載台22上方，該增 壓元件26可提升該拾取元件24與該載體30間區域28之 壓力，以增加該膠膜32所受之壓力差（亦即區域28與負壓 空間23之壓力差）。該增壓元件26更包括有一氣流產生裝 置260以及一盤體261。該氣流產生裝置260係設置於該 盤體261之上方，該氣流產生裝置260可產生高壓氣流91。 請參閱圖三B所示，該圖為本發明之盤體示意圖。本實施 φ 例中，該盤體261是一個圓盤狀之裝置，其中央開設有一 孔洞27，該孔洞27是提供給拾取元件24伸縮動作用之通 道。該盤體261更具有複數個通孔38，其係可以提供圖三 A中之高壓氣流91通過而提供一正壓力於該載體30之表 面。雖然在圖三B中，該盤體係為圓形，但是實際上在實 施時，並不以圓形為限。 請參閱圖四所示，該圖係為本發明之剝離裝置第二實 施例示意圖。在本實施例中，基本上之結構與圖三A相同， 所差異的是，在該承載台上具有一密室結構40，以提供容 9 201011857 置拾取元件24。在該密室結構40與該拾取元件24間更設 置有一增壓元件42，其係與該密室以及該拾取元件保持氣 密結合。在本實施例中，該增壓元件係為類似活塞之結構， 其係可藉由上升以及下降之運動，控制該元件側之區域28 間氣體之密度。也就是說，當該增壓元件42向下移動時， 會使得區域28之空間變小，進而壓縮在區域28内之空氣， 使得區域28内之氣體壓力增加，進而提供一高壓壓力於元 件上。 @ 請參閱圖五A至圖五C所示，係為本發明第一實施例 之實施流程示意圖。圖五A中，該載體30鋪放在該承載台 22上，該元件34貼附在膠膜32上，該膠膜32接觸該承 載台22台面，該承載台22利用真空機或者是抽氣元件（圖 中未顯示）將承載台22内部抽成真空以產生一負壓空間 23，並經由負壓孔220使該負壓空間23延伸到承載台22 的台面以接觸該膠膜32，使該膠膜32受到真空負壓之作 用力緊貼在承載台22的台面上。 φ 在圖五B及圖五C中，該載體30受到負壓空間23之 作用力緊貼於承載台22上，該載體30之膠膜32所受之壓 力差大約在一大氣壓内。當膠膜32受到貪壓空間23作用 緊貼在承載台上，同時該增壓元件26提供高壓氣流91經 由通孔38吹向載體30。藉由增壓元件所提供之正壓，使 得區域28與負壓空間23之壓力差超過一個大氣壓以上。 隨後，啟動剝離元件之作業，該拾取元件24會延伸至元件 34表面並提供吸取力將元件34吸住，該頂出元件25將元 件34頂起，而此動作會使元件34周緣之膠膜32略微與元 201011857 件34剝離，剝離之膠膜圖五B中之標號320所示。此時當 高壓氣流吹壓載體30時會提供一正向作用力於元件或者 是膠膜上，另一方面再藉由負壓作用於膠膜底部，因此藉 由此雙重之作用提升區域28與負壓空間23之壓力差，以 固定載體於承載台22上，避免元件34肩部相互碰撞受損 之可能性。另一方面，高壓氣流91亦會流向被頂起之元件 34與膠膜32略微剝離之處320產生剝離力，使該元件34 與該膠膜32之間除了拾取元件24作用於元件34之吸取力 _ 外更加上高壓氣流作用於被剝離膠膜320之作用力，使元 件34能更快速地脫離該膠膜32，如圖五C之狀態。 惟以上所述者，僅為本發明之實施例，當不能以之限 制本發明範圍。即大凡依本發明申請專利範圍所做之均等 變化及修飾，仍將不失本發明之要義所在，亦不脫離本發 明之精神和範圍，故都應視為本發明的進一步實施狀況。 例如，只要是需要從膠膜或者是其他黏著材質上吸取黏於 其上之元件都可以應用本發明之裝置。 ⑩ 綜合上述，本發明提供之剝離方法與裝置，可以藉由 正壓之作用可以辅助元件快速脫離薄膜以及避免元件肩部 相互碰撞受損，進而提高該產業之競爭力以及帶動週遭產 業之發展，誠已符合新型專利法所規定申請所需具備之要 件，故爰依法呈提新型專利之申請，謹請貴審查委員允 撥時間惠予審視，並賜准專利為禱。 【圖式簡單說明】 11 201011857 圖一 A與圖一 B係為習用之晶粒與薄膜剝離裝置示意圖。 圖一 C與圖一 D係為晶圓俯視以及剖視示意圖。 圖二所示，該圖係為本發明之剝離方法實施例流程示意圖。 圖三A係為本發明之剝離裝置第一實施例示意圖。 圖三B係為本發明之盤體示意圖。 圖四係為本發明之剝離裝置第二實施例示意圖。 圖五A至圖五C係為本發明第一實施例之實施流程示意圖。 _ 【主要元件符號說明】 101頂針 102取放頭 110頂針 111頂出機構 112取放頭 2剝離裝置 〇 22承載台 220負壓孔 23負壓空間 24拾取元件 25頂出元件 26增壓元件 260氣流產生裝置 261盤體 12 201011857 ' 27孔洞 28-區域 30載體 ’ 32膠膜 • 320剝離膠膜 34元件 38通孔 40密室結構 ® 42壓縮元件 90晶圓 9 0 0晶粒 902薄膜 91焉壓氣流201011857 IX. Description of the Invention: [Technical Field] The present invention relates to a peeling device, and more particularly to a peeling-off method using a pressure-force difference to assist a component to quickly peel a film piece by piece to facilitate picking up a component. Device. [Prior Art] A conventional die ejector device is shown in FIG. 1A, which is composed of a ejector pin 101 ❿ and a pick-and-place head 102. The device is intended to separate the die 900 from the film 902. The subsequent pick-and-place head 102 is used to pick up the die 900. As shown in Fig. 1C and Fig. 1D, the figure is a plan view and a cross-sectional view of the wafer. The wafer 90 has a plurality of crystal grains 900 attached to a film 902. However, the technique of Fig. 1A is easy to damage the crystal grains because the thimble exerts a stress concentration on the crystal grains. In addition, the technique of Fig. 1A can only be applied to crystal grains having a grain thickness of 3 mil·s or more. © As for the thickness of the crystal below 3mil, it needs to be topped out in the non-needle bed. The current non-thimble device is shown in Figure 1B, which is the technology disclosed in US Bulletin US Patent No. 4,990,051. This figure is a schematic diagram of a conventional non-thimble type die and film stripping device. In this embodiment, the die is ejected to the pick and place head 112 by a two-stage operation. That is, in the first stage, the die 900 is first ejected to a specific position by the ejector mechanism 111; then, in the second stage, the die 900 is ejected by the ejector pin 110. Although this embodiment can be applied to crystal grains of 3mi 1 or less, the problem of stress concentration caused by the conventional technique as shown in FIG. 1A can be reduced, but the technique cannot be applied to different sizes of crystal grains, so 2010-11857 When the grain size changes, it is necessary to replace the different size ejection mechanism, so that the change reduces the production efficiency, which inevitably increases the production cost. In summary, there is a need for a die and film peeling method and apparatus thereof to solve the problems associated with conventional techniques. SUMMARY OF THE INVENTION The main object of the present invention is to provide a peeling method and apparatus, in addition to the adsorption force generated by the vacuum negative pressure, and then provide a positive pressure on the component on the film, so that the pickup component is picked up and adhered to When the component on the film is pressed, the positive pressure can help the component to quickly separate from the film. SUMMARY OF THE INVENTION A primary object of the present invention is to provide a method and apparatus for stripping which can be pressed against a carrier carrying a film by a pressure on the suction side of the lifting element to avoid the shoulder of the element. The possibility of collision with each other. In order to achieve the above object, the present invention provides a peeling method comprising the steps of: providing a film having at least one member; providing a negative pressure on the bottom surface of the film; and picking up the film During at least one component, a positive pressure is applied to the at least one component to increase the pressure differential experienced by the film. Preferably, the film is subjected to a pressure difference greater than or equal to one atmosphere. In order to achieve the above object, the present invention provides a peeling device comprising: a carrying platform capable of carrying a film, the film having 6 201011857; the carrying platform further having: a negative calendar space, the negative The grinding space Ding knows that the negative magic acts on the film; the - ejection force is applied to the corresponding component, and the top is taken above the loading table and the top element is two and two pieces: The system is disposed above the carrying platform, and the 烊 ' ' 无 无 Λ Λ s s s 与 与 与 与 与 与 与 与 与 , , , , , , , 庆 庆 庆 庆 庆 庆 庆 庆 庆 庆 庆 庆 庆 庆 庆 庆 庆 庆 庆 庆 庆It is a nozzle, the basin can provide - negative grinding on the corresponding component to absorb = mouth. The piece has a plurality of through holes, and the first pass can provide a positive force. The pressure airflow passes through the plurality of force differences to be greater than or equal to =: the surface of the film, so that the pressure of the film is better, and the pressure element (4) is the gas in the space where the compression member is located to increase the pressure. The post-contraction difference is greater than or equal to - atmospheric pressure.刀 使 臈 臈 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 为 为 为 为 为 为 为 为 为 为 为 为 为 为 为 为 为 为 为 为 为 为 为The detailed statement is as follows: - Members can refer to Figure 2, which is a schematic diagram of the stripping process of the present invention. In the present embodiment, the embodiment: First, step (10) is performed to provide a 7L piece. The element is a grain, a glass, a Tauman element or a device ‘ but not limited thereto. Next, proceed to _41 to provide 201011857 on the underside of the film. Generally, the film is placed on a carrier, and the inside of the carrier can provide a negative pressure to the bottom of the film via the opening in the stage. The foregoing method of providing a negative pressure is only one of the methods, and the spirit of the step 41 is to provide a negative pressure on the bottom surface of the film, and there is no limitation on the manner in which it is used. Finally, in step 42, during the picking up of the at least one component, a positive pressure is applied to the at least one component to increase the pressure difference experienced by the film. Providing a positive pressure generally allows the use of airflow, but is not limited to this. As for the way of picking up the wafer, there are many ways in the conventional technology. For example, the ejector pin is used to lift the component or the blade is used to detach the edge of the component from the film first, so that the positive pressure can be applied to the edge of the component. The film in turn assists the component from the film by the pressure differential created between the positive and negative pressures, and then the wafer is removed by the pick-up element. The method of picking up is not the limitation of step 42. Step 42 mainly uses the force generated by the positive pressure to the gap between the component and the film, and the force generated by the pressure difference between the positive pressure and the negative pressure assists the component to be detached from the glue. membrane. Please refer to FIG. 3A, which is a schematic view of the first embodiment of the stripping device of the present invention. The stripping device 2 includes a carrier 22, a pick-up member 24, and a pressurizing member 26. The carrier 22 can be provided with a carrier 30, wherein the carrier 30 has a film 32 and a plurality of components 34 disposed on the film. The element 34 is a die, a glass, a ceramic component or a semiconductor component, but is not limited thereto. In this embodiment, the component is a die. The carrier 22 has a negative pressure space 23 and an ejection member 25. A plurality of negative pressure holes 220 are further communicated with the negative pressure space 23 on the stage on which the carrier 22 carries the carrier 30. When a negative pressure is generated in the negative pressure space 23, the suction generated by the vacuum negative pressure can be applied to the film 32 at the bottom of the carrier 30 by the plurality of 8 201011857 negative pressure holes 220, so that the carrier 30 is closely attached to the carrier 30. The table top of the carrying platform 22. The method of generating negative pressure is a conventional technique and will not be described here. The ejector element 25 is disposed in the carrier 22, and the top surface of the ejector member 25 can provide an ejection force on the corresponding component. The pick-up element 24 is disposed above the loading table 22 and corresponds to the ejector element 25, and the pick-up element 24 is a nozzle or other pick-up device capable of generating a negative pressure, which can generate a negative pressure. The element 34 is drawn at @ on the component 34 corresponding to the desired suction. The pressurizing element 26 is disposed above the carrying platform 22, and the pressurizing element 26 can raise the pressure of the region 28 between the picking member 24 and the carrier 30 to increase the pressure difference of the adhesive film 32 (also That is, the pressure difference between the region 28 and the negative pressure space 23). The plenum element 26 further includes an airflow generating device 260 and a disk 261. The airflow generating device 260 is disposed above the disk body 261, and the airflow generating device 260 can generate a high pressure airflow 91. Please refer to FIG. 3B, which is a schematic view of the disk body of the present invention. In the φ example, the disk body 261 is a disk-shaped device having a hole 27 formed in the center thereof, and the hole 27 is a passage for providing the telescopic action of the pickup member 24. The disk body 261 further has a plurality of through holes 38 which provide a high pressure gas stream 91 in Fig. 3A to provide a positive pressure on the surface of the carrier 30. Although in Fig. 3B, the disc system is circular, it is actually not limited to a circular shape when implemented. Referring to Figure 4, there is shown a schematic view of a second embodiment of the stripping apparatus of the present invention. In the present embodiment, the basic structure is the same as that of Fig. 3A, with the difference that there is a chamber structure 40 on the stage to provide the pick-up element 24. A plenum element 42 is disposed between the chamber structure 40 and the pick-up element 24 for maintaining a gas-tight coupling with the chamber and the pick-up element. In the present embodiment, the plenum element is a piston-like structure that controls the density of the gas between the regions 28 on the element side by the movement of the ascending and descending motions. That is, as the boosting element 42 moves downward, the space in the region 28 is reduced, thereby compressing the air in the region 28, causing the gas pressure in the region 28 to increase, thereby providing a high pressure on the component. . @ 。 FIG. 5A to FIG. 5C are schematic diagrams showing an implementation flow of the first embodiment of the present invention. In Fig. 5A, the carrier 30 is placed on the carrying platform 22, and the component 34 is attached to the adhesive film 32. The adhesive film 32 contacts the surface of the loading platform 22, and the loading platform 22 utilizes a vacuum machine or is pumped. An element (not shown) evacuates the inside of the stage 22 to create a negative pressure space 23, and extends the negative pressure space 23 to the table surface of the stage 22 via the negative pressure hole 220 to contact the film 32. The film 32 is pressed against the table surface of the stage 22 by the force of the vacuum negative pressure. φ In Fig. 5B and Fig. 5C, the carrier 30 is pressed against the carrier 22 by the force of the negative pressure space 23, and the film 32 of the carrier 30 is subjected to a pressure difference of about one atmosphere. When the film 32 is pressed against the load-bearing table by the squeezing space 23, the pressurizing member 26 supplies the high-pressure gas stream 91 to the carrier 30 via the through hole 38. The pressure difference between the region 28 and the negative pressure space 23 exceeds one atmosphere or more by the positive pressure provided by the pressurizing element. Subsequently, the operation of the stripping element is initiated, the picking element 24 extending to the surface of the element 34 and providing a suction force to attract the element 34, the ejecting element 25 lifting the element 34, and this action will cause the film of the periphery of the element 34 32 is slightly peeled off from the element 201011857 piece 34, and the peeled film is shown by reference numeral 320 in Figure 5B. At this time, when the high-pressure airflow blows the carrier 30, a positive force is applied to the component or the film, and on the other hand, the negative pressure acts on the bottom of the film, thereby enhancing the region 28 by the double action. The pressure difference of the negative pressure space 23 is to fix the carrier on the carrier 22, avoiding the possibility that the shoulders of the components 34 collide with each other. On the other hand, the high pressure gas stream 91 also flows to the portion 320 where the ejected member 34 is slightly peeled off from the film 32 to produce a peeling force, such that the picking member 24 acts on the member 34 and the film 32 is sucked. The force _ is further applied to the force of the peeled film 320, so that the element 34 can be detached from the film 32 more quickly, as shown in Fig. 5C. However, the above is only an embodiment of the present invention, and the scope of the present invention is not limited thereto. It is to be understood that the scope of the present invention is not limited to the spirit and scope of the present invention, and should be considered as further implementation of the present invention. For example, the device of the present invention can be applied as long as it is required to absorb the adhesive member from the film or other adhesive material. 10 In summary, the stripping method and device provided by the present invention can assist the component to quickly break away from the film and prevent the collision of the component shoulders by the positive pressure, thereby improving the competitiveness of the industry and promoting the development of the surrounding industry. Cheng has already met the requirements for the application as stipulated in the new patent law. Therefore, the application for new patents is submitted according to law. Please ask the review committee to allow time for review and grant the patent as a prayer. [Simple description of the diagram] 11 201011857 Figure 1 A and Figure 1 B is a schematic diagram of a conventional die and film stripping device. Figure 1 C and Figure 1 D is a schematic view of the wafer and a cross-sectional view. As shown in FIG. 2, the figure is a schematic flow chart of an embodiment of the stripping method of the present invention. Figure 3A is a schematic view of a first embodiment of the stripping device of the present invention. Figure 3B is a schematic view of the disk body of the present invention. Figure 4 is a schematic view of a second embodiment of the stripping device of the present invention. FIG. 5A to FIG. 5C are schematic diagrams showing an implementation flow of the first embodiment of the present invention. _ [Main component symbol description] 101 ejector pin 102 ejector head 110 ejector pin 111 ejector mechanism 112 ejector head 2 detachment device 〇 22 carrier table 220 negative pressure hole 23 negative pressure space 24 pickup element 25 ejector element 26 plenum element 260 Airflow generating device 261 disk body 12 201011857 '27 hole 28-area 30 carrier' 32 film • 320 peel film 34 element 38 through hole 40 chamber structure ® 42 compression element 90 wafer 90 0 grain 902 film 91 rolling airflow