JP2015012246A - Substrate supply device, and method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To stably take a substrate out of a substrate storage part by preventing the state where an insertion paper sheet is deposited to a bottom face of the substrate.SOLUTION: In a substrate supply device 100 comprising a substrate storage part 110 and a substrate hand 120, the substrate hand 120 includes, at positions corresponding to opposite two sides of a substrate 104, one or more adsorption pads 122 for adsorbing the substrate 104 and one or more blow nozzles 124 disposed adjacently to the adsorption pads 122 for blowing gas from a hole 104A provided on the substrate 104. The substrate supply device 100 comprises a control part 146 in which, in the state where the substrate 104 disposed on an uppermost surface of a laminate 102 is adsorbed by the adsorption pads 122, the substrate hand 120 is moved upwards and at least the blow nozzle 124 is caused to blow gas pressing an insertion paper sheet 106 disposed on a bottom face of the substrate 104 against the laminate 102 from the state where the adsorption pads 122 adsorb the substrate 104 to the state where the substrate 104 is separated from the laminate 102 by a predetermined distance.

Description

  The present invention relates to a substrate supply apparatus and method.

  Conventionally, a substrate supply apparatus as shown in Patent Document 1 is used for supplying a substrate (lead frame). The substrate supply apparatus includes a substrate storage unit that alternately stacks a plurality of substrates and a plurality of insertion sheets and stores them as a laminate, and a substrate hand that takes out the substrates from the substrate storage unit. And this board | substrate supply apparatus is equipped with a gas-injection apparatus, and it is made to blow off air on the lower surface of the board | substrate taken out with the board | substrate hand, and the structure which can remove the insertion sheet adhering to the lower surface of a board | substrate It has become.

JP-A-8-231046

  However, in particular, it is possible to stably remove the insertion sheet attached to the lower surface of the substrate with the configuration of the substrate supply apparatus as shown in Patent Document 1 due to the electrostatic adhesion force of the insertion sheet to the substrate. It was difficult.

  Therefore, the present invention has been made to solve the above-mentioned problems, and prevents the insertion sheet from adhering to the lower surface of the substrate and enables the substrate to be stably taken out from the substrate storage portion. It is an object of the present invention to provide a substrate supply apparatus and a method thereof.

  The present invention provides a substrate supply apparatus comprising: a substrate storage unit that alternately stacks a plurality of substrates and a plurality of insertion sheets, and stores the substrate as a laminate; and a substrate hand that takes out the substrate from the substrate storage unit. The substrate hand includes at least one suction pad that sucks the substrate at positions corresponding to at least two opposite sides of the substrate, and a hole that is disposed adjacent to the suction pad and is provided in the substrate. One or more blow nozzles for blowing out gas, and lifts the substrate hand in a state where the substrate disposed on the uppermost surface of the laminate is sucked by the suction pad, and at least the blow nozzle Further, from the state where the suction pad sucks the substrate to the state where the substrate is separated from the laminated body by a predetermined distance, the air which presses the insertion sheet disposed on the lower surface of the substrate against the laminated body. By providing a control unit for blown out it is obtained by solving the above problems.

  In the present invention, the gas is blown from the substrate side through the holes provided in the substrate by the blow nozzle from the state in which the suction pad sucks the substrate to the state in which the substrate is separated from the laminate by a predetermined distance, and is arranged on the lower surface of the substrate. The inserted insertion sheet is pressed against the laminate. That is, according to the present invention, the interposing sheet disposed on the lower surface of the substrate adsorbed by the adsorption pad is used for the gas blowing pressure from the time when the adsorption pad adsorbs the substrate to the substrate disposed further on the lower surface of the insertion sheet. The substrate and the interleaving paper are separated from each other while being pressed with (air blow pressure). For this reason, the blowing pressure of the gas from the blow nozzle can be directly set as the pressing force to the laminate of the interleaving paper. At the same time, the electrostatic chucking force between the interposer and the substrate placed on its lower surface can be used, and the interposer placed on the lower surface of the substrate adsorbed by the suction pad can be retained in the laminate as it is. It is. That is, it is possible to effectively separate the insertion sheet from the substrate sucked by the suction pad.

  It should be noted that the predetermined distance is the uppermost surface of the laminate without causing the interleaf to reattach to the lower surface of the substrate separated from the laminate even when the gas blowing from the blow nozzle stops. Therefore, it is possible to reliably prevent reattachment between the interposer and the substrate, and to prevent deformation and position change of the interposer that may be caused by reattachment. it can. That is, it is possible to easily collect and reuse the interleaving paper.

  The present invention provides a substrate supply method using a substrate storage unit that alternately stacks a plurality of substrates and a plurality of interleaving sheets and stores them as a laminate, and a substrate hand that takes out the substrates from the substrate storage unit. The substrate hand is provided at one or more suction pads for sucking the substrate at positions corresponding to at least two opposite sides of the substrate, and disposed adjacent to the suction pad. One or more blow nozzles for blowing gas through the holes, and the substrate hand is held in a state where the substrate disposed on the uppermost surface of the laminate is adsorbed by the suction pad. A step of raising, and at least the blow nozzle is arranged between the insertion pad disposed on the lower surface of the substrate from a state where the suction pad sucks the substrate to a state where the substrate is separated from the laminate by a predetermined distance. Can be grasped also a step of blowing the gas to be pressed against the laminate, the substrate supply method, which comprises a.

  According to the present invention, it is possible to prevent the insertion sheet from adhering to the lower surface of the substrate, and to stably take out the substrate from the substrate storage unit.

The schematic diagram showing the whole board | substrate supply apparatus which concerns on embodiment of this invention The perspective view showing the arrangement | positioning relationship between the board | substrate hand of FIG. 1, and the board | substrate arrange | positioned at the uppermost surface of a laminated body. The side view showing the state at the time of the adsorption | suction pad of the board | substrate hand of FIG. Flow chart showing the board removal procedure by the board feeder

  Hereinafter, an example of the first embodiment of the present invention will be described with reference to FIGS.

  First, a schematic configuration of the substrate supply apparatus according to the present embodiment will be described. This substrate supply apparatus can be used in a resin molding apparatus for molding a substrate on which a semiconductor chip is not mounted with a die bonder or a resin for mounting a semiconductor chip (for example, molding of an LED reflector or the like). (A semiconductor chip may be mounted on the substrate). In the following, the substrate has a substantially rectangular outer shape (including a case where a convex or concave portion is formed on the outer periphery or a complicated opening is formed inside), and a PCB substrate made of glass epoxy or A lead frame or the like in which a polyimide tape (also referred to as a back tape) is attached to part or all of the lower surface. This polyimide tape is used for burr prevention for resin molding and for fixing a lead frame for improving the yield when wire bonding is performed with a semiconductor chip.

  As shown in FIG. 1, the substrate supply apparatus 100 includes a substrate storage unit 110, an elevator driving unit 116, a substrate hand 120, a substrate hand driving unit 128, an insertion sheet hand 130, and an insertion sheet hand driving unit 138. A board receiving rail 140, a board receiving rail driving unit 142, and a control unit 146. Among these, the substrate storage unit 110 is configured to store a plurality of substrates 104 and a plurality of insertion sheets 106 alternately and store them as a laminate 102. The substrate hand 120 is configured to take out the substrate 104 from the substrate storage unit 110. Here, the substrate hand 120 is provided at one or more suction pads 122 for sucking the substrate 104 at positions corresponding to two opposing sides of the substrate 104 and a position adjacent to the suction pad 122 and provided on the substrate 104. One or more blow nozzles 124 for blowing out gas in the formed holes 104A (FIG. 3). Further, the control unit 146 raises the substrate hand 120 in a state where the substrate 104 disposed on the uppermost surface of the stacked body 102 is adsorbed by the adsorption pad 122, and the adsorption pad 122 is at least at the blow nozzle 124. From the state where the substrate 104 is adsorbed to the state where the substrate 104 is separated from the laminated body 102 by a predetermined distance H, the gas that presses the interposing paper 106 disposed on the lower surface of the substrate 104 against the laminated body 102 is blown out.

  Below, each component is demonstrated using FIGS. 1-3.

  As shown in FIG. 1, the substrate storage unit 110 includes a laminate cassette 112 and a laminate elevator 114. The laminate cassette 112 stores a laminate 102 in which a plurality of substrates 104 and a plurality of insertion sheets 106 are alternately laminated. The laminated body elevator 114 supports the laminated body 102 from below and is connected to the elevator driving unit 116.

  As shown in FIG. 1, the elevator drive unit 116 includes a motor unit 116A, a frame unit 116B, a ball screw 116C, and a guide unit 116D. The motor part 116A is supported by a frame part 116B that rotatably supports the ball screw 116C. The motor portion 116A can rotate the ball screw 116C to move the guide portion 116D engaged with the ball screw 116C up and down relative to the frame portion 116B. The guide portion 116D is connected to the laminate elevator 114, and the laminate elevator 114 moves up and down (moves in the Z direction) relative to the laminate cassette 112 by the vertical movement of the guide portion 116D.

  As shown in FIGS. 1 to 3, the substrate hand 120 can take out the substrate 104 from the substrate storage unit 110, and includes one or more suction pads 122 for sucking the substrate 104 and one or more blows for blowing gas. A nozzle 124 and a determination sensor 126 are included. As shown in FIG. 2, the same number of suction pads 122 are provided at positions corresponding to two opposing sides of the substrate 104 (three in FIG. 2). The blow nozzles 124 are also provided in the same number (four in FIG. 2) at positions adjacent to the suction pads 122 at positions corresponding to the two opposing sides of the substrate 104, respectively. In this embodiment, the suction pads 122 and the blow nozzles 124 are alternately arranged so that the suction pads 122 and the blow nozzles 124 are not adjacent to each other, but the suction pads or the blow nozzles are adjacent to each other. It may be made. Further, the position of the suction pad 122 and the position of the blow nozzle 124 are positions outside a region where a semiconductor chip or the like of the substrate 104 is mounted or a region where resin molding is performed (these are collectively referred to as a coating region of the substrate 104). It corresponds to. The position of the blow nozzle 124 corresponds to the holes 104A (four in FIG. 2) provided in the substrate 104. The hole 104A is provided for positioning the substrate 104, but may be provided in accordance with the position of the blow nozzle 124. When the suction pad 122 is attracted to the substrate 104, the tips of the blow nozzles 124 having a smaller diameter than the holes 104A of the substrate 104 do not enter the holes 104A of the substrate 104 as shown in FIG. The distance is 0.5 mm to 1 mm from the upper surface. That is, the blow nozzle 124 can blow out the gas through the hole 104 </ b> A of the substrate 104. The determination sensor 126 controls whether the substrate 104 is arranged on the uppermost surface of the laminated body 102 or the insertion sheet 106 is arranged when the substrate hand 120 is arranged above the laminated body 102. An output that can be discriminated at 146 (for example, an output using a difference in the reflectance of light) can be performed. The substrate hand 120 is connected to the substrate hand drive unit 128.

  As shown in FIG. 1, the substrate hand drive unit 128 includes a motor unit 128A, a frame unit 128B, a ball screw 128C, and a guide unit 128D. That is, since the substrate hand drive unit 128 has the same configuration as the elevator drive unit 116, description thereof is omitted. The substrate hand 120 moves up and down (moves in the Z direction) by the vertical movement of the guide portion 128D.

  As shown in FIG. 1, the insertion sheet hand 130 can take out the insertion sheet 106 from the substrate storage unit 110 and place the adsorbed insertion sheet 106 in the insertion sheet collection cassette 134 at the retracted position Xh. The insertion sheet hand 130 includes a plurality of suction pads 132 that suck the insertion sheet 106 and a determination sensor 136. The insertion sheet 106 is not provided with a hole at least at a position corresponding to the hole 104 </ b> A (FIG. 3), and the insertion sheet 106 is approximately the same size as the substrate 104. Similar to the suction pads 122, the same number of suction pads 132 are arranged outside the covered region of the substrate 104 and corresponding to positions along the two sides of the insertion sheet 106 (substrate 104). For this reason, even when the insertion sheet 106 is reused, dust, dust, and the like are prevented from adhering to the covering region of the substrate 104 due to contact with the suction pad 132. Since the determination sensor 136 has the same configuration as the determination sensor 126, the description thereof is omitted. The insertion sheet hand 130 is connected to the insertion sheet hand drive unit 138.

  The interleaf paper hand drive unit 138 includes two cylinder mechanisms 138A and 138B as shown in FIG. The cylinder mechanism 138A supports the insertion sheet hand 130 and moves up and down (moves in the Z direction), and the cylinder mechanism 138B supports the cylinder mechanism 138A and moves left and right (moves in the X direction).

  As shown in FIG. 1, the substrate receiving rail 140 is a jig that receives the substrate 104 sucked by the substrate hand 120, and has a concave portion that fits the shape of the substrate 104 on the upper surface. The substrate receiving rail 140 is connected to the substrate receiving rail driving unit 142.

  As shown in FIG. 1, the substrate receiving rail driving unit 142 has one cylinder mechanism. The board receiving rail driving unit 142 supports the board receiving rail 140 and moves left and right (moves in the X direction).

  As shown in FIG. 1, the control unit 146 is connected to the elevator driving unit 116, the board hand 120, the board hand driving unit 128, the interleaving paper hand 130, the interleaving paper hand driving unit 138, and the board receiving rail driving unit 142. Has been. The control unit 146 controls these mechanisms in accordance with the outputs of the determination sensors 126 and 136, a control program incorporated in advance, and an input command from an input unit (not shown). The substrate hand 120, the interleaf paper hand 130, the interleaf paper hand drive unit 138, and the substrate receiving rail drive unit 142 adsorb a compressor, a substrate 104, or the like that sends out compressed gas to blow out gas. An ejector (which may be a vacuum pump) that creates a reduced pressure state for realizing the above is connected and controlled by the control unit 146.

  Next, a procedure for taking out the substrate 104 by the control unit 146 of the substrate supply apparatus 100 will be described mainly with reference to FIGS.

  First, the laminate elevator 114 is raised so that the position of the uppermost surface of the laminate 102 is a predetermined position Z0 (step S2 in FIG. 4). The predetermined position Z0 is such that when the substrate hand 120 (insert paper hand 130) moves above the laminate 102, the substrate 104 (insert paper hand 130) on the top surface 104 of the laminate 102 (insert paper hand 130). The height is such that the insertion sheet 106) can be sucked. Then, the interleaf paper hand 130 is horizontally moved from the retracted position Xh and disposed above the stacked body 102 (step S4 in FIG. 4). Then, based on the output of the determination sensor 136 of the insertion sheet hand 130, the control unit 146 determines whether the substrate 104 or the insertion sheet 106 is disposed on the uppermost surface of the laminate 102 (FIG. 4). Step S6).

  When the substrate 104 is disposed on the uppermost surface of the laminated body 102 (Yes in step S6 in FIG. 4), the insertion sheet hand 130 is moved to the retreat position Xh (step S8 in FIG. 4). Then, the substrate hand 120 is lowered from the retracted position Zh (step S10 in FIG. 4). Then, based on the output of the determination sensor 126 of the substrate hand 120, the control unit 146 determines again whether the substrate 104 or the insertion sheet 106 is disposed on the uppermost surface of the laminate 102 (step of FIG. 4). S12).

  When the substrate 104 is disposed on the uppermost surface of the stacked body 102 (Yes in step S12 in FIG. 4), the substrate 104 at the predetermined position Z0 is sucked by the suction pad 122. Further, the blow nozzle 124 is operated to blow out gas from the blow nozzle 124 (step S14 in FIG. 4). In the case of the laminated body 106 arranged on the uppermost surface of the laminated body 102 (No in steps S6 and S12 in FIG. 4), the process proceeds to step S34 in FIG.

  Next, the substrate hand 120 is raised by a predetermined distance H while the substrate 104 disposed on the uppermost surface of the stacked body 102 is sucked by the suction pad 122 (step S16 in FIG. 4). That is, if the thickness of the substrate 104 is t, the position Z1 of the upper surface of the substrate 104 at this time is (Z0−t + H). At that time, the interleaving paper continuously disposed on the lower surface of the substrate 104 from the state in which the suction pad 122 sucks the substrate 104 to the blow nozzle 124 to the state in which the substrate 104 is separated from the laminate 102 by a predetermined distance H. The gas which presses 106 to the laminated body 102 is blown out. In other words, the insertion sheet 106 is kept on the uppermost surface of the laminated body 102 and the substrate 104 is separated from the laminated body 102, so that the pressing force (air blow pressure) by the gas is the insertion sheet 106. In this state, the electrostatic adhesion force to the substrate 104 is made larger. This air blow pressure can be optimized as appropriate according to the material of the interleaf paper 106, the size of the substrate 104, the predetermined distance H, and the like. Note that the predetermined distance H is the uppermost surface of the laminate 102 without the interleaf paper 106 reattaching to the lower surface of the substrate 104 separated from the laminate 102 even when the gas blowing from the blow nozzle 124 stops. The distance that can be formed. At this stage, the operation of the blow nozzle 124, that is, the blowing of gas from the blow nozzle 124 is stopped (step S18 in FIG. 4).

  Next, the substrate hand 122 is further raised, and the upper surface of the substrate 104 is moved to the standby position Z2 (> Z1) (step S20 in FIG. 4). Further, the substrate receiving rail 140 is horizontally moved from the retracted position Xb and disposed below the adsorbed substrate 104 (step S22 in FIG. 4).

  Next, the stacked body elevator 114 is slightly raised so that the position of the new uppermost surface of the stacked body 102 becomes the predetermined position Z0 (step S24 in FIG. 4). Further, the substrate hand 120 is lowered, and the upper surface of the substrate 104 is moved to the substrate delivery position Z3 (Z1 <Z3 <Z2) (step S26 in FIG. 4). Then, the operation of the suction pad 122 is stopped (step S28 in FIG. 4). Then, the substrate 104 is placed on the substrate receiving rail 140. Further, the interleaf paper hand 130 is moved above the laminated body 102 (step S30 in FIG. 4). Then, based on the output of the determination sensor 136 of the insertion sheet hand 130, the control unit 146 determines whether the substrate 104 or the insertion sheet 106 is disposed on the uppermost surface of the laminate 102 (FIG. 4). Step S32).

  When the insertion sheet 106 is disposed on the uppermost surface of the laminated body 102 (Yes in step S32 in FIG. 4), the substrate hand 120 is raised and moved to the retracted position Zh (> Z2) (FIG. 4 step S34). At this stage, in order to move the substrate 104 transferred on the substrate receiving rail 140 to the next process, an operation of pushing the substrate 104 on the substrate receiving rail 140 to a rail for receiving a substrate of a next process mechanism (not shown) ( (Substrate pusher operation) starts. Further, the insertion sheet hand 130 is lowered (step S36 in FIG. 4). Then, the upper surface of the insertion sheet 106 at the predetermined position Z0 is sucked by the suction pad 132 of the insertion sheet hand 130 (step S38 in FIG. 4). In addition, when the board | substrate 104 is arrange | positioned on the uppermost surface of the laminated body 102 (it is No at step S32 of FIG. 4), it returns to step S8 of FIG.

  Next, the insertion sheet hand 130 is raised (step S40 in FIG. 4). Further, the interstitial paper hand 130 is moved horizontally and placed at the retracted position Xh (step S42 in FIG. 4). At this stage, the substrate pusher operation is completed. Further, the substrate receiving rail 140 is moved horizontally to the retracted position Xb and retracted (step S44 in FIG. 4).

  Next, the operation of the suction pad 132 of the insertion sheet hand 130 is stopped, and the insertion sheet 106 is placed in the insertion sheet collection cassette 134 (step S46 in FIG. 4). Further, the laminate elevator 114 is slightly raised so that the position of the new uppermost surface of the laminate 102 becomes the predetermined position Z0 (step S48 in FIG. 4). And it returns to step S10 of FIG. 4 again. In this way, the substrate 104 is removed from the substrate storage unit 110.

  When the substrate 104 is a lead frame having a polyimide tape attached to the lower surface, a large electrostatic adhesive force acts between the polyimide tape and the insertion sheet 106. That is, the adhesion force of the insertion sheet 106 to the lower surface of the substrate 104 is larger than the adhesion force of the insertion sheet 106 to the upper surface of the substrate 104. Therefore, in this case, the predetermined distance H needs to be appropriately separated, and is preferably 2 mm or more and 6 mm or less. The predetermined distance H may be 6 mm or more, but if it greatly exceeds 10 mm, it becomes difficult to ensure the pressing force of the interleaf paper 106 to the laminated body 102 even if the air blow pressure is increased. The speed at which the substrate 104 is separated from the stacked body 102 is preferably as low as possible, but is about 3 mm / sec, and the time required for separating the substrate 104 and the interleaf paper 106 is about 2 seconds. The gas blowing pressure from the blow nozzle 124 (air blow pressure) is preferably 0.1 MPa to 0.25 MPa. Even if the gas blowing pressure from the blow nozzle 124 exceeds 0.25 MPa, the substrate 104 and the interleaving paper 106 can be separated, but in that case, the gas is inserted by the reaction force of the gas passing through the interleaving paper 106. There is a risk that the slip sheet 106 may be lifted (including misalignment and exposure).

  When the substrate 104 is a PCB substrate, the adhesion force of the insertion sheet 106 to the lower surface of the substrate 104 is equivalent to the adhesion force of the insertion sheet 106 to the upper surface of the substrate 104. Accordingly, even in this case, it is desirable that the predetermined distance H is 2 mm or more and 6 mm or less. The predetermined distance H may be 6 mm or more, but if it greatly exceeds 10 mm, it becomes difficult to ensure the pressing force of the interleaf paper 106 to the laminated body 102 even if the air blow pressure is increased. Further, the speed at which the substrate 104 is separated from the laminated body 102 is preferably as low as possible, but in this case as well, about 3 mm / sec is assumed, and the time required for separating the substrate 104 and the interleaf paper 106 is about 2 seconds. Yes. The gas blowing pressure from the blow nozzle 124 (air blow pressure) is preferably 0.05 MPa to 0.25 MPa. Even if the gas blowing pressure from the blow nozzle 124 exceeds 0.25 MPa, the substrate 104 and the interleaving paper 106 can be separated, but in this case, the reaction force of the gas passing through the interleaving paper 106 is also used. As a result, the insertion sheet 106 may be lifted (including misalignment and play).

  Based on the prior art, when adsorbing a substrate with an adsorption pad, by devising the adsorption position of the adsorption pad (for example, by arranging the adsorption position on a straight line), the portion of the substrate that is not adsorbed is bent, It is also conceivable that the interleaving paper that adheres to the lower surface of the substrate is separated by using a gas blowout using the bent portion of the substrate. However, even with such a method, the form of the interleaving paper attached to the lower surface of the substrate is not constant due to electrostatic adhesion, and it has been difficult to stably separate the interleaving paper from the substrate.

  In order to eliminate electrostatic adhesion, it is considered effective to use an ionizer that ionizes gas. However, with the current ionizers, it is difficult to create an ion air layer having a high ion density that is necessary and to provide a high pressure that requires the ion air layer. That is, in order to reduce the electrostatic adhesion force between the substrate and the insertion sheet, for example, the substrate is sucked and held and lifted, and air is sent between the substrate and the insertion sheet to create a gap. Consider forming an ion air layer in the gap with an ionizer. However, in that case, even if air is sent between the board and the interleaving paper, it is difficult for the interleaving paper to remain partially attached to the board and to make the adhering form reproducible and constant. Thus, it is considered difficult to reliably send the ion air layer to the adhering portion. Even if the ion air layer is sent to the adhering part, the separated interleaf paper will fluctuate due to the pressure of the ion air layer, resulting in variations in the shape of the interleaf paper and variations in the moving position. It is conceivable that the slip-sheet portion will adhere to the substrate again. The static electricity removing effect of the ion air layer is limited to the attenuation of a part of the surface charge, and sufficient static electricity removal is not performed. If the ion air layer is stopped, it is considered that reattachment of the interleaf paper occurs. In addition, when the ion air layer is provided separately from the gas blowing (air blow) by the blow nozzle, the air blow pressure of the ion air layer is small (about 0.03 MPa), and the ion air layer does not enter the gap. It is done.

  However, in the present embodiment, the use or combination of the ion air layer itself is not denied, and a necessary ion air layer may be blown out from the blow nozzle 124, and the periphery (the lower surface of the substrate 104) may be blown out. A configuration in which an ion air layer is sprayed from (including) may be provided.

  In the present embodiment, from the state in which the suction pad 122 sucks the substrate 104 to the state in which the substrate 104 is separated from the stacked body 102 by a predetermined distance H from the substrate 104 side by the hole 104A provided in the substrate 104 by the blow nozzle 124. The gas is continuously blown so that the interleaf paper 106 disposed on the lower surface of the substrate 104 is pressed against the laminate 102. In other words, in the present embodiment, the insertion sheet 106 disposed on the lower surface of the substrate 104 sucked by the suction pad 122 is transferred to the substrate 104 disposed further on the lower surface of the insertion sheet 106. From the time of adsorption, the substrate 104 and the interleaf sheet 106 are separated from each other by being pressed (air clipping state) with a gas blowing pressure (air blow pressure). For this reason, the blowing pressure of the gas from the blow nozzle 124 can be directly used as the pressing force of the interleaf paper 106 to the laminated body 102. At the same time, the electrostatic adsorption force between the insertion sheet 106 and the substrate 104 disposed on the lower surface thereof can be utilized, and the insertion sheet 106 disposed on the lower surface of the substrate 104 adsorbed by the adsorption pad 122 is left as it is, that is, first It is possible to keep the laminate 102 without being displaced from this state. That is, it is possible to effectively separate the insertion sheet 106 from the substrate 104 sucked by the suction pad 122.

  Further, in the present embodiment, even when the gas blowout from the blow nozzle 124 is stopped for a predetermined distance H, the interleaf paper 106 does not reattach to the lower surface of the substrate 104 separated from the laminated body 102, and the lamination is performed. The distance at which the uppermost surface of the body 102 can be formed. For this reason, it is possible to reliably prevent the interleaf paper 106 and the substrate 104 from reattaching, and to prevent deformation and position change of the interleaf paper 106 that may occur due to the reattachment. That is, it is easy to collect the interleaving paper 106 by the interleaving paper hand 130, and it is possible to prevent the interleaving paper 106 from being deformed when the interleaving paper 106 is collected, and it is easy to reuse the interleaving paper 106. Can be performed.

  In the present embodiment, the substrate hand 120 and the interleaf paper hand 130 are provided separately. For this reason, not only can the interleaving paper 106 be stably recovered, but also the cycle time for taking out the substrate 104 from the substrate storage unit 110 can be made faster than when both hands are used together. Further, since the substrate hand 120 only moves up and down, that is, only moves in the Z direction, even if the substrate 104 is detached from the substrate hand 120 during the movement from the laminate cassette 112 to the substrate receiving rail 140, Will return to the laminate 102. For this reason, the risk of dropping the substrate 104 to the outside of the apparatus can be minimized.

  Therefore, according to the present embodiment, it is possible to prevent the insertion sheet 106 from being attached to the lower surface of the substrate 104, and to stably take out the substrate 104 from the substrate storage unit 110.

  Although the present invention has been described with reference to the above embodiment, the present invention is not limited to the above embodiment. That is, it goes without saying that improvements and design changes can be made without departing from the scope of the present invention.

  For example, in the above embodiment, at a predetermined distance H, the blowing of gas from the blow nozzle 124 stops and the interleaf paper 106 forms the uppermost surface of the laminate 102. However, the present invention is not limited to this. Not. For example, the configuration may be such that the gas blowing from the blow nozzle is continued beyond a predetermined distance H, and the insertion sheet is excluded from the uppermost surface of the laminate at the predetermined distance H. May be.

  Further, in the above embodiment, the substrate hand 120 has the three suction pads 122 and the four blow nozzles 124 corresponding to the two sides of the substrate 104, but the present invention is not limited to this. If the suction pad can generate a suction force capable of sucking and holding the substrate, and the blow nozzle can keep the flatness and uniformly press the interleaving paper against the laminated body by blowing out the gas, the effects of the present invention can be obtained accordingly. be able to. For this reason, although it is preferable that there are a large number of suction pads and blow nozzles, the suction pads or blow nozzles may have a flat shape, and each may have only one corresponding to two sides of the substrate.

  Moreover, in the said embodiment, although the board | substrate hand 120 and the insertion sheet hand 130 became separate, this invention is not limited to this. For example, the substrate hand and the interleaf paper hand may be combined. In that case, the number of parts of the board supply device can be reduced, and cost reduction and compactness can be realized.

  A substrate supply apparatus according to the present invention includes a substrate storage unit that alternately stacks a plurality of substrates and a plurality of interleaving sheets and stores them as a laminated body, and a substrate supply having a substrate hand that takes out the substrate from the substrate storage unit Can be widely applied to the device.

DESCRIPTION OF SYMBOLS 100 ... Substrate supply apparatus 102 ... Laminate body 104 ... Substrate 106 ... Insert paper 110 ... Substrate storage part 112 ... Laminate body cassette 114 ... Laminate elevator 116 ... Elevator drive part 120 ... Substrate hand 122, 132 ... Suction pad 124 ... Blow Nozzles 126, 136 ... determination sensor 128 ... substrate hand drive unit 130 ... insert paper hand 134 ... insert paper collection cassette 138 ... insert paper hand drive unit 140 ... substrate receiving rail
142: Substrate receiving rail drive unit 146: Control unit

Claims (3)

In a substrate supply apparatus having a substrate storage unit that alternately stacks a plurality of substrates and a plurality of interleaving sheets and stores them as a laminate, and a substrate hand that takes out the substrate from the substrate storage unit,
The substrate hand includes at least one suction pad for sucking the substrate at positions corresponding to at least two opposite sides of the substrate, and a hole provided in the substrate at a position adjacent to the suction pad. One or more blow nozzles for blowing gas at
The substrate hand is lifted in a state where the substrate disposed on the uppermost surface of the laminate is sucked by the suction pad, and at least the blow nozzle sucks the substrate from the state where the suction pad sucks the substrate. A substrate supply apparatus comprising: a control unit that blows out the gas that presses the insertion sheet disposed on the lower surface of the substrate against the stacked body until the sheet is spaced a predetermined distance from the stacked body. In claim 1,
The predetermined distance forms the uppermost surface of the laminate without causing the interleaf to reattach to the lower surface of the substrate spaced apart from the laminate even when the gas blowing from the blow nozzle stops. A substrate supply apparatus characterized in that the distance can be set. In a substrate supply method using a substrate storage unit that alternately stacks a plurality of substrates and a plurality of insertion sheets and stores them as a laminate, and a substrate hand that takes out the substrate from the substrate storage unit,
The substrate hand includes at least one suction pad that sucks the substrate at positions corresponding to at least two opposite sides of the substrate, and a hole provided in the substrate that is disposed adjacent to the suction pad. And one or more blow nozzles for blowing out gas in
Raising the substrate hand in a state where the substrate disposed on the uppermost surface of the laminate is adsorbed by the suction pad;
At least the blow nozzle presses the insertion sheet disposed on the lower surface of the substrate from the state in which the suction pad sucks the substrate to the state in which the substrate is separated from the stacked body by a predetermined distance. Blowing out the gas,
The board | substrate supply method characterized by including these.

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