JP6888812B2 - Flexible device manufacturing equipment and manufacturing method - Google Patents

Description

The present invention relates to devices and methods for manufacturing flexible devices such as organic electroluminescent devices.

As a bendable flexible display device, an organic electroluminescence (hereinafter, organic EL) device is being widely used in electronic devices such as smartphones. For example, as described in Japanese Patent Application Laid-Open No. 2011-48374, in a general method for manufacturing an organic EL device, a flexible film is formed on one main surface of a hard support substrate, and the flexible film is formed on the flexible film. A device layer including a lower electrode, an organic EL portion, and an upper electrode is formed on the surface. After the device layer is formed, a protective film is applied with an adhesive to cover the device layer. Usually, a glass substrate is used as a support substrate, and a polyimide film is used as a flexible film.

After the layered structure including the flexible film, the device layer and the protective film is formed on the support substrate, the flexible film is irradiated with laser light from the main surface side of the support substrate on the opposite side of the layered structure. This process is called laser lift-off (LLO), and when the flexible film is irradiated with laser light, the adhesion between the support substrate and the flexible film is reduced, and the layered structure is peeled off from the support substrate. It becomes possible to do. The layered structure is formed so that the display device can be multi-chamfered, and after the layered structure is peeled off from the support substrate, a step of cutting out individual portions used as the display device from the layered structure is performed.

Japanese Unexamined Patent Publication No. 2011-48374

In the method for manufacturing an organic EL device as described above, since the edge of the protective film and the main surface of the support substrate are adhered with an adhesive, LLO is performed in order to peel off the layered structure from the support substrate. After that, a step of peeling the edge of the protective film from the support substrate using a cutting tool is required. By using such a blade, the flexible film of the layered structure may be cracked or particles may be generated. Further, in the method for manufacturing an organic EL device as described above, even if the protective film is peeled off from the support substrate, the edge of the protective film is reattached to the support substrate via an adhesive after the blade is separated from the support substrate. As a result, the layered structure may not be smoothly peeled off from the support substrate.

Further, in the method for manufacturing an organic EL device as described above, after the step of peeling the layered structure, a second protective film is attached to the flexible film of the layered structure peeled from the support substrate in order to protect the layered structure. Is being done. Therefore, in the method for manufacturing an organic EL device, it is desired to eliminate such a step related to the second protective film.

In addition, in the conventional method for manufacturing an organic EL device, wrinkles may occur in the layered structure peeled from the support substrate. Such wrinkles cause a decrease in the yield of the display device of the final product.

The present invention provides a flexible device manufacturing apparatus and manufacturing method capable of solving at least one of the above problems.

The first flexible device manufacturing apparatus of the present invention is a flexible device manufacturing apparatus that processes a layered structure formed on a support substrate to manufacture a plurality of flexible devices, and the layered structure is a support substrate of the support substrate. A flexible film formed so as to be in close contact with one main surface, a device layer formed on the flexible film and for giving the plurality of flexible devices a function as an electronic device, and an adhesive are used. A protective film attached so as to cover the device layer is included, and the edge of the protective film is attached to one main surface of the support substrate via the adhesive, and laser light is used. A first processing station that cuts the layered structure and divides the layered structure into a plurality of device portions corresponding to the plurality of flexible devices and a residual portion, and the first processing station. After the layered structure is processed, the flexible film is irradiated with laser light from the other main surface side of the support substrate to reduce the adhesion between the flexible film and the support substrate, or to reduce the adhesion between the flexible film and the support substrate. A second treatment station that removes the edge of the flexible film to reduce the adhesion between the flexible film and the support substrate, and the second treatment station that treats the layered structure and then the porous particles. The support substrate and the porous vacuum chuck are further separated from each other in a state where the layered structure is adsorbed on the porous vacuum chuck having the adsorbent formed in the above. A chuck unit that performs a process of separating the remaining portion together with the support substrate from the plurality of device portions is provided.

In the first flexible device manufacturing apparatus of the present invention, after the layered structure is processed by using the chuck unit, a film is attached to each of the plurality of device portions to which the porous vacuum chuck is adsorbed. A third processing station for processing may be further provided.

The first flexible device manufacturing apparatus of the present invention is a flexible device manufacturing apparatus that processes a layered structure formed on a support substrate to manufacture a plurality of flexible devices, and the layered structure is one of the support substrates. A flexible film formed so as to be in close contact with the main surface of the device, a device layer formed on the flexible film for giving the plurality of flexible devices a function as an electronic device, and a device via an adhesive. It includes a protective film attached so as to cover the layers, and the edge of the protective film is attached to one main surface of the support substrate via the adhesive to the plurality of flexible devices. A porous vacuum chuck that adsorbs the layered structure in a state where the layered structure is divided into a plurality of corresponding device portions and a residual portion, and the porous vacuum chuck adsorbs the layered structure. By irradiating the flexible film with laser light from the other main surface side of the support substrate in this state, the adhesion between the flexible film and the support substrate is lowered, or the edge portion of the flexible film is used. A first processing station that performs a process of reducing the adhesion between the flexible film and the support substrate, and the support substrate and the porous vacuum after the layered structure is processed by the first processing station. by be more separating the chucks, the porous vacuum chuck is provided with a plurality of the device portion adsorbed, and a chuck unit for performing a process for separating the remaining portion together with the supporting substrate.

In the first flexible device manufacturing apparatus of the present invention, after the layered structure is processed by using the chuck unit, a film is attached to each of the plurality of device portions to which the porous vacuum chuck is adsorbed. A second processing station for processing may be further provided.

The second flexible device manufacturing apparatus of the present invention is a flexible device manufacturing apparatus that processes a layered structure formed on a support substrate to produce a plurality of flexible devices, and one or a plurality of the flexible device manufacturing apparatus that processes the layered structure. A first moving conveyor unit capable of mounting a processing station of the above and a porous vacuum chuck having an adsorbent formed of porous particles and movably provided along the first moving path, and the porous. A second moving conveyor unit on which a quality vacuum chuck can be placed and provided so as to be movable along a second moving path is provided, and the first moving conveyor unit and the second moving conveyor unit are provided. The porous vacuum chuck table is configured to be movable between the two, and the porous vacuum chuck receives the layered structure in a state of being mounted on the first moving conveyor unit, and receives the layered structure. The porous vacuum chuck moves from the first moving conveyor unit to the second moving conveyor unit while holding the layered structure, and the porous vacuum chuck does not hold the layered structure. A flexible device manufacturing apparatus that is returned from the second mobile conveyor unit to the first mobile conveyor unit.

The flexible device manufacturing method of the present invention is a method for manufacturing a flexible device for manufacturing a plurality of flexible devices by processing a layered structure formed on a support substrate, wherein the layered structure is one of the support substrates. A flexible film formed so as to be in close contact with the main surface, a device layer formed on the flexible film for giving the plurality of flexible devices a function as an electronic device, and a device layer via an adhesive. The protective film is attached so as to cover the protective film, and the edge of the protective film is attached to one main surface of the support substrate via the adhesive, and the layered shape is formed by using laser light. A first step of cutting the structure to divide the layered structure into a plurality of device portions corresponding to the plurality of flexible devices and a residual portion, and after the first step, the other of the support substrate. By irradiating the flexible film with laser light from the main surface side, the adhesion between the flexible film and the support substrate is lowered, or the flexible film and the support substrate are provided with the exception of the edge of the flexible film. After the second step and the second step, the support substrate and the porous vacuum are in a state where the layered structure is adsorbed on a porous vacuum chuck having an adsorbent formed of porous particles. It includes a third step of separating the residual portion together with the support substrate from the plurality of device portions to which the porous vacuum chuck is attracted by further separating the chuck from the chuck.

The flexible device manufacturing method of the present invention may further include a fourth step of attaching a film to each of the plurality of device portions to which the porous vacuum chuck is adsorbed after the third step.

According to the first and second flexible device manufacturing apparatus of the present invention and the flexible device manufacturing method of the present invention, it is not necessary to perform the step of peeling the edge of the protective film from the support substrate using a cutting tool.

According to the first to third flexible device manufacturing apparatus of the present invention and the flexible device manufacturing method of the present invention, the step of temporarily attaching a protective film to the flexible film side of the layered structure can be eliminated, and further, the step of attaching a temporary protective film to the flexible film side can be eliminated. The yield of the flexible device of the final product does not deteriorate due to the wrinkles generated in the layered structure peeled off from the support substrate.

FIG. 1 is an explanatory diagram showing an outline of a flexible device manufacturing apparatus according to an embodiment of the present invention. FIG. 2 is a cross-sectional view of a layered structure and a support substrate used for manufacturing a flexible device. FIG. 3 is an explanatory diagram showing a pattern of the flexible device manufacturing apparatus in the half-cut process. FIG. 4 is an explanatory diagram illustrating an operation related to a half-cut process executed by the flexible device manufacturing apparatus. FIG. 5 is a plan view of the layered structure after the half-cut process. FIG. 6 is a cross-sectional view of the layered structure and the support substrate after the half-cut process. FIG. 7 is an explanatory diagram showing a pattern of a flexible device manufacturing apparatus in the LLO process. FIG. 8 is an explanatory diagram illustrating an operation related to the LLO process executed by the flexible device manufacturing apparatus. FIG. 9 is a cross-sectional view showing a pattern of the layered structure and the support substrate in the LLO process. FIG. 10 is an explanatory diagram showing a pattern of the flexible device manufacturing apparatus in the support substrate recovery process. 11 (a) and 11 (b) are cross-sectional views showing patterns of the layered structure and the support substrate in the support substrate recovery step. FIG. 12 is an explanatory diagram illustrating operations related to a support substrate collecting step, a support film attaching step, and a flexible device taking out step executed by the flexible device manufacturing apparatus. FIG. 13 is an explanatory diagram showing a pattern of the flexible device manufacturing apparatus in the support film attaching process. FIG. 14 is an explanatory diagram showing a pattern of the flexible device manufacturing apparatus in the flexible device taking-out process.

Hereinafter, the present invention will be described with reference to the drawings. FIG. 1 is an explanatory view showing an outline of a flexible device manufacturing apparatus according to an embodiment of the present invention, and FIG. 2 shows a layered structure 1 and a support substrate used for manufacturing a flexible device in the flexible device manufacturing apparatus. It is sectional drawing which shows 10.

As shown in FIG. 2, a layered structure 1 is formed on one main surface of the support substrate 10 by a forming apparatus (not shown) provided separately from the flexible device manufacturing apparatus shown in FIG. Ru. The layered structure 1 is formed so as to have a structure and a size capable of multi-chamfering a flexible device manufactured by a flexible device manufacturing apparatus. The layered structure 1 is formed on a rectangular flexible film 11 formed so as to be in close contact with one main surface of a rectangular and hard support substrate 10, and the flexible device serves as an electronic device. It includes a device layer 12 having a structure for realizing the function, and a rectangular protective film 14 attached so as to cover the device layer 12 via an adhesive 13. The edges of the four sides of the protective film 14 are attached to the main surface of the support substrate 10 via the adhesive 13 (see also FIG. 5).

The flexible film 11 is provided to support the device layer 12, and the protective film 14 is provided to protect the device layer 12 from the outside. The flexible film 11 is formed so as to be in close contact with the main surface of the layered structure 1, but is made of a flexible material such that the adhesion with the support substrate 10 is lowered by irradiating the laser beam. Has been done. Further, the support substrate 10 is made of a material that transmits laser light.

The flexible device manufactured by the flexible device manufacturing apparatus of the present embodiment is, for example, an organic EL device used as a display device in various electronic devices, and the device layer 12 of the layered structure 1 is a lower electrode and an organic device. It includes an EL layer and an upper electrode (neither shown). The flexible film 11 is a polyimide film, and the protective film 14 is a transparent polyethylene terephthalate (PET) film. As the adhesive 13, an acrylic or epoxy adhesive having thermosetting or ultraviolet curability is used. The adhesive 13 is arranged on the support substrate 10 so as to cover the device layer 12 in a state of being formed in a sheet shape, for example, and then a protective film 14 is arranged so as to cover the adhesive 13 to cover the adhesive 13. Hardening is done. As the support substrate 10, for example, a transparent glass substrate is used.

Since methods and devices for forming such a layered structure 1 used for multi-chamfering of an organic EL device on a support substrate 10 are known, further description thereof in the present specification will be omitted. The present invention is not limited to the production of organic EL devices, and may be applied to the production of any flexible device that can be produced based on the layered structure 1 having the configuration shown in FIG.

The flexible device manufacturing apparatus includes a holding unit 2 that receives and holds the support substrate 10 on which the layered structure 1 is formed from the forming apparatus (not shown). The holding unit 2 includes a U-shaped suction chuck 21, a support portion 22, and an elevating guide portion 23. The base end side of the suction chuck 21 is rotatably attached to the support portion 22 around the horizontal rotation axis R (see FIG. 8), and the support portion 22 is attached to the elevating guide portion 23 so as to be vertically movable. Has been done.

As shown in FIG. 2, the support substrate 10 on which the layered structure 1 is formed is held or sucked by the suction chuck 21 with the support substrate 10 side facing downward. The holding unit 2 is provided so as to be freely travelable along a horizontally provided first guide rail 24 by using a driving means (not shown) such as a ball screw mechanism or a rack and pinion mechanism. As shown in FIG. 1, when the holding unit 2 receives the support substrate 10 on one end side of the first guide rail 24, the holding unit 2 travels in the direction toward the other end side of the first guide rail 24 (in FIG. 1). The direction in which the holding unit 2 moves is indicated by arrows. Although arrows are also shown in other figures, these arrows explain the movement of the components of the flexible device manufacturing apparatus of the present embodiment. However, it does not indicate the component itself of the flexible device manufacturing apparatus).

In the flexible device manufacturing apparatus, the transfer unit 4 for transferring the support substrate 10 and the first movement for moving the transfer unit 4 between the half-cut station 3 and the holding unit 2 and the half-cut station 3 It is equipped with a mechanism 5. The half-cut station 3 includes a laser cutter 31, and performs a half-cut step of dividing the layered structure 1 of the support substrate 10 into individual device portions 15 used as flexible devices and a residual portion 16.

FIG. 3 is an explanatory view showing a pattern of the flexible device manufacturing apparatus in the half-cut process (in FIG. 3, the laser cutter 31 is not shown). FIG. 4 is an explanatory diagram illustrating an operation related to a half-cut process executed by the flexible device manufacturing apparatus. The transport unit 4 includes a pedestal portion 41 and a support column portion 42 provided under the pedestal portion 41. In the present embodiment, the support column 42 is provided with nine columns erected in a grid pattern (when viewed from above) at the base thereof, and the pedestal portion 41 has through holes 43 corresponding to each column. It is opened along the vertical direction.

The first moving mechanism 5 is composed of a uniaxial robot mechanism having a second guide rail 52 that slidably guides the slider portion 51. The pedestal portion 41 is fixed to the slider portion 51. Further, the support column portion 42 is configured to be able to move up and down with respect to the slider portion 51.

When the holding unit 2 that has received the support substrate 10 stops on the transport unit 4 arranged on the first guide rail 24 side, the strut portion 42 rises. When the strut portion 42 rises, each strut of the strut portion 42 projects from the upper surface of the pedestal portion 41 through the through hole 43 of the pedestal portion 41. Since each of the columns of the support column 42 and the suction chuck 21 of the holding unit 2 are arranged so as not to interfere with each other, when the support column 42 rises, the support substrate 10 held by the suction chuck 21 is moved from below. It is pushed and removed from the suction chuck 21.

When the support substrate 10 is removed from the suction chuck 21, the transport unit 4 starts traveling toward the half-cut station 3, and the support substrate 10 is arranged on the pedestal portion 41 by lowering the support column portion 42. .. The upper surface of the pedestal portion 41 is a horizontal plane, and the support substrate 10 is placed on the upper surface of the pedestal portion 41 with the layered structure 1 facing upward.

The laser cutter 31 includes a laser head 32 that can move in a horizontal plane, and when the transport unit 4 arrives at the half-cut station 3, the laser light emitted from the laser head 32 is a layered structure of the support substrate 10. 1 is irradiated to cut the layered structure 1 in the thickness direction. The output of this laser beam is adjusted so as not to cut the support substrate 10.

FIG. 5 is a plan view of the layered structure 1 after the half-cut process, and FIG. 6 is a view of the layered structure 1 and the support substrate 10 after the half-cut process, which are broken along the line AA shown in FIG. It is a sectional view. By controlling the position of the laser head 32 and the on / off of the laser beam, the plurality of device portions 15 are cut or divided with respect to the residual portion 16 of the layered structure 1. The device portion 15 is a portion of the layered structure 1 formed to have a structure used for a flexible device. In the present embodiment, the rectangular device portions 15 are arranged in 5 rows and 5 columns in the layered structure 1, but in the present invention, the number and arrangement of the device portions 15 included in the layered structure 1 are determined. It is not limited to the number and arrangement of embodiments. In the region shown by the shaded area in FIG. 5, the protective film 14 is adhered to the support substrate 10 by the adhesive 13.

When all the device portions 15 in the layered structure 1 are cut from the residual portion 16, the transport unit 4 starts traveling toward the holding unit 2, and the support column portion 42 rises to raise the support substrate 10. Separated from the upper surface of the pedestal portion 41. The support substrate 10 is arranged at a position higher than the suction chuck 21, and when the support substrate 10 arrives on the suction chuck 21, the transport unit 4 stops. Then, when the support column 42 is lowered, the support substrate 10 is placed on the suction chuck 21, and the suction chuck 21 holds or sucks the support substrate 10.

The flexible device manufacturing apparatus includes an LLO station 6 that performs a laser lift-off process. The LLO station 6 is provided adjacent to the half-cut station 3 and has a beam head 61 capable of irradiating a laser beam downward in a band shape or a line shape. As shown in FIGS. 1 and 3, on the other end side of the first guide rail 24, the direction in which the first moving conveyor unit 8 on which the porous vacuum chuck table 7 can be placed is orthogonal to the first guide rail 24. It is provided so that it can run freely. The second moving mechanism 9 that drives the first moving conveyor unit 8 is composed of a uniaxial robot mechanism having a third guide rail 91 (see FIG. 8) that slidably guides the first moving conveyor unit 8. .. The third guide rail 91 defines the movement path of the first moving conveyor unit 8, passes under the first guide rail 24, and extends so as to be orthogonal to the first guide rail 24.

On the upper surface of the porous vacuum chuck table 7, a rectangular adsorbent 71 having a large number of pores is provided by being formed by sintering porous ceramic particles. By performing vacuum suction through a vacuum guide path (not shown) communicating with the adsorbent 71, the work can be adsorbed over the entire upper surface of the adsorbent 71.

The first moving conveyor unit 8 has a first conveyor 81 having two rows of rollers supporting the lower side of the porous vacuum chuck table 7, and a first movable member 82 provided with the first conveyor 81. The first movable member 82 is connected to the first slider 92 (see FIG. 8) of the second moving mechanism 9 that slides along the third guide rail 91. The first conveyor 81 can operate so as to convey the porous vacuum chuck table 7 in a direction orthogonal to the moving direction of the first moving conveyor unit 8. As shown in FIGS. 1 and 3, the first moving conveyor unit 8 has the first guide rail 24 and the LLO station in a state where the porous vacuum chuck table 7 is placed at the first position, which is the initial position thereof. It is arranged between 6.

FIG. 7 is an explanatory view showing a pattern of the flexible device manufacturing apparatus in a state where the LLO process is executed at the LLO station 6 (beam head 61 is not shown), and FIG. 8 is executed by the flexible device manufacturing apparatus. It is explanatory drawing explaining the operation which concerns on the LLO process (the return process of the porous vacuum chuck table 7 which will be described later is also illustrated on the left side of FIG. 8). After the half-cut step is completed, the holding unit 2 holding the support substrate 10 is stopped in a state where the support substrate 10 is arranged on the porous vacuum chuck table 7 at the first position shown in FIG. After that, the support portion 22 of the holding unit 2 rises along the elevating guide portion 23.

As shown in the center of FIG. 8, after the support portion 22 of the holding unit 2 has risen to a predetermined height, the suction chuck 21 rotates 180 degrees around its rotation axis R, so that the support substrate 10 has a layered structure. 1 is arranged so as to be on the lower side. After that, the support portion 22 of the holding unit 2 is lowered, so that the support substrate 10 is an adsorbent of the porous vacuum chuck table 7 mounted on the first moving conveyor unit 8 with the layered structure 1 on the lower side. It is arranged on the upper surface of 71.

When the support substrate 10 is arranged on the upper surface of the adsorbent 71 of the porous vacuum chuck table 7, the holding of the support substrate 10 by the adsorption chuck 21 is released, and a vacuum pump (not shown) is driven to drive the support substrate 10. The porous vacuum chuck table 7 is vacuum-sucked, and the adsorbent 71 of the porous vacuum chuck table 7 sucks the layered structure 1 formed on the support substrate 10.

When the adsorbent 71 adsorbs the layered structure 1, the second moving mechanism 9 operates, so that the first moving conveyor unit 8 moves toward the LLO station 6. A check valve (not shown) is provided in the vacuum guide path that communicates with the porous vacuum chuck table 7 and the vacuum pump, and when the check valve operates, the adsorbent 71 of the porous vacuum chuck table 7 is provided. And the adsorption state of the layered structure 1 is maintained. On the other hand, the holding unit 2 moves to the initial position shown in FIG. 1, the support portion 22 is returned to the original height, and the suction chuck 21 is returned to the original position by reversing 180 degrees around the rotation axis R. Is done.

FIG. 9 is a cross-sectional view corresponding to FIG. 6 showing the patterns of the layered structure 1 and the support substrate 10 in the LLO process. The first mobile conveyor unit 8 stops when it arrives at the LLO station 6. A beam head 61 is arranged above the first mobile conveyor unit 8 and the support substrate 10. In the present embodiment, the beam head 61 is configured to be movable in the longitudinal direction while irradiating downward with a band-shaped or line-shaped laser beam along the lateral direction of the rectangular layered structure 1 and the support substrate 10. There is. The irradiated laser light passes through the support substrate 10 and hits the flexible film 11. Since the laser light of the beam head 61 is scanned from one end side to the other end side of the support substrate 10, the adhesion between the flexible film 11 of the layered structure 1 and the support substrate 10 is lowered.

In the present embodiment, as can be understood from FIG. 9, the laser beam of the beam head 61 irradiates the entire surface of the flexible film 11 of the layered structure 1 between the entire surface of the flexible film 11 and the support substrate 10. Adhesion is reduced. By irradiating the laser beam so as to remove the outer edge portion of the residual portion 16 of the layered structure 1, the adhesion is maintained between the region of the flexible film 11 constituting the outer edge portion and the support substrate 10. May be good. In the present invention, it is not necessary to arrange a mask that limits the irradiation range of the laser beam on the support substrate 10 in the LLO process.

When the irradiation of the laser beam is completed, the first moving conveyor unit 8 returns to the first position shown in FIG. As shown in FIG. 1 and the like, the flexible device manufacturing apparatus is provided parallel to the first guide rail 24, and the first chuck unit 100 that can move along the horizontally arranged fourth guide rail 101. It has. In the present embodiment, the first guide rail 24 and the fourth guide rail 101 are arranged so as to be aligned with each other. One end side of the fourth guide rail 101 is arranged on the other end side of the first guide rail 24 side, and a support substrate recovery station 110 is provided on the other end side of the fourth guide rail 101. In the state shown in FIG. 1, the first chuck unit 100 stands by at the support substrate recovery station 110.

As shown in FIG. 1 and the like, on one end side of the fourth guide rail 101, a second moving conveyor unit 120 on which the porous vacuum chuck table 7 can be placed can travel in a direction orthogonal to the fourth guide rail 101. It is provided in. The third moving mechanism 130 that drives the second moving conveyor unit 120 is composed of a uniaxial robot mechanism having a fifth guide rail 131 (see FIG. 12) that slidably guides the second moving conveyor unit 120. .. The fifth guide rail 131 defines a movement path of the second moving conveyor unit 120, and extends below the fourth guide rail 101 so as to be orthogonal to the fourth guide rail 101.

The second mobile conveyor unit 120 is configured in the same manner as the first mobile conveyor unit 8, and has a second conveyor 121 having two rows of rollers supporting the lower side of the porous vacuum chuck table 7 and a second conveyor. It has a second movable member 122 provided with 121. The second movable member 122 is connected to the second slider 132 (see FIG. 12) of the third moving mechanism 130 that slides along the fifth guide rail 131. The second conveyor 121 operates so as to convey the porous vacuum chuck table 7 in a direction orthogonal to the moving direction of the second moving conveyor unit 120.

In FIG. 1, both the first mobile conveyor unit 8 and the second mobile conveyor unit 120 are arranged at the first position, which is the initial position or the standby position. In this state, the flexible device manufacturing apparatus includes a first intermediate conveyor 141 that connects the first conveyor 81 of the first mobile conveyor unit 8 and the second conveyor 121 of the second mobile conveyor unit 120. The first intermediate conveyor 141 includes two rows of rollers that support the porous vacuum chuck table 7.

After the LLO process is completed, the first mobile conveyor unit 8 is returned to the first position shown in FIG. After that, by operating the first conveyor 81, the first intermediate conveyor 141, and the second conveyor 121, the porous vacuum chuck table 7 in a state where the layered structure 1 is adsorbed is changed from the first moving conveyor unit 8 to FIG. It is sent to the second mobile conveyor unit 120 arranged at the first position shown. After the porous vacuum chuck table 7 moves to the second moving conveyor unit 120, the empty first moving conveyor unit 8 moves along the third guide rail 91 in a direction away from the LLO station 6, and the first It crosses the guide rail 24 and stops at a second position near the end of the third guide rail 91 (see FIG. 10 and the like).

When the porous vacuum chuck table 7 is sent to the second mobile conveyor unit 120, a support substrate recovery step of recovering the support substrate 10 is performed. FIG. 10 is an explanatory diagram showing a pattern of the flexible device manufacturing apparatus in the support substrate recovery process. 11 (a) and 11 (b) are cross-sectional views showing patterns of the layered structure 1 and the support substrate 10 in the support substrate recovery step. FIG. 12 is an explanatory diagram illustrating a support substrate collecting step (and a support film attaching step and a flexible device taking out step described later) executed by the flexible device manufacturing apparatus.

In the support substrate recovery step, first, the first chuck unit 100 waiting at the support board recovery station 110 moves toward the second moving conveyor unit 120. In the present embodiment, the first chuck unit 100 includes a chuck head 103 having a total of four suction pads 102, and a first arm portion 104. The chuck head 103 is slidably provided on one end side of the first arm portion 104, and the other end side of the first arm portion 104 is slidably attached to the fourth guide rail 101.

When the chuck head 103 is arranged on the support substrate 10 which is adsorbed (via the layered structure 1) on the porous vacuum chuck table 7 arranged on the second moving conveyor unit 120, the first chuck is arranged. Unit 100 stops. After that, when the chuck head 103 is lowered and the suction pad 102 comes into contact with the support substrate 10 as shown in FIG. 11A, the suction pad 102 sucks the support substrate 10.

The adhesion between the layered structure 1 and the support substrate 10 is impaired by the LLO process, and the edges of the four sides of the protective film 14 of the layered structure 1 are attached to the support substrate 10 via the adhesive 13. The protective film 14 of the layered structure 1 is adsorbed on the upper surface of the adsorbent 71 of the porous vacuum chuck table 7. Further, by the half-cut step, the individual device portions 15 in the layered structure 1 are cut with respect to the residual portion 16 of the layered structure 1. Therefore, as shown in FIG. 11B, by sufficiently raising the chuck head 103 with respect to the porous vacuum chuck table 7 after adsorbing the support substrate 10 on the suction pad 102, the layered structure 1 is formed. Each device portion 15 is left on the porous vacuum chuck table 7 in a suction state, while the remaining portion 16 of the layered structure 1 is pulled up while being attached to the support substrate 10. The remaining portion 16 of the layered structure 1 is separated from the porous vacuum chuck table 7 together with the support substrate 10. In this way, a plurality of device portions 15, each of which is a flexible device, are taken out from the large-format layered structure 1.

If a foreign substance is present between the flexible film 11 and the support substrate 10, a situation may occur in which the adhesion between the flexible film 11 and the support substrate 10 is locally maintained even after the LLO step. The affected device portion 15 will be separated from or torn from the porous vacuum chuck table 7 together with the support substrate 10 as the chuck head 103 rises. However, in the present invention, the device portion 15 affected by foreign matter is limited. In the conventional method for manufacturing an organic EL device described above, due to the influence of such a foreign substance, a worse situation occurs in which the entire layered structure 1 formed on the support substrate 10 cannot be properly peeled off.

When the support substrate 10 to which the residual portion 16 of the layered structure 1 is attached is separated from the porous vacuum chuck table 7, the first chuck unit 100 moves to the fourth guide while the support substrate 10 is still adsorbed by the chuck head 103. It moves along the rail 101 toward the support substrate recovery station 110. Upon arriving at the support substrate recovery station 110, the first chuck unit 100 is lowered, and the suction state between the chuck head 103 and the support substrate 10 is released, so that the support substrate 10 is a stacker of the support substrate recovery station 110 (FIG. (Not shown). After that, the chuck head 103 rises, and the first chuck unit 100 returns to the standby state. The recovered support substrate 10 may be reused by removing the residual portion 16 of the adhered layered structure 1.

As shown in FIG. 1 and the like, the flexible device manufacturing apparatus includes a support film attaching station 150 on the side of the LLO station 6. As shown in FIG. 12, one end of the fifth guide rail 131 of the third moving mechanism 130 reaches the support film sticking station 150. After the support substrate 10 is removed from the porous vacuum chuck table 7 together with the residual portion 16 of the layered structure 1, the second moving conveyor unit 120 operates the third moving mechanism 130 to operate the fifth guide rail 131. And sent to the support film affixing station 150 (see the right part of FIG. 12). Upon arriving at the support film affixing station 150, the vacuum pump (not shown) operates to enhance the adsorption state between the adsorbent 71 of the porous vacuum chuck table 7 and the device portion 15.

At the support film affixing station 150, a support film affixing step of affixing the support film 17 to the flexible film 11 of each device portion 15 to which the adsorbent 71 of the porous vacuum chuck table 7 is adsorbed is performed. The support film 17 is a copper foil sheet or a graphite sheet included in the finished flexible device, and is completely different from the second protective film described in relation to the prior art. In the present embodiment, the support film sticking station 150 is provided with three stackers 151, and each stacker 151 stores a plurality of support films 17 in a stacked state. One main surface of the support film 17 is an adhesive layer, and the support film 17 is stored with a release paper (not shown) attached to the adhesive layer.

As shown in FIG. 12 and the like, the support film affixing station 150 receives the release mechanism 152 for peeling the release paper of the support film 17 and the support film 17 from which the release paper has been peeled off from the release mechanism 152, and receives the release paper 17 from the release mechanism 152, and the support film portion 15 It includes a movable sticking head 153 that sticks to the flexible film 11, and a suction head 154 that passes from the stacker 151 to the peeling mechanism 152. The sticking head 153 includes a suction portion 155 and a pressing roller 156.

A ribbon 157 having an adhesive surface is unwound from the end of the peeling mechanism 152 on the stacker 151 side so as to travel in the length direction thereof, and the support film 17 carried by the suction head 154 has a release paper of the ribbon 157. It is arranged in the peeling mechanism 152 so as to adhere to the adhesive surface of the above. Further, the suction portion 155 of the sticking head 153 sucks the upper surface of the support film 17 and moves together with the support film 17 as the ribbon 157 runs. At the end of the release mechanism 152 on the side of the porous vacuum chuck table 7, the ribbon 157 is bent downward, so that the suction portion 155 of the sticking head 153 moving toward the porous vacuum chuck table 7 is moved. The release paper of the support film 17 that is adsorbed is peeled off from the support film 17.

With the release paper peeled from the support film 17 and the adhesive surface of the support film 17 exposed downward, the sticking head 153 moves onto the device portion 15 to which the support film 17 is stuck. The support film affixing station 150 includes an image pickup device 158 that images the device portion 15 arranged on the porous vacuum chuck table 7, and is a target device portion based on an image obtained from the image pickup device 158. The position of the suction head 154 is controlled with respect to 15. The sticking head 153 is configured to be tiltable with the pressing roller 156 on the lower side. In this state, one end side of the support film 17 is brought into contact with one end side of the device portion 15, and the sticking head 153 is brought into contact with the device portion 15. By moving it to the other end side, the support film 17 is gradually adhered to the flexible film 11 of the device portion 15 while being pressed by the pressing roller 156. The flexible device 18 is completed by attaching the support film 17 to the device portion 15.

A support film 17 is attached to all the device portions 15 adsorbed on the porous vacuum chuck table 7, and after these device portions 15 become flexible devices 18, the third moving mechanism 130 is driven. , The second moving conveyor unit 120 moves away from the support film sticking station 150. The second moving conveyor unit 120 moves beyond the fourth guide rail 101 to the second position on the other end side of the fifth guide rail 131 in a state where the porous vacuum chuck table 7 is placed. With the second mobile conveyor unit 120 in the second position, the flexible device step of taking out the flexible device 18 is executed.

As can be understood from FIGS. 1 and 12, a flexible device collection station 160 is provided on the other end side of the fifth guide rail 131. Further, the flexible device manufacturing apparatus includes a second chuck unit 170 that can move along the sixth guide rail 171 provided in parallel with the moving direction of the fifth guide rail 131 or the second moving conveyor unit 120. In the present embodiment, the second chuck unit 170 includes a suction chuck 172 and a second arm portion 173. The suction chuck 172 is slidably provided on one end side of the second arm portion 173, and the other end side of the second arm portion 173 is slidably attached to the sixth guide rail 171.

FIG. 14 is an explanatory diagram showing a pattern of the flexible device manufacturing apparatus in the flexible device taking-out process. As can be understood from FIGS. 1, 14 and 12, when the second moving conveyor unit 120 moves to the second position on the other end side of the fifth guide rail 131, it stands by at the flexible device collection station 160. The second chuck unit 170 that has been moving moves toward the second moving conveyor unit 120. When the suction chuck 172 of the second chuck unit 170 arrives on the porous vacuum chuck table 7, the second chuck unit 170 stops.

When the second chuck unit 170 is stopped, the suction chuck 172 of the second chuck unit 170 is lowered, and the suction surface thereof comes into contact with all the flexible devices 18 sucked on the porous vacuum chuck table 7. After that, the suction state of the porous vacuum chuck table 7 and the flexible device 18 is eliminated, the vacuum pump (not shown) communicating with the suction chuck 172 is driven, and the suction chuck 172 sucks all the flexible devices 18. .. After the suction chuck 172 that has attracted the flexible device 18 rises to a predetermined position, the second chuck unit 170 moves to the flexible device recovery station 160.

When the second chuck unit 170 reaches the flexible device recovery station 160, the suction chuck 172 is lowered until the flexible device 18 approaches the upper surface of the recovery table 161. After that, the suction state of the suction chuck 172 and the flexible device 18 is eliminated, and the flexible device 18 is placed on the recovery table 161 (see the left portion of FIG. 12). Then, the suction chuck 172 rises, and the second chuck unit 170 returns to the standby state.

As shown in FIG. 14 and the like, the flexible device manufacturing apparatus includes a first conveyor 81 of the first mobile conveyor unit 8 in the second position and a second conveyor 81 of the second mobile conveyor unit 120 in the second position. A second intermediate conveyor 142 for connecting to the conveyor 121 is provided. The second intermediate conveyor 142 includes two rows of rollers that support the porous vacuum chuck table 7. After the flexible device take-out process is completed, the first conveyor 81, the second intermediate conveyor 142, and the second conveyor 121 are driven to move the empty porous vacuum chuck table 7 from which the workpiece is not attracted to the second moving conveyor. It moves from the unit 120 to the first moving conveyor unit 8.

As can be understood from FIGS. 14 and 8, when the porous vacuum chuck table 7 is received from the second moving conveyor unit 120, the first moving conveyor unit 8 is moved to the second position by being driven by the second moving mechanism 9. Is returned to the first position. As a result, the flexible device manufacturing apparatus shifts to the initial state shown in FIG. 1, and is a series as described above with respect to the new support substrate 10 on which the layered structure 1 is formed by the forming apparatus (not shown). Process is executed.

The above description is for explaining the present invention, and should not be construed as limiting or reducing the scope of the invention described in the claims. Further, the configuration of each part of the present invention is not limited to the above embodiment, and it goes without saying that various modifications can be made within the technical scope described in the claims.

1 Layered structure 10 Support substrate 11 Flexible film 13 Adhesive 14 Protective film 15 Device part 16 Residual part 17 Support film 18 Flexible device 2 Holding unit 3 Half cut station 4 Conveyor unit 5 1st moving mechanism 6 LLO station 7 Porous vacuum Chuck table 71 Adsorbent 8 1st moving conveyor unit 9 2nd moving mechanism 100 1st chuck unit 110 Support substrate recovery station 120 2nd moving conveyor unit 130 3rd moving mechanism 141 1st intermediate conveyor 142 2nd intermediate conveyor 150 Support film Sticking station 160 Flexible device collection station 170 2nd chuck unit

Claims (7)

In a flexible device manufacturing apparatus that manufactures a plurality of flexible devices by processing a layered structure formed on a support substrate.
The layered structure is formed on a flexible film formed so as to be in close contact with one main surface of the support substrate, and is formed on the flexible film to give the plurality of flexible devices a function as an electronic device. The device layer and a protective film attached so as to cover the device layer via an adhesive are included, and the edge of the protective film is one main surface of the support substrate via the adhesive. Is attached to
A first processing station that cuts the layered structure using laser light and divides the layered structure into a plurality of device portions corresponding to the plurality of flexible devices and a residual portion.
After the layered structure is processed at the first processing station, the flexible film is irradiated with laser light from the other main surface side of the support substrate to improve the adhesion between the flexible film and the support substrate. A second processing station that reduces or removes the edge of the flexible film to reduce the adhesion between the flexible film and the support substrate.
After the layered structure is processed at the second processing station, the support substrate and the porous vacuum chuck are in a state where the layered structure is adsorbed on a porous vacuum chuck having an adsorbent formed of porous particles. DOO by further separating the, from the plurality of devices portions where the porous vacuum chuck is adsorbed, the chuck unit for performing a process for separating the remaining portion together with the supporting substrate,
Flexible device manufacturing equipment. A third processing station for processing the layered structure using the chuck unit and then attaching a film to each of the plurality of device portions to which the porous vacuum chuck is adsorbed is further provided. Item 2. The flexible device manufacturing apparatus according to item 1. In a flexible device manufacturing apparatus that manufactures a plurality of flexible devices by processing a layered structure formed on a support substrate.
The layered structure is formed on a flexible film formed so as to be in close contact with one main surface of the support substrate, and is formed on the flexible film to give the plurality of flexible devices a function as an electronic device. The device layer and a protective film attached so as to cover the device layer via an adhesive are included, and the edge of the protective film is one main surface of the support substrate via the adhesive. Is attached to
A plurality of device portions corresponding to the plurality of flexible devices, a porous vacuum chuck that adsorbs the layered structure in a state where the layered structure is divided into a residual portion, and a porous vacuum chuck.
By irradiating the flexible film with laser light from the other main surface side of the support substrate while the porous vacuum chuck is adsorbing the layered structure, the flexible film and the support substrate are brought into close contact with each other. A first processing station that performs a process of reducing the property or reducing the adhesion between the flexible film and the support substrate by removing the edge of the flexible film.
After the layered structure is processed at the first processing station, the support substrate and the porous vacuum chuck are further separated from each other so that the plurality of device portions to which the porous vacuum chuck is attracted can be separated from each other. A chuck unit that performs a process of separating the remaining portion together with the support substrate, and
Flexible device manufacturing equipment. A second processing station for processing the layered structure using the chuck unit and then attaching a film to each of the plurality of device portions to which the porous vacuum chuck is adsorbed is further provided. Item 3. The flexible device manufacturing apparatus according to item 3. In a flexible device manufacturing apparatus that manufactures a plurality of flexible devices by processing a layered structure formed on a support substrate.
With one or more processing stations that process the layered structure,
A first moving conveyor unit capable of mounting a porous vacuum chuck having an adsorbent formed of porous particles and movably provided along the first moving path, and a first moving conveyor unit.
A second moving conveyor unit on which the porous vacuum chuck can be placed and is movably provided along the second moving path,
Is equipped with
The porous vacuum chuck is configured to be movable between the first mobile conveyor unit and the second mobile conveyor unit.
The porous vacuum chuck receives the layered structure in a state of being mounted on the first mobile conveyor unit, and receives the layered structure.
The porous vacuum chuck moves from the first moving conveyor unit to the second moving conveyor unit while holding the layered structure.
The porous vacuum chuck is returned from the second moving conveyor unit to the first moving conveyor unit without holding the layered structure.
Flexible device manufacturing equipment. In a method for manufacturing a flexible device in which a plurality of flexible devices are manufactured by processing a layered structure formed on a support substrate.
The layered structure is formed on a flexible film formed so as to be in close contact with one main surface of the support substrate, and is formed on the flexible film to give the plurality of flexible devices a function as an electronic device. The device layer and a protective film attached so as to cover the device layer via an adhesive are included, and the edge of the protective film is one main surface of the support substrate via the adhesive. Is attached to
A first step of cutting the layered structure using laser light to divide the layered structure into a plurality of device portions corresponding to the plurality of flexible devices and a residual portion, respectively.
After the first step, the flexible film is irradiated with laser light from the other main surface side of the support substrate to reduce the adhesion between the flexible film and the support substrate, or the edge of the flexible film. The second step of reducing the adhesion between the flexible film and the support substrate except for the portion, and
After the second step, the support substrate and the porous vacuum chuck are further separated from each other in a state where the layered structure is adsorbed on the porous vacuum chuck having an adsorbent formed of porous particles. A third step of separating the residual portion together with the support substrate from the plurality of device portions to which the quality vacuum chuck is adsorbed.
Manufacturing methods for flexible devices, including. The method for manufacturing a flexible device according to claim 6, further comprising a fourth step of attaching a film to each of the plurality of device portions to which the porous vacuum chuck is adsorbed after the third step.

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