JP2018181815A5 - - Google Patents
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- JP2018181815A5 JP2018181815A5 JP2017084729A JP2017084729A JP2018181815A5 JP 2018181815 A5 JP2018181815 A5 JP 2018181815A5 JP 2017084729 A JP2017084729 A JP 2017084729A JP 2017084729 A JP2017084729 A JP 2017084729A JP 2018181815 A5 JP2018181815 A5 JP 2018181815A5
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- JP
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- Prior art keywords
- flexible
- support substrate
- layered structure
- vacuum chuck
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000758 substrate Substances 0.000 claims 25
- 238000004519 manufacturing process Methods 0.000 claims 12
- 238000000034 method Methods 0.000 claims 7
- 239000000853 adhesive Substances 0.000 claims 6
- 230000001070 adhesive Effects 0.000 claims 6
- 230000001681 protective Effects 0.000 claims 6
- 239000003463 adsorbent Substances 0.000 claims 3
- 230000000875 corresponding Effects 0.000 claims 3
- 230000001678 irradiating Effects 0.000 claims 3
- 239000002245 particle Substances 0.000 claims 3
Claims (7)
前記層状構造体は、前記支持基板の一方の主面と密着するように形成されたフレキシブル膜と、前記フレキシブル膜上に形成されており、前記複数のフレキシブルデバイスに電子デバイスとしての機能を与えるためのデバイス層と、接着剤を介して前記デバイス層を覆うように貼られた保護フィルムとを含んでおり、前記保護フィルムの縁部は、前記接着剤を介して前記支持基板の一方の主面に付着しており、
レーザー光を用いて前記層状構造体を切断して、前記複数のフレキシブルデバイスに夫々対応した複数のデバイス部分と、残余部分とに前記層状構造体を分割する処理を行う第１処理ステーションと、
前記第１処理ステーションで前記層状構造体が処理された後、前記支持基板の他方の主面側から前記フレキシブル膜にレーザー光を照射することで、前記フレキシブル膜と前記支持基板との密着性を低下させる、又は、前記フレキシブル膜の縁部を除いて前記フレキシブル膜と前記支持基板との密着性を低下させる処理を行う第２処理ステーションと、
前記第２処理ステーションで前記層状構造体が処理された後、多孔質粒子で形成された吸着体を有する多孔質真空チャックに前記層状構造体が吸着した状態で前記支持基板と前記多孔質真空チャックとを離間させることで、前記多孔質真空チャックが吸着している前記複数のデバイス部分から、前記残余部分を前記支持基板と共に分離する処理を行うチャックユニットと、
を備える、フレキシブルデバイス製造装置。 In a flexible device manufacturing apparatus that manufactures a plurality of flexible devices by processing a layered structure formed on a support substrate,
The layered structure is a flexible film formed so as to be in intimate contact with one main surface of the support substrate, and is formed on the flexible film to provide the plurality of flexible devices with a function as an electronic device. and the device layer, with an adhesive includes a protective film that is affixed to cover the device layer, edges, one main surface of the support substrate via the adhesive of the protective film Is attached to
Cutting the layered structure using a laser beam, a plurality of device portions respectively corresponding to the plurality of flexible devices, and a first processing station performing a process of dividing the layered structure into a remaining portion,
After the layered structure is processed in the first processing station, by irradiating the flexible film with laser light from the other main surface side of the support substrate, the adhesion between the flexible film and the support substrate is improved. A second processing station that performs a process of reducing or reducing the adhesion between the flexible film and the support substrate except for an edge of the flexible film,
After the layer structure is processed in the second processing station, the support substrate and the porous vacuum chuck are held in a state where the layer structure is adsorbed on a porous vacuum chuck having an adsorbent formed of porous particles. By separating the, from the plurality of device portions that the porous vacuum chuck is adsorbed, a chuck unit that performs a process of separating the remaining portion together with the support substrate,
A flexible device manufacturing apparatus comprising:
前記層状構造体は、前記支持基板の一方の主面と密着するように形成されたフレキシブル膜と、前記フレキシブル膜上に形成されており、前記複数のフレキシブルデバイスに電子デバイスとしての機能を与えるためのデバイス層と、接着剤を介して前記デバイス層を覆うように貼られた保護フィルムとを含んでおり、前記保護フィルムの縁部は、前記接着剤を介して前記支持基板の一方の主面に付着しており、
前記複数のフレキシブルデバイスに夫々対応した複数のデバイス部分と、残余部分とに前記層状構造体が分割されている状態で前記層状構造体を吸着する多孔質真空チャックと、
前記多孔質真空チャックが前記層状構造体を吸着している状態で、前記支持基板の他方の主面側から前記フレキシブル膜にレーザー光を照射することで、前記フレキシブル膜と前記支持基板との密着性を低下させる、又は、前記フレキシブル膜の縁部を除いて前記フレキシブル膜と前記支持基板との密着性を低下させる処理を行う第１処理ステーションと、
前記第１処理ステーションで前記層状構造体が処理された後、前記支持基板と前記多孔質真空チャックとを離間させることで、前記多孔質真空チャックが吸着している前記複数のデバイス部分から、前記残余部分を前記支持基板と共に分離する処理を行うチャックユニットと、
を備える、フレキシブルデバイス製造装置。 In a flexible device manufacturing apparatus that manufactures a plurality of flexible devices by processing a layered structure formed on a support substrate,
The layered structure is a flexible film formed so as to be in intimate contact with one main surface of the support substrate, and is formed on the flexible film to provide the plurality of flexible devices with a function as an electronic device. and the device layer, with an adhesive includes a protective film that is affixed to cover the device layer, edges, one main surface of the support substrate via the adhesive of the protective film Is attached to
A plurality of device portions respectively corresponding to the plurality of flexible devices, and a porous vacuum chuck that adsorbs the layered structure in a state where the layered structure is divided into the remaining portions,
By irradiating the flexible film with laser light from the other main surface side of the support substrate while the porous vacuum chuck is adsorbing the layered structure, the flexible film and the support substrate are brought into close contact with each other. A first processing station that performs a process of reducing the adhesiveness, or reducing the adhesiveness between the flexible film and the support substrate except for the edge of the flexible film,
After the layered structure is processed in the first processing station, by separating the support substrate and the porous vacuum chuck, from the plurality of device portions where the porous vacuum chuck is adsorbed, A chuck unit for performing a process of separating the remaining portion together with the support substrate,
A flexible device manufacturing apparatus comprising:
前記層状構造体を処理する１又は複数の処理ステーションと、
多孔質粒子で形成された吸着体を有する多孔質真空チャックを載置可能であって、第１移動経路に沿って移動自在に設けられた第１移動コンベアユニットと、
前記多孔質真空チャックを載置可能であって、第２移動経路に沿って移動自在に設けられた第２移動コンベアユニットと、
を備えており、
前記第１移動コンベアユニットと前記第２移動コンベアユニットとの間で、前記多孔質真空チャックの移動が行えるように構成されており、
前記多孔質真空チャックは、前記第１移動コンベアユニットに載置された状態で、前記層状構造体を受け取り、
前記多孔質真空チャックは、前記層状構造体を保持した状態で前記第１移動コンベアユニットから前記第２移動コンベアユニットに移動し、
前記多孔質真空チャックは、前記層状構造体を保持していない状態で前記第２移動コンベアユニットから前記第１移動コンベアユニットへと戻される、
フレキシブルデバイス製造装置。 In a flexible device manufacturing apparatus that manufactures a plurality of flexible devices by processing a layered structure formed on a support substrate,
One or more processing stations for processing the layered structure;
A first moving conveyor unit capable of mounting a porous vacuum chuck having an adsorbent formed of porous particles, the first moving conveyor unit being movably provided along a first moving path;
A second moving conveyor unit capable of mounting the porous vacuum chuck thereon and movably provided along a second moving path;
With
Between said second mobile conveyor unit and the first mobile conveyor unit is configured to allow movement of the porous vacuum chuck,
The porous vacuum chuck receives the layered structure while being placed on the first moving conveyor unit,
The porous vacuum chuck moves from the first moving conveyor unit to the second moving conveyor unit while holding the layered structure,
The porous vacuum chuck is returned from the second moving conveyor unit to the first moving conveyor unit without holding the layered structure,
Flexible device manufacturing equipment.
前記層状構造体は、前記支持基板の一方の主面と密着するように形成されたフレキシブル膜と、前記フレキシブル膜上に形成されており、前記複数のフレキシブルデバイスに電子デバイスとしての機能を与えるためのデバイス層と、接着剤を介して前記デバイス層を覆うように貼られた保護フィルムとを含んでおり、前記保護フィルムの縁部は、前記接着剤を介して前記支持基板の一方の主面に付着しており、
レーザー光を用いて前記層状構造体を切断して、前記複数のフレキシブルデバイスに夫々対応した複数のデバイス部分と、残余部分とに前記層状構造体を分割する第１工程と、
前記第１工程後、前記支持基板の他方の主面側から前記フレキシブル膜にレーザー光を照射することで、前記フレキシブル膜と前記支持基板との密着性を低下させる、又は、前記フレキシブル膜の縁部を除いて前記フレキシブル膜と前記支持基板との密着性を低下させる第２工程と、
前記第２工程後、多孔質粒子で形成された吸着体を有する多孔質真空チャックに前記層状構造体が吸着した状態で前記支持基板と前記多孔質真空チャックとを離間させることで、前記多孔質真空チャックが吸着している前記複数のデバイス部分から、前記残余部分を前記支持基板と共に分離する第３工程と、
を含む、フレキシブルデバイスの製造方法。 In a flexible device manufacturing method for manufacturing a plurality of flexible devices by processing a layered structure formed on a supporting substrate,
The layered structure is a flexible film formed so as to be in intimate contact with one main surface of the support substrate, and is formed on the flexible film to provide the plurality of flexible devices with a function as an electronic device. and the device layer, with an adhesive includes a protective film that is affixed to cover the device layer, edges, one main surface of the support substrate via the adhesive of the protective film Is attached to
Cutting the layered structure using laser light, a plurality of device portions corresponding to the plurality of flexible devices, and a first step of dividing the layered structure into a remaining portion,
After the first step, by irradiating the flexible film with laser light from the other main surface side of the support substrate, the adhesiveness between the flexible film and the support substrate is reduced, or the edge of the flexible film is reduced. A second step of reducing the adhesion between the flexible film and the support substrate except for the portion,
After the second step, the support substrate and the porous vacuum chuck are separated in a state where the layered structure is adsorbed to a porous vacuum chuck having an adsorbent formed of porous particles, whereby the porous A third step of separating the remaining portion together with the support substrate from the plurality of device portions to which the vacuum chuck is attached;
A method for manufacturing a flexible device, comprising:
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017084729A JP6888812B2 (en) | 2017-04-21 | 2017-04-21 | Flexible device manufacturing equipment and manufacturing method |
| TW107112748A TWI744517B (en) | 2017-04-21 | 2018-04-13 | Manufacturing device and manufacturing method of flexible element |
| CN201810361332.0A CN108735918B (en) | 2017-04-21 | 2018-04-20 | Apparatus and method for manufacturing flexible device |
| KR1020180046170A KR102499047B1 (en) | 2017-04-21 | 2018-04-20 | Apparatus and method for manufacturing flexible device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017084729A JP6888812B2 (en) | 2017-04-21 | 2017-04-21 | Flexible device manufacturing equipment and manufacturing method |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018181815A JP2018181815A (en) | 2018-11-15 |
| JP2018181815A5 true JP2018181815A5 (en) | 2020-03-12 |
| JP6888812B2 JP6888812B2 (en) | 2021-06-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017084729A Active JP6888812B2 (en) | 2017-04-21 | 2017-04-21 | Flexible device manufacturing equipment and manufacturing method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6888812B2 (en) |
| KR (1) | KR102499047B1 (en) |
| CN (1) | CN108735918B (en) |
| TW (1) | TWI744517B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20240017994A (en) * | 2018-12-21 | 2024-02-08 | 도쿄엘렉트론가부시키가이샤 | Periphery removing apparatus and periphery removing method |
| CN112026331B (en) * | 2019-06-03 | 2022-05-13 | 万向一二三股份公司 | Foam release paper stripping mechanism and stripping method thereof |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004306191A (en) * | 2003-04-07 | 2004-11-04 | Seiko Epson Corp | Table device, film deposition device, optical element, semiconductor device and electronic equipment |
| KR101149433B1 (en) | 2009-08-28 | 2012-05-22 | 삼성모바일디스플레이주식회사 | Flexible display and method for manufacturing the same |
| KR101097344B1 (en) * | 2010-03-09 | 2011-12-23 | 삼성모바일디스플레이주식회사 | Method of manufacturing flexible display apparatus |
| JP2011233426A (en) * | 2010-04-28 | 2011-11-17 | Tazmo Co Ltd | Firing apparatus for organic film and organic element having organic film fired by the apparatus |
| JP2012069557A (en) * | 2010-09-21 | 2012-04-05 | Covalent Materials Corp | Porous chuck and method of manufacturing same |
| JP2013191746A (en) * | 2012-03-14 | 2013-09-26 | Toshiba Corp | Method for manufacturing semiconductor device, and semiconductor manufacturing apparatus |
| JP2013251191A (en) * | 2012-06-01 | 2013-12-12 | Dainippon Printing Co Ltd | Organic electroluminescent element |
| JP2014048619A (en) * | 2012-09-04 | 2014-03-17 | Panasonic Corp | Manufacturing method of flexible device |
| KR102025704B1 (en) * | 2012-09-14 | 2019-09-27 | 삼성디스플레이 주식회사 | Apparatus for inspecting film |
| KR20140062368A (en) * | 2012-11-14 | 2014-05-23 | 엘지디스플레이 주식회사 | Method of fabricating the flexible display device |
| KR102158971B1 (en) * | 2013-03-11 | 2020-09-24 | 삼성디스플레이 주식회사 | Substrate peeling device, method of peeling substrate and method of manufacturing flexible display device |
| KR102113174B1 (en) * | 2013-04-30 | 2020-05-21 | 삼성디스플레이 주식회사 | A flexible display device manufacturing method |
| KR102135933B1 (en) * | 2013-12-31 | 2020-07-21 | 엘지디스플레이 주식회사 | Method of fabricating flexible organic light emitting diode display device |
| US9437839B2 (en) * | 2014-06-19 | 2016-09-06 | Panasonic Intellectual Property Management Co., Ltd. | Method for manufacturing electronic device and electronic device manufactured thereby |
| JP5954549B2 (en) * | 2014-08-01 | 2016-07-20 | 日東電工株式会社 | Method for handling display cell of flexible thin film structure |
-
2017
- 2017-04-21 JP JP2017084729A patent/JP6888812B2/en active Active
-
2018
- 2018-04-13 TW TW107112748A patent/TWI744517B/en active
- 2018-04-20 CN CN201810361332.0A patent/CN108735918B/en active Active
- 2018-04-20 KR KR1020180046170A patent/KR102499047B1/en active IP Right Grant
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