JP2018181815A - Manufacturing apparatus of flexible device and manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a flexible device manufacturing apparatus which does not require a step of peeling a layer structure from a support substrate by using an edge tool.SOLUTION: A flexible device manufacturing apparatus comprises: a first processing station 3 that cuts a layer structure 1 formed on a support substrate 10 by using a laser beam, and performs processing for dividing a plural device parts 15 from a residual part 16; a second processing station 6 that performs processing for reducing adhesion between a flexible film 11 of the layer structure 1 and the support substrate 10 by irradiating the support substrate 10 with the laser beam after the layer structure 1 is processed in the first processing station 3; and a chuck unit 100 that performs processing for separating the residual part 16 from the plural device parts 10 with the support substrate 10 by separating the support substrate 10 and a porous vacuum chuck 7 in a state where the layer structure 1 is sucked to the porous vacuum chuck 7 after the layer structure 1 is processed in the second processing station 6.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an apparatus and method for manufacturing flexible devices such as organic electroluminescent devices.

  Organic electroluminescent (hereinafter, organic EL) devices are being widely used in electronic devices such as smart phones as flexible display devices that can be bent. For example, as described in JP-A-2011-48374, in a general method of manufacturing an organic EL device, a flexible film is formed on one main surface of a hard support substrate, and the flexible film is formed on the flexible film. A device layer including the lower electrode, the organic EL unit, and the upper electrode is formed on the After the device layer is formed, a protective film is attached using an adhesive to cover the device layer. Usually, a glass substrate is used as a support substrate, and a polyimide film is used as a flexible film.

  After the layered structure including the flexible film, the device layer and the protective film is formed on the supporting substrate, the flexible film is irradiated with laser light from the main surface side of the supporting substrate on the opposite side of the layered structure. This process is called laser lift-off (LLO), and by irradiating the flexible film with laser light, the adhesion between the support substrate and the flexible film is reduced, and the layered structure is peeled off from the support substrate. It is possible to The layered structure is formed so that the display device can be chamfered, and after peeling the layered structure from the support substrate, a process of cutting away individual portions used as the display device from the layered structure is performed.

JP, 2011-48374, A

  In the method of manufacturing the organic EL device as described above, since the edge of the protective film and the main surface of the support substrate are bonded with an adhesive, LLO is performed to separate the layered structure from the support substrate. Then, a step of peeling the edge of the protective film from the support substrate using a knife is required. By using such a blade, the flexible film of the layered structure may be cracked or particles may be generated. In addition, in the method of manufacturing an organic EL device as described above, even if the protective film is peeled off from the support substrate, the edge of the protective film reattaches to the support substrate via the adhesive after releasing the cutter from the support substrate. In some cases, the layered structure can not be peeled off smoothly from the supporting substrate.

  Furthermore, in the method of manufacturing an organic EL device as described above, the second protective film is attached to the flexible film of the layered structure peeled from the support substrate to protect the layered structure after the peeling step of the layered structure. The thing is done. Therefore, in the method of manufacturing an organic EL device, it is desirable to eliminate the process related to such a second protective film.

  In addition, in the conventional method of manufacturing an organic EL device, wrinkles may occur in the layered structure peeled off from the support substrate. Such defects cause deterioration in the yield of display devices of final products.

  The present invention provides a flexible device manufacturing apparatus and method that can solve at least one of the above problems.

  The first flexible device manufacturing apparatus of the present invention is a flexible device manufacturing apparatus for manufacturing a plurality of flexible devices by processing a layered structure formed on a support substrate, wherein the layered structure is the support substrate. A flexible film formed in close contact with one main surface, a device layer formed on the flexible film, for giving the plurality of flexible devices a function as an electronic device, and an adhesive And a protective film attached to cover the device layer, wherein the edge of the protective film is attached to one of the main surfaces of the support substrate via the adhesive, and a laser beam is used. The layered structure is cut to divide the layered structure into a plurality of device portions respectively corresponding to the plurality of flexible devices and a remaining portion. And the flexible film is irradiated with the laser beam from the other main surface side of the support substrate after the layered structure is processed at the first processing station for performing the processing and the first processing station. A second processing station for reducing adhesion between the membrane and the support substrate, or reducing adhesion between the flexible membrane and the support substrate except for the edge of the flexible membrane; After the layered structure is processed at a processing station, the support substrate and the porous vacuum chuck are separated in a state where the layered structure is adsorbed to a porous vacuum chuck having an adsorbent formed of porous particles. Process to separate the remaining part from the plurality of device parts adsorbed by the porous vacuum chuck together with the support substrate. It includes a chuck unit.

  In the first flexible device manufacturing apparatus of the present invention, after the layered structure is processed using the chuck unit, a film is attached to each of the plurality of device portions adsorbed by the porous vacuum chuck. It may further comprise a third processing station for processing.

  The first flexible device manufacturing apparatus of the present invention is a flexible device manufacturing apparatus for processing a layered structure formed on a support substrate to manufacture a plurality of flexible devices, wherein the layered structure is one of the support substrates. A flexible film formed to be in close contact with the main surface of the device, a device layer formed on the flexible film, for giving the plurality of flexible devices a function as an electronic device, and a device via an adhesive And a protective film attached to cover the layer, the edge of the protective film being attached to one main surface of the support substrate via the adhesive, to the plurality of flexible devices A porous material which adsorbs the layered structure in a state where the layered structure is divided into a plurality of corresponding device portions and a remaining portion. The flexible film and the support are formed by irradiating the flexible film with a laser beam from the other principal surface side of the support substrate while the empty chuck and the porous vacuum chuck are adsorbing the layered structure. A first processing station for performing processing for reducing adhesion to a substrate or reducing adhesion between the flexible film and the support substrate except for the edge of the flexible film; and By separating the support substrate and the porous vacuum chuck after the layered structure is processed, the remaining portions of the plurality of device portions to which the porous vacuum chuck is adsorbed are made to be together with the support substrate. And a chuck unit for performing separation processing.

  In the first flexible device manufacturing apparatus of the present invention, after the layered structure is processed using the chuck unit, a film is attached to each of the plurality of device portions adsorbed by the porous vacuum chuck. It may further comprise a second processing station for processing.

  A second flexible device manufacturing apparatus according to the present invention is a flexible device manufacturing apparatus for processing a layered structure formed on a support substrate to produce a plurality of flexible devices, wherein one or more of the layered structure are processed. And a first movable conveyor unit capable of mounting a porous vacuum chuck having an adsorbent formed of porous particles and movable along a first movement path; A second movable conveyer unit capable of mounting the quality vacuum chuck and movable along a second movement path, the first movable conveyer unit and the second movable conveyer unit Between the movable vacuum chuck table and the movable vacuum conveyor table, and the porous vacuum chuck is configured to move the porous vacuum chuck table. And the porous vacuum chuck is moved from the first movable conveyor unit to the second movable conveyor unit while holding the layered structure while being placed on the The flexible device manufacturing apparatus, wherein the porous vacuum chuck is returned from the second movable conveyor unit to the first movable conveyor unit without holding the layered structure.

  The method of manufacturing a flexible device according to the present invention is a method of manufacturing a flexible device in which a plurality of flexible devices are manufactured by processing a layered structure formed on a supporting substrate, wherein the layered structure is one of the supporting substrates. A flexible film formed to be in close contact with the main surface, a device layer formed on the flexible film, for giving the plurality of flexible devices a function as an electronic device, and a device layer via an adhesive And an edge portion of the protective film is attached to one main surface of the support substrate via the adhesive, and the layer is formed using a laser beam. The structure is cut to divide the layered structure into a plurality of device portions respectively corresponding to the plurality of flexible devices and a remaining portion. After the first step, the flexible film is irradiated with a laser beam from the other principal surface side of the support substrate to reduce the adhesion between the flexible film and the support substrate, or A second step of reducing the adhesion between the flexible membrane and the support substrate except for the edge of the flexible membrane, and a porous vacuum chuck having an adsorbent formed of porous particles after the second step. By separating the support substrate and the porous vacuum chuck in a state where the layered structure is adsorbed, the remaining portion is separated together with the support substrate from the plurality of device portions to which the porous vacuum chuck is adsorbed. And the third step of

  The method of manufacturing a flexible device according to the present invention may further include a fourth step of applying a film to each of the plurality of device portions adsorbed by the porous vacuum chuck after the third step.

  According to the first and second flexible device manufacturing apparatuses of the present invention and the flexible device manufacturing method of the present invention, it is not necessary to perform the step of peeling the edge of the protective film from the support substrate using a cutter.

  According to the first to third flexible device manufacturing apparatuses of the present invention and the flexible device manufacturing method of the present invention, the step of sticking a temporary protective film on the flexible film side of the layered structure can be eliminated, and further, The yield of the flexible device of the final product does not deteriorate due to the wrinkles generated in the layered structure peeled off from the support substrate.

FIG. 1 is an explanatory view showing an outline of a flexible device manufacturing apparatus according to an embodiment of the present invention. FIG. 2 is a cross-sectional view of a layered structure and a support substrate used in the manufacture of a flexible device. FIG. 3: is explanatory drawing which shows the pattern of the flexible device manufacturing apparatus in a half cut process. FIG. 4 is an explanatory view for explaining an operation according to a half cut process performed by the flexible device manufacturing apparatus. FIG. 5 is a plan view of the layered structure after the half cutting process. FIG. 6 is a cross-sectional view of the layered structure and the support substrate after the half cutting process. FIG. 7 is an explanatory view showing the pattern of the flexible device manufacturing apparatus in the LLO process. FIG. 8 is an explanatory diagram for explaining an operation relating to the LLO process executed by the flexible device manufacturing apparatus. FIG. 9 is a cross-sectional view showing the pattern of the layered structure and the support substrate in the LLO step. FIG. 10 is an explanatory view showing the pattern of the flexible device manufacturing apparatus in the supporting substrate recovery step. FIG. 11A and FIG. 11B are cross-sectional views showing the pattern of the layered structure and the support substrate in the support substrate recovery step. FIG. 12 is an explanatory view for explaining operations related to a support substrate recovery step, a support film sticking step, and a flexible device removal step which are executed by the flexible device manufacturing apparatus. FIG. 13 is an explanatory view showing the pattern of the flexible device manufacturing apparatus in the support film sticking step. FIG. 14 is an explanatory view showing the pattern of the flexible device manufacturing apparatus in the flexible device taking-out step.

  Hereinafter, the present invention will be described with reference to the drawings. FIG. 1 is an explanatory view showing an outline of a flexible device manufacturing apparatus according to an embodiment of the present invention, and FIG. 2 is a layered structure 1 and a support substrate used for manufacturing a flexible device in the flexible device manufacturing apparatus. 10 is a cross-sectional view showing 10;

  In a forming apparatus (not shown) provided separately from the flexible device manufacturing apparatus shown in FIG. 1, a layered structure 1 is formed on one main surface of a support substrate 10 as shown in FIG. Ru. The layered structure 1 is formed so as to have a structure and size capable of multi-faceting a flexible device manufactured by a flexible device manufacturing apparatus. The layered structure 1 is formed on a flexible flexible film 11 and a rectangular flexible film 11 formed to be in close contact with one main surface of a rectangular hard support substrate 10, and the flexible device is used as an electronic device. It includes a device layer 12 having a structure for realizing a function, and a rectangular protective film 14 attached so as to cover the device layer 12 via an adhesive 13. The edges of the four sides of the protective film 14 are attached to the main surface of the support substrate 10 via the adhesive 13 (see also FIG. 5).

  The flexible film 11 is provided to support the device layer 12, and the protective film 14 is provided to protect the device layer 12 from the outside. The flexible film 11 is formed so as to be in close contact with the main surface of the layered structure 1, but is formed of a flexible material such that the adhesion with the support substrate 10 is reduced by irradiating the laser light. It is done. Further, the support substrate 10 is formed of a material that transmits laser light.

  The flexible device manufactured by the flexible device manufacturing apparatus of the present embodiment is, for example, an organic EL device used as a display device in various electronic devices, and the device layer 12 of the layered structure 1 is a lower electrode, an organic It contains an EL layer and a top electrode (both not shown). The flexible film 11 is a polyimide film, and the protective film 14 is a transparent polyethylene terephthalate (PET) film. As the adhesive 13, an acrylic or epoxy adhesive having thermosetting or ultraviolet curing properties is used. The adhesive 13 is disposed on the support substrate 10 so as to cover the device layer 12 in a sheet-like state, for example, and then the protective film 14 is disposed so as to cover the adhesive 13. Curing is done. For example, a transparent glass substrate is used as the support substrate 10.

  Since a method and an apparatus for forming such a layered structure 1 used for multiple beveling of an organic EL device on a support substrate 10 are known, further description of them in the present specification is omitted. The present invention is not limited to the manufacture of the organic EL device, but may be applied to the manufacture of any flexible device that can be manufactured based on the layered structure 1 having the configuration as shown in FIG.

  The flexible device manufacturing apparatus includes a holding unit 2 which receives and holds the support substrate 10 on which the layered structure 1 is formed from a forming apparatus (not shown). The holding unit 2 includes a suction chuck 21 formed in a U-shape, a support portion 22 and an elevation guide portion 23. The base end side of the suction chuck 21 is attached to the support 22 rotatably around a horizontal rotation axis R (see FIG. 8), and the support 22 is attached to the elevation guide 23 so as to be vertically movable. It is done.

  The support substrate 10 on which the layered structure 1 is formed is held or adsorbed by the suction chuck 21 with the support substrate 10 side facing downward as shown in FIG. The holding unit 2 is provided so as to be movable along a horizontally provided first guide rail 24 using driving means (not shown) such as a ball screw mechanism and a rack and pinion mechanism. As shown in FIG. 1, the holding unit 2 travels in a direction toward the other end of the first guide rail 24 when receiving the support substrate 10 at one end of the first guide rail 24 (in FIG. 1, The direction in which the holding unit 2 moves is shown by the arrows, and the arrows are also shown in the other drawings, but these arrows explain the movement of the components of the flexible device manufacturing apparatus of this embodiment. And does not represent the components of the flexible device manufacturing apparatus).

  The flexible device manufacturing apparatus includes a half cutting station 3, a transport unit 4 for transporting the support substrate 10 between the holding unit 2 and the half cutting station 3, and a first movement for moving the transport unit 4. A mechanism 5 is provided. The half cut station 3 includes a laser cutter 31 and performs a half cut process of dividing the layered structure 1 of the support substrate 10 into individual device parts 15 used as flexible devices and a remaining part 16.

  FIG. 3 is an explanatory view showing the pattern of the flexible device manufacturing apparatus in the half cutting step (in FIG. 3, the laser cutter 31 is not shown). FIG. 4 is an explanatory view for explaining an operation according to a half cut process performed by the flexible device manufacturing apparatus. The transport unit 4 includes a pedestal 41 and a support 42 provided below the pedestal 41. In the present embodiment, the support portion 42 is provided with nine support columns erected in a lattice form (as viewed from above) at the base thereof, and the pedestal portion 41 has through holes 43 corresponding to the respective support columns. It has been established along the vertical direction.

  The first moving mechanism 5 is constituted by a single-axis robot mechanism having a second guide rail 52 which slidably guides the slider portion 51. The pedestal 41 is fixed to the slider 51. In addition, the support portion 42 is configured to be able to move up and down with respect to the slider portion 51.

  When the holding unit 2 having received the support substrate 10 stops on the transport unit 4 in a state of being disposed on the first guide rail 24 side, the support column portion 42 is raised. When the column portion 42 ascends, each column of the column portion 42 protrudes from the upper surface of the pedestal portion 41 through the through hole 43 of the pedestal portion 41. The support posts of the support 42 and the suction chuck 21 of the holding unit 2 are disposed so as not to interfere with each other. Therefore, when the support 42 is raised, the support substrate 10 held by the suction chuck 21 is viewed from below. It is pushed and removed from the suction chuck 21.

  When the support substrate 10 is removed from the suction chuck 21, the transport unit 4 starts traveling toward the half cutting station 3, and the support substrate 10 is disposed on the pedestal portion 41 by lowering the support column 42. . The upper surface of the pedestal 41 is a horizontal surface, and the support substrate 10 is mounted on the upper surface of the pedestal 41 with the layered structure 1 facing upward.

  The laser cutter 31 is provided with a laser head 32 movable in a horizontal plane, and when the transport unit 4 arrives at the half cutting station 3, the laser light emitted from the laser head 32 is a layered structure of the support substrate 10 1 to cut the layered structure 1 in the thickness direction. The output of the laser light is adjusted so as not to cut the support substrate 10.

  FIG. 5 is a plan view of the layered structure 1 after the half cutting step, and FIG. 6 is a view of the layered structure 1 and the supporting substrate 10 after the half cutting step broken at line A-A shown in FIG. FIG. By controlling the position of the laser head 32 and the on / off of the laser light, the plurality of device portions 15 are cut or divided with respect to the remaining portion 16 of the layered structure 1. The device portion 15 is a portion formed in the layered structure 1 to have a structure used for a flexible device. In the present embodiment, the rectangular device portions 15 are arranged in five rows and five columns in the layered structure 1, but in the present invention, the number and arrangement of the device portions 15 included in the layered structure 1 are It is not limited to the number and arrangement of the embodiments. The protective film 14 is bonded to the support substrate 10 with the adhesive 13 in the area indicated by hatching in FIG. 5.

  When all the device parts 15 in the layered structure 1 are cut from the remaining part 16, the transport unit 4 starts traveling toward the holding unit 2, and the support base 10 is raised by raising the column portion 42. It is separated from the upper surface of the pedestal 41. The support substrate 10 is disposed at a position higher than the suction chuck 21, and when the support substrate 10 arrives on the suction chuck 21, the transport unit 4 is stopped. Then, the support substrate 10 is placed on the suction chuck 21 by the lowering of the support column 42, and the suction chuck 21 holds or sucks the support substrate 10.

  The flexible device manufacturing apparatus includes an LLO station 6 which performs a laser lift-off process. The LLO station 6 is provided adjacent to the half cut station 3 and has a beam head 61 capable of irradiating laser light downward in a strip or line shape. As shown in FIGS. 1 and 3, the first movable conveyor unit 8 capable of mounting the porous vacuum chuck table 7 on the other end side of the first guide rail 24 is orthogonal to the first guide rail 24. It is provided to run freely. The second moving mechanism 9 for driving the first moving conveyor unit 8 is constituted by a single-axis robot mechanism having a third guide rail 91 (see FIG. 8) for slidably guiding the first moving conveyor unit 8. . The third guide rail 91 defines a movement path of the first movable conveyor unit 8, and extends below the first guide rail 24 so as to be orthogonal to the first guide rail 24.

  On the upper surface of the porous vacuum chuck table 7, a rectangular adsorbent 71 having a large number of pores formed by sintering porous ceramic particles is provided. By performing vacuum suction via a vacuum guide path (not shown) communicating with the adsorber 71, the work can be adsorbed over the entire top surface of the adsorber 71.

  The first moving conveyor unit 8 has a first conveyor 81 having two roller rows supporting the lower side of the porous vacuum chuck table 7 and a first movable member 82 provided with the first conveyor 81. The first movable member 82 is connected to the first slider 92 (see FIG. 8) of the second moving mechanism 9 sliding along the third guide rail 91. The first conveyor 81 is operable to convey the porous vacuum chuck table 7 in the direction orthogonal to the moving direction of the first movable conveyor unit 8. As shown in FIG. 1 and FIG. 3, the first movable conveyor unit 8 mounts the first guide rail 24 and the LLO station in a state where the porous vacuum chuck table 7 is mounted at the first position which is its initial position. It is placed between six.

  FIG. 7 is an explanatory view showing a pattern of the flexible device manufacturing apparatus in a state where the LLO process is performed in the LLO station 6 (the beam head 61 is not shown), and FIG. 8 is performed in the flexible device manufacturing apparatus It is explanatory drawing explaining the operation | movement which concerns on a LLO process (The return process of the porous vacuum chuck table 7 mentioned later is also shown in the left side of FIG. 8). After completion of the half cutting process, the holding unit 2 holding the support substrate 10 is stopped in a state where the support substrate 10 is disposed on the porous vacuum chuck table 7 at the first position shown in FIG. Thereafter, the support portion 22 of the holding unit 2 ascends along the elevation guide portion 23.

  As shown in the center of FIG. 8, after the support portion 22 of the holding unit 2 rises to a predetermined height, the support substrate 10 has a layered structure by rotating the suction chuck 21 180 degrees around its rotation axis R. It is arranged so that 1 is on the lower side. Thereafter, the support portion 22 of the holding unit 2 is lowered, so that the support substrate 10 is the adsorber of the porous vacuum chuck table 7 placed on the first movable conveyor unit 8 with the layered structure 1 downward. It is placed on the top of 71.

  When the support substrate 10 is disposed on the upper surface of the adsorbing body 71 of the porous vacuum chuck table 7, the holding of the support substrate 10 by the adsorption chuck 21 is released, and the vacuum pump (not shown) is driven. The porous vacuum chuck table 7 is vacuum-sucked, and the adsorber 71 of the porous vacuum chuck table 7 adsorbs the layered structure 1 formed on the support substrate 10.

  When the adsorber 71 adsorbs the layered structure 1, the second moving mechanism 9 operates to move the first moving conveyor unit 8 toward the LLO station 6. A non-return valve (not shown) is provided in the vacuum guide passage communicating with the porous vacuum chuck table 7 and the vacuum pump, and the non-return valve works to attract the adsorber 71 of the porous vacuum chuck table 7. And the adsorption state of the layered structure 1 is maintained. On the other hand, the holding unit 2 is moved to the initial position shown in FIG. 1, the support portion 22 is returned to the original height, and the suction chuck 21 is returned to the original position by reversing 180 degrees around the rotation axis R. Be

  FIG. 9 is a cross-sectional view corresponding to FIG. 6 showing patterns of the layered structure 1 and the support substrate 10 in the LLO step. The first moving conveyor unit 8 stops when it arrives at the LLO station 6. A beam head 61 is disposed above the first moving conveyor unit 8 and the support substrate 10. In the present embodiment, the beam head 61 is configured to be movable in the longitudinal direction while irradiating a band-like or line-like laser beam along the short side direction of the rectangular layered structure 1 and the support substrate 10 downward. There is. The irradiated laser light passes through the support substrate 10 and strikes the flexible film 11. When the laser beam of the beam head 61 is scanned from one end side to the other end side of the support substrate 10, the adhesion between the flexible film 11 of the layered structure 1 and the support substrate 10 is reduced.

  In the present embodiment, as can be understood from FIG. 9, the entire surface of the flexible film 11 of the layered structure 1 is irradiated with the laser beam of the beam head 61, so that the entire surface of the flexible film 11 and the support substrate 10 are The adhesion of the In addition, adhesion is maintained between the area | region of the flexible film 11 which comprises the said outer edge part, and the support substrate 10 by irradiating a laser beam so that the outer edge part of the remaining part 16 of the layered structure 1 may be remove | excluded It is also good. In the present invention, in the LLO step, it is not necessary to dispose a mask for limiting the irradiation range of the laser light on the support substrate 10.

  When the irradiation of the laser beam is completed, the first movable conveyor unit 8 returns to the first position shown in FIG. As shown in FIG. 1 and the like, the flexible device manufacturing apparatus is provided parallel to the first guide rail 24 and is movable along the fourth guide rail 101 disposed horizontally. Is equipped. In the present embodiment, the first guide rail 24 and the fourth guide rail 101 are arranged in alignment. One end side of the fourth guide rail 101 is disposed on the other end side of the first guide rail 24 side, and the support substrate recovery station 110 is provided on the other end side of the fourth guide rail 101. In the state shown in FIG. 1, the first chuck unit 100 stands by at the support substrate recovery station 110.

  As shown in FIG. 1 etc., the second movable conveyor unit 120 capable of mounting the porous vacuum chuck table 7 can run in the direction orthogonal to the fourth guide rail 101 on one end side of the fourth guide rail 101 Provided in The third moving mechanism 130 for driving the second moving conveyor unit 120 is configured by a single-axis robot mechanism having a fifth guide rail 131 (see FIG. 12) for slidably guiding the second moving conveyor unit 120. . The fifth guide rail 131 defines a movement path of the second movable conveyor unit 120, and extends below the fourth guide rail 101 so as to be orthogonal to the fourth guide rail 101.

  The second moving conveyer unit 120 is configured in the same manner as the first moving conveyer unit 8, and includes a second conveyer 121 having two rows of roller rows supporting the lower side of the porous vacuum chuck table 7, and a second conveyer And a second movable member 122 provided with the reference numeral 121. The second movable member 122 is connected to the second slider 132 (see FIG. 12) of the third moving mechanism 130 sliding along the fifth guide rail 131. The second conveyor 121 operates to convey the porous vacuum chuck table 7 in the direction orthogonal to the moving direction of the second moving conveyor unit 120.

  In FIG. 1, the first moving conveyor unit 8 and the second moving conveyor unit 120 are both arranged at a first position, which is an initial position or a standby position. In this state, the flexible device manufacturing apparatus includes a first intermediate conveyor 141 which connects the first conveyor 81 of the first movable conveyor unit 8 and the second conveyor 121 of the second movable conveyor unit 120. The first intermediate conveyor 141 includes two rows of roller rows supporting the porous vacuum chuck table 7.

  After the LLO process is completed, the first mobile conveyor unit 8 is returned to the first position shown in FIG. Thereafter, the first conveyer 81, the first intermediate conveyer 141, and the second conveyer 121 are operated, whereby the porous vacuum chuck table 7 in the state of adsorbing the layered structure 1 is shown in FIG. It is sent to the second moving conveyor unit 120 disposed at the first position shown. After the porous vacuum chuck table 7 is moved to the second moving conveyor unit 120, the empty first moving conveyor unit 8 moves along the third guide rail 91 in a direction away from the LLO station 6, It stops at the second position near the end of the third guide rail 91 beyond the guide rail 24 (see FIG. 10 and the like).

  When the porous vacuum chuck table 7 is sent to the second movable conveyor unit 120, a support substrate recovery step of recovering the support substrate 10 is performed. FIG. 10 is an explanatory view showing the pattern of the flexible device manufacturing apparatus in the supporting substrate recovery step. 11A and 11B are cross-sectional views showing the patterns of the layered structure 1 and the support substrate 10 in the support substrate recovery step. FIG. 12 is an explanatory view for explaining a support substrate recovery step (as well as a support film sticking step and a flexible device removal step described later) performed by the flexible device manufacturing apparatus.

  In the supporting substrate recovery step, first, the first chuck unit 100 waiting at the supporting substrate recovery station 110 moves toward the second moving conveyor unit 120. In the present embodiment, the first chuck unit 100 includes a chuck head 103 having a total of four suction pads 102, and a first arm portion 104. The chuck head 103 is movably provided at one end side of the first arm portion 104, and the other end side of the first arm portion 104 is slidably attached to the fourth guide rail 101.

  When the chuck head 103 is disposed on the support substrate 10 adsorbed (via the layered structure 1) on the porous vacuum chuck table 7 disposed on the second moving conveyor unit 120, the first chuck The unit 100 stops. Thereafter, when the chuck head 103 is lowered and the suction pad 102 comes in contact with the support substrate 10 as shown in FIG. 11A, the suction pad 102 sucks the support substrate 10.

  The adhesion between the layered structure 1 and the support substrate 10 is impaired by the LLO step, and the four edge portions of the protective film 14 of the layered structure 1 are attached to the support substrate 10 via the adhesive 13. The protective film 14 of the layered structure 1 is adsorbed on the upper surface of the adsorbing body 71 of the porous vacuum chuck table 7. Furthermore, individual device portions 15 in the layered structure 1 are cut to the remaining portion 16 of the layered structure 1 by the LLO process. Therefore, after the support substrate 10 is adsorbed to the adsorption pad 102, the chuck head 103 is sufficiently elevated with respect to the porous vacuum chuck table 7, as shown in FIG. 11 (b), in the layered structure 1. While each device portion 15 is left adsorbed on the porous vacuum chuck table 7, the remaining portion 16 of the layered structure 1 is pulled up in a state of being attached to the support substrate 10. The remaining portion 16 of the layered structure 1 will be separated from the porous vacuum chuck table 7 together with the support substrate 10. In this manner, a plurality of device portions 15 each becoming a flexible device are taken out from the large-sized layered structure 1.

  If foreign matter is present between the flexible film 11 and the support substrate 10, the adhesion between the flexible film 11 and the support substrate 10 may be locally maintained even after the LLO process. The affected device portion 15 will be separated or torn from the porous vacuum chuck table 7 together with the support substrate 10 as the chuck head 103 rises. However, in the present invention, the device portion 15 affected by foreign matter is limited. In the conventional method of manufacturing an organic EL device described above, such a foreign matter causes a more severe situation in which the entire layered structure 1 formed on the support substrate 10 can not be properly peeled off.

  When the support substrate 10 to which the remaining portion 16 of the layered structure 1 is attached is separated from the porous vacuum chuck table 7, the first chuck unit 100 performs the fourth guiding while the chuck head 103 still adsorbs the support substrate 10. It moves along the rail 101 toward the support substrate recovery station 110. When arriving at the support substrate recovery station 110, the first chuck unit 100 is lowered to release the suction state between the chuck head 103 and the support substrate 10, whereby the support substrate 10 becomes a stacker of the support substrate recovery station 110 (see FIG. Not shown). Thereafter, the chuck head 103 is lifted, and the first chuck unit 100 returns to the standby state. The recovered support substrate 10 may be reused by removing the remaining portion 16 of the adhering layered structure 1.

  As shown in FIG. 1 and the like, the flexible device manufacturing apparatus is provided with a support film sticking station 150 on the side of the LLO station 6. As shown in FIG. 12, one end of the fifth guide rail 131 of the third moving mechanism 130 reaches the support film sticking station 150. After the support substrate 10 is removed from the porous vacuum chuck table 7 together with the remaining portion 16 of the layered structure 1, the second moving conveyor unit 120 operates the third moving mechanism 130 to operate the fifth guide rail 131. And is sent to the support film sticking station 150 (see the right side of FIG. 12). When arriving at the support film sticking station 150, the vacuum pump (not shown) operates to strengthen the adsorption state between the adsorbing body 71 of the porous vacuum chuck table 7 and the device portion 15.

  In the support film sticking station 150, a support film sticking step of sticking the support film 17 on the flexible film 11 of each device portion 15 to which the adsorbing body 71 of the porous vacuum chuck table 7 is adsorbed is performed. The support film 17 is a copper foil sheet or a graphite sheet contained in a flexible device of a finished product, which is completely different from the second protective film described in the related art. In the present embodiment, the support film sticking station 150 is provided with three stackers 151, and each stacker 151 stores a plurality of support films 17 in a stacked state. One main surface of the support film 17 is an adhesive layer, and the support film 17 is stored in a state where a release paper (not shown) adheres to the adhesive layer.

  As shown in FIG. 12 and the like, the support film sticking station 150 receives from the peeling mechanism 152 the peeling mechanism 152 for peeling the peeling paper of the support film 17 and the support film 17 from which the peeling paper is peeled. A movable sticking head 153 stuck to the flexible film 11 and a suction head 154 which delivers the stacker 151 to the peeling mechanism 152 are provided. The sticking head 153 is provided with a suction unit 155 and a pressing roller 156.

  From the end of the peeling mechanism 152 on the side of the stacker 151, a ribbon 157 having an adhesive surface is drawn out so as to be able to travel in its length direction, and in the support film 17 carried by the suction head 154, the release paper is a ribbon 157 Is disposed on the peeling mechanism 152 so as to adhere to the adhesive surface of the Further, the suction portion 155 of the sticking head 153 sucks the upper surface of the support film 17 and moves together with the support film 17 as the ribbon 157 travels. At the end of the peeling mechanism 152 on the porous vacuum chuck table 7 side, the ribbon 157 is bent downward, whereby the suction portion 155 of the sticking head 153 moving toward the porous vacuum chuck table 7 is The release sheet of the support film 17 being adsorbed is released from the support film 17.

  With the release paper peeling off the support film 17 and the adhesive surface of the support film 17 exposed downward, the sticking head 153 moves onto the device portion 15 to which the support film 17 is attached. The support film sticking station 150 includes an imaging device 158 for imaging the device portion 15 disposed on the porous vacuum chuck table 7, and a target device portion based on an image obtained from the imaging device 158. The control of the position of the suction head 154 is performed for 15. The sticking head 153 is configured to be capable of tilting with the pressing roller 156 facing downward, and in this state one end of the support film 17 is brought into contact with one end of the device portion 15 to make the sticking head 153 a part of the device portion 15 By moving to the other end side, the support film 17 is gradually stuck on the flexible film 11 of the device portion 15 while being pressed by the pressing roller 156. The support film 17 is attached to the device portion 15 to complete the flexible device 18.

  The support film 17 is attached to all the device parts 15 attracted to the porous vacuum chuck table 7 and after these device parts 15 become flexible devices 18, the third moving mechanism 130 is driven. , And the second moving conveyor unit 120 moves in a direction away from the support film sticking station 150. The second moving conveyor unit 120 moves to the second position on the other end side of the fifth guide rail 131 beyond the fourth guide rail 101 with the porous vacuum chuck table 7 mounted. With the second moving conveyor unit 120 in the second position, a flexible device process of taking out the flexible device 18 is performed.

  As can be understood from FIGS. 1 and 12, the flexible device recovery station 160 is provided on the other end side of the fifth guide rail 131. The flexible device manufacturing apparatus further includes a second chuck unit 170 movable along a sixth guide rail 171 provided in parallel with the movement direction of the fifth guide rail 131 or the second moving conveyor unit 120. In the present embodiment, the second chuck unit 170 includes a suction chuck 172 and a second arm portion 173. The suction chuck 172 is movably provided at one end of the second arm 173, and the other end of the second arm 173 is slidably attached to the sixth guide rail 171.

  FIG. 14 is an explanatory view showing the pattern of the flexible device manufacturing apparatus in the flexible device taking-out step. As can be understood from FIG. 1, FIG. 14 and FIG. 12 etc., when the second moving conveyor unit 120 moves to the second position on the other end side of the fifth guide rail 131, it stands by at the flexible device recovery station 160. The second chuck unit 170 moves toward the second moving conveyor unit 120. When the suction chuck 172 of the second chuck unit 170 arrives on the porous vacuum chuck table 7, the second chuck unit 170 is stopped.

  When the second chuck unit 170 stops, the suction chuck 172 of the second chuck unit 170 descends, and its suction surface comes in contact with all the flexible devices 18 held by the porous vacuum chuck table 7. Thereafter, the suction state of the porous vacuum chuck table 7 and the flexible device 18 is canceled, and a vacuum pump (not shown) communicating with the suction chuck 172 is driven to suction the all flexible devices 18. . After the suction chuck 172 having suctioned the flexible device 18 ascends to a predetermined position, the second chuck unit 170 moves to the flexible device recovery station 160.

  When the second chuck unit 170 reaches the flexible device recovery station 160, the suction chuck 172 is lowered until the flexible device 18 approaches the top surface of the recovery table 161. Thereafter, the suction state of the suction chuck 172 and the flexible device 18 is cancelled, and the flexible device 18 is placed on the collection table 161 (see the left portion in FIG. 12). Then, the suction chuck 172 ascends, and the second chuck unit 170 returns to the standby state.

  As shown in FIG. 14 and the like, the flexible device manufacturing apparatus includes the first conveyor 81 of the first movable conveyor unit 8 in the second position, and the second conveyer unit 120 in the second position. A second intermediate conveyor 142 is connected to the conveyor 121. The second intermediate conveyor 142 includes two rows of roller rows supporting the porous vacuum chuck table 7. After the flexible device take-out step is completed, the first conveyer 81, the second intermediate conveyer 142, and the second conveyer 121 are driven to open the porous vacuum chuck table 7 in the empty state in which the workpiece is not adsorbed. The unit 120 is moved to the first moving conveyor unit 8.

  As can be understood from FIGS. 14 and 8, when the porous vacuum chuck table 7 is received from the second moving conveyor unit 120, the first moving conveyor unit 8 is driven to the second position by the second moving mechanism 9. Is returned to the first position. Then, the flexible device manufacturing apparatus shifts to the initial state shown in FIG. 1, and a series of the above-described series with respect to the new support substrate 10 on which the layered structure 1 is formed by the forming apparatus whose illustration is omitted. The following steps are performed.

  The above description is intended to illustrate the present invention, and is not to be construed as limiting the scope of the invention as defined in the appended claims. Further, the configuration of each part of the present invention is of course not limited to the above embodiment, and various modifications can be made within the technical scope described in the claims.

DESCRIPTION OF SYMBOLS 1 Layered structure 10 Support substrate 11 Flexible film 13 Adhesive 14 Protective film 15 Device part 16 Remaining part 17 Support film 18 Flexible device 2 Holding unit 3 Half cut station 4 Conveying unit 5 1st moving mechanism 6 LLO station 7 Porous vacuum Chuck table 71 adsorber 8 first moving conveyor unit 9 second moving mechanism 100 first chuck unit 110 supporting substrate recovery station 120 second moving conveyor unit 130 third moving mechanism 141 first intermediate conveyor 142 second intermediate conveyor 150 support film Sticking station 160 Flexible device recovery station 170 Second chuck unit

Claims (7)

In a flexible device manufacturing apparatus for processing a layered structure formed on a support substrate to manufacture a plurality of flexible devices,
The layered structure is formed on a flexible film formed to be in close contact with one main surface of the support substrate, and on the flexible film, to give the plurality of flexible devices a function as an electronic device. And a protective film attached to cover the device layer via an adhesive, the edge of the protective film being on the one main surface of the support substrate via the adhesive. Is attached,
A first processing station for dividing the layered structure into a plurality of device portions respectively corresponding to the plurality of flexible devices and a remaining portion by cutting the layered structure using a laser beam;
After the layered structure is processed at the first processing station, the flexible film is irradiated with a laser beam from the other main surface side of the support substrate to thereby make the adhesion between the flexible film and the support substrate A second processing station for performing processing for reducing or reducing the adhesion between the flexible film and the support substrate except for the edge of the flexible film;
After the layered structure is processed at the second processing station, the support substrate and the porous vacuum chuck in a state where the layered structure is adsorbed to a porous vacuum chuck having an adsorbent formed of porous particles. A chuck unit for separating the remaining portion together with the support substrate from the plurality of device portions to which the porous vacuum chuck is attracted,
A flexible device manufacturing apparatus comprising:   The method further comprises a third processing station for applying a film to each of the plurality of device portions to which the porous vacuum chuck is attached after the layered structure is processed using the chuck unit. The flexible device manufacturing apparatus of claim 1. In a flexible device manufacturing apparatus for processing a layered structure formed on a support substrate to manufacture a plurality of flexible devices,
The layered structure is formed on a flexible film formed to be in close contact with one main surface of the support substrate, and on the flexible film, to give the plurality of flexible devices a function as an electronic device. And a protective film attached to cover the device layer via an adhesive, the edge of the protective film being on the one main surface of the support substrate via the adhesive. Is attached,
A porous vacuum chuck for adsorbing the layered structure in a state in which the layered structure is divided into a plurality of device portions respectively corresponding to the plurality of flexible devices and a remaining portion;
The flexible film and the support substrate are adhered to each other by irradiating the flexible film with a laser beam from the other main surface side of the support substrate while the porous vacuum chuck is adsorbing the layered structure. A first processing station for performing processing for reducing the conductivity or reducing the adhesion between the flexible film and the support substrate except for the edge of the flexible film;
After the layered structure is processed at the first processing station, the support substrate and the porous vacuum chuck are separated to allow the porous vacuum chuck to adsorb the plurality of device portions from the plurality of device portions. A chuck unit for performing a process of separating the remaining portion with the support substrate;
A flexible device manufacturing apparatus comprising:   The method further comprises a second processing station for applying a film to each of the plurality of device portions adsorbed by the porous vacuum chuck after the layered structure is processed using the chuck unit. The flexible device manufacturing apparatus according to Item 3. In a flexible device manufacturing apparatus for processing a layered structure formed on a support substrate to manufacture a plurality of flexible devices,
One or more processing stations for processing the layered structure;
A first movable conveyor unit capable of mounting a porous vacuum chuck having an adsorbent formed of porous particles, and movably provided along a first movement path;
A second movable conveyor unit capable of mounting the porous vacuum chuck and movably provided along a second movement path;
Equipped with
The porous vacuum chuck table can be moved between the first moving conveyor unit and the second moving conveyor unit,
The porous vacuum chuck receives the layered structure while being placed on the first movable conveyor unit,
The porous vacuum chuck moves from the first movable conveyor unit to the second movable conveyor unit while holding the layered structure.
The porous vacuum chuck is returned from the second movable conveyor unit to the first movable conveyor unit without holding the layered structure.
Flexible device manufacturing equipment. In a method of manufacturing a flexible device, wherein a layered structure formed on a support substrate is processed to manufacture a plurality of flexible devices,
The layered structure is formed on a flexible film formed to be in close contact with one main surface of the support substrate, and on the flexible film, to give the plurality of flexible devices a function as an electronic device. And a protective film attached to cover the device layer via an adhesive, and the edge of the protective film is one of the main surfaces of the support substrate via the adhesive 13. Is attached to the
A first step of cutting the layered structure using laser light to divide the layered structure into a plurality of device portions respectively corresponding to the plurality of flexible devices and a remaining portion;
After the first step, the flexible film is irradiated with a laser beam from the other principal surface side of the support substrate to reduce the adhesion between the flexible film and the support substrate, or the edge of the flexible film A second step of reducing the adhesion between the flexible film and the support substrate except for
After the second step, the porous substrate is separated from the supporting substrate from the porous vacuum chuck in a state where the layered structure is adsorbed to the porous vacuum chuck having an adsorbent formed of porous particles. A third step of separating the remaining portion together with the support substrate from the plurality of device portions to which a vacuum chuck is attracted;
A method of manufacturing a flexible device, including: The method of manufacturing a flexible device according to claim 6, further comprising: a fourth step of applying a film to each of the plurality of device portions adsorbed by the porous vacuum chuck after the third step.

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