TW201521098A - Adhesive material cutting method and adhesive material cutting apparatus - Google Patents

Abstract

Provided are an adhesive material cutting method and an adhesive material cutting apparatus. A metal wire drawn from a reel and moving toward a direction is directed between guide pins. The guide pins are electrified via the metal wire to heat the metal wire between the guide pins. The metal wire is abutted against the outer periphery of a substrate held by an adsorption table with a diameter less than the substrate, and the sealing sheet exposed from the substrate W is cut in the radial direction, such that the adsorption table is rotated to make the metal wire cut the excessive portion of the sealing sheet along the outer periphery of the substrate.

Description

Method for cutting adhesive body and cutting device for adhesive body

The present invention relates to a method of cutting an adhesive body which is attached to a workpiece such as a semiconductor element, a semiconductor wafer, a circuit board, or the like, a sealing sheet for a surface protection, and an adhesive sheet such as an adhesive sheet, and the like. The cutting device for the adhesive.

A method of cutting a surface protection sheet attached to a circuit surface of a semiconductor wafer (hereinafter, referred to as "wafer" as appropriate) along the outer diameter of the semiconductor wafer has been proposed and implemented. That is, while changing the angle and the direction of rotation of the tool, the tool is cut along the arc portion and the notch portion of the semiconductor wafer. Specifically, the cutter is inserted from the vicinity of the notch so that the side of the cutter is cut along the inclined surface of the notch to the inner end. Thereafter, the tool is moved back to the initial position at which the scoring starts along the cutting rail, and the direction of the cutting edge is changed to cut the protective tape along the arc portion. Then, when the tool reaches the open end of the other side of the notch, the angle of the tool is changed, so that the side of the tool is cut along the inclined surface of the notch until the inner end reaches the inner end, and is connected with the first half of the score. And cut off the protective tape. (Refer to Japanese Patent Laid-Open Publication No. 2009-125871).

Advanced technical literature Patent literature

Patent Document 1 Japanese Patent Laid-Open Publication No. 2009-125871

In recent years, with the demand for high-density packaging, the thickness of the wafer tends to be thin. Since the rigidity of the wafer is reduced in accordance with the reduction in thickness, the surface protective adhesive tape is a case where an adhesive tape of a substrate thicker or harder than the conventional one is used.

Since the adhesive tape having increased thickness and hardness is cut by a cutter, the quality deterioration due to abrasion or defect of the cutter becomes remarkable. Further, since the adhesion of the adhesive to the cutter is made dull, there is a problem that the adhesive tape cannot be cut with good precision.

The present invention has been made in view of such circumstances, and it is a primary object of the invention to provide a cutting method for an adhesive body capable of cutting an adherend attached to a workpiece with good precision for a long period of time and a cutting device for the adhesive body.

In order to achieve such a purpose, the present invention adopts the composition of the second.

In other words, the adhesive body attached to the workpiece is cut along the outer shape of the workpiece, and the traveling metal wire is brought into contact with the adhesive body exposed from the workpiece, and the metal of the contact portion is abutted. The wire is energized and the adhesive is cut while heating.

According to the above method, the metal wire is cut while the metal wire is being moved. Therefore, the portion where the metal wire such as the adhesive or the resin is adhered at the time of cutting is not reused. That is, the portion of the uncontaminated metal wire can be always abutted against the adhesive and cut. Moreover, since the adhesive body is cut while heating the metal wire, the adhesive tape having a hard base material or a thick sealing sheet can be softened and cut easily. Therefore, regardless of the type of the adherend, the adherend can be cut with good precision along the shape of the workpiece for a long time.

Further, with the above method, the workpiece can be rotated and the wire can travel in synchronization with the rotation speed.

According to this method, the adherend can be cut at a high speed and with good precision by the multiplier effect of the rotation of the workpiece and the progress of the metal wire.

Further, in the above method, it is preferable to adjust the tension of the metal wire in accordance with the uneven shape of the outer circumference of the workpiece, and it is preferable that the pressing of the metal wire at the contact portion is constant.

For example, in the case where the positioning notch formed on the outer circumference of the workpiece is formed, the metal wire pressed against the outer circumference of the workpiece travels following the notch shape. Therefore, the metal wire can cut the adhesive body with good precision in accordance with the shape of the workpiece having irregularities on the outer circumference.

Further, in order to achieve such a purpose, the present invention adopts a configuration as the second.

That is, an adhesive cutting device is a cutting device for adhering an adhesive attached to a workpiece along an outer shape of the workpiece, the device comprising the following structure; a holding table for holding the workpiece Cutting mechanism to make the metal wire abut on the adhesive exposed from the aforementioned workpiece The body is configured to cut the adhesive body; and the rotation driving mechanism rotates the holding table and the metal wire so that the metal wire travels along the outer shape of the workpiece. The cutting mechanism includes: a driving mechanism, and the wire is guided by the guide roller The power supply unit is disposed to pass through one of the contact portions of the adhesive body and the metal wire, and the metal wire between the guide pins is electrically connected.

According to this configuration, the wire passing through the guide pin can be electrically heated by the guide pin. In other words, the portion of the wire that is not contaminated by the cutting of the adherend is heated while abutting against the adherend, and the adhesive can be cut while being softened. Therefore, according to this configuration, the above method can be suitably carried out.

Further, the above apparatus is preferably a tension adjusting mechanism having a tension for adjusting a wire between the guide pins.

According to this configuration, the metal wire follows the irregularities formed on the outer circumference of the workpiece, and the adherend can be cut with good precision.

According to the cutting method of the adherend and the cutting device for the adherend according to the present invention, the adherend can be cut with good precision along the shape of the workpiece irrespective of the type of the adhesive, the characteristics, and the shape of the workpiece.

1‧‧‧Substrate supply/recycling department

2‧‧‧Substrate transport mechanism

3‧‧‧ Calibration table

4‧‧‧1st cover film supply department

5‧‧‧Seaner supply unit

6‧‧‧1st transport agency

7‧‧‧2nd cover film supply department

8‧‧‧2nd transport agency

9‧‧‧3rd transport agency

10‧‧‧ Attachment unit

11‧‧‧1st stripping unit

12‧‧‧Workpiece transport mechanism

13‧‧‧cutting device

14‧‧‧2nd peeling unit

16‧‧‧ Robotic arm

17‧‧‧White Nuoli chuck

18‧‧‧ Positioning pins

19‧‧‧Positioning holes

20‧‧‧Adsorption transport hole

21‧‧‧1st Maintenance Department

22‧‧‧ Positioning pins

23‧‧‧1st cover film adsorption pad

24‧‧‧Adhesive pad for sealing sheet

26‧‧‧2nd Maintenance Department

27‧‧‧Positioning holes

29‧‧‧Adhesive pad for sealing sheet

30‧‧‧ Positioning pins

32‧‧‧Upper pressurizing unit

33‧‧‧Bottom pressurizing unit

34‧‧‧Cylinder block

35‧‧‧ Pushing members

37‧‧‧ Keeping the table

38, 39‧‧‧Adsorption pad

41‧‧‧With the supply department

42‧‧‧With recycling department

43‧‧‧ Attachment roller

44‧‧‧Cylinder block

46‧‧‧ Keeping Department

47‧‧‧Adsorption pad

49‧‧‧ Keeping the table

50‧‧‧cutting unit

51‧‧‧Adsorption plate

52‧‧‧ camera

53‧‧‧1st movable table

54‧‧‧2nd movable table

55‧‧‧rail

56‧‧‧rails

60‧‧‧Metal wire supply department

61‧‧‧cutting department

62‧‧‧Wire winding department

63‧‧‧Metal wire

64‧‧‧ reel

65‧‧‧Rotary axis

66‧‧‧Marketing

67‧‧‧Power Supply Department

68‧‧‧ Controller

69‧‧‧ Tension roller

70‧‧‧ empty reel

71‧‧‧Rolling shaft

72‧‧‧Motor

75‧‧‧With the supply department

76‧‧‧ peeling bar

77‧‧With recycling department

78‧‧‧ Raw material roll

79‧‧‧ Guide roller

80‧‧‧Winding shaft

C1, C2‧‧‧匣

F1‧‧‧1st cover film

F2‧‧‧2nd cover film

H‧‧‧heater

M‧‧‧ sealing layer

G‧‧·guide roller

S1‧‧‧1st release liner

S2‧‧‧2nd release liner

T‧‧‧ Sealing film

Ts‧‧‧ peeling tape

W‧‧‧Substrate

X‧‧‧ central axis

Figure 1 is a cross-sectional view of a sealing sheet.

Fig. 2 is a top view showing the overall configuration of the sealing sheet attaching device.

Fig. 3 is a top view of the first and second cover film supply portions.

Fig. 4 is a front view of the first and second cover film supply portions.

Figure 5 is a top view of the first and second cover films.

Fig. 6 is a top view of the first conveying mechanism.

Fig. 7 is a front view of the first conveying mechanism.

Fig. 8 is a top view of the second conveying mechanism.

Fig. 9 is a front view of the second conveying mechanism.

Fig. 10 is a top view showing the adsorption surface of the holding table and the pressing member.

Figure 11 is a front view of the workpiece transport mechanism.

Fig. 12 is a top view of the holding table provided in the cutting unit.

Fig. 13 is a front view of the holding table provided in the cutting unit.

Figure 14 is a perspective view of the cutting unit.

Figure 15 is a flow chart of the sealing sheet attaching process.

Fig. 16 is a view showing the carrying out of the first cover film.

Fig. 17 is a view showing the carrying out of the first cover film.

Fig. 18 is a view showing the carrying out of the sealing sheet.

Fig. 19 is a view showing the carrying out of the sealing sheet.

Fig. 20 is a view showing the delivery of the sealing sheet from the first conveying mechanism to the second conveying mechanism.

Fig. 21 is a view showing the delivery of the sealing sheet from the second conveying mechanism to the pressing member.

Fig. 22 is a view showing the delivery of the sealing sheet from the second conveying mechanism to the pressing member.

Fig. 23 is a view showing the second release liner peeled off from the sealing sheet.

Fig. 24 is a view showing an operation of attaching a sealing sheet to a substrate.

Fig. 25 is a view showing the first cover film peeled off from the sealing sheet.

Fig. 26 is a view showing an operation of carrying out the substrate from the holding table.

Fig. 27 is a view showing the cutting operation of the sealing sheet.

Fig. 28 is a view showing the cutting operation of the sealing sheet.

Fig. 29 is a view showing an operation of peeling off the first release liner from the sealing sheet.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings. A sealing sheet having a sealing layer formed of a resin composition is attached to a semiconductor substrate (hereinafter simply referred to as a "substrate") having a plurality of semiconductor elements formed on its surface, and the sealing sheet is placed along the sealing sheet. The case where the shape of the substrate is cut is described as an example.

<sealing sheet>

The sealing sheet T is, for example, as shown in Fig. 1, and has a rectangular shape larger than the shape of the workpiece. Further, in the sealing sheet T, the first release liner S1 for protection and the second release liner S2 are attached to both surfaces of the sealing layer M.

The sealing layer M is formed into a sheet shape from a sealing material. Examples of the sealing material include a thermosetting epoxy resin, an epoxy resin, a thermosetting polyimide resin, a phenol resin, a urea resin, a melamine resin, and an unsaturated polyester. A thermosetting resin such as a resin, a diallyl phthalate resin, or a thermosetting urethane resin. In addition, as the sealing material, a thermosetting resin composition containing an additive in an appropriate ratio to the above-mentioned thermosetting resin may be mentioned.

Examples of the additive include a filler, a phosphor, and the like. Examples of the filler include inorganic fine particles such as silica, titania, talc, alumina, aluminum nitride, and tantalum nitride, and the like, for example, organic particles such as silicon oxide particles. Microparticles, etc. The phosphor has a wavelength conversion function, and examples thereof include a yellow phosphor that can convert blue light into yellow light, a red phosphor that can convert blue light into red light, and the like. Examples of the yellow phosphor include garnet-type phosphors such as Y ₃ Al ₅ O ₁₂ :Ce (YAG (yttrium aluminum garnet): Ce). Examples of the red phosphor include a nitride phosphor such as CaAlSiN ₃ :Eu, CaSiN ₂ :Eu, or the like.

The sealing layer M is adjusted to a semi-solid shape before sealing the semiconductor element, in particular, in the case where the sealing material contains a thermosetting resin, for example, before being completely hardened (C-staged), that is, in a semi-hardening (B) In the phase) state is adjusted.

The size of the sealing layer M is appropriately set in accordance with the size of the semiconductor element and the substrate. Specifically, in the case where the long piece is prepared as the sealing sheet, the length of the sealing layer in the left-right direction, that is, the width is, for example, 100 mm or more, preferably 200 mm or more, for example, 1500 mm or less, preferably 700 mm or less. Further, the thickness of the sealing layer is appropriately set in accordance with the size of the semiconductor element, and is, for example, 30 μm or more, preferably 100 μm or more, and further, for example, 3000 μm or less, preferably 1,000 μm or less.

Examples of the first release liner S1 and the second release liner S2 include a polymer sheet such as a polyethylene sheet, a polyester sheet (PET or the like), a polystyrene sheet, a polycarbonate sheet, and a polyimide sheet. For example, a ceramic sheet such as a metal foil or the like. The release liner may be subjected to a release treatment such as fluorine treatment on the contact surface in contact with the seal layer. The dimensions of the first release liner and the second release liner are appropriately set in accordance with the peeling conditions, and the thickness is an example. For example, it is 15 μm or more, preferably 25 μm or more, and further, for example, 125 μm or less, preferably 75 μm or less.

<Sealing sheet attachment device>

Hereinafter, a device in which the sealing sheet is attached to a substrate by a sealing sheet attaching device including a cutting device according to an embodiment of the present invention will be described. In the present embodiment, the case where the sealing sheet and the substrate are pressed by the two cover sheets larger than the shape of the sealing sheet and the sealing sheet is pressed and attached to the substrate will be described as an example.

Fig. 2 is a top view showing the overall configuration of the sealing sheet attaching device.

As shown in FIG. 2, the sealing sheet attaching device is a substrate supply/recovery unit 1, a substrate transfer mechanism 2, a calibration table 3, a first cover film supply unit 4, a sealing sheet supply unit 5, a first transfer mechanism 6, and a first The cover film supply unit 7, the second transfer mechanism 8, the third transfer mechanism 9, the attaching unit 10, the first peeling unit 11, the workpiece transport mechanism 12, the cutting device 13, and the second peeling unit 14 are configured. Here, the first and third conveying mechanisms 6 and 9 and the workpiece conveying mechanism 12 are suspended and held so as to be movable along the guide rails laid on the patio. The other configuration is provided on the apparatus base. Hereinafter, each configuration will be described in detail.

The substrate supply/recovery unit 1 is provided with 匣C1 and C2 for inserting and accommodating the substrate W before the sealing sheet T and the substrate W to which the sealing sheet T is attached, on the cymbal. The substrate W has a circuit surface facing upward and spaced apart from each other at a predetermined interval, and is housed in a plurality of layers C1 and C2.

The substrate transfer mechanism 2 includes a robot arm 16 . The robot arm 16 is horizontally moved by the movable table. Robotic arm 16 system The structure can be advanced, retracted, rotated and lifted horizontally. Further, the robot arm 16 is a Bernoulli chuck 17 having a horseshoe shape at the front end. The white Nucleus chuck 17 takes out the substrate W in a non-contact manner from the substrate C in which the substrate W to be processed is stored, and presses the calibration table 3, the holding table 37 (see FIG. 23), the holding table 49, and the recovery cassette C2. The substrate W is transferred in a non-contact manner.

The calibration table 3 detects a calibration notch formed on the outer circumference of the substrate W while rotating while holding the back surface of the substrate W in a state in which the back surface of the substrate W is sucked and held by the adsorption pad that advances and retreats from the holding surface. Thereafter, the calibration station 3 performs the centering of the substrate based on the detection result.

As shown in FIG. 3 and FIG. 4, the first cover film supply unit 4 has a positioning pin 18 standing upright on the bottom. In other words, as shown in FIG. 5, the first cover film supply unit 4 inserts the positioning pin 18 into the positioning hole 19 formed on the outer circumference of the first cover film F1, and sets the predetermined number of the first cover film F1. Stacked storage. In addition, the first cover film F1 is formed with a plurality of adsorption transfer holes 20 along the outer circumference of the sealing sheet T indicated by the two-dot chain line of FIG. 5 .

As shown in FIG. 18 and FIG. 19, the sealing sheet supply unit 5 laminates and stores a predetermined number of the sealing sheets T.

As shown in FIG. 6 and FIG. 7 , the first transfer mechanism 6 includes a positioning pin 22 , a first cover film adsorption pad 23 , and a sealing sheet adsorption pad 24 on the bottom surface of the first holding unit 21 . Further, the third transport mechanism 9 also has the same configuration as that of the first transport mechanism 6.

The second transport mechanism 8 includes a second holding unit 26 (see FIGS. 19 to 22 ). As shown in FIG. 8 and FIG. 9 , the second holding portion 26 includes the adsorption pad provided on the bottom surface of the first holding portion 21 of the first conveying mechanism 6 . 23 and the first cover film adsorption pad 28 and the sealing sheet adsorption pad 29 are provided at respective positions facing the adsorption pad 24. Further, a positioning hole 27 into which the pin 22 is inserted is formed in the first holding portion 21 and the pin 22 opposite to each other. Further, each corner portion of the second holding portion 26 is provided with a positioning pin 30 through which the positioning hole 19 of the first cover film F1 is inserted. In addition, the pin 30 is constructed to be raised and lowered by a spring or a cylinder. In other words, the second transport mechanism 8 is configured to perform the pick-up operation from the first transport mechanism 6 in a state in which the first cover film F1 and the seal sheet T are maintained.

As shown in FIGS. 23 to 26, the attaching unit 10 is constituted by the upper pressurizing unit 32, the lower pressurizing unit 33, and the like. The upper pressurizing unit 32 includes a pressing member 35 that moves up and down along the guide rail in response to the operation of the cylinder 34.

The lower press unit 33 includes a holding stage 37 that sucks and holds the second cover film F2 and the substrate W. As shown in FIG. 2, the holding base 37 is configured such that it can reciprocate along the guide rail from the position where the second cover film F2 and the substrate W are picked up to the lower position of the upper press unit 32 opposed to the pressing member 35.

Further, as shown in FIG. 10, the bottom surface of the pressing member 35 and the surface of the holding table 37 are provided with adsorption pads 38 and 39, respectively, in the same arrangement as the first conveying mechanism 6. In other words, one of the pressing members 35 simultaneously adsorbs and holds the first cover film F1 and the sealing sheet T. The other holding stage 37 simultaneously adsorbs and holds the second cover film F2 and the substrate W. Moreover, as shown in FIG. 24, the heater H is embedded in at least one of the pressing member 35 and the holding stand 37.

As shown in FIG. 23 and FIG. 25, the first peeling unit 11 is composed of two sets of peeling units including a tape supply unit 41, a tape collecting unit 42, and an attaching roller 43. The two peeling units are juxtaposed at predetermined intervals on the guide rails laid in the horizontal direction of Fig. 2 . These stripping unit systems are constructed to be horizontally movable. Moreover, the attaching roller 43 of each peeling unit is configured to be movable in a range from a predetermined position that covers the outer side of the upper side press unit 32 to a predetermined peeling position between the upper press unit 32 and the lower press unit 33. Further, the two attachment rollers 43 are constructed such that they can be raised and lowered by the cylinder 44 or the like.

Further, each tape supply unit 41 supplies a peeling tape Ts which is narrower than the substrate W. One of the tape collecting portions 42 is obtained by winding and collecting the peeling tape Ts which is integrated with the second release liner S2 and peeled off. The other tape collecting portion 42 is integrally wound with the first cover sheet F1 and is wound and collected by the peeling peeling tape Ts.

As shown in FIG. 11, the workpiece transfer mechanism 12 is provided with a plurality of adsorption pads 47 in the holding portion 46 at the tip end of the arm portion. The holding portion 46 is constructed to be movable up and down. Therefore, the workpiece transport mechanism 12 sucks the substrate W to which the sealing sheet T is attached by the holding portion 46, and transports and mounts the substrate W from the pick-up position toward the holding table 49 on the cutting device 13 side.

As shown in FIG. 2, the cutting device 13 is constituted by a holding table 49, a cutting unit 50, and the like. As shown in FIGS. 12 and 13, the holding table 49 has a suction plate 51 having a smaller diameter than the diameter of the substrate W, and the back surface of the substrate W placed by the workpiece transfer mechanism 12 and placed in a predetermined alignment posture is provided. Vacuum adsorption. Further, the holding base 49 is configured to be horizontally moved forward and backward by the first movable table 53 and the second movable table 54, and Rotating around the central axis X by a rotary motor. In other words, the first movable table 53 moves along the guide rail 55 toward the pick-up position and the cutting unit 50 side. The second movable table 54 is moved by the guide rail 56 in a direction crossing the guide rail 55.

Further, a camera 52 for obtaining a contour image of the outer circumference of the substrate W for calibration is provided near the lower side of the holding table 49.

As shown in FIG. 14, the cutting unit 50 is composed of a wire supply unit 60, a cutting unit 61, a wire winding unit 62, and the like.

In the wire supply portion 60, the spool 64 around which the wire 63 is wound is loaded on the rotary shaft 65. The rotating shaft 65 is coupled to the electromagnetic brake and is applied with a moderate rotational resistance. Excessive wire 63 is thus prevented from being withdrawn. Further, the metal wire 63 may be a metal that can be energized, for example, a nickel-chromium alloy, tungsten, or the like.

As shown in FIGS. 14, 27, and 28, the cutting portion 61 is constituted by a guide pin 66, a power supply portion 67, a controller 68, and the like. The guide pins 66 are formed by a pair of upper and lower sides, and guide the metal wires 63 in a direction crossing the substrate W. Further, the guide pin 66 has a tip end made of metal and is configured to supply a current from the power supply unit 67 via the controller 68. That is, the controller 68 energizes the metal wires 63 between the guide pins. Further, the tension roller 69 that applies a moderate tension to the wire 63 guided between the guide pins via the guide roller G is provided on the upstream side and the downstream side by sandwiching the cutting portion 61. Further, the guide pin 66, the guide roller G, and the tension roller 69 are formed with guide grooves for preventing the wire 63 from coming off.

The tension roller 69 is configured to be coupled to a driving portion such as a motor or a cylinder and to ascend and descend along the guide shaft.

The wire winding portion 62 is mounted on the winding shaft 71 by the empty drum 70 that winds the wire 63 after the sealing piece is cut. The winding shaft 71 is constructed to wind and recover the wire 63 by the rotational driving of the motor 72.

As shown in FIG. 29, the second peeling unit 14 is composed of a tape supply unit 75, a peeling bar 76, a tape collecting portion 77, and the like. These components are fixedly attached to the longitudinal wall that is fixed to the device frame.

The tape supply unit 75 extracts the peeling tape Ts which is narrower than the substrate W from the raw material roll 78 wound into a cylinder, and guides it to the blade-shaped peeling bar 76 via the guide roller 79.

The peeling bar 76 is pressed against the peeling tape Ts so as to be attached to the first cover film F1 and the peeling tape Ts is folded back and reversed, and the first cover film F1 integrated with the peeling tape Ts is peeled off from the sealing sheet T. .

The belt collecting portion 77 is configured to wind and wind the peeling tape Ts and the first cover film F1 on the winding shaft 80.

Next, an operation for attaching the surface protective sealing sheet T to the surface of the substrate W by the apparatus of the above-described embodiment and cutting one of the shapes of the substrate W is performed according to the flowchart of FIG. 15 and FIGS. 16 to 33. Give instructions.

When the attaching command is issued, the first conveying mechanism 6, the third conveying mechanism 9, and the substrate conveying mechanism 2 are operated at substantially the same time.

The first transport mechanism 6 moves the first holding portion 21 upward of the first cover film supply unit 4 . Thereafter, as shown in FIG. 16, the first holding portion 21 is lowered and the first cover film F1 is sucked and held.

As shown in FIG. 17 , the first holding portion 21 of the first conveying mechanism 6 moves the upper side of the sealing sheet supply unit 5 while the first cover film F1 is sucked and held (step S1A). Then, as shown in FIG. 18, the first holding portion 21 lowers the first holding portion 21 and sucks and holds the sealing sheet T by the adsorption hole 20 formed in the first cover film F1.

As shown in FIG. 19, the second holding portion 26 of the second conveying mechanism 8 moves downward in the first holding portion 21 that moves and holds the sealing sheet T upward (step S2A). When the alignment of the first holding portion 21 and the second holding portion 26 is completed, as shown in FIG. 20, the first holding portion 21 is lowered. At this time, the positioning pin 22 of the first holding portion 21 is inserted into the positioning hole 27 of the second holding portion 26 . At the same time, the pin 30 provided at the corner of the second conveying mechanism 8 is inserted into the hole 19 of the corner portion of the first cover film F1. Therefore, the first cover film F1 is delivered to the second transfer mechanism 8 from the first transfer mechanism 6 while maintaining the alignment posture state (step S3A).

When the delivery is completed, the first holding portion 21 is raised, and the next first cover film F1 is carried out.

The second holding portion 26 moves below the upper pressing unit 32. When the pressing member 35 of the upper pressing unit 32 is aligned with the second holding portion 26, as shown in FIG. 21, the second holding portion 26 is raised. The pressing member 35 adsorbs and holds the first cover film F1 and the sealing sheet T by the suction pads 38 and 39 on the bottom surface (step S4A). Thereafter, as shown in FIG. 22, the second holding portion 26 is lowered and moved toward the standby position outside the first pressurizing unit 32.

The attaching roller 43 of the peeling unit of any one of the first peeling units 11 moves between the first pressurizing unit 32 and the second pressurizing unit 33. When the attaching roller 43 reaches the end portion on the back side of the sealing sheet T, as shown in FIG. 23, the attaching roller 43 is raised to attach the peeling tape Ts to the second release liner S2. After that, the peeling unit attaches the peeling tape Ts to the second release liner S2 while moving the attaching roller 43, and winds the peeling tape Ts in synchronization with the moving speed. At this time, the second release liner S2 is peeled off. The tape Ts is integrated and peeled off from the sealing sheet T (step S5A). Further, at the time of peeling off the second release liner S2, the holding table 37 that adsorbs and holds the substrate W via the second cover film F2 is moved below the pressing member 35.

In the same manner as the first transport mechanism 6, the third transport unit 9 is moved to the upper side of the second cover film supply unit 7 as shown in FIG. 16 and FIG. 3 The holding portion 31 is lowered to adsorb and hold the second cover film F2. The third holding portion 31 is lifted and held by the second cover film F2, and is moved toward the lower pressing unit 33 (step S1B). Thereafter, the third holding portion 31 places the second cover film F2 on the holding table 37 (step S2B).

The robot arm 16 of the substrate transfer mechanism 2 moves the white Nucleus chuck 17 at the tip end toward the crucible C1 placed on the crucible. The white Null chuck 17 is inserted into the gap between the substrates W accommodated in the crucible C1. The robot arm 16 that sucks and holds the substrate W by the white Nucleus chuck 17 in a non-contact manner carries out the substrate W from the crucible C1 and mounts it on the calibration table 3 (step S1C).

The substrate W placed on the calibration table 3 is aligned by a notch formed on the outer circumference (step S2C). The aligned substrate W is then carried out by the white Nucleus chuck 17. The white Null chuck 17 mounts the substrate W on the second cover film F2 placed on the holding table 37 (step S3C).

The holding stage 37 sucks and holds the second cover film F2 and moves the lower side of the pressing member 35 of the upper pressing unit 32 while maintaining the substrate W by the adsorption hole 20 of the second cover film F2.

When the opposing of the pressing member 35 and the holding table 37 is completed, as shown in FIG. 24, the pressing member 35 heated by the heater H is lowered to a predetermined position. That is, the pressed member 35 and the holding table 37 The sealing layer M of the sandwiched sealing sheet T is pressed against the substrate W (step S6). At this time, since the sealing layer M of the sealing sheet T is softened by the heating of the heater H, the unevenness formed on the surface of the substrate W is intruded and adhered. Further, the sealing layer M is in a semi-hardened state by being pressurized and heated for a predetermined period of time.

After a predetermined period of time, the pressing member 35 is raised. The attaching roller 43 of the peeling unit moves between the first pressurizing unit 32 and the second pressurizing unit 33. When the attaching roller 43 reaches the end of the first cover film F1, as shown in FIG. 25, the attaching roller 43 is lowered to attach the peeling tape Ts to the first cover film F1. After that, the peeling tape Ts is gradually attached to the first cover film F1 while moving the attaching roller 43, and the peeling tape Ts is wound in synchronization with the moving speed, whereby the first cover film F1 and the peeling tape Ts are integrated. It peels from the sealing sheet T (step S7).

The holding table 37 that sucks and holds the substrate W to which the sealing sheet T is attached is moved toward the delivery position of the workpiece conveying mechanism 12. As shown in FIG. 26, the holding portion 46 of the workpiece transfer mechanism 12 adsorbs and holds the surface of the sealing sheet T and transports the substrate W to the holding table 49, and then mounts the substrate W on the holding table 49 (step S8). At this time, the second cover film F2 is maintained to be retained by the holding stage 37. In addition, the second cover film F2 is transported to the collection unit (not shown) by the third transfer mechanism 9 and discarded.

When the substrate W is suction-held by the adsorption plate 51, the outer periphery of the substrate W is imaged by the camera 52 while rotating the adsorption plate 51. The contour image of the obtained substrate W is subjected to image processing such as binarization processing and pattern matching, for example, to obtain the center coordinates of the substrate W. According to the center coordinates, the movable tables 53 and 54 are operated to be aligned (step S9).

When the registration is completed, the holding table 49 is moved toward the cutting unit 50 side. When the holding table 49 reaches the cutting unit 50 side, it moves horizontally toward the cutting unit 50 side (X direction in the drawing). With the horizontal movement of the holding table 49, the motor 72 of the cutting unit 50 is driven to move the wire 63 in one direction, and the predetermined current is transmitted from the power supply unit 67 to the guide pin 66 through the controller 68. When the holding table 49 is moved to the cutting position, as shown in FIG. 27, the first cover film F1 and the sealing layer M are continuously engraved with traces until the metal wire 63 contacts the periphery of the substrate W. When the metal wire 63 reaches the predetermined position, as shown in FIG. 28, the suction plate 51 rotates about the central axis X, and the metal wire 63 travels in one direction and only the heated portion of the metal wire 63 abuts against the outer periphery of the substrate W. . Therefore, the sealing layer M exposed from the substrate W by the attaching process is cut in accordance with the shape of the substrate (step S10).

Further, in the cutting process, when the outer periphery of the substrate has irregularities such as notches, the holding table 49 is moved so that the predetermined pressing of the metal wire 63 can act on the outer periphery of the substrate. That is, the holding table 49 is moved in accordance with the position information of the contour image data of the substrate W obtained at the calibration table 3. At the same time, the lifting operation tension roller 69 施加 applies a predetermined tension between the guide pins 66.

When the cutting process is completed, the holding table 49 moves to the peeling start position on the initial approach path. When the holding table 49 reaches the predetermined position, as shown in FIG. 29, the second peeling unit 14 is actuated and the peeling bar 76 is lowered to the tape attachment start end of the sealing sheet T on the substrate W. When the peeling tape Ts is attached to the end portion of the first release liner S1 on the sealing sheet T by the pressing of the peeling bar 76, the movable table 54 moves. The peeling tape Ts is wound around the winding shaft 80 in synchronization with the movement of the movable table 54, and the first peeling The liner S1 and the peeling tape Ts are integrated and are peeled off from the sealing sheet T (step S11).

When the first release liner S1 is peeled off from the surface of the sealing sheet T, the holding table 49 moves to a position where it is delivered toward the substrate conveyance mechanism 2.

When the white Nucleus chuck 17 of the substrate transfer device 2 holds the substrate W in a non-contact manner, it is transported to the crucible C2 and stored (step S12).

In the above, the process of attaching the sealing sheet T to the substrate W once is completed, and thereafter, the above-described operation is repeated in sequence until the sheet bonding processing of the predetermined number of substrates W is completed (step S13).

As described above, by bringing the heated metal wire 63 into contact with the outer circumference of the substrate W and moving along the outer circumference, the sealing layer M and the first release liner S1 can be softened and easily cut. Further, since the wire 63 is moved in one direction during the cutting process, the used cut portion is not reused. That is, the metal wire 63 contaminated by the adhesion of the softened sealing layer M is not used, and therefore, the occurrence of the cutting failure due to the contamination of the metal wire 63 can be avoided. Moreover, by causing the metal wire 63 to travel downward, it is possible to prevent dust generated during cutting from adhering to the surface side of the substrate. Further, by using the metal wire 63 wound back to the reel, the clean metal wire 63 can be used for a long period of time.

Further, the present invention can also be carried out in the following forms.

(1) With regard to the apparatus of the above embodiment, the sealing layer M and the first release liner S1 may be cut while the metal wire 63 reciprocates.

(2) Regarding the apparatus of the above embodiment, only the sealing layer M may be cut after the first release liner S1 is peeled off.

(3) The cutting device of the above embodiment is not limited to the above embodiment, and may be used for cutting the surface protective adhesive tape attached to the circuit forming surface of the semiconductor wafer.

(4) Although the case where the circular substrate W is cut is described as an example in the apparatus of the above embodiment, the shape of the substrate may be square, rectangular or polygonal. When the adhesive sheet such as the sealing sheet or the adhesive tape attached to the substrate of the same shape is cut, the linear movement of the holding table 49 and the rotation of the predetermined angle are transmitted, so that the adhesive body can be cut with good precision according to the shape of the substrate. .

(5) In the apparatus of the above embodiment, the bonding of the sealing sheet T to the substrate W may be performed by accommodating the substrate W in the chamber and in a vacuum state.

49‧‧‧ Keeping the table

50‧‧‧cutting unit

51‧‧‧Adsorption plate

53‧‧‧1st movable table

54‧‧‧2nd movable table

63‧‧‧Metal wire

66‧‧‧Marketing

67‧‧‧Power Supply Department

68‧‧‧ Controller

T‧‧‧ Sealing film

W‧‧‧Substrate

Claims (5)

A method of cutting an adhesive body is a method of cutting an adhesive body attached to an adhesive body attached to a workpiece along an outer shape of the workpiece, and the method includes the following process; causing the traveling metal wire to abut from the workpiece The adhesive body energizes the metal wire of the contact portion, and cuts the adhesive while heating. A method of cutting an adherend of claim 1, wherein the workpiece is rotated and the wire is advanced in synchronization with the rotational speed. In the method of cutting an adhesive body according to claim 1, wherein the tension of the metal wire is adjusted in accordance with the uneven shape of the outer periphery of the workpiece, the pressing of the wire at the abutting portion is constant. A cutting device for an adhesive body is a cutting device for an adhesive body that is attached to an adhesive body of a workpiece and cut along an outer shape of the workpiece. The device includes the following configuration; the holding table holds and holds the workpiece; a mechanism for abutting the metal wire against the adhering body protruding from the workpiece to cut the adhesive body; and a rotation driving mechanism for rotating the holding table and the metal wire in a manner that the metal wire travels along the outer shape of the workpiece, the cutting The mechanism includes a driving mechanism that guides the wire to travel at the cutting portion by the guide roller, and a power supply portion that is disposed between the guide pin and the guide pin via a contact portion between the adhesive body and the wire The metal wire is turned on. The cutting device for an adhesive body according to claim 4, further comprising a tension adjusting mechanism for adjusting a tension of the wire between the guide pins.