KR102064727B1 - Sheet adhering device and method for preventing enlargement of the device - Google Patents

Abstract

The sheet attaching device 1 includes at least one of a frame accommodating means 3 capable of accommodating a frame member RF integrated with the adherend WF via an adhesive sheet, and at least one of the frame member RF and the adherend WF. Support means 6 which supports frame member RF, conveyance means 7 which conveys frame member RF to support means 6 from frame accommodating means 3, and support means 6 It is provided with the attachment means 9 which contacts and adheres the adhesive sheet to the frame member RF or the frame member RF and the to-be-adhered body WF which were made, The frame member RF is equipped with the opening part RF1, The component of the said sheet attachment apparatus 1 arrange | positions in the opening space SP formed by the opening part RF1 of the said frame member RF when the frame member RF is accommodated in the frame accommodating means 3. do.

Description

Sheet attaching device and prevention of enlargement of device {SHEET ADHERING DEVICE AND METHOD FOR PREVENTING ENLARGEMENT OF THE DEVICE}

TECHNICAL FIELD This invention relates to the sheet attachment apparatus which attaches an adhesive sheet, and the prevention method of enlargement of an apparatus.

Conventionally, in the semiconductor manufacturing process, the sheet attachment apparatus which attaches an adhesive sheet to a semiconductor wafer (henceforth a wafer) and a ring frame is known (for example, document 1: Unexamined-Japanese-Patent No. 2005-) See publication 33119).

The sheet sticking apparatus of Document 1 is equipped with a wafer supply part which supplies a wafer, a ring frame supply part which supplies a ring frame, a mounting mechanism which adheres an adhesive sheet to the wafer and ring frame supplied from each supply part, and an adhesive sheet It is comprised so that a wafer and a ring frame may be integrated through these.

However, in the conventional sheet attachment apparatus as described in Document 1, since the ring frame also increases as the wafer increases, the volume in the opening of the ring frame accommodated in the ring frame supply portion increases. This causes only the unnecessary space that uses nothing to increase, resulting in a problem that the device is unnecessarily large in size.

An object of the present invention is to provide a sheet attaching device and a method for preventing the enlargement of the device, which can effectively prevent the device from being unnecessarily enlarged by using the space effectively.

The apparatus for attaching a sheet of the present invention includes frame accommodating means capable of accommodating a frame member integrated with an adherend via an adhesive sheet, support means for supporting at least a frame member among the frame member and the adherend, and the frame accommodating means. A conveyance means for conveying the frame member from the support means to the support means; and attachment means for contacting and attaching the adhesive sheet to the frame member or frame member and the adherend supported by the support means, wherein the frame member is an opening portion. And a component of the sheet applying apparatus is arranged in an opening space formed by an opening of the frame member when the frame member is accommodated in the frame receiving means.

In the sheet attaching apparatus of the present invention, the component includes at least one of control means for controlling the sheet attaching apparatus, elevating means for elevating the frame member, and waste accommodating means for accommodating unnecessary materials generated by the sheet attaching apparatus. Is preferably.

The enlargement prevention method of the apparatus of this invention is a enlargement prevention method of the apparatus provided with the frame accommodating means which can accommodate the frame member integrated with a to-be-adhered body via an adhesive sheet, and when the said frame member is accommodated in the said frame accommodating means. The component of the said apparatus is arrange | positioned in the opening space formed by the opening part of the said frame member.

According to the present invention as described above, since the components of the sheet applying apparatus are disposed in the opening space, the opening space can be effectively used, and the apparatus can be prevented from being unnecessarily enlarged.

In the present invention, if the component of the sheet applying apparatus is at least one of the control means, the elevating means, the waste accommodating means, the opening space can be reliably used effectively to prevent the apparatus from being unnecessarily enlarged.

1 is a plan view of a sheet applying apparatus according to an embodiment of the present invention.
FIG. 2 is a side view of the attaching means of the sheet attaching apparatus of FIG. 1. FIG.
3 is a partial cross-sectional side view of the frame receiving means of the sheet attachment device of FIG. 1.
4A is a plan view illustrating a modification.
4B is a partial cross-sectional side view of FIG. 4A.

EMBODIMENT OF THE INVENTION Hereinafter, one Embodiment of this invention is described based on drawing.

In addition, X-axis, Y-axis, and Z-axis in embodiment are orthogonal to each other, X-axis and Y-axis are an axis in a horizontal plane, and Z-axis is an axis orthogonal to a horizontal plane. In addition, in each embodiment, when a direction is shown based on the case seen from the arrow AR direction parallel to a Y axis, "upper" is an arrow direction of a Z axis, "lower" is the opposite direction, and "left" is X The arrow direction of the axis is "right" in the opposite direction, the "before" is the arrow direction of the Y axis, and the "rear" is the opposite direction.

In FIG. 1, the sheet sticking apparatus 1 is integrated with the wafer WF via the wafer accommodating means 2 which can accommodate two or more wafers WF as a to-be-adhered body, and the adhesive sheet AS (FIG. 2). A frame accommodating means 3 capable of accommodating a plurality of ring frames RF as a frame member to be used, a support means 6 for supporting at least the ring frame RF among the ring frame RF and the wafer WF, and the frame accommodating property. The conveying means 7 which conveys the ring frame RF from the means 3 to the support means 6, the ring frame RF or ring frame RF supported by the support means 6, and the wafer WF. It is provided with the attachment means 9 which contacts and adheres the adhesive sheet AS, and the control means 10 which controls the said sheet | seat attachment apparatus 1, and is supported by the frame 11. As shown in FIG.

The wafer accommodating means 2 includes a wafer cassette 21 capable of accommodating the wafer WF having the protective sheet PS (FIG. 2) on its surface in the vertical direction, and is separated from the frame 11. Possibly supported.

The frame accommodating means 3 can raise and lower the support member 32 provided with the guide 31 along the external shape of the ring frame RF at both ends, and the support member 32 by the output shaft 33 (FIG. 3). And a direct drive motor 34 serving as a lifting means, a pole 35 in contact with four outer edges of the ring frame RF, for positioning the ring frame RF, and a top ring frame ( A sensor 36 including an optical sensor, a contact sensor, a camera, or the like for detecting the upper surface of the RF) and positioning the uppermost ring frame RF at a predetermined position is provided. And when the ring frame RF is accommodated on the support member 32 along the pole 35, the opening space SP is formed by the opening part RF1 of the said ring frame RF.

The support means 6 includes a table 62 having a support surface 61 capable of adsorbing and holding the wafer WF and the ring frame RF by suction means such as a pressure reducing pump or a vacuum ejector (not shown); The linear motor 64 as a drive device which supports the 62 by the slider 63 (FIG. 2) is provided.

The conveying means 7 is equipped with the articulated robot 71 as a drive apparatus, and the holding means 72 provided in the front-end | tip part of this articulated robot 71. As shown in FIG. The articulated robot 71 is a so-called six-axis robot having joints rotatable in six places, and the wafer WF held by the holding means 72 within the working range of the articulated robot 71 and The ring frame RF is configured to be movable at any position and at any angle. The holding means 72 is a disk-like holding frame 74 having a recess 73 on one side 74A, as shown in the drawing from the AR direction indicated by reference sign AA in FIG. 1. And the XY table 75 disposed in the recess 73 and the suction plate 77 supported by the output portion 76 of the XY table 75, and the surface 74A of the holding frame 74 is provided. It is comprised so that the adsorption plate 77 can be moved to the orthogonal biaxial direction in the following plane, and the adsorption plate 77 can be rotated in the said plane. The suction plate 77 has a suction surface 79 on which a plurality of suction holes 78 are formed, and is connected to the articulated robot 71 so as to be connected to suction means such as a pressure reducing pump or a vacuum ejector (not shown). It is possible to adsorb and hold the WF and the ring frame RF. In addition, the adsorption plate 77 has two systems, a system for adsorption holding and holding a wafer WF, and a system for adsorption holding and holding a ring frame RF.

In addition, in the left direction of the conveying means 7, the outer edge position of the wafer WF, the orientation marks, such as the V notch and orientation flat which are not shown in the wafer WF, a circuit pattern, a street, or the ring frame RF The detection means 8 which consists of an optical sensor, an imaging device, etc. which can detect the outer edge and inner edge position of the inside, the notch RF2 formed in the outer periphery of the ring frame RF, etc. is provided.

As shown in FIG. 2, the attachment means 9 has the strip | belt-shaped peeling sheet which the adhesive sheet AS which has the adhesive bond layer AD on one surface of the base material sheet BS via the said adhesive bond layer AD. The peeling sheet | seat by returning the support roller 91 which supports the raw material RS attached to one surface of the RL, the some guide roller 92 which guides the raw material RS, and the raw material RS is folded back. Pressing roller 93 for peeling off the adhesive sheet AS from the RL and a pressure roller for contacting and attaching the adhesive sheet AS peeled off by the peeling plate 93 to the wafer WF and the ring frame RF. 94, the drive roller 96 driven by the rotational motor 95 as a drive device, the pinch roller 97 which fits the peeling sheet RL between the drive roller 96, and the drive which is not shown in figure. The recovery roller 98 which drives by an apparatus and collect | recovers the peeling sheet RL is provided.

The control means 10 is comprised with a personal computer, a sequencer, etc., is provided so that control of the whole operation | movement of the sheet attachment apparatus 1 is possible, and is arrange | positioned in the opening space SP.

In addition, in the case of this embodiment, the peeling means 12 which peels the protective sheet PS adhering to the wafer WF, and the unnecessary member accommodating box 13 as waste storage means which collect | recovers the peeled protective sheet PS are collected. ) Are added, but detailed description is omitted since these are not essential requirements of the present invention. In this connection, as the peeling means 12, what was described, for example in peeling apparatus prior art documents, such as Japanese Patent Application No. 2008-285228 and Japanese Patent Application No. 2011-55508, can be illustrated, and the unnecessary member accommodating box 13 ) Is not limited at all as long as it can accommodate and recover protective sheet PS.

In the above sheet attachment apparatus 1, the procedure of attaching the adhesive sheet AS to the wafer WF and the ring frame RF is demonstrated.

First, the raw material RS is set as shown in FIG. Then, when the wafer cassette 21 is set at the position shown in FIG. 1 and the plurality of ring frames RF are stacked on the support member 32 along the pole 35, the opening space SP is set. ) Is formed, and the frame accommodating means 3 drives the linear motion motor 34 to raise the stacked ring frames RF so that the ring frame RF positioned at the top thereof is located at the predetermined position. ) Is detected and the drive of the linear motion motor 34 is stopped.

When the set of each member is completed as mentioned above, the conveying means 7 drives the articulated robot 71, the holding means 72 is inserted in the inside of the wafer cassette 21, and the adsorption surface 79 is carried out. After contacting the wafer WF, suction means (not shown) is driven to adsorb and hold the wafer WF. Subsequently, the conveying means 7 drives the articulated robot 71, moves the wafer WF to a position that can be detected by the detecting means 8, drives the XY table 75 to drive the wafer. The WF is rotated by a predetermined angle. Thereby, the detection means 8 detects the outer edge position of the wafer WF and the V notch position which are not shown in figure, and these various data are output to the control means 10. As shown in FIG. When various data of the wafer WF are input to the control means 10, the center position of the wafer WF is calculated, and the conveying means 7 drives the XY table 75 and the articulated robot 71 to drive the wafer. It loads on the support surface 61 of the table 62 so that the center position of WF and the V notch position which are not shown in figure may become a predetermined position.

Subsequently, the conveying means 7 drives the articulated robot 71 to move the holding means 72 above the frame accommodating means 3 to move the suction surface 79 to the uppermost position positioned at the predetermined position. After contacting the located ring frame RF, suction means (not shown) is driven to suck and hold the ring frame RF. Subsequently, the conveying means 7 drives the articulated robot 71 to move the ring frame RF to a position that can be detected by the detecting means 8, and the detecting means 8 detects the wafer described above. The same operation as in the case of (WF), after which the center position of the opening portion RF1 of the ring frame RF coincides with the center position of the wafer WF supported on the table 62; The ring frame RF is mounted on the support surface 61 of the table 62 with the V notch RF2 of the ring frame RF facing a predetermined direction. In addition, when the uppermost ring frame RF is conveyed and the ring frame RF located just below the uppermost portion becomes the uppermost ring frame RF, the frame accommodating means 3 supplies the linear motor 34. By driving, the ring frame RF positioned at the top thereof is detected by the sensor 36 at a predetermined position, and driving of the linear motion motor 34 is stopped.

Subsequently, the supporting means 6 drives the linear motor 64 to move the table 62 to the left, so that the wafer WF and the ring frame RF have reached a predetermined position. When detected by the detecting means, the attaching means 9 drives the rotation motor 95 in synchronization with the movement of the table 62 to send out the raw material RS. Thereby, the adhesive sheet AS is peeled off by the peeling plate 93, and the peeled adhesive sheet AS is attached to the wafer WF and the ring frame RF by the pressure roller 94, and FIG. As indicated by the double-dotted line in FIG. 2, the wafer support WK is formed. In this way, when the wafer support body WK is formed, it detects by the detection means not shown, and the support means 6 stops the linear motor 64. As shown in FIG. Then, the conveying means 7 drives the articulated robot 71, lifts up and down the wafer support WK, and transfers it to an unshown delivery means having an adsorption support surface that faces the support surface 61. Then, the wafer support WK is vertically inverted by being placed on the support surface 61 again.

Subsequently, the support means 6 drives the linear motor 64 to move the table 62 to the left direction. When detection means (not shown) that the wafer support body WK has reached a predetermined position is detected, the peeling means 12 attaches a peeling tape (not shown) to the protective sheet PS, and tensions the peeling tape. The protective sheet PS is peeled off from the wafer WF (see the peeling apparatus prior art document for details). When the protective sheet PS is peeled off from the wafer WF, the conveying means 7 drives the articulated robot 71, and the suction surface 79 is brought into contact with the protective sheet PS that has been peeled off and suction not shown. The means is driven to adsorb and hold the protective sheet PS, and discard it in the unnecessary member accommodating box 13. And the wafer support body WK from which the protective sheet PS was peeled off is conveyed by the conveyance means which is not shown in a separate process, the table 62 returns to the position shown by the solid line in FIG. The same operation is repeated.

According to the present embodiment as described above, the following effects are obtained.

That is, since the component of the said sheet sticking apparatus 1, ie, the control means 10, is arrange | positioned in the opening space SP, the opening space SP can be utilized effectively, and conventionally, the ring frame RF What was arrange | positioned outside the opening RF1 can be arrange | positioned in the opening RF1 of the said ring frame RF, and the sheet sticking apparatus 1 can be prevented from being unnecessarily enlarged.

As mentioned above, although the best structure, method, etc. for implementing this invention are disclosed in the said description, this invention is not limited to this. That is, the present invention is mainly shown and described in particular with respect to specific embodiments, but the embodiments, embodiments, shapes, materials, quantities, and other details of the above-described embodiments without departing from the technical spirit and desired range of the present invention are described. In the configuration, a person skilled in the art can make various modifications. In addition, the description which limited the shape, material, etc. which were disclosed above was illustrated as illustration in order to make understanding of this invention easy, and since it does not limit this invention, it is a part of limitation of these shapes, materials, etc. Or description in the name of a member beyond all limitation is contained in this invention.

For example, as shown in FIG. 4A, FIG. 4B, the linear motor 34A which is the lifting means of the frame accommodating means 3, and serves as a drive device is arrange | positioned in the opening space SP, and the slider of the linear motor 34A is shown. It can also be set as the structure which supports the support member 32 by 34B. As shown by the dashed-dotted line in FIG. 4A, the control means 10 may be arrange | positioned inside opening space SP, and may be arrange | positioned outside opening space SP. In this case, unlike the above-described embodiment, it is not necessary to arrange a driving device such as a linear motion motor under the supporting ring frame RF, so that the number of accommodates of the ring frame RF accommodated in the frame accommodating means 3 is increased. You can.

Moreover, only the ring frame RF may be mounted on the table 62, and the adhesive sheet AS may be attached to the ring frame RF.

Instead of the pressure roller 94, a pressing member made of blade material, rubber, resin, sponge, or the like can be employed, and a configuration in which pressure is applied by air injection can also be adopted.

In addition, instead of the peeling plate 93, the peeling member by a roller etc. can also be employ | adopted.

In addition, although arbitrary components of the sheet | seat sticking apparatus 1 can be arrange | positioned in the opening space SP, it is an ultraviolet irradiation device to the sheet | seat sticking apparatus 1 like Japanese patent application 2001-172847, for example. Is provided, the power supply unit of the ultraviolet irradiation means may be disposed in the opening space SP.

Moreover, the unnecessary member accommodating box 13 described in the said embodiment can also be arrange | positioned in opening space SP.

Moreover, when the sheet attachment device 1 is equipped with the cutting means which cut | disconnects the adhesive sheet which affixed to the to-be-adhered body to a predetermined shape like Japanese Patent Application No. Hei 10-231608, accommodating the unnecessary part of the cut | disconnected adhesive sheet is unnecessary member. It can also be accommodated in the box 13.

In addition, the wafer accommodating means 2 and the frame accommodating means 3 can also be provided in multiple numbers.

In addition, the kind, material, etc. of the to-be-adhered body and adhesive sheet AS in this invention are not specifically limited, For example, adhesive sheet AS is between base material sheet BS and adhesive bond layer AD. It may be one having a middle layer, a three or more layers such as having a cover layer on the upper surface of the base sheet BS, or a so-called double-sided adhesive sheet capable of peeling the base sheet BS from the adhesive layer AD. In addition, as this double-sided adhesive sheet, what has a single layer or an intermediate | middle layer of a multilayer, or a single layer or a multilayer which does not have an intermediate | middle layer may be sufficient. The adherend may be a semiconductor wafer, and the adhesive sheet AS may be a protective sheet, a dicing tape, a die attach film, or the like. At this time, a semiconductor wafer can illustrate a silicon semiconductor wafer, a compound semiconductor wafer, etc., The adhesive sheet AS adhering to such a semiconductor wafer is not limited to these, Arbitrary sheets, films, tapes, etc. Uses, adhesive sheets, and the like can be applied. The adherend may be a substrate of an optical disk, and the adhesive sheet AS may have a resin layer constituting the recording layer. As mentioned above, as a to-be-adhered body, not only another to-be-adhered body, such as a glass plate, a steel plate, a pottery, a wooden board, or a resin board, but a member, articles, etc. of arbitrary forms can be made into object.

In addition, the drive device in the above embodiment employs a rotating motor, a linear motor, a linear motor, a single axis robot, an electric machine such as a multi-joint robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, a rotary cylinder, and the like. In addition, what was combined can also be employ | adopted combining them directly or indirectly (it may overlap with what was illustrated by embodiment).

Claims (3)

Frame accommodating means capable of accommodating a frame member integrated with the adherend via an adhesive sheet;
Support means for supporting at least a frame member of the frame member and the adherend;
Conveying means for conveying said frame member from said frame accommodating means to said support means;
An attachment means for contacting and attaching the adhesive sheet to the frame member or frame member and the adherend supported by the support means,
The frame member has an opening,
A component of the sheet applying apparatus is arranged in an opening space formed by an opening of the frame member when the frame member is accommodated in the frame receiving means. The said component is at least one of the control means which controls the said sheet attachment apparatus, the elevating means which raises and lowers the said frame member, and the waste accommodation means which accommodates the unnecessary substance produced by the said sheet attachment apparatus. The sheet attachment apparatus characterized by the above-mentioned. It is a method of preventing the enlargement of the apparatus provided with the frame accommodating means which can accommodate the frame member integrated with a to-be-adhered body via an adhesive sheet,
A method for preventing the enlargement of the device, characterized by disposing a component of the device in an opening space formed by the opening of the frame member when the frame member is accommodated in the frame receiving means.

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