JP2003297908A - Separating device for adhesive sheet and separating method employing the device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a separating device and a separating method for an adhesive sheet, which efficiently and surely separate an adhesive sheet, to which a reject chip is bonded, from a ring frame without generating any deformation or the like in the ring frame and surely and easily recover the adhesive sheet, to which the reject chip is bonded. <P>SOLUTION: A plurality of ring frames 14, to which the adhesive sheet 15 received in a magazine 13 is bonded, are retained and conveyed in one time by a plurality of receiving pawls 5a, 5b having an arced configuration mated with that of the ring frame 14, then, a separating head 9, having a plurality of separating pins 8 arranged so as to be capable of pushing the vicinity of the ring frames 14 and all of them are provided with the same length while being supported by the receiving pawls 5a, 5b, is lowered whereby the adhesive sheets 15 are simultaneously separated from the plurality of ring frames 14. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pressure-sensitive adhesive sheet peeling apparatus and method used for peeling a pressure-sensitive adhesive sheet from a ring frame in an assembly process in semiconductor device manufacturing.

[0002]

2. Description of the Related Art Assembling steps of a semiconductor device manufacturing process include wafer mounting, dicing, and UV (ultraviolet).
The process includes irradiation, die bonding, tape peeling, wire bonding, molding, etc. In the die bonding process, only non-defective chips of the semiconductor wafer on the adhesive sheet attached to the ring frame are picked up and die bonded. On the other hand, the adhesive sheet to which the defective chip is adhered is peeled off from the ring frame in order to reuse the ring frame. At this time, the defective chips on the adhesive sheet have to be collected and discarded under strict control in order to prevent leakage of information recorded in the chips.

Conventionally, the peeling of the adhesive sheet from the ring frame has been manually performed one by one. Further, recently, various automatic peeling devices for peeling an adhesive sheet by using a machine have been proposed. For example, JP-A-11-274
In Japanese Patent Application Laid-Open No. 186 and Japanese Patent Application Laid-Open No. 2000-31097, ring frames to which an adhesive sheet to which defective chips are adhered are attached are conveyed and held one by one at a peeling position, and a pusher or the like is used. An automatic device has been proposed that pushes down the adhesive sheet from the ring frame by lowering it, and further, it is disclosed in JP-A-11-274186.
The publication also proposes an automatic device for peeling an adhesive sheet from a plurality of ring frames housed in a magazine with a single operation.

FIG. 12 is a perspective view showing a conventional peeling device disclosed in Japanese Patent Laid-Open No. 11-274186. In the figure, reference numeral 21 denotes a magazine that can store a plurality of ring frames one by one, with a space therebetween, and reference numeral 21a denotes a magazine 21.
Grooves for supporting the ring frame provided on the 2
2 is a top plate of the magazine 21, 22a is a hole provided in the top plate 22 in plurality, 23 is a bottom plate of the magazine, and 24 is a bottom plate 23.
The reference numeral 25 designates a saucer placed on the top, the numeral 25 designates a pusher having a plurality of pusher bars 26, and the numeral 27 designates a drive device for moving the pusher 25 up and down. The plurality of holes 22a provided in the top plate 22 of the magazine 21 are considered as a whole in consideration of the position where the pressure-sensitive adhesive sheet is pressed in order to peel off the pressure-sensitive adhesive sheet attached to the ring frame housed in the magazine 21. The pusher 2 is formed so as to draw a circle.
The pusher bar 26 provided on the No. 5 is arranged at a position corresponding to each hole 22a. Also, pusher bar 2
6 has a spherical tip and a pusher bar 26 at the tip position.
It has different lengths so as to be inclined as a whole.

The peeling operation by the conventional device is performed by the magazine 2
The pusher bar 26 is lowered through the hole 22a provided in the top plate 22 of No. 1, and the pusher bar 2 is attached to the adhesive sheet attached to the ring frame housed in the magazine 21.
6 are brought into contact sequentially (in the figure, the pusher bar 26a at the right end is
Contact), and gradually peel off the adhesive sheet attached to the ring frame from one end thereof. Then, the adhesive sheet is peeled off from all the ring frames housed in the magazine 21, and the peeled adhesive sheet is put into the tray 24.
Receive and discard in bulk.

[0006]

As described above, in the manufacturing process of the semiconductor device, several methods have been conventionally proposed as a method for peeling the adhesive sheet to which the defective chip is adhered from the ring frame. However, the manual peeling work is labor-intensive and inefficient, and it is possible that the ring frame is deformed by applying an uneven load to the ring frame, and defective chips are scattered and collected reliably. However, there is a problem in that it is not possible, and even when an automated device is used, there is a problem in that the peeling process for each sheet reduces the labor load but does not improve the work efficiency so much.

In the method disclosed in Japanese Patent Laid-Open No. 11-274186 for peeling the adhesive sheet from a plurality of ring frames housed in the magazine 21 by one operation, the pusher bar 26 has its tip position. Have different lengths so as to be inclined as a whole, as shown in FIG. 13, before the peeling of the adhesive sheet 15 from the upper ring frame 14 stored in the magazine 21 is completed, Since the peeling work by a part of the pusher bar 26 is started with respect to the adhesive sheet 15 of the ring frame 14 inserted in the step of, and further below it,
Since the load applied to each part of one ring frame 14 differs depending on the contact state with the pusher bar 26, there is a problem that the ring frame 14 is deformed or the like.

In addition to the contents described above, as shown in FIG. 14, a ring frame 14 to which an adhesive sheet 15 is attached
Has a very small area (supporting width B) on both ends of the ring frame 14 as compared with the size of the ring frame 14.
Since the ring frame 14 is supported by being mounted on the la 1a and the supporting structure of the ring frame 14 is unstable, there is a problem that it is not possible to perform an efficient and stable peeling operation.

Further, when discarding the peeled adhesive sheet 15, the pusher bar 26 has different lengths so that the tip end position is inclined as a whole, so that the longest pusher bar 26 comes into contact with the tray 24. Sometimes the peeling work by the shortest pusher bar 26 is not completed, and in the present invention, the bottom plate 2 of the magazine 21 is
3, a method is also proposed in which a discharging hole is provided and the peeled adhesive sheet 15 is discharged to the outside of the magazine 21 as it is by pushing the pusher bar 26. However, the adhesive sheet 15 is obliquely inclined by the pusher bar 26. Since the adhesive sheet 15 may be attached to the pusher bar 26 or the like because it is pressed with, it is possible to easily collect the peeled adhesive sheet 15, that is, to collect the defective chip adhered to the adhesive sheet 15. There was a problem of not having.

The present invention has been made in order to solve the above-mentioned problems, and an adhesive sheet to which defective chips are adhered can be efficiently and efficiently removed from the ring frame without causing deformation or the like in the ring frame. An object of the present invention is to provide a peeling device and a peeling method for a pressure-sensitive adhesive sheet, which can be surely peeled off and can reliably and easily collect the pressure-sensitive adhesive sheet to which the peeled defective chip is bonded.

[0011]

SUMMARY OF THE INVENTION An adhesive sheet peeling apparatus according to the present invention is a magazine in which a magazine containing a plurality of ring frames to which the adhesive sheet is attached is housed at intervals from one another. A base having a placing section and a peeling section for performing a peeling operation, a first arm having a plurality of receiving claws provided at a predetermined pitch, and a plurality of other receiving claws provided at a predetermined pitch, A second arm which is paired with the first arm and can support the ring frame by receiving claws provided on each, and a first drive which moves the first arm along a predetermined track on the base. A device, a second drive device for moving the second arm along a predetermined track on the base, an opening provided on the base at the peeling section, and a peeling pin arranged above the opening. A peeling head having, and a peeling head A third drive unit for vertically moving,
A recovery container disposed below the opening, a first drive device,
A control device for controlling the second drive device and the third drive device is provided, and by lowering the peeling head, the peeling pin supports the receiving pawl of the first arm and the receiving pawl of the second arm. The adhesive sheet attached to the ring frame is peeled off.

Further, the number and the arrangement pitch of the receiving claws respectively provided on the first arm and the second arm are configured to coincide with the number and the pitch of the ring frames stored in the magazine. The portion of the receiving claw that supports the ring frame has an arc shape that matches the shape of the ring frame. Further, a cutout portion matching the outer shape of the ring frame is formed in the portion of the receiving claw that supports the ring frame.

Further, the peeling pin is configured such that a plurality of pins having the same length are arranged at predetermined positions, and the plurality of peeling pins are in contact with the adhesive sheet attached to the ring frame at the same time. Further, the plurality of peeling pins are arranged so as to be able to press the vicinity of the portion supported by the receiving claws of the ring frame without interfering with the ring frame.

Further, the method for peeling off an adhesive sheet according to the present invention comprises a step of placing a magazine containing a plurality of ring frames to which the adhesive sheet is attached at a distance from each other on a magazine placing portion. , The first arm and the second arm are moved into the magazine mounted on the magazine mounting portion, and the plurality of receiving claws provided on the first arm and the plurality of receiving pawls provided on the second arm are moved. The step of simultaneously supporting a plurality of ring frames in the magazine with the claws,
Step of moving the first arm and the second arm to the peeling position while the ring frame is supported by the receiving claw, and lowering the peeling head having the peeling pin, and attaching it to the ring frame supported by the receiving claw A step of pressing the pressure-sensitive adhesive sheet being peeled off by a peeling pin and sequentially peeling it from the upper side, and a step of collecting the peeled pressure-sensitive adhesive sheet,
In the process of raising the peeling head to the initial position and in the state where the ring frame from which the adhesive sheet has been peeled is supported by the claws, the first arm and the second arm are placed in the magazine placed on the magazine placing section. The process includes the steps of moving and storing the ring frame from which the adhesive sheet has been peeled off in a magazine, and moving the first arm and the second arm to their respective initial positions.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiment 1. An embodiment of the present invention will be described below with reference to the drawings. 1 is a schematic diagram showing the structure of a pressure-sensitive adhesive sheet peeling device according to a first embodiment of the present invention, and FIGS. 2 to 5 are schematic diagrams for explaining the operation of the peeling device according to the first embodiment.

In the figure, reference numeral 1 denotes a base table having a magazine placing section 2 and a peeling section 3 for performing a peeling work. The peeling section 3 is provided with an opening (not shown) in the base table 1. Reference numerals 4a and 4b denote a first arm and a second arm which form a pair, 5a denotes a plurality of receiving claws provided on the first arm 4a at a predetermined pitch, and 5b provides a second arm 4b at a predetermined pitch. A plurality of receiving claws, 6a is the first arm 4a
Drive device (hereinafter, referred to as a first drive device), and 6b is a drive device for the second arm 4b (hereinafter, referred to as a second drive device). 7 is a peeling mechanism section installed in the peeling section 3.
The peeling head 9 includes a peeling pin 8 and a driving device (hereinafter, referred to as a third driving device) 10 that vertically moves the peeling head 9. Reference numeral 11 denotes a recovery container, which is installed below the opening provided in the base 1 in the peeling section, and in which the peeled adhesive tape is collected, and 12 is a control device for controlling each drive system.

Further, 13 is a magazine which can store the ring frames 14 one by one with a space therebetween, and 15 is an adhesive sheet attached to the ring frame 14, which has an adhesive surface on one surface (the upper surface in the drawing). A plurality of defective chips (not shown) are adhered to the adhesive surface. The receiving claws 5 provided on the first arm 4a and the second arm 4b, respectively.
The numbers a and 5b are provided in the same number as the number of ring frames 14 stored in the magazine 13, and are arranged at the same pitch as the storage pitch of the ring frames 14 in the magazine 13.

Next, the operation of the adhesive sheet peeling apparatus according to the present embodiment will be described. First, in the die bonding process in the semiconductor device manufacturing, the ring frame 14
The ring frame 1 to which the adhesive sheet 15 having the defective chips remains after the non-defective chips on the adhesive sheet 15 attached to the above are picked up and die-bonded
When a magazine 13 containing a plurality of 4 is placed and fixed on the magazine placing portion 2 of the base 1, the first arm 4
a and the second arm 4b move from their respective standby positions to the magazine mounting portion 2 along a predetermined track on the base 1, and the receiving claws 5a and 5b accommodate a plurality of magazines stored in the magazine 13. The ring frame 14 is supported simultaneously (FIG. 2).

At this time, even if the holding position of the ring frame 14 in the magazine 13 is displaced in the horizontal direction due to vibrations or the like when the magazine 13 is conveyed, the ring frame 14 is moved to the magazine by the mechanism described below. 1
3, the receiving claw 5a and the receiving claw 5b are always at a fixed position.
Will be picked up by. FIG. 6 is a cross-sectional view for explaining a position correcting mechanism when the ring frame in the magazine is supported by the receiving claw. In the figure, 16 is a notch formed in the tip of the receiving claws 5 a, 5 b (the part supported by the ring frame 14) in accordance with the outer shape of the ring frame 14, and 17 is a slope at the tip following the notch 16. It is a horizontal support having a portion 18.

As shown in FIG. 6, when the holding position of the ring frame 14 in the magazine 13 is displaced in the horizontal direction, the ring frame 14 moves when the first arm 4a and the second arm 4b move. One receiving claw (in FIG. 6,
The notch 16 wall of the receiving claw 5b of the upper ring frame 14a and the receiving claw 5a of the lower ring frame 14b comes into contact with the wall of the notch 16 first, and the magazine 1 is directly moved as the receiving claw moves.
3 is slid on the ring frame support portion (groove portion) and conveyed to a predetermined position, and is picked up and supported while being fitted in the notch portions 16 provided in the receiving claws 5a and 5b. The sloped portion 18 is provided at the tip of the receiving claws 5a and 5b so that the ring frame 14 can be smoothly supported along the slope when the receiving claws 5a and 5b contact the ring frame 14. This is to lead to.

FIG. 7 is a plan view of the supporting state of the ring frame by the receiving claws as seen from the lower surface side. Receiving claw 5
The planar shape of the tip end portions (portions supported by the ring frame 14) of a and 5b has an arc shape according to the shape of the ring frame 14, and the ring frame 14 is stable in a wide area along the outer peripheral portion thereof. Supported. The width of the receiving claws 5a, 5b is preferably as large as possible so that the ring frame 14 can be stably supported, but is set to a size that allows movement without contacting the inner wall of the magazine 13. In FIG. 7, 13a is a groove for supporting the ring frame 14 provided in the magazine 13, A is a supporting width of the ring frame 14 by the receiving claws 5a and 5b, and B is a width.
Is the ring frame 14 formed by the groove 13a of the magazine 13.
Shows the support width of.

Next, as shown in FIG. 3, a plurality of ring frames 14 supported by the receiving claws 5a and 5b.
The first arm 4a and the second arm 4b are transported to the peeling section 3 by moving along a predetermined track on the base 1. In addition, from the magazine 13 to the ring frame 1
4 is carried out, the ring frame 14 supported by the receiving claw 5a and the receiving claw 5b is slightly lifted along the inclined portions 18 (see FIG. 6) provided on the receiving claw 5a and the receiving claw 5b, respectively. It is possible to prevent undesired contact with the ring frame supporting portion of the magazine 13 and to carry out smoothly. Further, since the ring frame 14 is conveyed while being fitted into the notches 16 provided on the receiving claws 5a and 5b, the position shift of the ring frame 14 with respect to the receiving claws 5a and 5b being conveyed. Can be prevented.

Next, as shown in FIG. 4, when the plurality of ring frames 14 supported by the receiving claws 5a and 5b are conveyed to the peeling section 3, the peeling head 9 having the peeling pins 8 is arranged from above. The adhesive sheet 15 attached to the ring frame 14 descends and is pressed by the peeling pin 8 to be peeled off sequentially from the upper side. FIG. 8 is a side view showing an example of a peeling head having peeling pins, and FIG. 9 is an enlarged sectional view showing a peeling process of an adhesive sheet by the peeling pins.
As for the peeling pins 8 provided on the peeling head 9, a plurality of peeling pins 8 having the same length are arranged at predetermined intervals (four in FIG. 8).
All the peeling pins 8 are configured to contact the adhesive sheet 15 at the same time. The shape of the tip of the peeling pin 8 is not particularly limited, but the shape of the tip of the peeling pin 8, especially the outer peripheral portion on the ring frame side, is preferably such that the adhesive sheet 15 to be peeled is along, for example, a spherical shape.

The position where the peeling pin 8 presses the adhesive sheet 14 attached to the ring frame 14 (the position where the peeling pin 8 is arranged) does not interfere with the ring frame 14 and is close to the ring frame 14. It is necessary for the ring frame 14 to receive the receiving claw 5
The vicinity of the portion supported by a and 5b is desirable. Further, since the peeled pressure-sensitive adhesive sheet 15 is pressed in the horizontal state so that the peeled pressure-sensitive adhesive sheet 15 does not bend and re-attach to the peeling pin or another ring frame, at least the ring frame 14 is pressed by the receiving claws 5a and 5b. It is necessary to press four locations (hatched portions in FIG. 10) near the supported portion. Note that the shape of the peeling pin 8 for pressing the four locations may be a cylindrical shape, a prismatic shape, or a state in which both are mixed (FIG. 11). Alternatively, the above-mentioned four locations may be pressed by one ring-shaped or a plurality of arc-shaped peeling pins.

Next, as shown in FIG. 5, when the adhesive sheet 15 is completely peeled off from all the ring frames 14 supported by the receiving claws 5a and 5b, the peeling pin 8 descends as it is, and the base 1 The adhesive sheet 15 peeled off through the opening provided in is disposed in the collection container 11 together with the defective chip. Since the adhesive force of the uppermost adhesive sheet 15 adhered to the peeling pin 8 cannot support the weight of the peeled adhesive sheets 15, the peeled adhesive sheets 15 naturally peel off. It is peeled from 8 and collected in the collection container 11. After that, the peeling head 9 having the peeling pin 8 rises to a predetermined standby position and enters the standby state.

Next, the ring frame 14 from which the adhesive sheet 15 supported by the receiving claws 5a and 5b is peeled off
Is moved into the magazine 13 by moving the first arm 4a and the second arm 4b from the peeling section 3 to the magazine placing section 2 along a predetermined track on the base 1, and the groove portion of the magazine 13 13a. Finally, the first arm 4a and the second arm 4b move along a predetermined track on the base 1, and are in a standby state at each standby position. Through the above steps, one cycle of the peeling / peeling step of simultaneously peeling the adhesive sheets 15 from the plurality of ring frames 14 housed in the magazine 13 is completed. A series of operations in the peeling process is controlled by the controller.

According to the present embodiment, the adhesive sheets 15 can be peeled off simultaneously from the plurality of ring frames 14 housed in the magazine 13, so that the time required for the peeling work can be shortened. Further, when peeling the adhesive sheet 15 from the ring frame 14, the ring frame 14 is stably supported in a wide area by the receiving claws 5a and 5b having an arc shape matching the shape of the ring frame 14,
Further, since the plurality of peeling pins 8 all have the same length and press the vicinity of the ring frame 14 supported by the receiving claws 5a and 5b, the peeling pins 8 are evenly attached to the adhesive portion of the ring frame 14 and the adhesive sheet 15. The load can be efficiently applied, the deformation of the ring frame 14 can be prevented, and the peeled adhesive sheet 15 can remove the peeling pin 8.
It can be prevented from adhering to etc.

Further, since the adhesion between the peeling pin 8 and the peeled plural adhesive sheets 15 is only the adhesive force of the uppermost adhesive sheet 15, the plural peeled adhesive sheets 15 are adhered.
Can be naturally peeled off from the peeling pin 8 by its own weight, and the adhesive sheet 15 to which the defective chip is adhered can be reliably collected.

[0029]

As described above, according to the present invention, the pressure-sensitive adhesive sheet can be peeled off from the plurality of ring frames at the same time, so that the pressure-sensitive adhesive sheet peeling device with good working efficiency can be obtained. In addition, the adhesive sheet to which the peeled defective chip is adhered can be easily and surely collected.

Further, since the ring frames housed in the magazine are simultaneously peeled off, lot management and the like become easy.

Further, since the portion of the receiving claw that supports the ring frame that supports the ring frame has an arc shape that matches the shape of the ring frame, the ring frame can be stably supported.

Further, since the ring frame is fitted into the notch provided in the receiving claw according to the outer shape of the ring frame, the ring frame can be easily positioned with respect to the receiving claw and at the time of transportation. It is possible to prevent misalignment.

Further, since the plurality of peeling pins for pressing and peeling the pressure-sensitive adhesive sheet from the ring frame all have the same length, the pressure-sensitive adhesive sheet attached to the ring frame can be peeled by applying a uniform load, It is possible to prevent deformation of the ring frame.

Further, since the plurality of peeling pins press the vicinity supported by the receiving claws of the ring frame,
Efficiently apply a peeling load to ensure reliable peeling, and prevent the peeled adhesive sheet from sticking to peeling pins, etc., and easily collect the peeled adhesive sheet to which defective chips are attached. You can

In addition, a plurality of ring frames to which the adhesive sheets stored in the magazine are attached may be supported and conveyed at one time, and the adhesive sheets may be peeled from the plurality of ring frames by one vertical movement of the peeling head. As well as
The peeled pressure-sensitive adhesive sheet can be reliably collected, and the plurality of ring frames from which the pressure-sensitive adhesive sheet has been peeled are stored again in the magazine, so that a manufacturing method with good workability can be provided.

[Brief description of drawings]

FIG. 1 is a schematic view showing a configuration of a pressure-sensitive adhesive sheet peeling device according to a first embodiment of the present invention.

FIG. 2 is a schematic diagram for explaining the operation of the peeling device according to the first embodiment of the present invention.

FIG. 3 is a schematic diagram for explaining the operation of the peeling device according to the first embodiment of the present invention.

FIG. 4 is a schematic diagram for explaining the operation of the peeling device according to the first embodiment of the present invention.

FIG. 5 is a schematic diagram for explaining the operation of the peeling device according to the first embodiment of the present invention.

FIG. 6 is a cross-sectional view showing a state where the ring frame is supported by the receiving claws of the peeling device according to the first embodiment of the present invention.

FIG. 7 is a plan view showing a supporting state of the ring frame by the receiving claws of the peeling device according to the first embodiment of the present invention.

FIG. 8 is a perspective view showing an example of a peeling head having peeling pins of the peeling device according to Embodiment 1 of the present invention.

FIG. 9 is an enlarged cross-sectional view showing a peeling process of the adhesive sheet by the peeling pin of the peeling device according to the first embodiment of the present invention.

FIG. 10 is a plan view showing an example of the pressing position of the adhesive sheet attached to the ring frame by the peeling pin of the peeling device according to the first embodiment of the present invention.

FIG. 11 is a plan view showing an example of a pressing position and a pin shape of the adhesive sheet attached to the ring frame by the peeling pin of the peeling device according to the first embodiment of the present invention.

FIG. 12 is an enlarged cross-sectional view showing a peeling process of a pressure-sensitive adhesive sheet by peeling pins of a conventional peeling device of this type.

FIG. 13 is a cross-sectional view illustrating a problem of a conventional peeling device.

FIG. 14 is a plan view for explaining a problem of the conventional peeling device.

[Explanation of symbols]

1 foundation table, 2 magazine mounting section, 3 peeling section, 4a
First arm, 4b Second arm, 5a, 5b Receiving claw, 6a First driving device, 6b Second driving device, 7 Peeling mechanism part, 8 Peeling pin, 9 Peeling head, 10 Third driving device, 11 Recovery Container, 12 controller, 13 magazine, 13a groove, 14 ring frame, 15
Adhesive sheet, 16 Notch part, 17 Support part, 18
Slope section.

Claims (7)

[Claims] 1. A foundation having a magazine placing section for placing a magazine that houses a plurality of ring frames to which an adhesive sheet is attached, one ring frame at a time, and a peeling section for performing a peeling operation. A base, a first arm provided with a plurality of receiving claws at a predetermined pitch, and a plurality of other receiving claws provided at a predetermined pitch, which are provided in pairs respectively with the first arm. A second arm capable of supporting the ring frame by the receiving claw, a first drive device for moving the first arm along a predetermined track on the base, and the second arm A second drive device that moves along a predetermined track on the base, an opening provided in the base in the peeling section, and a peeling head having a peeling pin arranged above the opening, Move the peeling head up and down A third drive device for allowing the recovery container to be disposed below the opening, a control device for controlling the first drive device, the second drive device, and the third drive device, By lowering the head, the peeling pin is configured to peel off the adhesive sheet attached to the ring frame supported by the receiving claw of the first arm and the receiving claw of the second arm. A peeling device for an adhesive sheet, which is characterized in that 2. The number and arrangement pitch of the receiving claws provided on each of the first arm and the second arm are configured so as to match the number and storage pitch of the ring frames stored in the magazine. The peeling device for an adhesive sheet according to claim 1, wherein 3. The peeling device for a pressure-sensitive adhesive sheet according to claim 1, wherein a portion of the receiving claw that supports the ring frame has an arc shape matching the shape of the ring frame. 4. The peeling of the pressure-sensitive adhesive sheet according to claim 3, wherein a cutout portion matching the outer shape of the ring frame is formed in a portion of the receiving claw that supports the ring frame. apparatus. 5. The peeling pin is configured such that a plurality of pins having the same length are arranged at predetermined positions, and the plurality of peeling pins are simultaneously in contact with an adhesive sheet attached to the ring frame. The peeling device for a pressure-sensitive adhesive sheet according to claim 1, wherein 6. The peeling pins are arranged so as to be able to press the vicinity of a portion of the ring frame supported by the receiving claws without interfering with the ring frame. The peeling device for an adhesive sheet according to claim 5. 7. A step of placing a magazine, in which a plurality of ring frames to which an adhesive sheet is adhered, are housed one by one with a space between each other, on a magazine placing section, and a first arm and a second arm. In the magazine mounted on the magazine mounting section, and by the plurality of receiving claws provided on the first arm and the second arm, the inside of the magazine A step of simultaneously supporting the plurality of ring frames, a step of moving the first arm and the second arm to a peeling position while the ring frames are supported by the receiving claws, and a peeling pin. A process of lowering the peeling head and pressing the pressure-sensitive adhesive sheet attached to the ring frame supported by the receiving claws with the peeling pin to sequentially peel from the upper side. The step of collecting the peeled pressure-sensitive adhesive sheet, the step of raising the peeling head to the initial position, the ring frame from which the pressure-sensitive adhesive sheet has been peeled is supported by the receiving claws, and the first A step of moving the arm and the second arm into a magazine placed on the magazine placing portion, and storing the ring frame from which the adhesive sheet has been peeled in the magazine; the first arm and the first arm; A method for peeling an adhesive sheet, comprising the step of moving the second arm to each initial position.