TWM451642U - Electric-conductive adhesive tape set for automatic processing system - Google Patents

Abstract

An electric-conductive adhesive tape set for use in an automatic processing system is provided. The electric-conductive adhesive tape set comprises a rotation disk set, a second annular element, and an electric-conductive adhesive tape. The rotation disk set has two baffles and a first annular element wherein the baffles are connected to the two sides of the first annular element respectively. Each of the baffles is engaged with the automatic processing system through a first hole, and the second annular element is engaged with the first annular element through a second hole. The electric-conductive adhesive tape comprises an electric-conductive layer, and the automatic processing system is adapted to rotate the electric-conductive adhesive tape to cut the electric-conductive adhesive layer so that a portion of the electric-conductive layer could be attached on a TFT substrate and a CF substrate of a LCD panel.

Description

Conductive tape set for an automated processing system

The invention relates to a conductive tape set for an automated processing system, in particular to a liquid crystal panel (LCD) automated processing system, wherein the automated processing system can adhere the conductive tape of the conductive tape group to the thin film transistor of the liquid crystal panel. (Thin film transistor, TFT) substrate and color filter (CF) substrate for the purpose of eliminating static electricity between the thin film transistor substrate and the color filter substrate. The application of the automated processing system and the conductive tape is based on the adhesion between the thin film transistor substrate and the color filter substrate for eliminating static electricity, and the liquid crystal panel is suitable for the application of IPS wide viewing angle technology (In Panel Switching) The liquid crystal panel produced, however, can be applied in any of the thin-plate bonding techniques that require tape as an adhesive or conductive application.

LCD panels are currently widely used display devices. To meet economic benefits and increase production speed, the improvement of process automation level is an important key factor. In particular, liquid crystal panels made by using IPS In View Switching technology still need to be manually completed during the manufacturing process, and the most time-consuming part is the thin film transistor substrate of the liquid crystal panel and color filter. The conductive tape between the substrate is pasted.

Specifically, the structure of the liquid crystal panel is mainly formed by sequentially combining a color filter substrate, a color filter, a liquid crystal material, a thin film transistor, and a thin film transistor substrate, wherein a thin film transistor for avoiding the liquid crystal panel is used. The substrate and the color filter substrate generate static electricity and affect the imaging quality of the liquid crystal panel. Usually, the conductive tape is simultaneously Adhered to the edge of the thin film transistor substrate and the color filter substrate to conduct static electricity. However, the conventional method is to manually attach the conductive film between the thin film transistor substrate and the color filter.

Please refer to FIG. 1 further. Conventionally, the conductive tape 1 is usually attached to the paper 2 at an interval of independent strips. After the thin film transistor substrate and the color filter substrate are bonded, the conventional conductive is manually performed. The tape 1 is peeled off from the paper 2 and further adhered to the thin film transistor substrate and the color filter substrate. The above-mentioned manual processing method not only takes time and labor, but also often causes the adhesive layer of the conductive tape 1 to be accidentally touched by the hand, so that the adhesiveness or conductivity of the conductive tape 1 is greatly reduced, and further, the method of manual adhesion cannot be accurately performed. The conductive tape 1 is located on the edge of the thin film transistor substrate and the color filter substrate. These problems lead to the assembly of the thin film transistor substrate and the color filter substrate, which cannot pass the electrostatic test, and the yield cannot be improved. .

In view of this, it is an urgent need for the industry to provide a conductive tape that can be used in an automated processing system, thereby accurately adhering to the edges of the thin film transistor substrate and the color filter substrate, and eliminating the lack of manual sticking. aims.

In order to solve the foregoing problems, the purpose of the present invention is to provide a conductive tape set that can be applied to an automated processing system, particularly in an automated processing system for a liquid crystal panel, thereby simplifying the manufacturing process, thereby improving production efficiency and product yield.

In order to achieve the above object, the automatic processing system of the present invention is used for processing a thin film transistor substrate and a color filter substrate of a liquid crystal panel. The conductive tape group of the present invention comprises a turntable group, a second ring member and a Conductive tape. The turntable set has a second gear a first annular member, the baffles are respectively connected to the two side surfaces of the first annular member, and the baffles are respectively engaged with the automated processing system by a first hole, the second The ring member is engaged with the first ring member by a second hole. The conductive tape has a first protective layer and a conductive layer attached to the first protective layer. Wherein the automated processing system is adapted to rotate the conductive tape and cut the conductive layer such that a portion of the conductive layer becomes a conductive sheet, the conductive sheet is adhered to the thin film transistor substrate with a first portion, and the conductive sheet is simultaneously A second portion is adhered to the color filter substrate.

The above objects, technical features, and advantages will be more apparent from the following description.

The conductive tape set 3 of the first embodiment of the present invention can be applied to an automated processing system 4, and the automated processing system 4 can be used to process a thin film transistor substrate 51 and a color filter substrate 52 of a liquid crystal panel 5. Please refer to FIG. 2A and FIG. 3A. FIG. 2A is a schematic view of the conductive tape set 3, and FIG. 3A is a schematic view of the automated processing system 4. The conductive tape set 3 includes a turntable set 31, a second ring member 32 and a conductive tape 33. As shown in FIG. 2B, it is a schematic view of the turntable set 31. The turntable set 31 has two baffles 311 and a first ring piece. 312, the baffles 311 are respectively in contact with the two side surfaces 312a of the first ring member 312. As shown in FIG. 2C, the second ring member 32 and the conductive tape 33 are assembled. The conductive tape 33 is directly wrapped around one of the circumferences of the second ring member 32. Please refer to FIG. 2D for a cross-sectional view of the conductive tape 33. The conductive tape 33 has a first protective layer 331 and a conductive layer 332 attached to the first protective layer 331. In this embodiment, the conductive tape 33 may include a first An adhesive layer 334 is interposed between the conductive layer 332 and the first protective layer 331. The conductive layer 332 can be adhered to the first protective layer 331 by the first adhesive layer 334.

As described above, after the second ring member 32 is engaged with the first ring member 312 by a second hole 321 in the actual assembly process, the baffle 311 is further adapted to be the second ring member 312. The side surfaces 312a are joined to each other such that the second ring member 32 is fixed between the baffles 311, and the baffles 311 are respectively engaged with the automated processing system 4 by a first hole 313. Thereby, the automated processing system 4 is adapted to rotate the conductive tape 33 and cut the conductive layer 332. As shown in FIG. 3F, a portion of the conductive layer 332 is adapted to be a conductive sheet 333, and the conductive sheet 333 is adhered to the film by a first portion 333a. On the transistor substrate 51, the second portion 333b of the conductive sheet 333 is adhered to the color filter substrate. In this embodiment, the thin film transistor substrate 51 and the color filter substrate 52 are suitably placed in a Processing platform.

The processing of the conductive tape set 3 by the automated processing system 4 is further described. Referring to FIG. 3A, the automated processing system 4 includes a first rotating structure 41, a guiding module 42, a cutting module 43, and a suction cup. The module 44 and a second rotating structure 45. Each of the baffles 311 is engaged with the first rotating structure 41 by the first hole 313, so that the first rotating structure 41 rotates the conductive tape set 3. Next, the guiding module 42 has a plurality of rollers 421 and a conductive tape anti-rewind valve 422. The rollers 421 are connected to the conductive tape 33 to guide the conductive tape 33, and the conductive tape anti-winding valve 422 can guide the conductive tape 33. In the same direction of advancement.

Please refer to FIG. 3B and FIG. 3C for a schematic diagram of the guiding module 42 cutting the conductive layer 332. As shown in FIG. 3B, the guiding module 42 first guides the conductive tape 33 to the cutting module 43 and, as in the 3C. As shown, the cutting module 43 is adapted to cut a portion of the conductive layer 332. A part of the conductive layer 332 is made into a conductive sheet 333. Please refer to FIG. 3D and FIG. 3E and FIG. 3F for the suction cup module 44 to adsorb the conductive sheet 333 and move to the thin film transistor substrate 51 and the color filter substrate 52. As shown in FIG. 3D, the suction cup is shown. The module 44 has a suction cup 441 for adsorbing the conductive sheet 333, and moves the conductive sheet 333 above the thin film transistor substrate 51 and the color filter substrate 52 (as shown in FIG. 3E), so that the conductive sheet 333 is attached. At the junction of the thin film transistor substrate 51 and the color filter substrate 52 (as shown in FIG. 3F).

Furthermore, please refer to FIG. 3G and FIG. 3H, which are respectively a bottom view and a side view of the structure of the suction cup 441. The suction cup 441 is a two-piece type, and has a first adsorption member 441a and a second adsorption member 441b. The first adsorption member 441a is adapted to adsorb the first portion 333a of the conductive sheet 333 and move onto the thin film transistor substrate 51. The second adsorption member 441b is adapted to adsorb the second portion 333b of the conductive sheet 333 and move to the color filter substrate. When the first adsorption member 441a and the second adsorption member 441b are lowered, a height difference is generated between the thin film transistor substrate 51 and the color filter substrate 52. As shown in FIG. 3F, the conductive tape 33 can be made closer. The film is attached between the thin film transistor substrate 51 and the color filter substrate 52. The suction cup module 44 has a heater 442 adapted to heat the conductive sheet 333 before attaching the substrates, so as to have a better bonding effect when subsequently attached to the substrates. After the conductive sheet 333 is simultaneously adhered to the thin film transistor substrate 51 and the color filter substrate 52, the conductive circuit of the liquid crystal panel 5 is further connected to the conductive sheet 333, whereby the static electricity of the substrates is permeable and conductive. Sheet 333 is conducted to the conductive circuit and is led out.

After the suction pad 441 adsorbs the conductive sheet 333, the guiding module 42 guides the first protective layer 331 to the second rotating structure 45, and the second rotating structure 45 is adapted to be rotated to make the first protection. The layer 331 is wound around the second rotating structure 45 to recover the first protective layer 331.

The conductive tape set 6 of the second embodiment of the present invention can be applied to an automated processing system 7, and the automated processing system 7 can also be used to process a thin film transistor substrate 51 and a color filter substrate 52 of the liquid crystal panel 5. The conductive tape set 6 of the second embodiment is the same as the conductive tape set 3 of the first embodiment, and also includes a turntable set 61, a second ring member 62 and a conductive tape 63, and the manner in which the components are connected The conductive tape set 3 of an embodiment is the same and will not be described herein. The conductive tape group 6 is different from the conductive tape group 3 in that the conductive tape 63 includes a first adhesive layer 634 interposed between the conductive layer 632 and the first protective layer 631, and further includes a second protective layer 635 and a first layer. The second adhesive layer 636, please refer to FIG. 4 for a schematic cross-sectional view of the conductive tape. The second adhesive layer 636 is interposed between the conductive layer 632 and the second protective layer 635, and the conductive layer 632 is adhered to the second adhesive layer 636. Two protective layers 635.

5 is a schematic diagram of the automated processing system 7, and the automated processing system 7 is the same as the automated processing system 4, and includes a first rotating structure 71, a guiding module 72, a cutting module 73, and a suction mold. The group 74 and the second rotating structure 75, and the guiding module 72 also guides the conductive layer 632 of the conductive tape 63, and the cutting module 73 cuts the conductive layer 632 into the conductive sheet 633, and then the two suction cup modules 74 The suction cup is adhered to the thin film transistor substrate 51 and the color filter substrate 52 for adhesion, and will not be described herein.

The automated machining system 7 differs from the automated machining system 4 in that the automated machining system 7 further includes a third rotating structure 76. After the suction cup of the suction cup module 74 adsorbs the conductive sheet, the guiding module 72 guides the second protective layer 635 to the second rotating structure 75, and the second rotating structure 75 is adapted to rotate to wrap the second protective layer 635 around the second rotation. Knot Structure 75. Before the guiding module 72 guides the conductive layer 632 to the cutting module 73, the guiding module 72 first guides the first protective layer 731 to the third rotating structure 76, and the third rotating structure 76 is adapted to be rotated to make the first The protective layer 631 is wound around the third rotating structure 76.

As described above, the conductive sheet 633 is adhered to the thin film transistor substrate 51 and the color filter substrate 52 through the first adhesive layer 634, and the conductive sheet 633 is electrically and electrically conductive by the second adhesive layer 636. The circuit or other component is bonded to derive the static electricity of the substrates. It should be noted that, in other embodiments of the present invention, when the guiding module 72 guides the second protective layer 635, the second adhesive layer 636 can also be peeled off at the same time. At this time, the conductive sheet 633 only needs to be adhered by the first adhesive. Layer 634 is bonded to the substrates.

In summary, the present invention discloses a conductive tape set for an automated processing system that allows the conductive tape to retain its adhesiveness and automatically adhere to the thin film transistor substrate and the color filter substrate assembly in a more precise alignment manner. In this way, the time required for manual attachment can be greatly reduced, and at the same time, the yield of the product can be greatly improved.

However, the illustrations disclosed above are merely preferred embodiments of the present invention, and those skilled in the art will make modifications or equivalent changes according to the spirit of the present invention; for example, the ring members and baffles of the conductive tape set. Other configurations, such as the configuration of a conventional analog tape, to be the material tape of the automated processing system, should still be included in the literal or equivalent scope of the patent application scope of the present application.

1‧‧‧Conductive tape

2‧‧‧ Taiwan paper

3‧‧‧ Conductive tape set

31‧‧‧ Turntable set

311‧‧ ‧ baffle

312‧‧‧ first ring

312a‧‧‧ side surface

313‧‧‧ first hole

32‧‧‧Second ring

321‧‧‧Second hole

33‧‧‧Conductive tape

331‧‧‧First protective layer

332‧‧‧ Conductive layer

333‧‧‧Electrical sheet

333a‧‧‧Part 1

333b‧‧‧Part II

334‧‧‧First adhesive layer

4‧‧‧Automatic processing system

41‧‧‧First rotating structure

42‧‧‧Guide Module

421‧‧‧Roller

422‧‧‧Conductive tape anti-rewind valve

43‧‧‧Cutting module

44‧‧‧Sucker module

441‧‧‧Sucker

441a‧‧‧First adsorption unit

441b‧‧‧First adsorption unit

442‧‧‧heater

45‧‧‧Second rotating structure

5‧‧‧LCD screen

51‧‧‧Thin film transistor substrate

52‧‧‧Color filter substrate

6‧‧‧Conductive tape set

61‧‧‧ rotating group

62‧‧‧Second ring

63‧‧‧Conductive tape

631‧‧‧First protective layer

632‧‧‧ Conductive layer

633‧‧‧Conductor

634‧‧‧First adhesive layer

635‧‧‧Second protective layer

636‧‧‧Second Adhesive Layer

7‧‧‧Automated processing system

71‧‧‧First rotating structure

72‧‧‧Guide Module

73‧‧‧Cutting module

731‧‧‧First protective layer

74‧‧‧Sucker module

75‧‧‧Second rotating structure

76‧‧‧ Third rotating structure

1 is a schematic view of a conventional conductive tape; FIG. 2A is a schematic view showing a conductive tape set of the first embodiment of the present invention; 2B is a schematic view of the turntable set of the conductive tape set of the first embodiment of the present invention; FIG. 2C is a schematic view showing the assembly of the second ring member and the conductive tape of the conductive tape set of the first embodiment; A cross-sectional view of a conductive tape of a conductive tape set according to an embodiment; FIG. 3A is a schematic view of an automated processing system applied to the conductive tape set of the first embodiment; FIG. 3B and FIG. 3C are conductive tapes of the first embodiment of the present invention. The schematic diagram of the process of cutting the conductive layer of the conductive tape set by the guiding module of the automated processing system applied by the group; 3D, 3E and 3F are the automated processing systems applied to the conductive tape set of the first embodiment of the present invention. The schematic diagram of the process of adsorbing the conductive layer of the conductive tape group by the suction cup module; FIG. 3G is a bottom view of the suction cup module of the automated processing system applied by the conductive tape set of the first embodiment; FIG. 3H is the first creation The side view of the suction cup module of the automated processing system applied to the conductive tape set of the embodiment; FIG. 4 is the conductive tape of the conductive tape set of the second embodiment of the present invention. Schematic plane; and a schematic view of a fifth applied automated graph creation of a second embodiment according to the present embodiment the conductive tape set of processing systems.

3‧‧‧ Conductive tape set

31‧‧‧ Turntable set

311‧‧ ‧ baffle

312‧‧‧ first ring

312a‧‧‧ side surface

313‧‧‧ first hole

32‧‧‧Second ring

33‧‧‧Conductive tape

Claims (13)

A conductive tape set for an automated processing system for processing a thin film transistor substrate (TFT) and a color filter (CF) of a liquid crystal panel The conductive tape set comprises: a turntable set having two baffles and a first ring member respectively connected to the two side surfaces of the first ring member, wherein the baffles are respectively a first hole is engaged with the automated processing system; a second ring member is engaged with the first ring member by a second hole; and a conductive tape is directly wound around a periphery of the second ring member. The method includes: a first protective layer; and a conductive layer attached to the first protective layer; wherein the automated processing system is adapted to rotate the conductive tape and cut the conductive layer to make a portion of the conductive layer become a The conductive sheet is adhered to the thin film transistor substrate with a first portion, and at the same time, a second portion of the conductive sheet is adhered to the color filter substrate. The conductive tape set of claim 1, wherein the conductive tape comprises a first adhesive layer between the conductive layer and the first protective layer, and the conductive layer is adhered to the first adhesive layer by the first adhesive layer A protective layer. The conductive tape set of claim 2, wherein the automated processing system comprises a first rotating structure, each of the baffles being respectively engaged with the first rotating structure by the first hole, so that the first rotating structure Rotate the conductive tape set. The conductive tape set of claim 3, wherein the automated processing system comprises a guiding module having a plurality of rollers attached to the conductive tape to guide the conductive tape. The conductive tape set of claim 4, wherein the guiding module has a conductive tape anti-rewind valve to guide the conductive tape in the same forward direction. The conductive tape set of claim 5, wherein the automated processing system comprises a cutting module, the guiding module is adapted to guide the conductive tape to the cutting module, the cutting module is adapted to cut a portion The conductive layer is such that a portion of the conductive layer becomes the conductive sheet. The conductive tape set according to claim 6, wherein the automated processing system comprises a suction cup module having a suction cup adapted to adsorb the conductive sheet, and moving the conductive sheet to the thin film transistor substrate and the color filter substrate Above. The conductive tape set according to claim 7, wherein the suction cup module has a heater to heat the conductive sheet. The conductive tape set according to claim 8, wherein the suction cup has a first adsorption member and a second adsorption member, wherein the first adsorption member is adapted to adsorb the first portion of the conductive sheet and move to the thin film transistor substrate. The second adsorption component is adapted to adsorb the conductive sheet and move the second portion onto the color filter substrate, so that the conductive sheet is adhered to the thin film transistor substrate with the first portion, and at the same time The second portion of the conductive sheet is adhered to the color filter substrate. The conductive tape set of claim 9, wherein the guiding module guides the first protective layer to a second rotating structure after the suction cup adsorbs the conductive sheet, the second The rotating structure is adapted to rotate to wrap the first protective layer around the second rotating structure. The conductive tape set of claim 10, wherein the conductive tape further comprises a second protective layer and a second adhesive layer, the second adhesive layer being interposed between the conductive layer and the second protective layer, the conductive The layer is adhered to the second protective layer by the second adhesive layer. The conductive tape set of claim 11, wherein the guiding module guides the second protective layer to the second rotating structure after the suction cup adsorbs the conductive piece, and the second rotating structure is adapted to be rotated to make the first The second protective layer is wound around the second rotating structure. The conductive tape set of claim 12, wherein the automated processing system has a third rotating structure, and the guiding module guides the first protective layer before the guiding module guides the conductive layer to the cutting module To the third rotating structure, the third rotating structure is adapted to rotate to wrap the first protective layer around the third rotating structure.