JPH0774208A - Mounting method of electronic component and feeder apparatus of anisotropic conductive film - Google Patents

Abstract

PURPOSE:To ensure the quality of a liquid-crystal display, to eliminate the defect of a TCP(tape carrier package) and to simply control the inventory of TCP components in diversified small-quantity production when an electronic component and a circuit board are bonded electrically and mechanically by using an anisotropic conductive film. CONSTITUTION:Immediately before a TCP is mounted and loaded on a liquid- crystal display, an anisotropic conductive film is pasted on the TCP. In conventional cases, a process in which the anisotropic conductive film is pasted on the liquid-crystal display or the TCP is performed before a process in which the TCP is positioned with, and mounted on, the liquid-crystal display. However, the processes are included in the processes 2a, 2b in which the TCP is mounted, and a process 1a in which the anisotropic conductive film is pasted after the TCP has been picked up by a mounting head is performed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting method for connecting an electronic component and a circuit board using an anisotropic conductive film, and an anisotropic conductive film supply device.

[0002]

2. Description of the Related Art Anisotropic conductive film (Anisotropic Con)
The joining of an electronic component and a circuit board using an inductive film (hereinafter, referred to as ACD) is already known from literatures and the like.
It is also a technology used in production. Particularly, in liquid crystal displays in which solder bonding or the like cannot be used, it is often used for bonding a driver IC and a glass panel. Conventionally, the driver IC and the glass panel in these liquid crystal displays have been joined by hand or by semi-automatic production using a simple device. 20 years per annum in recent years
In response to the rapid increase in demand for liquid crystal displays exceeding 100%, electronic component mounting machines using fully automatic anisotropic conductive films have been developed.

A conventional method for mounting electronic components using an anisotropic conductive film will be described below with reference to the drawings.

FIG. 3 and FIG. 4 show the process flow of each of the first and second methods according to the conventional electronic component mounting method using an anisotropic conductive film. Each process is roughly divided into liquid crystal display or tape-shaped electronic parts (Tape
Carrier Package: One form of a package in which ICs are mounted on a film-like tape carrier of a continuous camera: hereinafter simply referred to as TCP) Step 1 of attaching an anisotropic conductive film (base film peeling), and TCP Is accurately positioned on the liquid crystal display and temporarily bonded, and the TCP bonded on the liquid crystal display is completely bonded by pressure and heat.
And, in each method, equipments a, b, c and d,
e, f.

[0005]

According to the first method shown in FIG. 3, since the anisotropic conductive film is attached to the liquid crystal display, the TCP is positioned and completely joined, the anisotropic method applied to the liquid crystal display is used. There is a problem that static electricity is generated when the base film (also referred to as a separator film) of the anisotropic conductive film is peeled from the conductive conductive film, and the liquid crystal display on which the thin film transistor is formed is destroyed.

In the second method shown in FIG. 4, after the anisotropic conductive film is attached to the TCP, the TCP is positioned and completely joined. I had to keep it refrigerated.
Especially when producing a wide variety of products in small quantities, each individual T
If the CP inventory period becomes longer and the life of the anisotropic conductive film is exceeded, we have no choice but to discard defective products including TCP, which is troublesome to handle and there is a risk of producing a large number of defective products. There was a problem.

In view of the above problems, the present invention is an electronic device which ensures the quality of a target liquid crystal display, and does not cause a defect in TCP, and facilitates inventory management of TCP parts during high-mix low-volume production. A component mounting method and an anisotropic conductive film supply device are provided.

[0008]

In order to solve the above problems, an electronic component mounting method and an anisotropic conductive film supply apparatus according to the present invention use an anisotropic conductive film to form an electronic component and a circuit board. When performing electrical and mechanical joining, the electronic component is held by suction by the electronic component mounting head of the mounting machine, and then anisotropic conductive that is cut into a predetermined length with respect to the electronic component in this state. This can be realized by a method of attaching a film and then mounting the electronic component at a predetermined position on the circuit board.

[0009]

According to the present invention, no static electricity is applied to the liquid crystal display when the base film of the anisotropic conductive film is peeled off, and therefore the liquid crystal display can be prevented from being broken. In addition, since TCP and the anisotropic conductive film are supplied separately, they may be stored independently, and even if the life of the anisotropic conductive film is exceeded, only the anisotropic conductive film is stored. Just throw it away,
The risk of creating large numbers of defects is extremely small.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS.

FIG. 1 is a process flow chart showing a method of mounting an electronic component using an anisotropic conductive film which is an embodiment of the present invention. In the electronic component mounting method shown in FIG. 1, TCP is used.
The anisotropic conductive film is attached to the TCP immediately before mounting on the liquid crystal display. Conventionally,
Before the step of positioning and mounting the TCP on the liquid crystal display, the step of attaching the anisotropic conductive film to the liquid crystal display or TCP was taken into the steps 2a and 2b for mounting the TCP, and the TCP mounting head ( A step 1a is provided in which the anisotropic conductive film is attached after being picked up (not shown). The process 2a, the process 1a, and the process 2b are performed by the facility g, and the process 3 is performed by the facility h.

FIG. 2 is a perspective view of a principal part of the anisotropic conductive film supply device necessary for attaching the anisotropic conductive film corresponding to step 2a in the process flow shown in FIG. In the figure,
(A) is an enlarged view of the film 14, and (B) is an enlarged view of the adsorption / heating head portion.

As shown in FIG. 2, the anisotropic conductive film 12 provided on the main body 10 has a supply reel mounting portion 11 on which a film 14 having a two-layer structure of an anisotropic conductive film 12 and a base film 13 is formed. Attach the supply reel 15 and film from there
The reference numeral 14 designates a tension roller 16 which functions to maintain an appropriate film tension, a front film lock portion 17 which regulates the movement of the film 14, and a base film 13 side of the film 14 which is adsorbed and held, and at the same time, an anisotropic conductive film 12 is formed. Adsorption / heating head part 18 for applying heat necessary for attachment to the anisotropic conductive film 12, film pull-out part 19 capable of pulling out film 14 by an arbitrary length, after pulling out film 14, and base The rear film lock part 20 for preventing the film 14 from loosening when the film 13 is peeled off, and the tension roller 21 for preventing the winding force of the base film 13 serving as a scrap tape from being directly applied to the anisotropic conductive film 12. Then, the film 14 is applied so as to be wound around the base film recovery reel 22.

In such a feeding device having the film 14 applied thereto, first, the film withdrawing portion 19 is fed by an arbitrary distance while the front film lock portion 17 is released, so that the film 14 is fed by the same amount. Will be done. When the film 14 has been fed, the front film lock 17
Closes. In addition, the cutter 23 of the cutting unit operates to cut the anisotropic conductive film 12 into a predetermined length before shifting to the next feeding.

In the present embodiment, the anisotropic conductive film 12 is cut by a method called burn-off so that only the anisotropic conductive film 12 portion on the base film 13 has a predetermined width (the width of the burn-off tool). The method of burning out is used. Alternatively, the anisotropic conductive film 12 may be cut with a knife-shaped one.

A mounting head (not shown) of a mounting machine is mounted on a TCP (not shown) above the anisotropic conductive film 12 cut to a predetermined length and sent to the adsorption / heating head section 18. It is positioned in a state where it is sucked and held. After this,
The suction / heating head section 18 of the mounting machine descends, and the TCP is attached to the stage 24 disposed beside the suction / heating head section 18 of the anisotropic conductive film supply device and the suction / heating head section of the mounting machine.
It will be sandwiched between 18.

At this time, at the same time, the position where the anisotropic conductive film 12 should be attached is just above the adsorption / heating head portion 18, and the attachment of the anisotropic conductive film 12 is completed. When the attachment is completed, the adsorption / heating head portion 18 swings around the fulcrum 25 as it is, and the continuously connected base film 13 is attached to the TCP. It will be peeled off from the part of the film 12.

At this time, the rear film lock portion 20 functions to surely peel off the base film 13. 26 is an actuator for pulling out the anisotropic conductive film 12,
27 is an actuator for swinging the head, and 28 is a suction hole of the film 14.

[0019]

As described above, according to the present invention, since the anisotropic conductive film is not attached to the liquid crystal display, the influence of static electricity at the time of peeling the base film of the anisotropic conductive film does not affect the liquid crystal display. Does not reach.
Therefore, destruction of the liquid crystal display can be prevented. Further, since the TCP and the anisotropic conductive film are supplied separately, they may be stored independently of each other, and the effect of easy management can be exhibited.

[Brief description of drawings]

FIG. 1 is a process flow chart showing an electronic component mounting method according to an embodiment of the present invention.

FIG. 2 is a perspective view of a main part of an anisotropic conductive film supply device according to an embodiment of the present invention.

FIG. 3 is a process flow chart showing a first method of a conventional electronic component mounting method.

FIG. 4 is a process flow chart showing a second method of the conventional electronic component mounting method.

[Explanation of symbols]

10 ... Main body, 11 ... Supply reel mounting portion, 12 ... Anisotropic conductive film, 13 ... Base film, 14 ... Film,
15 ... Supply reel, 16, 21 ... Tension roller, 17 ... Front film lock part, 18 ... Adsorption / heating head part, 19
… Film drawer, 20… Rear film lock,
22 ... Base film recovery reel, 23 ... Cutter, 24
… Stage, 25… Support point, 26, 27… Actuator,
28 ... Suction hole.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Shozo Minatani 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (2)

[Claims] 1. When electrically and mechanically joining an electronic component and a circuit board using an anisotropic conductive film,
After the electronic component is sucked and held by the electronic component mounting head of the mounting machine, an anisotropic conductive film cut in advance to a predetermined length is attached to the electronic component, and then the electronic component is circuited. A method of mounting an electronic component, which comprises mounting at a predetermined position on a substrate. 2. A supply reel for storing and supplying an anisotropic conductive film, a film pull-out portion for drawing out the anisotropic conductive film supplied from the supply reel by an arbitrary length, and an anisotropic conductive film pulled out. An anisotropic device having a cutting unit for cutting the film in advance, an adsorption / heating head unit for holding and heating the cut anisotropic conductive film, and a collecting reel for winding and collecting used scrap tape Conductive film supply device.