JP2928855B2 - Method and apparatus for transferring adhesive layer - Google Patents

Description

Description: FIELD OF THE INVENTION The present invention relates to a bonding agent used for connecting a bonding portion, and in particular, an adhesive layer is formed by laminating an adhesive on release paper. The present invention relates to a method and an apparatus for transferring an adhesive layer in which an adhesive layer is stuck to a joint portion surface using a film tape that has been applied.

[Prior Art] Conventionally, an adhesive used for connection of a joint is formed by directly applying to the surface of the joint with a brush or by silk-screen printing. Also, the adhesive layer itself is formed into a film, or the adhesive is formed into a film on which an adhesive layer is formed by laminating the tape-shaped release paper, and these are punched and manually attached to a predetermined area on one surface of the joint. I was doing it. Then, these adhesive layers are joined to the other surface of the joint in the next step.

[Problem to be solved by the invention] However, the adhesive is directly brushed on the surface of the joint,
Alternatively, forming by silk printing is performed by hand because it is difficult to make the adhesive layer formed thereby uniform and flat, and automation is difficult, and therefore, the productivity is poor. Was.

In addition, even when a film forming an adhesive layer is used, it is difficult to manually attach the punched film to a predetermined region of the joint surface even by manual work,
Automation was even more difficult. Then, due to the incorrect attachment, in the next step of joining with the other surface of the joint, the edge of the joint is exposed at the time of thermocompression bonding by the thermocompression bonding head and adheres to the thermocompression bonding head, resulting in flatness of the surface. This was inconvenient because of the poor press bonding.

Therefore, in order to prevent the leaching, in particular, use a film of an adhesive layer formed by laminating an adhesive on release paper, and attach the adhesive layer in advance to the edge of the thermocompression bonding area on the joint surface. Even if a slit is formed along the slit to prevent the protrusion, it is difficult and time-consuming to insert this slit, and even if the positioning of the joint surface to the thermocompression bonding area is performed manually. It is difficult, and the automation makes it more complicated and difficult, and has the drawback of increasing the cost of parts and lowering productivity.

The present invention has been made in view of the above-described circumstances, and its purpose is to perform processing such as a position prevention slit for improving the productivity, which is to improve the productivity of bonding an adhesive layer to a joint. It is an object of the present invention to provide an automated method and apparatus for transferring an adhesive layer which can be handled in a form.

Means for Solving the Problems In order to achieve the above object, the present invention provides a method for transferring an adhesive layer, the method comprising: laminating an adhesive on a tape-shaped release paper to form a film having an adhesive layer formed thereon The tape is thermocompressed to the joint surface, and after the thermocompression, a squeegee having at least one acute angle is gradually moved in parallel with the film tape while pressing the film tape at the acute angle portion. The object is to lift the film tape at a portion immediately after the pressed portion, peel off the adhesive layer in the region adhered to the joint surface from the release paper, and transfer the adhesive layer to the joint surface.

Further, the transfer device of the present invention is a delivery reel that feeds out a necessary amount of a film tape obtained by laminating an adhesive on a tape-shaped release paper in order to realize the transfer of the adhesive layer to the joint surface, A thermocompression head for thermocompression bonding the unwound film tape to the joint surface, and at least one acute angle for exfoliating the adhesive layer in a region where the film tape is thermocompression bonded to the junction surface, the acute angle A squeegee that moves gradually while pressing the film tape at the portion, and a take-up reel that winds up the film tape where the adhesive layer in the thermocompression-bonded area is separated at the joint surface.

[Function] In the method for transferring an adhesive layer according to the present invention, the transfer of the adhesive layer by thermocompression bonding to the joint surface does not leave an extra adhesive layer on the joint surface when the release paper is peeled off. At least one
A squeegee with an acute angle is used. Then, the squeegee is gradually moved while pressing the film tape thermocompression-bonded to the joint surface at the acute angle portion, and with the movement, lifts the film tape immediately after the acute angle portion. That is,
The adhesive layer is squeezed by the sharp edges of the squeegee. The adhesive layer on the joint surface is thermocompression-bonded, but the other portions of the adhesive layer are not adhered anywhere. Therefore, only the adhesive layer on the joint surface is peeled off from the release paper by this ironing action, and the adhesive layer on the other portion is separated from the adhesive layer on the joint surface and lifted together with the release paper. . By continuously performing such an operation with the movement of the squeegee, the adhesive layer of the film tape is reliably transferred only to the joint surface. Further, according to the transfer device of the present invention, the required amount of the film tape on which the adhesive layer is formed by laminating the adhesive layer is sent out from the reel, and the area of the head surface of the thermocompression bonding head is thermocompressed to the joint surface. I do.
The squeegee is gradually moved from the downstream direction of the film tape while pressing the thermocompression-bonded film tape at the acute angle portion, and the film tape is lifted immediately after the acute angle portion. Therefore, an extra adhesive layer other than the thermocompression head surface area is lifted together with the release paper. Since this film tape has a device structure that can be wound on a take-up reel, it can be automated and the structure can be simplified. Further, it is possible to easily improve the positional accuracy, productivity, and the like.

EXAMPLES Hereinafter, a method and an apparatus for transferring an adhesive layer according to the present invention will be described with reference to the drawings. Referring to FIG. 1 to FIG.
For example, in the case where a conductive bonding agent is used for connection between circuit boards, an embodiment of a transfer method and an apparatus for attaching the conductive bonding agent to one circuit board will be described.

With reference to FIGS. 8 to 10, a description will be given of a transfer method for attaching a conductive bonding agent laminated on a base film, which is a tape-shaped release paper, to a circuit board. As shown in FIG. 8, a hot-melt type conductive bonding agent 1 is previously formed on one entire surface of a tape-shaped base film 3 via a release agent 2, and such a film tape 4 is a bonding portion. It is thermocompression-bonded to one circuit board 5.

Next, as shown in FIG. 9, at least one acute angle portion
The squeegee 6 having 61 is moved as indicated by the arrow while pressing the film tape 4 at the sharp portion 61 thereof. While moving the squeegee 6 little by little, the base film 3
When tension is applied to the base film 3, the base film 3, which is release paper, is lifted immediately after the acute angle portion 61. The thermocompression bonded portion of the conductive bonding agent 1 is firmly bonded to the circuit board 5, but the other portions are not adhered anywhere.
In this state, the conductive bonding agent 1 is subjected to an ironing action due to the lifting of the base film 3 immediately after the acute angle portion 61. Therefore, the conductive bonding agent 1 is sharply cut and separated at the boundary of the bonding portion, and is pulled together with the base film 3 from the edge portion 13 of the thermocompression bonding surface region, leaving the conductive bonding agent region 12 corresponding to the bonding portion. It will be lifted off.

Then, as shown in FIG. 10, the squeegee 6 is further gradually moved in the direction of the arrow, and the moved base film 3 is lifted immediately after the acute angle portion 61, and is thermocompression-bonded to the circuit board 5. The extra portion 11 of the conductive bonding agent and the base film 3 other than the region pasted and adhered are peeled off from the bonded portion and removed. Therefore, the conductive bonding agent 1 is accurately transferred to the circuit board 5.

As shown in FIG. 1, the schematic structure of the transfer device for attaching the conductive bonding agent 1 used for connection between circuit boards to one circuit board 5 is as follows. This is an apparatus for attaching the conductive bonding agent 1 to the circuit board 5 using the film tape 4 formed on the tape-shaped base film 3 via a tape. A transport system A from which a required amount of the film tape 4 is fed, a press-bonding press unit B to which the film tape 4 is thermocompression-bonded to attach the conductive bonding agent 1 to the circuit board 5, and a conductive bonding agent 1 includes a cradle jig C which is a circuit board cradle for transferring 1 to the circuit board 5.

The transport system A includes a delivery reel 8 driven by a motor 7 for delivering the film tape 4, two fixed free rolls 14 and 15 for guiding and guiding the film tape 4 delivered from the delivery reel 8, and a return spring. (Not shown), the film tape 4 is tensed, and the conductive bonding agent 1 is left in a region thermocompression-bonded from the film tape 4 to a circuit board 5 described later. Squeegee 6 for peeling off essential parts and base film 3, movable free roll 16 and air cylinder 17
As a result, the gear 19 provided with a one-way clutch (not shown) is rotated by the operation of the rack 18, and the used film tape 4 peeled off with the squeegee 6 leaving the thermocompression bonding area on the circuit board, thereby causing the squeegee to squeeze. A drive roll 20 for pulling the movable free roll 16 and the movable free roll 16 against the bias of the return spring; a nip roller 21 for pressing the used film tape 4 hung by the rotation of the drive roll 20 so as not to slip; The used film tape 4 sent by the roll 20 is a take-up reel
A tension roll 22 urged by a tension spring (not shown) so as not to be loosened before being wound around 10;
It comprises a fixed free roll 23 for guiding and guiding the used film tape 4 to the take-up reel 10, and a take-up reel 10 for driving the empty film tape 4 by the motor 9 to take up.

At least one of the squeegees 6 has an acute angle, and the squeegee 6 presses the film tape 4 thermocompression-bonded to the circuit board 5 described later at the acute angle portion 61, while using the drive roll 20 to squeeze the used film tape. The tape 4 is gradually moved in the direction parallel to the running direction of the tape 4 from the rear, and the used film tape is lifted immediately after the acute angle portion 61. Accordingly, the film tape composed of the excess portion 11 of the conductive bonding agent and the base film 3 except for the region thermally bonded to the circuit board 5 is gradually peeled off.

The crimping press unit B includes a crimping press in which a stand base 31 that slides on the base 30 in the front-rear direction and a thermocompression head 33 that moves up and down the stand base 31 are provided via a heat insulating material 34.
32 and the thermocompression bonding head 33 is fixed free roll
It is located on the running surface of the film tape 4 between 15 and the squeegee 6.

The cradle jig C is constituted by a cradle 41 which is slidable on the table 40 in the front-rear direction and capable of moving up and down. The cradle 41 is a film tape 4 between the fixed free roll 15 and the squeegee 6.
A fixing portion 42 for positioning the circuit board 5 is formed on the receiving table 41, which is located below the running surface.

The process of transferring the conductive bonding agent to the circuit board by the above-described transfer device will be described with reference to FIGS.

As shown in FIG. 2, a transport system A in which the film tape 4 is fed out from the delivery reel 8 by a predetermined amount necessary for thermocompression bonding to the circuit board 5, and the film tape is subordinately wound up by the take-up reel 10. , The film tape 4 is guided and guided by a fixed free roll 15. The used film tape from which the conductive bonding agent 1 in the area thermocompression-bonded to the circuit board 5 is removed is stretched around the squeegee 6 and the movable free roll 16. After that, the film tape is
The squeegee 6 and the movable free roll are rotated by the drive roll 21 while being pressed by the nip roll 21 and the nip roll 21 as described later.
Tension for moving 16 is applied. Thereafter, the film tape 4 is guided by a fixed free roll 23 via a tension roll 22 and wound around a take-up reel 10 (note that the shaft core is indicated in the drawing is a fixed one). , And those without a shaft core indicate that they are movable.) In the transport system A in such a state, the pressing press unit B and the receiving jig C are first moved with respect to the running surface of the film tape 4 between the fixed free roll 15 and the squeegee 6. After the circuit board 5 is positioned and set at the front position, the receiving table 41 is slid rearward to be spaced apart from the lower surface of the running surface. Next, the thermocompression bonding head 33 of the compression bonding press unit B is separated from the upper surface of the running surface by the compression bonding press 32 in which the base 30 is slid forward.

Then, as shown in FIG. 3, the receiving table 41 is raised to the running surface of the film tape, and the circuit board 5 positioned and set thereon is brought into contact with the film tape 4.
The bonding agent 1 for conduction in the area of the head compression surface is thermocompression-bonded to the circuit board 5 by the thermocompression head 33 due to the lowering of the compression press 32.

Therefore, after the thermocompression bonding, as shown in FIG.
The thermocompression bonding head 33 is lifted and pulled backward, and is separated from the transport area of the film tape 4.

In this state, the film tape 4 is thermocompression-bonded to the circuit board 5, and in a state where the thermocompression bonding head 33 is detached from the transport area, the drive roll 20 pressed by the nip roll 21 as shown in FIG. Air cylinder as shown
By the operation of 17, it is rotated via a gear 19 provided with a one-way clutch. At this time, the sending reel 8 is stopped and the film tape 4 is not sent. Therefore, tension is applied to the film tape 4 by the rotation of the drive roll 20, and the film tape is crushed. Accordingly, the squeegee 6 and the movable free roll 16 are drawn against the bias of the return spring. In such pulling, the squeegee 6 moves in parallel along the running surface from the downstream direction of the film tape while pressing the film tape 4 at at least one sharp angle portion 61 provided on the squeegee. The tension acting on the used film tape 4 also causes the film tape 4 itself to be lifted immediately after the acute angle portion 61 of the squeegee 6, and the film tape 4
However, it becomes a form that is squeezed at the acute angle part, and the thermocompression bonding head
Excess conductive bonding agent 1 and base film 3 other than the area thermally bonded to the circuit board on the head surface of 33 are peeled off, and are used as a used film tape via take-up reel 10 via tension roll 22 and fixed free roll 23. It will be wound up. The tension roll 22 is a driving roll.
The film tape 4 is pulled by a tension spring (not shown) so as to prevent the film tape 4 from being loosened between the take-up reel 20 and the take-up reel 10.

Next, after the conductive bonding agent is transferred to the circuit board 5, the receiving table 41 is lowered from the running surface of the film tape 4 as shown in FIG. The unwinding of the film tape 4 from the delivery reel 8 and the squeegee 6 and the movable free roll 16
Is returned to the position before the movement by the bias of the return spring. At this time, since the gear 19 for rotating the drive roll 20 is provided with a one-way clutch, the film tape 4 does not run backward.

Therefore, as shown in FIG. 7, by sliding the receiving table 41 in the forward direction, the receiving table 41 can be removed from the transport area of the film tape and the circuit board can be removed.

Therefore, the transfer of the conductive bonding agent to the circuit board is automated by circulating the above steps together with the feeding of the film tape from the delivery reel by a predetermined amount, and the thermocompression bonding surface is attached to the circuit board. It will be transferred accurately.

When the electrodes of the electronic component are placed on the conductive bonding agent thermocompression-bonded to the circuit board and thermocompression-bonded again, the circuit board and the electronic component are electrically connected.

Note that the present invention is not limited to the above-described embodiment, and may be used, for example, for connection of electric devices such as cabinets and electric device components.

[Effects of the Invention] As described above in detail, according to the method and the apparatus for transferring an adhesive layer of the present invention, the operation of attaching the adhesive layer to the joint surface is performed by using the adhesive as release paper. The automatic supply is enabled by the film tape circuit board of the adhesive layer formed by laminating on the film tape. Then, the transfer of the adhesive layer to the joint surface is accurately performed by peeling off the film tape by a squeegee, and there is no excess adhesive layer remaining on the joint surface. The work is easy and easy to do,
The structure is also simple. Further, productivity and cost reduction can be achieved by such an automated method and apparatus for transferring an adhesive layer.

[Brief description of the drawings]

1 to 10 show an embodiment of the present invention, FIG. 1 is a perspective view showing a transfer device structure, and FIGS.
FIG. 2 is a view for explaining an operation state of the transfer device, FIG. 2 is a view at the start of the transfer operation, FIG. 3 is a view at the time of thermocompression bonding, FIG. FIG. 6 is a diagram showing a form at the time of peeling by squeegee operation, FIG.
FIG. 7 is a view at the end of the transfer operation. 8th
FIG. 10 to FIG. 10 are structural views of essential parts for explaining the operation of the squeegee in the method of transferring the bonding agent for conduction, FIG. 8 is a cross-sectional view of the structure before the squeegee operation, and FIG. And FIG. 10 is a sectional view of the structure in operation. DESCRIPTION OF SYMBOLS 1 ... Conductive bonding agent, 2 ... Release agent, 3 ... Base film, 4 ... Film tape, 5 ... Circuit board, 6 ...
Squeegee, 61 ... acute angle part, 8 ... delivery reel, 10 ...
… Take-up reel, 14, 15, 23 …… Fixed freeroll, 16
…… Movable free roll, 17 …… Air cylinder, 19 …… Gear, 20 …… Drive roll, 21 …… Nip roll, 22 …… Tension roll, 32 …… Crimping press, 33 …… Thermo-compression head, 41 …… Cradle, A: Conveyance system, B: Crimping press unit, C: Cradle jig.

Claims (2)

(57) [Claims] 1. A film tape having an adhesive layer formed on a tape-shaped release paper is thermocompression-bonded to the joint surface, and after the thermocompression bonding,
At least one squeegee moves the film tape little by little in parallel with its running direction while being pressed at the acute angle portion having the squeegee, and with the movement, peels off the release paper by being lifted immediately after the acute angle portion, A method for transferring an adhesive layer, wherein the adhesive layer is transferred to a joint surface. 2. A delivery reel for transferring a required amount of a film tape having an adhesive layer formed on a tape-shaped release paper, which is a means for transferring the adhesive layer to a joint surface. In order to remove the release paper from the film tape while leaving the adhesive layer only in the thermocompression bonding area on the joint surface, a thermocompression head for thermocompression bonding the fed film tape to the joint surface. A squeegee that moves gradually while pressing the film tape at a certain acute angle portion, and a take-up reel on which an empty film tape that has been peeled off by leaving the adhesive layer in the thermocompression bonding area on the joint surface is taken up. Characteristic adhesive layer transfer device.