JP3176917U - Conductive adhesive tape set for automated processing systems - Google Patents

Abstract

A conductive adhesive tape set for an automatic processing system is provided that includes a rotating disk set, a second annular member, and a conductive adhesive tape.
The turntable set 31 includes two shutters 311 and a first annular member 312, and the shutters 311 are in contact with two side surfaces 312 a of the first annular member 312, respectively. The second annular member 32 is engaged with the first annular member 312 through the second hole, respectively, and is engaged with the automated processing system via the first hole 313. The conductive adhesive tape includes a conductive layer, and the automated processing system rotates the conductive adhesive tape to cut the conductive layer, and a part of the conductive layer is simultaneously applied to the TFT substrate and the CF substrate of the liquid crystal panel. Adhere to.
[Selection] Figure 2A

Description

  The present invention relates to a conductive adhesive tape set for an automated processing system, and in particular, can adhere the conductive adhesive tape of the conductive adhesive tape set to a thin film transistor (TFT) substrate and a CF (color filter, CF) substrate of an LCD. The present invention relates to a conductive adhesive tape set for a liquid crystal panel (LCD) automated processing system that achieves the purpose of removing static electricity between a TFT substrate and a CF substrate. The application of this automated processing system and conductive adhesive tape is based on the technical starting point of removing static electricity by bonding between the TFT substrate and the CF substrate, and the LCD uses IPS wide angle technology (In Panel Switching). Although it is an LCD manufactured by using any of the thin plate bonding techniques, it can be applied in an application in which an adhesive tape needs to be used for bonding or conducting.

  The LCD is a display facility that is widely used at present, and in order to improve the production speed in accordance with the economic effect profit, the improvement of the manufacturing process automation level is an important and important factor. In particular, LCD manufactured using IPS wide-angle technology (In Panel Switching) still needs to be completed manually in the manufacturing process, and the most time-consuming part is the TFT substrate and CF substrate of LCD. Of the conductive adhesive tape between the two.

  Specifically, the structure of the above-mentioned LCD is mainly composed of CF substrate, CF, liquid crystal material, TFT and TFT substrate in order, and static electricity is generated in the LCD TFT substrate and the CF substrate, and the LCD In order to avoid affecting the imaging quality, generally, a conductive adhesive tape is simultaneously adhered to the edges of the TFT substrate and the CF substrate to discharge static electricity. However, in each of the conventional methods, the conductive adhesive tape is manually attached between the TFT substrate and the CF substrate.

  Please refer to FIG. The conventional conductive adhesive tape 1 is generally attached to the mount 2 with an interval in the form of an independent strip, the TFT substrate and the CF substrate are bonded together, and then the conventional conductive adhesive tape 1 is manually pulled from the mount 2. Peel off and adhere to the TFT substrate and CF substrate. The above-described manual processing method is not only time-consuming, but also the case where the hand inadvertently touches the adhesive layer of the conductive adhesive tape 1 may significantly reduce the adhesiveness or conductivity of the conductive adhesive tape 1. There are many. The manual adhesion method cannot accurately position the conductive adhesive tape 1 on the edge of the TFT substrate and the CF substrate. Due to these problems, the assembly in which the TFT substrate and the CF substrate are combined is subjected to an electrostatic test. The result is that the yield cannot be improved.

  In view of the above circumstances, it has been urgently achieved in this industry to provide a conductive adhesive tape that can be used in an automated processing system and that can accurately adhere to the edges of a TFT substrate and a CF substrate and avoid the disadvantages of manual bonding. It has become a goal to try.

  In order to solve the above-mentioned problems, the present invention simplifies the manufacturing process, and further improves the production efficiency and product yield. In particular, the present invention is a conductive adhesive tape set for an automated processing system, particularly for an automated processing system of a liquid crystal panel. An object of the present invention is to provide a conductive adhesive tape set.

  In order to achieve the above-mentioned object, an automatic processing system according to the present invention is for processing a TFT substrate and a CF substrate of a liquid crystal panel, and the conductive adhesive tape set of the present invention includes a rotating disk set, 2 annular members and a conductive adhesive tape. The turntable set includes two shutters and a first annular member, and the shutters are in contact with two side surfaces of the first annular member, respectively, and are respectively connected to the first annular member through the first hole. Engaged with the automated processing system, the second annular member is engaged with the first annular member through the second hole. The conductive adhesive tape includes a first protective layer and a conductive layer attached to the first protective layer. In this automated processing system, the conductive adhesive tape is rotated, the conductive layer is cut, and a part of the conductive layer is made into a conductive sheet. The conductive sheet has a first portion on the TFT substrate. At the same time, the second portion sticks to the CF substrate.

  In order to explain the objects, technical features, and effects in an easy-to-understand manner, a preferred embodiment will be described in detail below with reference to the drawings.

It is a schematic diagram of the conventional electrically conductive adhesive tape. It is a schematic diagram of the conductive adhesive tape set in the 1st Example of this invention. It is a schematic diagram of the turntable set of the conductive adhesive tape set in the first embodiment of the present invention. It is an assembly schematic diagram of the 2nd annular member and conductive adhesive tape of the conductive adhesive tape set in the 1st example of the present invention. It is a cross-sectional schematic diagram of the conductive adhesive tape of the conductive adhesive tape set in 1st Example of this invention. It is a schematic diagram of the automatic processing system using the electrically conductive adhesive tape set in 1st Example of this invention. It is a process schematic diagram in which the guide module of the automated processing system using the conductive adhesive tape set in the first embodiment of the present invention cuts the conductive layer of the conductive adhesive tape set. It is a process schematic diagram in which the guide module of the automated processing system using the conductive adhesive tape set in the first embodiment of the present invention cuts the conductive layer of the conductive adhesive tape set. It is a process schematic diagram in which the suction cup module of the automated processing system using the conductive adhesive tape set in the first embodiment of the present invention adsorbs the conductive layer of the conductive adhesive tape set. It is a process schematic diagram in which the suction cup module of the automated processing system using the conductive adhesive tape set in the first embodiment of the present invention adsorbs the conductive layer of the conductive adhesive tape set. It is a process schematic diagram in which the suction cup module of the automated processing system using the conductive adhesive tape set in the first embodiment of the present invention adsorbs the conductive layer of the conductive adhesive tape set. It is a lower surface schematic diagram of the suction cup module of the automatic processing system using the electrically conductive adhesive tape set in 1st Example of this invention. It is a side surface schematic diagram of the suction cup module of the automatic processing system using the electrically conductive adhesive tape set in 1st Example of this invention. It is a cross-sectional schematic diagram of the conductive adhesive tape of the conductive adhesive tape set in the 2nd Example of this invention. It is a schematic diagram of the automatic processing system using the electrically conductive adhesive tape set in 1st Example of this invention.

  The conductive adhesive tape set 3 in the first embodiment of the present invention is used in an automated processing system 4 for processing the TFT substrate 51 and the CF substrate 52 of the liquid crystal panel 5. Reference is now made to FIG. 2A, which is a schematic diagram of the conductive adhesive tape set 3, and FIG. 3A, which is a schematic diagram of the automated processing system 4. The conductive adhesive tape set 3 includes a turntable set 31, a second annular member 32, and a conductive adhesive tape 33. FIG. 2B shows a schematic diagram of the turntable set 31. The turntable set 31 includes two shutters 311 and one first annular member 312, and these shutters 311 are in contact with the two side surfaces 312 a of the first annular member 312. FIG. 2C shows an assembly schematic diagram of the second annular member 32 and the conductive adhesive tape 33. The conductive adhesive tape 33 is wound directly around the periphery of the second annular member 32. Referring to FIG. 2D, which is a schematic cross-sectional view of the conductive adhesive tape 33, the conductive adhesive tape 33 includes a first protective layer 331 and a conductive layer 332 attached to the first protective layer 331. In the present embodiment, the conductive adhesive tape 33 includes a first adhesive layer 334 interposed between the conductive layer 332 and the first protective layer 331. The conductive layer 332 can be adhered to the first protective layer 331 by the first adhesive layer 334.

  As described above, in the actual assembly process, after the second annular member 32 is engaged with the first annular member 312 through the second hole 321, these shutters 311 are further moved to the first annular member 312. The second annular member 32 is fixed between the shutters 311 in contact with the two side surfaces 312 a of the member 312, and the shutters 311 are respectively connected to the automated processing system 4 through the first holes 313. Engaged. Thereby, the automated processing system 4 rotates the conductive adhesive tape 33 to cut the conductive layer 332, and as shown in FIG. 3F, a part of the conductive layer 332 becomes the conductive sheet 333, and the conductive sheet 333 is The first portion 333a adheres to the TFT substrate 51, and the second portion 333b adheres to the CF substrate. In this embodiment, the TFT substrate 51 and the CF substrate 52 may be placed on a processing table.

  The processing steps of the automated processing system 4 for the conductive adhesive tape set 3 will be described in more detail. Referring to FIG. 3A, the automated processing system 4 includes a first rotation structure 41, a guide module 42, a cutting module 43, a suction cup module 44, and a second rotation structure 45. Each shutter 311 is engaged with the first rotating structure 41 through the first hole 313, and the conductive adhesive tape set 3 is rotated by the first rotating structure 41. Next, the guide module 42 is in contact with the conductive adhesive tape 33 and a plurality of rollers 421 that guide the conductive adhesive tape 33, and a conductive adhesive tape winding that can guide the conductive adhesive tape 33 to advance in the same direction. A rotation prevention valve 422.

  Reference is made to FIGS. 3B and 3C, which are schematic views of the guide module 42 cutting the conductive layer 332. First, as shown in FIG. 3B, the guide module 42 first guides the conductive adhesive tape 33 to the cutting module 43, and as shown in FIG. 3C, the cutting module 43 cuts a part of the conductive layer 332, A conductive sheet 333 is formed. Next, reference is made to FIGS. 3D, 3E, and 3F, which are schematic views showing that the suction cup module 44 adsorbs the conductive sheet 333 and moves it to the TFT substrate 51 and the CF substrate 52. FIG. As shown in FIG. 3D, the sucker module 44 adsorbs the conductive sheet 333 and moves it above the TFT substrate 51 and the CF substrate 52 (as shown in FIG. 3E). A suction cup 441 is attached to the interface (as shown in FIG. 3F).

  Further, refer to FIG. 3G and FIG. 3H, which are a schematic bottom view and a schematic side view, respectively, of the structure of the suction cup 441. The suction cup 441 is a two-part type, and adsorbs the first adsorbing member 441 a that adsorbs the first portion 333 a of the conductive sheet 333 and moves it to the TFT substrate 51, and adsorbs the second portion 333 b of the conductive sheet 333. When the first adsorption member 441a and the second adsorption member 441b are lowered, a difference in height occurs between the TFT substrate 51 and the CF substrate 52, and the second adsorption member 441b is moved to the CF substrate 52. As shown in FIG. 3F, the conductive adhesive tape 33 can be tightly attached between the TFT substrate 51 and the CF substrate 52. The suction cup module 44 includes a heater 442 that can heat the conductive sheet 333 before adhering to these substrates and then have a more preferable bonding effect when adhering to these substrates. After the conductive sheet 333 adheres to the TFT substrate 51 and the CF substrate 52 at the same time, the conductive circuit of the liquid crystal panel 5 can be further connected to the conductive sheet 333, so that the static electricity of these substrates passes through the conductive sheet 333. Can be conducted to the conductive circuit and released to the outside.

  After the suction cup 441 adsorbs the conductive sheet 333, the guide module 42 guides the first protective layer 331 to the second rotating structure 45, and the second rotating structure 45 rotates to the first The first protective layer 331 is recovered by winding the protective layer 331 around the second rotating structure 45.

  The conductive adhesive tape set 6 of the second embodiment of the present invention is used in an automated processing system 7 that can similarly process the TFT substrate 51 and the CF substrate 52 of the liquid crystal panel 5. Similar to the conductive adhesive tape set 3 of the first embodiment, the conductive adhesive tape set 6 of the second embodiment includes a turntable set 61, a second annular member 62, and a conductive adhesive tape 63. And since the connection method of each element is the same as that of the conductive adhesive tape set 3 in the first embodiment, it will not be described in detail here. The conductive adhesive tape set 6 includes the second protective layer 635 and the second adhesive layer in addition to the first adhesive layer 634 in which the conductive adhesive tape 63 is interposed between the conductive layer 632 and the first protective layer 631. It differs from the conductive adhesive tape set 3 in that it further comprises a layer 636. Further referring to FIG. 4, which is a schematic cross-sectional view of the conductive adhesive tape, the second adhesive layer 636 is interposed between the conductive layer 632 and the second protective layer 635, and the conductive layer 632 is the second adhesive layer. 636 adheres to the second protective layer 635.

  Referring to FIG. 5, which is a schematic diagram of the automated machining system 7, the automated machining system 7 is similar to the automated machining system 4 in that the first rotating structure 71, the guide module 72, the cutting module 73, and the suction cup module. 74 and a second rotating structure 75. Similarly, after the guide module 72 guides the conductive layer 632 of the conductive adhesive tape 63 and the cutting module 73 cuts the conductive layer 632 into a conductive sheet, the two-part suction cup of the sucker module 74 uses the conductive sheet as a TFT substrate. 51 and the CF substrate 52 are adsorbed and bonded together, but will not be described in detail here.

  The automated machining system 7 is different from the automated machining system 4 in that it further includes a third rotating structure 76. After the sucker of the sucker module 74 adsorbs the conductive sheet, the guide module 72 guides the second protective layer 635 to the second rotating structure 75, and the second rotating structure 75 rotates. The second protective layer 635 is wound around the second rotating structure 75. The guide module 72 first guides the first protective layer 731 to the third rotating structure 76 before guiding the conductive layer 632 to the cutting module 73, and the third rotating structure 76 rotates. Then, the first protective layer 631 is wound around the third rotating structure 76.

  As described above, the conductive sheet 633 thereby adheres to the TFT substrate 51 and the CF substrate 52 via the first adhesive layer 634, and is connected to the conductive circuit or other elements via the second adhesive layer 636. The static electricity in these substrates is discharged by bonding. In another embodiment of the present invention, the guide module 72 can peel the second adhesive layer 636 at the same time as guiding the second protective layer 635. At this time, it should be noted that the conductive sheet 633 is bonded onto these substrates only by the first adhesive layer 634.

  In summary, according to the conductive adhesive tape set for an automated processing system disclosed in the present invention, the conductive adhesive tape keeps its adhesiveness and automatically aligns the TFT substrate and the CF substrate with an accurate alignment method. This can significantly reduce the time required for manual attachment and greatly improve product yield.

  The drawings and explanations disclosed above are preferred embodiments of the present invention. For those skilled in the art, for example, the annular member and shutter of the conductive adhesive tape set are similar to the conventional analog recording tape in other ways. It can also be assembled into the above structure and used as the material tape of the automated processing system. All modifications and equivalent changes made within the scope of the present invention should still be included in the definition or equivalent scope of the claims for utility model registration.

DESCRIPTION OF SYMBOLS 1 Conductive adhesive tape 2 Mount 3 Conductive adhesive tape set 31 Turntable set 311 Shutter 312 1st annular member 312a Side surface 313 1st hole 32 2nd annular member 321 2nd hole 33 Conductive adhesive tape 331 1st Protective layer 332 Conductive layer 333 Conductive sheet 333a First portion 333b of conductive sheet 333 Second portion 334 of conductive sheet 333 First adhesive layer 4 Automated processing system 41 First rotating structure 42 Guide module 421 Roller 422 Conductive Adhesive tape winding prevention valve 43 Cutting module 44 Suction cup module 441 Suction cup 441a First suction member 441b of suction cup 441 Second suction member 442 of suction cup 441 Heater 45 Second rotation structure 5 Liquid crystal panel 51 TFT substrate 51
52 CF substrate 6 conductive adhesive tape set 61 turntable set 62 second annular member 63 conductive adhesive tape 631 first protective layer 632 conductive layer 634 first adhesive layer 635 second protective layer 636 second adhesive layer 7 Automated processing system 71 First rotation structure 72 Guide module 73 Cutting module 731 First protective layer 74 Suction cup module 75 Second rotation structure 76 Third rotation structure

Claims (13)

A conductive adhesive tape set for an automated processing system for processing a thin film transistor substrate (TFT) and a color filter substrate (color filter, CF) of a liquid crystal panel,
Two shutters and a first annular member, wherein the shutters are in contact with two side surfaces of the first annular member, respectively, and are engaged with the automated processing system through the first holes, respectively. Turntable set
A second annular member engaged with the first annular member via a second hole;
A conductive adhesive tape that includes a first protective layer and a conductive layer attached to the first protective layer, and directly wraps around a periphery of the second annular member;
The automated processing system rotates the conductive adhesive tape, cuts the conductive layer, turns a part of the conductive layer into a conductive sheet, and the conductive sheet adheres to the TFT substrate at the first portion. In addition, a conductive adhesive tape set for an automated processing system that adheres to the CF substrate at the second portion.   The conductive adhesive tape includes a first adhesive layer interposed between the conductive layer and the first protective layer, and the conductive layer adheres to the first protective layer by the first adhesive layer. The conductive adhesive tape set according to claim 1.   The automated processing system includes a first rotating structure, and each shutter is configured to pass through the first hole so that the first rotating structure rotates the conductive adhesive tape set. The conductive adhesive tape set according to claim 2, which is engaged with the first rotating structure.   The conductive adhesive tape set according to claim 3, wherein the automated processing system includes a guide module having a plurality of rollers that contact the conductive adhesive tape and guide the conductive adhesive tape.   The conductive adhesive tape set according to claim 4, wherein the guide module includes a conductive adhesive tape winding prevention valve that guides the conductive adhesive tape to advance in the same direction.   The automated processing system includes a cutting module, the guide module guides the conductive adhesive tape to the cutting module, and the cutting module cuts a part of the conductive layer into the conductive sheet. 5. The conductive adhesive tape set according to 5.   The conductive adhesive tape set according to claim 6, wherein the automated processing system includes a suction cup module having a suction cup that sucks the conductive sheet and moves the conductive sheet above the TFT substrate and the CF substrate.   The conductive suction tape set according to claim 7, wherein the suction cup module includes a heater for heating the conductive sheet.   The suction cup sucks the first portion of the conductive sheet and moves it to the TFT substrate; and the suction cup sucks the second portion of the conductive sheet and moves it to the CF substrate. 9. The conductive adhesive according to claim 8, wherein the conductive sheet is adhered to the TFT substrate at the first portion and is adhered to the CF substrate at the second portion of the conductive sheet. Tape set.   After the suction cup adsorbs the conductive sheet, the guide module guides the first protective layer to the second rotating structure, and the second rotating structure rotates to turn the first The conductive adhesive tape set according to claim 9, wherein the protective layer is wound around the second rotating structure.   The conductive adhesive tape further comprises a second protective layer and a second adhesive layer, the second adhesive layer is interposed between the conductive layer and the second protective layer, and the conductive layer is The conductive adhesive tape set according to claim 9, wherein the second adhesive layer adheres to the second protective layer.   After the suction cup adsorbs the conductive sheet, the guide module guides the second protective layer to the second rotating structure, and the second rotating structure rotates to rotate the first sheet. The conductive adhesive tape set according to claim 11, wherein two protective layers are wound around the second rotating structure.   The automated processing system includes a third rotating structure, and the guide module guides the first protective layer to the third rotating structure before guiding the conductive layer to the cutting module. The conductive adhesive tape set according to claim 12, wherein the third rotating structure rotates to wind the first protective layer around the third rotating module.

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