201224593 六、發明說明： 【發明所屬之技術領域】 本發明，是有關於具有蓋玻璃和觸控板的電子裝置， 特別是，有關於可以從1枚的玻璃母材將多數的完成玻璃 基板效率佳地製造的電子裝置用玻璃基板的製造方法。 【先前技術】 行動電話機，攜帶音樂播放器，攜帶型個人電腦等， 可攜帶的小型的電腦裝置已廣泛普及。且，將這些的顯示 裝置覆蓋的蓋玻璃，不限定於保護電子裝置的用途，也多 可發揮作爲觸控板的附加功能》 另一方面，在這些攜帶用電子裝置中，不只有小型化 的要求，其輕量化的要求也強，且，也有激烈的價格競爭 〇 這種狀況下，在蓋玻璃和觸控板的製造中，考慮從1 枚的玻璃母材將多數的完成玻璃基板切出。在此，也考慮 藉由化學硏磨將玻璃基板切出，但是考慮抑制製造成本的 話，機械性地切斷分離的方式較有利。 【發明內容】 (本發明所欲解決的課題） 但是採取機械性的切斷分離法的話，無論如何注意皆 會有碎玻璃從玻璃切斷端面飛散的無法迴避的問題。 且飛散的碎玻璃若一旦附著在玻璃基板的話，因爲無 -5- 201224593 法在洗淨過程.中容易地被除去，所以其後，將薄片材貼合 在玻璃表面的情況時，必需由手動作業將附著的碎玻璃除 去而使作業煩雜。且，使用畫線器等將碎玻璃除去的話， 也有可能損傷形成於玻璃表面的導電膜等。 本發明，是鑑於上述的問題點，其目的是提供一種可 以從1枚的玻璃母材將多數的完成玻璃基板效率佳地製造 的電子裝置用玻璃基板的製造方法。 (用以解決課題的手段） 爲了達成上述的目的，本發明的電子裝置用玻璃基板 的製造方法，具有：對於被區分成複數使用領域的玻璃基 板，在其表背面的一方或雙方形成薄膜層的第1過程；及 將第1過程結束後的玻璃基板內包地由保護薄膜覆蓋玻璃 基板整體的第2過程；及在由前述保護薄膜所覆蓋的狀態 下，將前述玻璃基板與保護薄膜一起被分別機械性地切斷 分離成複數使用領域的第3過程；及從被切斷分離的各玻 璃基板將保護薄膜剝離的第4過程；及對於已將保護薄膜 剝離的玻璃基板，將薄片材貼合在其表背面的一方或雙方 的第5過程。 薄膜層，最佳可以例示導電膜，第1過程結束後的玻 璃基板的透光性，是具有全光線透過率爲80%以上最佳。 在此，導電膜，是雖無特別限定，但是較佳是，塗抹導電 性聚合物而形成。且，較佳是，塗抹面的單位面積[cm2] ，可發揮300Ω〜3000ΜΩ的電阻率的構成。且，第1過程201224593 VI. Description of the Invention: [Technical Field] The present invention relates to an electronic device having a cover glass and a touch panel, and more particularly to the efficiency of a plurality of completed glass substrates from one glass base material A method of producing a glass substrate for an electronic device manufactured by Jiadi. [Prior Art] Mobile phones, portable music players, portable personal computers, etc., portable small computer devices have become widespread. Moreover, the cover glass which covers these display devices is not limited to the use for protecting an electronic device, and can also exhibit an additional function as a touch panel. On the other hand, in these portable electronic devices, not only miniaturization is required. Requires that the requirements for lightweighting are also strong, and there is also fierce price competition. In this case, in the manufacture of cover glass and touch panel, it is considered to cut out a large number of completed glass substrates from one glass base material. . Here, it is also considered to cut out the glass substrate by chemical honing, but it is advantageous to mechanically cut off the separation in consideration of suppressing the manufacturing cost. SUMMARY OF THE INVENTION (Problems to be Solved by the Invention) However, in the case of adopting a mechanical cutting and separating method, there is a problem that the broken glass is scattered from the glass cut end face regardless of the attention. If the scattered cullet is attached to the glass substrate, it is easily removed in the cleaning process because it is not used in the cleaning process. Therefore, when the sheet is attached to the glass surface, it is necessary to manually The work removes the attached broken glass and makes the work complicated. Further, if the cullet is removed by using a line keeper or the like, the conductive film formed on the surface of the glass or the like may be damaged. The present invention has been made in view of the above problems, and an object of the invention is to provide a method for producing a glass substrate for an electronic device which can efficiently manufacture a plurality of completed glass substrates from one glass base material. (Means for Solving the Problem) In order to achieve the above object, a method for producing a glass substrate for an electronic device according to the present invention has a film layer formed on one or both of the front and back surfaces of a glass substrate that is divided into a plurality of fields of use. And a second process of covering the entire glass substrate with a protective film in a glass substrate after the completion of the first process; and, in a state covered by the protective film, the glass substrate together with the protective film a third process that is mechanically cut and separated into a plurality of fields of use; and a fourth process of peeling off the protective film from each of the glass substrates that are cut and separated; and a sheet of glass that has been peeled off from the protective film The fifth process of bonding one or both sides of the back of the watch. The film layer is preferably exemplified as a conductive film, and the light transmittance of the glass substrate after the end of the first process is preferably 80% or more of the total light transmittance. Here, the conductive film is not particularly limited, but is preferably formed by applying a conductive polymer. Further, it is preferable that the unit area [cm2] of the application surface can exhibit a resistivity of 300 Ω to 3000 Ω. And, the first process
-6- 201224593 結束後的玻璃基板的表面鉛筆硬度，是B〜6H。又，電阻 率愈低，硬度就愈低，電阻率愈高，硬度就愈高。 在此，即使將導電性聚合物塗抹在玻璃基板，玻璃基 板的平坦度若高的話，就無法發揮充分的接合強度。在此 ，較佳是，在第1過程中，對於設有薄膜層的玻璃基板的 表面，先實行粗面化的表面處理。表面處理，是使蝕刻液 接觸玻璃表面最佳，在將玻璃基板的需要處密封的狀態下 ，將玻璃基板浸漬在蝕刻液很簡易。 形成導電性的薄膜層的情況時，若考慮保護電子裝置 的帶電防止的用途的話，是形成於玻璃基板的表背面的雙 方較佳。但是，若考慮製造成本的話，只有形成於露出於 使用者的一方面最佳。 在本發明的第2過程中，玻璃基板的整體雖是由保護 薄膜覆蓋，但是不是只有覆蓋，將保護薄膜黏接在玻璃基 板的全面最佳。採取這種構成的話，在其後的第3過程即 使將玻璃基板機械性地切斷，碎玻璃也不會附著在玻璃基 板，在第4過程只有將保護薄膜剝離，就可以將碎玻璃與 保護薄膜一起除去。 保護薄膜及玻璃基板（正確是玻璃基板的薄膜層）的 接合強度’有需要設定成最適，依據本發明人的檢討，判 明在保護薄膜的貼附面積25mmx25mm中的朝180。方向的剝 離試驗（剝離速度300mm/min)中，應將保護薄膜的接合 力，設定成1 .5〜3·5[Ν]。 在此’接合力若太強的話’在第4過程的保護薄膜的 201224593 剝離時，玻璃基板的薄膜層會被剝離，另一方面，接合力 若太弱的話，在第3過程的玻璃基板的切斷分離時，藉由 使保護薄膜被剝離，碎玻璃等會附著在玻璃基板。 且在第3過程中，因爲有需要一次就將保護薄膜及玻 璃基板在切斷，所以保護薄膜的薄膜厚，是應設定在10〜 50/zm的範圍。且，在第3過程中，使旋轉裁刀的刀刃旋轉 並掃描玻璃表面，將保護薄膜及玻璃基板切斷最佳。刀刃 的接觸壓力，是依據在第3過程使用的切斷裝置的內部機 構，被維持在一定壓力，此一定壓力，是設定成7N〜1 0N 的範圍內的最適値。 在任何情況下，由7N〜1 0N程度的壓力，可以容易地 切斷玻璃基板及保護薄膜，保護薄膜的薄膜厚爲10〜50 ，玻璃基板的板厚爲1.0mm以下最佳。 玻璃基板，是單板的玻璃基板也可以，將2枚的玻璃 基板貼合的貼合基板也可以。後者的例，可以例示構成顯 示裝置的玻璃基板，最佳是液晶顯示器用的貼合玻璃基板 〇 且將液晶顯示器用的玻璃基板製造的情況時，在第5 過程中，各偏光薄片材是被貼合在2枚的玻璃基板的各表 面。在本發明中，在第4過程將保護薄膜剝離的話，碎玻 璃因爲會自動地被除去，所以可以與第4過程連續地設置 第5過程》 又，先在第4過程設置洗淨過程也可以，但是不需要 浸漬於洗淨液的濕式洗淨，藉由設置離子吹風或超音波洗 -8 - 201224593 淨的乾洗淨過程就足夠。如此在本發明中，因爲不需設置 濕式洗淨，所以不需要乾燥過程，可以消解：乾燥過程中 的處理時間的不必要的浪費、和乾燥處理中的薄膜層的劣 化。 [發明的效果] 依據以上說明的本發明的電子裝置用玻璃基板的製造 方法，可以從1枚的玻璃母材將多數的完成玻璃基板效率 佳地製造。 【實施方式】 以下，依據實施例詳細說明本發明。第1圖，是說明 實施例的電子裝置用玻璃基板的製造方法的流程圖。在此 實施例中，積層加工結束後的玻璃基板，是被捆包並朝別 的加工工場被移送，玻璃基板，雖例示構成液晶顯示器的 貼合玻璃基板，但是未特別限定。-6- 201224593 The surface pencil hardness of the glass substrate after the end is B~6H. Also, the lower the resistivity, the lower the hardness, and the higher the resistivity, the higher the hardness. Here, even if the conductive polymer is applied to the glass substrate, if the flatness of the glass substrate is high, sufficient bonding strength cannot be exhibited. Here, preferably, in the first process, the surface of the glass substrate provided with the film layer is first subjected to a roughening surface treatment. The surface treatment is such that the etching liquid is in contact with the glass surface, and it is easy to immerse the glass substrate in the etching liquid in a state where the glass substrate is sealed. In the case of forming a conductive thin film layer, it is preferable to form both of the front and back surfaces of the glass substrate in consideration of the use for protecting the electrification of the electronic device. However, considering the manufacturing cost, it is best to be formed on the one hand exposed to the user. In the second process of the present invention, although the entire glass substrate is covered by the protective film, it is not only covered, but the entire protective film is bonded to the glass substrate. According to this configuration, even if the glass substrate is mechanically cut in the subsequent third process, the cullet does not adhere to the glass substrate, and in the fourth process, only the protective film is peeled off, and the cullet can be protected. The film is removed together. The bonding strength of the protective film and the glass substrate (correctly the film layer of the glass substrate) needs to be set to be optimum. According to the review by the inventors, it is found that the bonding area of the protective film is 180 mm in 25 mm. In the peeling test of the direction (peeling speed: 300 mm/min), the bonding force of the protective film should be set to 1.5 to 3. 5 [Ν]. When the 'joining force is too strong', the film layer of the glass substrate is peeled off when the protective film of the fourth process is peeled off at 201224593, and if the bonding force is too weak, the glass substrate of the third process is When the separation is separated, the protective film is peeled off, and cullet or the like adheres to the glass substrate. Further, in the third process, since the protective film and the glass substrate are cut once, the film thickness of the protective film should be set in the range of 10 to 50/zm. Further, in the third process, the blade of the rotary cutter is rotated and the glass surface is scanned to optimize the protection film and the glass substrate. The contact pressure of the blade is maintained at a constant pressure in accordance with the internal mechanism of the cutting device used in the third process, and the constant pressure is an optimum range in the range of 7N to 10N. In any case, the glass substrate and the protective film can be easily cut by a pressure of about 7 N to 10 N. The film thickness of the protective film is 10 to 50, and the thickness of the glass substrate is preferably 1.0 mm or less. The glass substrate may be a glass substrate of a single plate or a bonded substrate in which two glass substrates are bonded together. In the latter case, a glass substrate constituting the display device can be exemplified, and when a glass substrate for a liquid crystal display is preferably used, and a glass substrate for a liquid crystal display is used, in the fifth process, each of the polarizing sheets is It is bonded to each surface of two glass substrates. In the present invention, if the protective film is peeled off in the fourth process, since the cullet is automatically removed, the fifth process can be continuously provided in the fourth process. Further, the cleaning process can be set in the fourth process. However, it does not need to be immersed in the wet cleaning of the washing liquid, and it is sufficient to set the net dry cleaning or ultrasonic cleaning -8 - 201224593 net dry cleaning process. Thus, in the present invention, since it is not necessary to provide wet cleaning, the drying process is not required, and it is possible to eliminate the unnecessary waste of the processing time in the drying process and the deterioration of the film layer in the drying process. [Effects of the Invention] According to the method for producing a glass substrate for an electronic device of the present invention described above, a plurality of completed glass substrates can be efficiently produced from one glass base material. [Embodiment] Hereinafter, the present invention will be described in detail based on examples. Fig. 1 is a flow chart for explaining a method of manufacturing a glass substrate for an electronic device according to an embodiment. In the embodiment, the glass substrate after the lamination processing is bundled and transferred to another processing factory. The glass substrate is exemplified as a laminated glass substrate constituting a liquid crystal display, but is not particularly limited.
以下，依據第1圖說明的話，在本實施例中，將玻璃 母材GL加工並製造NxM個的液晶顯示器。即，加工對象的 玻璃母材GL，是使液晶顯示器的顯示單元CEL · · · CEL 縱橫形成的貼合玻璃基板GL。此貼合玻璃基板GL，是在 :在內面側設有濾色板的第1基板G 1、及在內面側配置有 晶體管陣列被第2基板G2之間，使液晶被封入並構成NxM 個的顯示單元CEL。 貼合玻璃基板GL，是在將第1基板G1及第2基板G2的 201224593 周緣密封的狀態下’被浸漬在蝕刻液，使其玻璃表面被化 學硏磨。其結果，玻璃表面被適度粗面化（ST1)。且， 藉由此化學硏磨處理（ST1)，可以將貼合玻璃基板GL適 度地薄型化。供塗抹處理（ST2 )的貼合玻璃基板GL的板 厚，較佳是1.0mm以下，更佳是〇·5〜0.7mm程度。 接著，對於玻璃基板GL的洗淨及密封材的除去處理結 束後的貼合玻璃基板GL，使用狹縫塗佈機，在第1玻璃基 板G1的表面，塗抹導電性聚合物LAY (ST2:第2圖（a) 參照）。在此實施例中，使用聚噻吩系的導電性聚合物， 在經過乾燥處理（ST3 )的乾燥狀態，設定成使玻璃基板 G1的全光線透過率具有80%以上的透光性。且，塗抹面的 單位面積[cm2]，是依據用途被設定成300Ω〜3000ΜΩ的 範圍的最適合的電阻率。且，乾燥狀態的玻璃基板G1的表 面鉛筆硬度，是對應電阻率被設定成B〜6H程度。 接著，對於貼合玻璃基板GL，實施將一對的保護薄膜 Fil、Fi2貼合覆蓋的積層加工（ST4 )。又，乾洗淨處理 (ST3 )及積層加工處理（ST4 )，是在清淨室實施最佳。 保護薄膜的素材，雖無特別限定，但是在此實施例中，是 將在聚酯薄膜塗抹了丙烯系黏接劑者分別貼合在貼合玻璃 基板GL的表背面。 在此，保護薄膜及玻璃基板的接合力雖成爲問題，但 是太強或太弱也有問題，因此需形成成爲最適合的接合力 的黏接層。具體而言，在保護薄膜Fil被黏接在玻璃基板 G1狀態下，在朝保護薄膜Fil的貼附面積25mmx25mm中的 201224593 1 80°方向的剝離試驗（剝離速度3 00mm/min )，使保護薄 膜的接合力，被設定成1.5〜3.5[N/25mm]的範圍。 且保護薄膜Fil、Fi2的膜厚，是不損傷作業性和防濕 性的範圍愈薄愈佳，具體而言，50 # m以下較佳，最佳是 使用膜厚1〇〜50// m的薄膜材。又，lOym未滿的話，貼 合作業變困難。 在任何情況下，貼合作業（ST4 )終了的話，將積層 加工結束後的複數枚的貼合玻璃基板捆包，就可以朝其他 的加工工場出貨。即，依據本實施例，因爲容易刮傷的導 電膜可確實地被保護，所以不需要由同一工場一貫全部的 加工處理，此點也成爲大的優點。又，當然也不否定由同 一工場一貫作業。 考慮到這一點，在此，雖將經過捆包及出貨過程爲前 提進行說明，但是在進貨作業結束後的其他的加工工場中 ，將積層加工結束後的複數枚的貼合玻璃基板GL、·· · 、GL取出，對於各貼合玻璃基板GL ’在其表面側及背面 側形成劃線將各顯示單元領域CEL切出（ST5〜ST6)。第 2圖（b)，是圖示縱橫形成的劃線CUT’在第1面形成了 第1劃線之後，藉由在第2面的對應位置形成第2劃線’使 貼合玻璃基板GL與保護薄膜Fil、Fi2—起被切斷。 又，在本實施例中’因爲玻璃基板01^的板厚是丨·0111111 以下，保護薄膜Fil、Fi2的膜厚是5〇ym以下’所以藉由 將旋轉裁刀的刀刃’由8N程度的壓力與保護薄膜171抵接掃 描，就可以將各顯示單元領域CEL切出。 -11 - 201224593 如此切斷分離處理終了的話，實行離子吹風處理（ ST7 )。在此，離子吹風處理，是藉由將離子吹附於工件 CEL (被切出的各貼合玻璃基板），就可進行將保護薄膜 所帶電的靜電除電，並且將塵等的異物除去的處理。又， 假設在切斷分離處理中發生碎玻璃，即使這些殘存，碎玻 璃因爲只會附著在保護薄膜所以不會產生問題。 離子吹風處理若終了的話，接著，將保護薄膜Fil、 Fi2剝離（ST8 )。此剝離處理，雖是人爲的被實行，但是 保護薄膜Fil的接合強度因爲是設定成適度，所以特別不 會導致作業困難。 且在最後，將偏光薄片各貼合在工件CEL的表背面的 話，液晶顯示器就完成（ST9 )。 以上，雖具體而言說明本發明的一實施例，但是具體 的記載內容並不特別限定本發明。 【圖式簡單說明】 [第1圖]說明實施例的製造方法的流程圖。 [第2圖]說明第1圖的製造方法的圖面。 【主要元件符號說明】 ST2 :第1過程 ST4 :第2過程 ST5〜ST6 :第3過程 S T 8 :第4過程 ST9 :第5過程Hereinafter, in the present embodiment, in the present embodiment, the glass base material GL is processed and NxM liquid crystal displays are manufactured. In other words, the glass base material GL to be processed is a bonded glass substrate GL in which the display unit CEL · · · CEL of the liquid crystal display is formed vertically and horizontally. The bonded glass substrate GL has a first substrate G1 provided with a color filter on the inner surface side and a transistor array disposed between the second substrate G2 on the inner surface side, and the liquid crystal is sealed to constitute NxM. Display unit CEL. The bonded glass substrate GL is immersed in an etching liquid in a state where the first substrate G1 and the second substrate G2 are sealed at the periphery of 201224593, and the glass surface is chemically honed. As a result, the surface of the glass is moderately roughened (ST1). Further, by the chemical honing treatment (ST1), the bonded glass substrate GL can be appropriately thinned. The thickness of the bonded glass substrate GL to be applied (ST2) is preferably 1.0 mm or less, more preferably about 5 to 0.7 mm. Then, the laminated glass substrate GL after the cleaning of the glass substrate GL and the sealing material removal process are finished, and the conductive polymer LAY is applied to the surface of the first glass substrate G1 using a slit coater (ST2: 2 Figure (a) Reference). In this embodiment, a polythiophene-based conductive polymer is used, and in a dried state after drying (ST3), the total light transmittance of the glass substrate G1 is set to 80% or more. Further, the unit area [cm2] of the application surface is an optimum resistivity which is set to a range of 300 Ω to 3000 Ω depending on the application. Further, the surface pencil hardness of the glass substrate G1 in a dry state is such that the corresponding specific resistance is set to a degree of B to 6H. Then, the laminated glass substrate GL is subjected to a lamination process in which a pair of protective films Fil and Fi2 are bonded and covered (ST4). Further, the dry cleaning treatment (ST3) and the laminating processing (ST4) are optimal in the clean room. The material of the protective film is not particularly limited. However, in this embodiment, the polyester film is coated with a propylene-based adhesive and bonded to the front and back surfaces of the bonded glass substrate GL. Here, although the bonding strength between the protective film and the glass substrate is a problem, it is too strong or too weak, and it is necessary to form an adhesive layer which is the most suitable bonding force. Specifically, in a state where the protective film Fil is bonded to the glass substrate G1, a peeling test (peeling speed of 300 mm/min) in a direction of 201224593 1 80° in a bonding area of 25 mm×25 mm toward the protective film Fil is performed to form a protective film. The bonding force is set to a range of 1.5 to 3.5 [N/25 mm]. Further, the film thicknesses of the protective films Fil and Fi2 are preferably as thin as possible without impairing workability and moisture resistance. Specifically, 50 # m or less is preferable, and film thickness is preferably 1 〇 50 50 / m m. Film material. Also, if lOym is not full, it will be difficult to paste the cooperation industry. In any case, if the post-cooperation industry (ST4) is completed, the laminated glass substrates after the lamination processing are completed can be shipped to other processing plants. That is, according to the present embodiment, since the conductive film which is easily scratched can be surely protected, it is not necessary to have all the processing processing by the same factory, which is also a great advantage. Moreover, of course, it does not negate the consistent operation of the same workshop. In view of this, in the case of the packaging and shipping process, the laminated glass substrate GL after the lamination processing is completed in another processing factory after the completion of the loading operation. When the GL is taken out, each of the display unit regions CEL is cut out by forming a scribe line on the front side and the back side of each of the bonded glass substrates GL' (ST5 to ST6). In the second drawing (b), the scribe line CUT' formed in the vertical and horizontal directions is formed with the first scribe line on the first surface, and the second scribe line is formed at the corresponding position on the second surface to bond the glass substrate GL. It is cut off together with the protective films Fil and Fi2. Further, in the present embodiment, 'the thickness of the glass substrate 01 is 丨·0111111 or less, and the thickness of the protective films Fil and Fi2 is 5 〇 ym or less. Therefore, the blade edge of the rotary cutter is made of 8 N or less. The pressure and the protective film 171 are abutted and scanned, and each display unit field CEL can be cut out. -11 - 201224593 When the separation and separation process is completed, the ion blowing treatment (ST7) is performed. Here, in the ion blowing treatment, the ions are blown onto the workpiece CEL (the bonded laminated glass substrates), and the static electricity that is charged by the protective film can be removed, and the foreign matter such as dust can be removed. . Further, it is assumed that cullet is generated in the cutting and separating process, and even if these remain, the cullet does not cause a problem because it adheres only to the protective film. When the ion blowing treatment is completed, the protective films Fil and Fi2 are then peeled off (ST8). Although the peeling treatment is carried out artificially, the bonding strength of the protective film Fil is set to be moderate, and therefore it is particularly difficult to cause work. Finally, when the polarizing sheets are respectively attached to the front and back surfaces of the workpiece CEL, the liquid crystal display is completed (ST9). Although an embodiment of the present invention has been specifically described above, the specific description does not particularly limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS [Fig. 1] A flow chart for explaining a manufacturing method of an embodiment. [Fig. 2] A drawing showing the manufacturing method of Fig. 1. [Main component symbol description] ST2: 1st process ST4: 2nd process ST5~ST6: 3rd process S T 8 : 4th process ST9: 5th process