CN201495175U - Waterfall type laminar flow etching cutting device - Google Patents

Waterfall type laminar flow etching cutting device Download PDF

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Publication number
CN201495175U
CN201495175U CN2009200752506U CN200920075250U CN201495175U CN 201495175 U CN201495175 U CN 201495175U CN 2009200752506 U CN2009200752506 U CN 2009200752506U CN 200920075250 U CN200920075250 U CN 200920075250U CN 201495175 U CN201495175 U CN 201495175U
Authority
CN
China
Prior art keywords
glass substrate
microscope carrier
etching
etching solution
laminar flow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2009200752506U
Other languages
Chinese (zh)
Inventor
严立巍
周旭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHANGHAI YIJIE PHOTOELECTRIC TECHNOLOGY Co Ltd
Original Assignee
SHANGHAI YIJIE PHOTOELECTRIC TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHANGHAI YIJIE PHOTOELECTRIC TECHNOLOGY Co Ltd filed Critical SHANGHAI YIJIE PHOTOELECTRIC TECHNOLOGY Co Ltd
Priority to CN2009200752506U priority Critical patent/CN201495175U/en
Application granted granted Critical
Publication of CN201495175U publication Critical patent/CN201495175U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model provides a waterfall type laminar flow etching cutting device. The device mainly comprises a slant platform deck, a projection and an etching solution release device. The slant platform deck can be adjusted to an angle from 0 to 85 degrees, and the projection is arranged on the surface of the platform deck. A glass substrate is made in a slant state during the operation. Etching solution overflowing from the groove of the etching solution release device uniformly flows across the glass substrate put on the platform deck in the way of naturally flowing waterfall. The glass substrate is uniformly etched and thinned, or crystal grains lined with protective films of various shapes are cut off. Thus, products produced on the glass substrate etched flow down the glass substrate in a slant state with remaining etching solution along the slant direction of the glass substrate.

Description

The waterfall laminar flow etching cutting unit
Technical field
The utility model relates to a kind of glass laminar flow etching cutting unit, particularly a kind of waterfall laminar flow etching cutting unit.
Background technology
At present glass substrate being processed into needed crystal grain method has only following several: 1, adopt profile lathing limit grinding to carry out profile cutting, chamfering etc.2, adopt laser cutting to cut.3, adopt the water cutting mode to cut (promptly water is pressurized to more than the 300MPa, ejects superfine High-Pressure Water by the cutting of a special use glass substrate is processed) by extremely-high tension generator.But the aforesaid way facility investment is big, and all can only handle by monolithic, can not be suitable for large-scale production, and production cost is equally very high.
The Chinese patent publication number is the preparation method of the disclosed cellphone window protecting screen of CN1986873A, adopts the CNC processing technology that ultra-thin glass is cut chamfering by the size and the shape of product.
The cutting method ubiquity of above-mentioned thin type glass substrate collapsing in angle and the cutting of might causing might cause layering, and the product needed edging after finishing has increased time and operating cost simultaneously.
The utility model content
Technical problem to be solved in the utility model is to provide a kind of waterfall laminar flow etching cutting unit, make etching solution under action of gravity with the waterfall stream mode glass substrate of flowing through.Waterfall stream can be taken away the resultant of reaction on surface, thereby obtains average etched surfaces and the good crystal grain of shape.
Technical problem to be solved in the utility model also is a kind of waterfall type lamellar flow etching apparatus is provided, and makes that the contact area of glass substrate and microscope carrier is minimum.The purpose of doing like this is, reduces the contact area of glass substrate and microscope carrier as far as possible, prevents effectively that glass substrate and microscope carrier from adhering to and breaks when causing taking out.The scuffing that reduces effectively to avoid glass substrate of contact area.
Based on above-mentioned purpose, the utility model waterfall laminar flow etching cutting unit mainly comprises:
Microscope carrier can be regulated in 0-85 ° of scope.Can make glass substrate in 0-85 ° of scope, adjust by the angle of inclination that changes microscope carrier.The microscope carrier that tilts makes resultant of reaction to emit along waterfall stream, has guaranteed the homogeneity of reaction.
The etching solution reliever is placed on the microscope carrier top, and has the strip groove that can store etching solution.Etching solution under the groove spontaneous current, the glass substrate on the microscope carrier of flowing through uniformly.
During operation, glass substrate is skewed placement, makes that etching solution can be by the etching solution reliever groove glass substrate of flowing through uniformly.Tilted-putted glass substrate helps the removal of etching resultant, and waterfall stream has guaranteed the homogeneity of cutting uniformly.
On the microscope carrier a plurality of protruded objects can be arranged, make glass substrate be placed on the microscope carrier with minimum contact area.Minimum contact area can avoid glass substrate and microscope carrier to adhere to and scratch.
Microscope carrier in the utility model can about moving at the uniform velocity, make the glass substrate that is placed on it also move thereupon.About the glass substrate that at the uniform velocity moves can obtain more uniform surperficial waterfall stream.
Above-mentioned etching solution is a hydrogen fluoride solution, and the resultant that the etching glass substrate produces is a silicon fluoride.
This waterfall laminar flow etching cutting unit further comprises:
One fixed jig is fixed the glass substrate that is placed on the microscope carrier.
The utility model has the advantages that: in the time of the thinning glass substrate, at many means of the prior art, the utility model uses the gravity essence of etching solution self dexterously, make its mode that flows down with waterfall equably under the surface current of glass substrate, and can not be adsorbed on the glass substrate, and then glass substrate can be etched equably; Glass substrate relies on protruded object with contacting of microscope carrier on the other hand, has reduced the risk of fragmentation and scuffing.The cutting groove that cutting is produced is very narrow again, thereby has reduced the injury to product, and the cutting of on-mechanical power has avoided also that traditional cutting exists collapses angle and demixing phenomenon.Product after finishing does not need edging yet, has saved time and operating cost.Etching solution can be recycled and also reduce cost.
Description of drawings
Fig. 1 is the synoptic diagram of waterfall laminar flow etching cutting unit among the utility model embodiment.
Fig. 2 A-Fig. 2 B is the synoptic diagram of waterfall laminar flow etching cutting unit in another example of the utility model.
Among the figure: 1-etching solution reliever, 2-microscope carrier, 3-etching solution, 4-glass substrate, 5-protruded object, 6-fixed jig.
Embodiment
Further set forth the present invention below in conjunction with the drawings and specific embodiments.
With reference to figure 1, Fig. 1 is the synoptic diagram of the utility model waterfall laminar flow etching cutting unit.As shown in Figure 1, the utility model waterfall laminar flow etching cutting unit mainly comprises microscope carrier 2, has the etching solution reliever 1 of the strip groove that stores etching solution 3, this wherein, the fixed jig (not shown) can be fixed the glass substrate 4 that is placed on the microscope carrier 2.Under weight percent concentration 5-55% condition, its rate of etch can reach 5 μ m/min-25 μ m/min in etching solution 3 concentration.
The utility model waterfall laminar flow etching cutting unit makes glass substrate 4 present 0-85 ° heeling condition by the microscope carrier 2 that tilts.And the etching solution 3 that etching solution reliever 1 overflows, under the effect of gravity with the mode of the waterfall stream glass substrate 4 of flowing through uniformly.Waterfall stream has played the etching glass substrate and has taken away the effect of resultant of reaction, reaches the purpose that cuts out different glass substrate by this waterfall stream.
When etching solution reliever 1 overflowed waterfall stream, microscope carrier 2 and glass substrate 4 moved uniformly to obtain the optimal etch homogeneity about also.
Can control the etch-rate of 3 pairs of glass substrates 4 of etching solution by the angle of inclination that changes microscope carrier 2.Simultaneously, owing under microscope carrier skewed make that resultant of reaction can spontaneous current, solved resultant and adhered to the etched problem of influence.
In addition, for glass substrate 4 is fixed on the microscope carrier 2, use adhesive tape fixing glass substrate 4 usually.Do not only complicated operation like this, operation is finished and is caused glass substrate 4 to break when tearing glued membrane probably.And glass substrate 4 adheres to the probability that also can increase fragmentation with microscope carrier 2.For overcoming the above problems, can use the microscope carrier of fixed jig 6 and protruded object 5 to solve this type of problem in the utility model.
Fig. 2 A, Fig. 2 B are another synoptic diagram of the utility model waterfall laminar flow etching cutting unit.Shown in Fig. 2 A, a plurality of protruded objects 5 are installed on the microscope carrier 2 of the utility model waterfall laminar flow etching cutting unit, thereby make glass substrate 4 minimum, shown in Fig. 2 B with the contact area of microscope carrier 2.
Thus, glass substrate 4 can be embedded under the effect of fixed jig 6 on the microscope carrier 2, and glass substrate 4 is also very little with the contact area of microscope carrier 2 simultaneously.And then with adhesive tape will around the space seal the infiltration that just can avoid etching solution 3, protected the back side of glass substrate 4 also to reduce risk when unloading lower glass substrate 4.
Ultimate principle of the present utility model, principal character and advantage have below briefly been described.The practitioner of the industry should understand, and the utility model includes but not limited to above-mentioned example.Above-mentioned example and specification sheets have only briefly been illustrated principle of the present utility model, and under the prerequisite that does not break away from the novel spirit and scope of this use, the utility model also has various variations and improvement.All under the desired protection of the utility model, the claimed scope of the utility model is defined by appending claims and equivalent thereof these changes and improvements.

Claims (4)

1. waterfall laminar flow etching cutting unit, in order to etching or glass-cutting substrate, this etching cutting unit comprises:
One microscope carrier, this microscope carrier can freely be adjusted between 0-85 °, makes the glass substrate 4 that is placed on it also present 0-85 ° of inclination thereupon;
One etching solution reliever is placed on the top of this microscope carrier, and has the strip groove that stores etching solution;
Wherein, but under the etching solution spontaneous current that overflows by the groove of etching solution reliever, be placed in glass substrate on this microscope carrier and flow through equably.
2. waterfall laminar flow etching cutting unit as claimed in claim 1 is characterized in that, has a plurality of protruded objects on this microscope carrier, the feasible flat surface that does not touch this microscope carrier that is placed on this microscope carrier.
3. waterfall laminar flow etching cutting unit as claimed in claim 1 is characterized in that, but described microscope carrier move left and right make to be placed in also left and right sidesing shifting of glass substrate on this scarp, and make the flow through etching solution of this glass substrate flow down more equably.
4. waterfall laminar flow etching cutting unit as claimed in claim 1 is characterized in that, this waterfall laminar flow etching cutting unit further comprises:
One fixed jig is fixed this glass substrate that is placed on this microscope carrier.
CN2009200752506U 2009-07-24 2009-07-24 Waterfall type laminar flow etching cutting device Expired - Fee Related CN201495175U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2009200752506U CN201495175U (en) 2009-07-24 2009-07-24 Waterfall type laminar flow etching cutting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2009200752506U CN201495175U (en) 2009-07-24 2009-07-24 Waterfall type laminar flow etching cutting device

Publications (1)

Publication Number Publication Date
CN201495175U true CN201495175U (en) 2010-06-02

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009200752506U Expired - Fee Related CN201495175U (en) 2009-07-24 2009-07-24 Waterfall type laminar flow etching cutting device

Country Status (1)

Country Link
CN (1) CN201495175U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103370285A (en) * 2010-10-14 2013-10-23 株式会社Nsc Method of producing glass substrate for electronic device
CN103502172A (en) * 2011-05-11 2014-01-08 Hoya株式会社 Process for producing cover glass for electronic appliance, and holder for glass substrate for cover glass for electronic appliance
CN106430994A (en) * 2016-09-30 2017-02-22 浙江星星科技股份有限公司 Processing method for 3D glass panel free from flash point

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103370285A (en) * 2010-10-14 2013-10-23 株式会社Nsc Method of producing glass substrate for electronic device
CN103502172A (en) * 2011-05-11 2014-01-08 Hoya株式会社 Process for producing cover glass for electronic appliance, and holder for glass substrate for cover glass for electronic appliance
CN106430994A (en) * 2016-09-30 2017-02-22 浙江星星科技股份有限公司 Processing method for 3D glass panel free from flash point
CN106430994B (en) * 2016-09-30 2020-06-19 浙江星星科技股份有限公司 Processing method of 3D glass panel without flash point

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GR01 Patent grant
C14 Grant of patent or utility model
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100602

Termination date: 20150724

EXPY Termination of patent right or utility model