KR20130086232A - Method of producing glass substrate for electronic device - Google Patents

Abstract

This invention provides the manufacturing method which can manufacture many glass substrates for electronic devices efficiently with one glass base material.
A glass substrate divided into a plurality of use areas, comprising: a first step (ST2) of forming a thin film layer on one or both of front and back surfaces thereof; A second step (ST4) of covering the entire glass substrate with a protective film to contain the glass substrate having finished the first step; A third step (ST5 to ST6) of mechanically cutting and separating the glass substrate together with the protective film for each of the plurality of use areas in a state covered with the protective film; 4th process (ST7) which peels a protective film from each glass substrate isolate | separated by cutting | disconnection; And 5th process (ST8) which adhere | attaches a sheet | seat material with respect to the glass substrate which peeled the protective film on the one or both of the front and back surface.

Description

Manufacturing method of glass substrate for electronic device {METHOD OF PRODUCING GLASS SUBSTRATE FOR ELECTRONIC DEVICE}

BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to an electronic device having a cover glass or a touch panel, and more particularly to a method for manufacturing a glass substrate for an electronic device, which can efficiently manufacture a large number of finished glass substrates with one glass base material.

Portable small computer devices, such as a mobile telephone, a portable music player, and a portable computer, are widely used. And the cover glass which covers these display devices is not only limited to the use which protects an electronic device, but also exhibits additional functions as a touch panel in many cases.

On the other hand, in such portable electronic devices, not only the request for miniaturization but also the weight reduction are strong, and they are also exposed to severe price competition.

Under such a situation, in order to manufacture a cover glass or a touch panel, the method of cutting many completed glass substrates from one glass base material can be considered. Although the method of cutting out a glass substrate by chemical polishing can also be considered here, in order to suppress manufacturing cost, it is more advantageous to cut mechanically and isolate.

However, if a mechanical cut separation method is adopted, there is a problem that no matter how careful, glass cullets can be scattered in the cut glass surface.

And once the scattered cullet is adhered to the glass substrate, it cannot be easily removed in the cleaning process. Therefore, when the sheet material is adhered to the glass surface, there is a complicated trouble of manually removing the attached cullet. In addition, when a scriber or the like is used to remove the cullet, there is a possibility that the conductive film or the like formed on the glass surface is damaged.

This invention is made | formed in view of said problem, and an object of this invention is to provide the manufacturing method of the glass substrate for electronic devices which can manufacture a large number of completed glass substrates with one glass base material efficiently.

In order to achieve the above object, a method for manufacturing a glass substrate for an electronic device according to the present invention comprises: a first step of forming a thin film layer on one or both of front and back surfaces of a glass substrate divided into a plurality of use regions; A second step of covering the entire glass substrate with a protective film to contain the glass substrate having finished the first step; A third step of mechanically cutting and separating the glass substrate together with the protective film for each of the plurality of use areas while being covered with the protective film; A fourth step of peeling off the protective film from each of the cut and separated glass substrates; And a fifth step of adhering the sheet material to one or both of the front and back surfaces thereof with respect to the glass substrate from which the protective film has been peeled off.

As a thin film layer, Preferably a conductive film can be illustrated, It is preferable that the glass substrate which completed the 1st process has a light transmittance whose total light transmittance is 80% or more. Although a conductive film is not specifically limited here, Preferably it forms by apply | coating a conductive polymer. And preferably it should be configured to exhibit a resistivity of 300Ω ~ 3000MΩ per unit area [cm2] of the coated surface. In addition, the surface pencil hardness of the glass substrate which completed the 1st process should be B-6H. On the other hand, the lower the resistivity, the lower the hardness, and the higher the resistivity, the higher the hardness.

Here, even if the conductive polymer is applied to the glass substrate, if the flatness of the glass substrate is high, sufficient adhesive strength cannot be exhibited. Therefore, it is preferable to perform the surface treatment which roughens the surface of the glass substrate which provides a thin film layer preferably before a 1st process. It is preferable to make an etching liquid contact a glass surface as surface treatment, and it is easy to immerse a glass substrate in etching liquid in the state which sealed the required site | part of a glass substrate.

When forming an electroconductive thin film layer, it can be considered to provide in the front and back surfaces of a glass substrate from a viewpoint of the antistatic use which protects an electronic device. However, considering the manufacturing cost, it is preferable to form only on one side exposed to the user.

In the 2nd process of this invention, although the whole glass substrate is covered with a protective film, it is preferable not only to cover but to stick a protective film on the whole glass substrate whole surface. By adopting such a configuration, the glass cullet does not adhere to the glass substrate even if the glass substrate is mechanically cut in the subsequent third process, and the glass cullet is removed together with the protective film by simply peeling off the protective film in the fourth process. can do.

Although the adhesive strength of a protective film and a glass substrate (exactly a thin film layer of a glass substrate) needs to be set optimally, according to the inventor's examination, the peeling test (peeling) in the 180 degree direction in 25 mm x 25 mm of adhesion areas of a protective film Speed 300 mm / min), it was found that the adhesive force of the protective film should be set to 1.5 to 3.5 [N].

Here, if the adhesive force is too strong, the thin film layer of the glass substrate is peeled off at the time of peeling off the protective film of the fourth step, while if the adhesive force is too weak, the protective film is peeled off during the glass substrate cutting separation of the third step, such that the glass cullet or the like is applied to the glass substrate. It is attached.

In addition, since it is necessary to cut | disconnect a protective film and a glass substrate at once in a 3rd process, the film thickness of a protective film should be set to 10-50 micrometers. Moreover, in a 3rd process, it is preferable to rotate a cutter blade of a rotary cutter, and to scan a glass surface, and to cut a protective film and a glass substrate. The contact pressure of the cutter blade must be maintained at a constant pressure based on the internal mechanism of the cutting device used in the third process, and this constant pressure is set to an optimum value within the range of 7N to 10N.

As a result, it is preferable that the film thickness of a protective film shall be 10-50 micrometers, and the plate | board thickness of a glass substrate may be 1.0 mm or less so that a glass substrate and a protective film can be easily cut | disconnected at the pressure of about 7N-10N.

The glass substrate by a single plate may be sufficient as a glass substrate, and the bonding substrate which bonded two glass substrates may be sufficient as it. Examples of the latter may exemplify a glass substrate constituting the display device, and preferably, a laminated glass substrate for a liquid crystal display corresponds thereto.

And when manufacturing the glass substrate for liquid crystal displays, a polarizing sheet material is adhere | attached on each surface of two glass substrates in a 5th process, respectively. In this invention, since a glass cullet is automatically removed when peeling a protective film in a 4th process, a 5th process can be provided continuously to a 4th process.

In addition, although the washing | cleaning process may be provided prior to a 4th process, the wet washing | cleaning which is immersed in a washing | cleaning liquid is unnecessary, and it is sufficient to provide the dry washing process by an ion blower or ultrasonic cleaning. As described above, in the present invention, the wet cleaning is not provided, so that the drying step is unnecessary, and the waste of processing time in the drying step and deterioration of the thin film layer in the drying process can be eliminated.

According to the manufacturing method of the glass substrate for electronic devices of this invention demonstrated above, many completed glass substrates can be manufactured efficiently with one glass base material.

1 is a flowchart illustrating a manufacturing method according to an embodiment.
2 is a view for explaining the manufacturing method of FIG.

EMBODIMENT OF THE INVENTION Hereinafter, this invention is demonstrated in detail based on an Example. BRIEF DESCRIPTION OF THE DRAWINGS It is a flow chart explaining the manufacturing method of the glass substrate for electronic devices which concerns on an Example. In this embodiment, the glass substrate after lamination processing is packaged and transferred to another processing plant, and although the laminated glass substrate which comprises a liquid crystal display is illustrated as a glass substrate, neither is specifically limited.

Hereinafter, if it demonstrates based on FIG. 1, in this Example, a glass base material GL is processed and NxM liquid crystal display is manufactured. That is, the glass base material GL of a process target is the laminated glass substrate GL in which the display cell CEL ... CEL of a liquid crystal display was formed in the vertical and horizontal direction. The laminated glass substrate GL has liquid crystals encapsulated between a first substrate G1 having a color filter provided on an inner surface side thereof and a second substrate G2 on which an array of transistors is arranged on an inner surface side thereof. CEL) is configured.

The laminated glass substrate GL is immersed in an etchant in a state where the peripheral edges of the first substrate G1 and the second substrate G2 are sealed, and the glass surface thereof is chemically polished. As a result, the glass surface is appropriately roughened (ST1). Moreover, the laminated glass substrate GL can be appropriately thinned by this chemical polishing process ST1. Preferably the plate | board thickness of the laminated glass substrate GL provided to coating process ST2 is 1.0 mm or less, More preferably, it is about 0.5-0.7 mm.

Next, the conductive polymer LAY is applied to the surface of the first glass substrate G1 using the slit coater to the laminated glass substrate GL which has been cleaned of the glass substrate GL and the removal of the sealing material (ST2). : See FIG. 2 (a)). In this embodiment, a polythiophene-based conductive polymer is used, and is set so as to have a light transmittance of 80% or more in the total light transmittance of the glass substrate G1 in the dry state subjected to the dry drying process (ST3). In addition, per unit area [cm 2] of the coated surface, the optimum resistivity in the range of 300? Moreover, the surface pencil hardness of the glass substrate G1 of a dry state is set so that it may become about B-6H corresponding to resistivity.

Subsequently, lamination processing is performed on the laminated glass substrate GL by adhering a pair of protective films Fi1 and Fi2 to be covered (ST4). On the other hand, it is preferable that dry cleaning process ST3 and the lamination process ST4 are performed in a clean room. Although the raw material of a protective film is not specifically limited, In this Example, what apply | coated the acrylic adhesive to the polyester film is adhere | attached on the front and back surface of the laminated glass substrate GL, respectively.

Although the adhesive force of a protective film and a glass substrate becomes a problem here, it is a problem even if it is too strong and too weak, and the adhesion layer which becomes an optimal adhesive force is formed. Specifically, in the peeling test (peel rate 300 mm / min) in the 180 degree direction in the adhesion area of 25 mm x 25 mm of the protective film Fi1 in the state which stuck the protective film Fi1 to the glass substrate G1, The adhesive force of a protective film is set in the range of 1.5-3.5 [N / 25mm].

The film thicknesses of the protective films Fi1 and Fi2 are preferably as thin as possible in a range that does not impair workability or moisture resistance. Specifically, the thickness of the protective films Fi1 and Fi2 is preferably 50 μm or less, and more preferably 10 to 50 film thickness. A film material of 탆 is used. On the other hand, when it is less than 10 micrometers, a bonding operation is difficult.

As a result, after the bonding work ST4 is finished, a plurality of laminated glass substrates having been laminated can be packaged and shipped to other processing plants. That is, according to this embodiment, since the electrically conductive film which is easy to be damaged is reliably protected, it is not necessary to complete | finish all the processing processes in the same factory, and such a point also becomes a big advantage. On the other hand, the assembly work in the same factory is not denied, of course.

Based on this point, a description will be given here on the premise of the packaging and shipping process. In the other processing plants that have finished the work, the laminated glass substrates (GL, ..., GL) having been laminated are taken out, and each laminated glass substrate is removed. A scribe line is formed on the front side and the back side of the GL to cut out each display cell region CEL (ST5 to ST6). FIG. 2B illustrates a scribe line (CUT) formed vertically and horizontally, and after forming the first scribe line on the first surface, the second scribe line is formed on the corresponding position of the second surface to form a laminated glass substrate ( GL) is cut together with the protective films Fi1, Fi2.

On the other hand, in this embodiment, since the plate | board thickness of glass substrate GL is 1.0 mm or less, and the film thickness of protective films Fi1 and Fi2 is 50 micrometers or less, the cutter blade of a rotary cutter is made into a protective film (with a pressure of about 8N). Each display cell area CEL can be cut out by pressing and scanning against Fi).

In this way, when the process of cutting and separating is completed, an ion blower process is performed (ST7). Here, an ion blower process is a process which removes foreign substances, such as dust, while static electricity which may be charged to the protective film by spraying ion to the workpiece | work CEL (each cut | bonded laminated glass substrate). On the other hand, even if the glass cullet is generated by the cutting and separating treatment, and this remains, the glass cullet is only attached to the protective film, and thus no problem occurs.

After the ion blower treatment is completed, the protective films Fi1 and Fi2 are subsequently peeled off (ST8). Although this peeling process is performed artificially, since the adhesive strength of the protective film Fi1 is set suitably, there is no difficulty in especially working.

Finally, when the polarizing sheets are adhered to the front and back surfaces of the workpiece CEL, the liquid crystal display is completed (ST9).

As mentioned above, although one Example of this invention was described concretely, the specific content of description does not specifically limit this invention.

ST2 first process
ST4 second process
ST5 ~ ST6 third process
ST8 fourth process
ST9 fifth process

Claims (11)

A glass substrate divided into a plurality of use areas, comprising: a first step of forming a thin film layer on one or both of front and back surfaces;
A second step of covering the entire glass substrate with a protective film to contain the glass substrate having finished the first step;
A third step of mechanically cutting and separating the glass substrate together with the protective film for each of the plurality of use areas while being covered with the protective film;
A fourth step of peeling off the protective film from each glass substrate separated by cutting; And
And a fifth step of adhering the sheet material to one or both of the front and back surfaces with respect to the glass substrate on which the protective film has been peeled off. The method of claim 1,
Before performing the said 1st process, the surface treatment which makes an etching liquid contact the surface of the glass substrate in which a thin film layer is formed is performed, The manufacturing method of the glass substrate for electronic devices characterized by the above-mentioned. The method according to claim 1 or 2,
In the first step, the conductive thin film layer is formed on one side of the front and back of the glass substrate, the manufacturing method of the glass substrate for an electronic device. The method of claim 3,
The thin film layer is formed by coating a conductive polymer solution, and has a resistivity of 300 Ω to 3000 MΩ / □. 5. The method according to any one of claims 1 to 4,
The surface pencil hardness of the glass substrate which finished the said 1st process is B-6H, The manufacturing method of the glass substrate for electronic devices characterized by the above-mentioned. 5. The method according to any one of claims 1 to 4,
In the second step, the protective film is adhered to the glass substrate, the manufacturing method of the glass substrate for an electronic device. The method of claim 5,
When the peeling test (peel speed 300mm / min) was performed in the direction of 180 ° from the adhesive area of 25 mm × 25 mm in the state where the protective film was stuck to the glass substrate, the adhesive force of the protective film was 1.5 to 3.5 [N]. The manufacturing method of the glass substrate for electronic devices characterized by the above-mentioned. 8. The method according to any one of claims 1 to 7,
The protective film is 10-50 micrometers in film thickness, The manufacturing method of the glass substrate for electronic devices characterized by the above-mentioned. The method according to any one of claims 1 to 8,
The glass substrate has a plate | board thickness of 1.0 mm or less, The manufacturing method of the glass substrate for electronic devices characterized by the above-mentioned. 10. The method according to any one of claims 1 to 9,
A glass substrate is a liquid crystal glass substrate formed by joining two glass substrates, and the sheet material is bonded to two glass substrate surfaces as a polarizing film material, respectively. 11. The method according to any one of claims 1 to 10,
The glass substrate which completed the said 3rd process is supplied to the said 4th process through the dry cleaning process by an ion blower or ultrasonic cleaning, The manufacturing method of the glass substrate for electronic devices characterized by the above-mentioned.

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