JPS6298638A - Die-bonding device - Google Patents

Die-bonding device

Info

Publication number
JPS6298638A
JPS6298638A JP23819685A JP23819685A JPS6298638A JP S6298638 A JPS6298638 A JP S6298638A JP 23819685 A JP23819685 A JP 23819685A JP 23819685 A JP23819685 A JP 23819685A JP S6298638 A JPS6298638 A JP S6298638A
Authority
JP
Japan
Prior art keywords
die
needle
push
thrust
peripheral
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP23819685A
Other languages
Japanese (ja)
Other versions
JPH0354858B2 (en
Inventor
Kazuo Sugiura
一夫 杉浦
Nobuhito Yamazaki
山崎 信人
Takatoshi Kawamura
敬人志 河村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP23819685A priority Critical patent/JPS6298638A/en
Publication of JPS6298638A publication Critical patent/JPS6298638A/en
Publication of JPH0354858B2 publication Critical patent/JPH0354858B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H01L2221/68322Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support

Abstract

PURPOSE:To prevent a break, a crack and a misattraction from being generated in and to a die by a method wherein, in the cylinder constituted with the center thrust-up needle as its center, the thrust-up cylindrical body arranged so as to be movable vertically is provided between the attracting bodies and the center thrust-up needle and a plurality of peripheral thrust-up needles arranged so as to be movable vertically are provided outside of this thrust-up cylindrical body. CONSTITUTION:A thrust-up cylindrical body 10 is first made to ascend, whereby the four corners of a die 1 are peeled already from a wafer sheet 2. Then, a center thrust-up needle 4 and peripheral thrust-up needles 11 only are made to ascend and thrust up the die 1, whereby the die 1 is placed on the center thrust-up needle 4 and the peripheral thrust-up needles 11. At this time, attracting nozzles 6 keep a slight gap between the die 1 to be attracted. Since the die 1 is placed on the needle 4 and the needles 11 in such a way, the die is attracted to the attracting nozzles 6 by the suction force of the nozzles 6.

Description

【発明の詳細な説明】 [産業上の利用分野] 本発明は、ウェハーシートを吸着体で吸着している状態
でウェハーシート上のダイを中心突き上げ針で突j上げ
、この突き上げられたダイを吸着ノズルで吸着して移送
するダイボンデイング装置に関する。
[Detailed Description of the Invention] [Field of Industrial Application] The present invention involves pushing up a die on a wafer sheet with a central push-up needle while the wafer sheet is being attracted by an adsorbent, and lifting up the pushed-up die. The present invention relates to a die bonding device that uses a suction nozzle to adsorb and transfer.

[従来の技術] 従来、かかるダイボンデイング装置として、吸着ノズル
の吸着面が、第4図に示すように平型のもの(例えば特
開昭54−58356号公報参照)と、第5図に示すよ
うに角錐型のものが知られている。
[Prior Art] Conventionally, such die bonding apparatuses have a flat type in which the suction surface of the suction nozzle is shown in FIG. Pyramid-shaped ones are known.

第4図及び第5図において、ダイ1が粘着されたウェハ
ーシート2はxY方向に移動する図示しない枠体に固定
されている。ウニハルシート2のf方には真空孔3aが
形成された吸着体3が配設されており、この吸着体3の
中央部にダイlを突きLげる中心突き上げ針4が配設さ
れている。前記中心突きヒげ針4のに方には突き上げら
れたダイlを真空によって吸着する吸着面が平型の吸着
ノズル5または角錐型の吸着ノズル6が上下動及びXY
方向移動町ス屯に配設されており、吸着ノズル5.6は
図示しないスプリングでF方に付勢されている。
In FIGS. 4 and 5, the wafer sheet 2 to which the die 1 is attached is fixed to a frame (not shown) that moves in the x and Y directions. An adsorbent 3 in which a vacuum hole 3a is formed is disposed on the f side of the unihull sheet 2, and a central push-up needle 4 for pushing a die I is disposed in the center of the adsorbent 3. A suction nozzle 5 with a flat suction surface or a suction nozzle 6 with a pyramidal suction surface, which suctions the thrust-up die l by vacuum, is placed on the side of the center needle 4 for vertical and XY movement.
The suction nozzle 5.6 is biased in the F direction by a spring (not shown).

次にかかる装置の作動を簡単に説明する。ここで、第5
図は吸着ミスの場合を示す、まず第4図(a)及び第5
図(a)に示すように、ウェハーシート2を吸着体3で
吸着し、また吸着ノズル5.6の先端とダイlの表面が
わずかな隙間S1(約0.01−0.1mm)(第4図
の場合)、吸着ノズル6の角錐内面と吸着されるダイl
とのSz(約0.3〜0.5mm)(第5図の場合)を
有するように吸着ノズル5.6が下降する。前記隙間S
1、Szは吸着ノズル6が下降してダイ1に衝撃荷重を
加えないために設けられている。次に第4図(b)  
(c)及び第5図(b)(c)に示すように、中心突き
−Lげ針4が上昇してダイlを突き七げ、ダイlは吸着
ノズル5,6に吸着される。この時、吸着ノズル5.6
は吸着ノズル5をド方に付勢しているスプリングに抗し
てダイlと共に上昇させられる。その後第4図(d)及
び第5図(d)に示すように由心突き上げ針4が下降す
る。
Next, the operation of this device will be briefly explained. Here, the fifth
The figure shows the case of suction error. First, Figures 4(a) and 5
As shown in FIG. 4), the pyramidal inner surface of the suction nozzle 6 and the die l to be suctioned
The suction nozzle 5.6 is lowered so as to have a Sz (approximately 0.3 to 0.5 mm) (in the case of FIG. 5). The gap S
1, Sz is provided to prevent the suction nozzle 6 from descending and applying an impact load to the die 1. Next, Figure 4(b)
As shown in FIG. 5(c) and FIGS. 5(b) and 5(c), the central punching needle 4 rises and punches the die 1, and the die 1 is sucked by the suction nozzles 5 and 6. At this time, suction nozzle 5.6
is raised together with the die 1 against the spring that urges the suction nozzle 5 in the opposite direction. Thereafter, as shown in FIGS. 4(d) and 5(d), the pivot needle 4 descends.

し発明が解決しようとする問題点] 第4図に示す平型の吸着ノズル5は、その吸着面がフラ
ットに形成されていること及び吸着ノズル5とダイlと
の隙間Stが約0.01〜0.1mmと非常に小さいこ
とにより、中心突き上げ針4で突き」二げられたダイl
は水平状態で吸着ノズル5に当接して吸着されるので、
吸着ミスを起すことはない。
Problems to be Solved by the Invention] The flat suction nozzle 5 shown in FIG. 4 has a flat suction surface and a gap St between the suction nozzle 5 and the die l of approximately 0.01. Due to the extremely small size of ~0.1mm, the die l was punched with the center punching needle 4.
is in contact with the suction nozzle 5 in a horizontal state and is suctioned, so
No suction mistakes will occur.

しかし、この吸着ノズル5は、吸着面がフラットである
ので、吸着ノズル5に対するダイ1の位置ずれが修正さ
れない、またダイlのパターン表面に接触するので、ダ
イ1表面に傷が付き易い。
However, since the suction nozzle 5 has a flat suction surface, the positional deviation of the die 1 with respect to the suction nozzle 5 is not corrected, and since it comes into contact with the pattern surface of the die 1, the surface of the die 1 is easily damaged.

特に近来、ICパターンの微細化に伴い、グイ1表面の
傷が問題になりつつある。これらのことより、一般に第
5図に示す角錐型の吸着ノズル6が用いられている。
Particularly in recent years, with the miniaturization of IC patterns, scratches on the surface of the gooey 1 are becoming a problem. For these reasons, a pyramid-shaped suction nozzle 6 shown in FIG. 5 is generally used.

しかし、第5図に示す角錐型の吸着ノズル6の場合は、
中心突き上げ針4と吸着ノズル6とでダイlをサンドイ
ッチした状態で突き上げ分離するので、ダイlのエツジ
に割れ、欠けが発生するという問題点があった。
However, in the case of the pyramid-shaped suction nozzle 6 shown in FIG.
Since the die 1 is sandwiched between the central push-up needle 4 and the suction nozzle 6 and then pushed up and separated, there is a problem that cracks and chips occur at the edges of the die 1.

また第5図(a)より明らかなように、吸着ノズル6の
先端がダイlの表面よりわずかな隙間を有するように下
降した時、吸着ノズル6の角錐内面と吸着されるダイ1
との隙間S2が約0.3〜0.5mmと犬きくなるので
、次に同図(b)(C)に示すように中心突き一ヒげ針
4で突き上げられたダイlが傾いて吸着ノズル6に当接
することが多い。このようにダイlが傾いて吸着ノズル
6に当接すると、ダイlの外周と吸着ノズル6との間に
わずかな隙間が生じ、この隙間より真空もれが生じるの
で、吸着ミスを起し、うまくウェハーシート2よりダイ
lを分離できなくなるという間四点があった。
Furthermore, as is clear from FIG. 5(a), when the tip of the suction nozzle 6 descends so that there is a slight gap from the surface of the die 1, the die 1 is attracted to the pyramidal inner surface of the suction nozzle 6.
Since the gap S2 between the two and It often comes into contact with the nozzle 6. When the die l is tilted and comes into contact with the suction nozzle 6 in this way, a slight gap is created between the outer periphery of the die l and the suction nozzle 6, and vacuum leakage occurs from this gap, causing a suction error. There were four points where the die 1 could not be successfully separated from the wafer sheet 2.

本発明の目的は、ダイの欠け、割れ及び吸着ミスが生じ
ないで、ウェハーシートからダイを良好に分離すること
ができるダイポンディング装置を提供することにある。
SUMMARY OF THE INVENTION An object of the present invention is to provide a die bonding device that can effectively separate die from a wafer sheet without chipping, cracking, or adsorption errors in the die.

[問題点を解決するための手段] に記従来技術の問題点を解消するための本発明の構成を
実施例に対応する第1図及び第2図にょつて説1月する
。吸着体3と中心突き上げ針4間には、中心突き上げ針
4を中心とする筒状の突き上げ筒体10がヒ下動可能に
配設されている。また突き一ヒげ筒体10の外側にはダ
イ1の周辺部を突きEげるように4木の周辺突き上げ針
11が上下動nT(@に配設されている。
[Means for Solving the Problems] The structure of the present invention for solving the problems of the prior art will be explained below with reference to FIGS. 1 and 2, which correspond to embodiments. A cylindrical push-up cylinder 10 centered on the center push-up needle 4 is disposed between the suction body 3 and the center push-up needle 4 so as to be movable downward. Further, on the outside of the stabbing cylinder 10, four peripheral pushing needles 11 are arranged in a vertical movement nT (@) so as to stab the peripheral part of the die 1.

[作用] 第1図(b)に示すように先ず突き上げ筒体lOが1:
昇する。これよってダイlの四隅はウェハーシート2よ
り既にはがされる。次に同図(C)のように中心突き上
げ針4及び周辺突きとげ針11のみが一上昇しダイlを
突き上げる。これによりダイ1は中心突き上げ針4及び
周辺突き一ヒげ針11−ヒに載置される。この時吸着ノ
ズル6は吸着されるダイlとわずかな隙間を保っている
。このように、ダイlは中心突きヒげ針4及び周辺突き
上げ針ll上に載置されているので、同図(d)に示す
ように吸着ノズル6の吸引力により吸着ノズル6に吸着
される。
[Operation] As shown in FIG. 1(b), first, the push-up cylinder lO is 1:
rise As a result, the four corners of the die l have already been peeled off from the wafer sheet 2. Next, as shown in FIG. 4(C), only the central push-up needle 4 and the peripheral push-up needle 11 rise one level to push up the die 1. As a result, the die 1 is placed on the central push-up needle 4 and the peripheral push-up needles 11-h. At this time, the suction nozzle 6 maintains a small gap with the die l to be suctioned. In this way, since the die l is placed on the central thrust needle 4 and the peripheral thrust needle ll, it is attracted to the suction nozzle 6 by the suction force of the suction nozzle 6, as shown in FIG. .

[実施例] 以下1本発明の一実施例を第1図及び第2図により説明
する。なお、第4図及び第5図と同じまたは相当部材に
は同一符号を付し、その説明を省略する。吸着体3と中
心突き上げ針4間には、中心突き一ヒげ針4を中心とす
る筒状の突き上げ筒体lOが上下動可能に配設されてい
る。また突き上げ筒体10の外側にはダイlの周辺部を
突き上げるように4木の周辺突き上げ針11が上下動可
能に配設されている。ここで、前記突き上げ筒体lOに
よりダイlを突き上げた後、中心突き−Lげ針4及び周
辺突き上げ針11で更にダイ1を突き上げるようになっ
ている。
[Example] An example of the present invention will be described below with reference to FIGS. 1 and 2. Note that the same or equivalent members as in FIGS. 4 and 5 are designated by the same reference numerals, and their explanations will be omitted. Between the suction body 3 and the center push-up needle 4, a cylindrical push-up cylinder 10 centered on the center push-up needle 4 is arranged so as to be movable up and down. Further, on the outside of the push-up cylinder 10, four peripheral push-up needles 11 are arranged so as to be movable up and down so as to push up the peripheral portion of the die l. Here, after the die 1 is pushed up by the push-up cylinder lO, the die 1 is further pushed up by the center push-up needle 4 and the peripheral push-up needle 11.

次に作用について説明する。第1図(L)に示すように
、吸着体3でウニl\−シート2を吸着した状態で、同
図(b)に示すように突き上げ筒体101周辺突き上げ
針11及び中心突き上げ針4がわずかに上昇し、ピック
アップされるダイ1を突き上げ筒体10でわずかに突き
上げる。このように、突き上げ筒体10でダイ1をわず
かに突き上げると、ダイlの四隅はウニl\−シート2
からはがれる。この時、中心突き上げ針4及び周辺突き
一ヒげ針11の先端は突き上げ筒体10の上面より突出
していない状態にある。前記動作と同時またはその後も
しくは前に、吸着ノズル6が下降し、吸着ノズル6の角
錐内面と吸着されるダイlとは大きな隙間S3を保つ。
Next, the effect will be explained. As shown in FIG. 1(L), with the sea urchin l\-sheet 2 being adsorbed by the suction body 3, as shown in FIG. The die 1 to be picked up is pushed up slightly by the cylindrical body 10. In this way, when the die 1 is pushed up slightly with the push-up cylinder 10, the four corners of the die 1
It can be peeled off. At this time, the tips of the central push-up needle 4 and the peripheral push-up needles 11 are not protruding from the upper surface of the push-up cylinder 10. Simultaneously with, after, or before the above operation, the suction nozzle 6 descends, and a large gap S3 is maintained between the pyramidal inner surface of the suction nozzle 6 and the die l to be suctioned.

次に同図(C)に示すように、中心突き上げ針4及び周
辺突き上げ針11のみが更にトイする。
Next, as shown in the same figure (C), only the center push-up needle 4 and the peripheral push-up needle 11 are further toyed.

これにより、ダイlのみが上方に突き上げられ、ダイl
はウェハーシート2より分離される。この場合、吸着さ
れるダイ1は中心突きヒげ針4及び周辺突き上げ針11
によって隣接するダイlより上方に突き一ヒげられてい
るので、吸着ノズル6の下面は隣接するダイlに当らな
く、吸着されるダイ1と吸着ノズル6の角錐内面との隙
間S、は0゜01−0.1mm程度のわずかな隙間にす
ることができる。
As a result, only the die l is pushed upward, and the die l
is separated from the wafer sheet 2. In this case, the die 1 to be sucked has a central push-up needle 4 and a peripheral push-up needle 11.
, the lower surface of the suction nozzle 6 does not hit the adjacent die l, and the gap S between the sucked die 1 and the pyramidal inner surface of the suction nozzle 6 is 0. The gap can be as small as 0.01-0.1 mm.

このように、吸着されるダイlはウェハーシート2より
分離され、中心突き一ヒげ針4及び周辺突き上げ針11
上にJi!、置された状態にあるので、吸γiノズル6
の吸引力により、同図(d)に示すように吸着ノズル6
に吸着される。その後、同図(e)に示すように、突き
上げ筒体lO1中心突き一ヒげ針4及び周辺突き一ヒげ
針11はウェハーシート2の下方に下降する。
In this way, the die l to be sucked is separated from the wafer sheet 2, and the center punching needle 4 and the peripheral punching needle 11
Ji on top! , so the suction γi nozzle 6
Due to the suction force of the suction nozzle 6 as shown in the same figure (d),
is adsorbed to. Thereafter, as shown in FIG. 2(e), the thrusting cylinder lO1, the central thrusting needle 4, and the peripheral thrusting needle 11 descend below the wafer sheet 2.

以上の説明から明らかなように、同図(b)の工程によ
ってダイlの四隅はウェハーシート2より既にはがされ
ているので、同図(C)のように中心突き上げ針4及び
周辺突き上げ針11でダイlを突き上げる場合、ウェハ
ーシート2よりダイlは分離し易い。また同図(C)に
示すように、中心突き一ヒげ針4及び周辺突き丘げ針1
1上に截置されているダイlを同図(d)に示すように
吸着ノズル6の吸引力により吸着するので、ダイlの欠
け、割れが生じることがない、また同図(C)の状態に
おいては、ダイlと吸着ノズル6の角錐内面との隙間を
非常に小さくできるので、ダイlが傾くことがなく吸着
ノズル6に吸着され、吸着ミスが生じない。
As is clear from the above explanation, the four corners of the die 1 have already been peeled off from the wafer sheet 2 by the process shown in FIG. When the die l is pushed up by the wafer sheet 11, the die l is more easily separated from the wafer sheet 2. In addition, as shown in the same figure (C), a central needle 4 and a peripheral needle 1
Since the die l cut out on the die l is adsorbed by the suction force of the suction nozzle 6 as shown in the same figure (d), the die l will not be chipped or cracked. In this state, the gap between the die 1 and the pyramidal inner surface of the suction nozzle 6 can be made very small, so the die 1 is attracted to the suction nozzle 6 without tilting, and no suction errors occur.

第3図は本発明の他の実施例を示す、上記実施例におい
ては、周辺突きヒげ針11を4木配設した場合について
説明したが、この周辺突き一トげ針11の本数はダイl
を安定して支持できる本数であればよく、その本数は特
に限定されない0例えば第3図(a)に示すように3本
でも、また同図(b)に示すように8木でもよい。
FIG. 3 shows another embodiment of the present invention. In the above embodiment, the case where four peripheral prick needles 11 are arranged is explained, but the number of peripheral prick needles 11 can be adjusted as needed. l
The number of trees is not particularly limited as long as it can stably support the tree.For example, it may be three as shown in FIG. 3(a), or eight as shown in FIG. 3(b).

なお、上記実施例においては、中心突き一ヒげ針4及び
周辺突き上げ針11は、同図(b)(c)の工程を経て
上昇したが、同図(b)の工程においては突き上げ筒体
10のみが上昇し、その後同図(C)のように中心突き
上げ針4及び周辺突きLげ針11のみが上昇してもよい
、また本発明は吸着面が角錐をなす吸着ノズル6の場合
に効果が著しいが、第4図に示すように吸着面がフラッ
トな吸着ノズル5の場合も適用できることは勿論である
。また図示の実施例においては、突き上げ筒体10を円
筒状に形成したが、角状でもよい。
In the above embodiment, the center thrust needle 4 and the peripheral thrust needle 11 were raised through the steps shown in FIG. 10 may be raised, and then only the central thrusting needle 4 and the peripheral thrusting needle 11 may be raised as shown in FIG. Although the effect is remarkable, it goes without saying that it can also be applied to the suction nozzle 5 with a flat suction surface as shown in FIG. Further, in the illustrated embodiment, the push-up cylinder 10 is formed in a cylindrical shape, but it may also be angular.

[発明の効果] 以上の説明から明らかなように、本発明によれば、中心
突き上げ針を中心とする筒で吸着体と前記中心突き七げ
針の間に上下動可能に配設された突きトげ筒体と、この
突きLげ筒体の外側に上下動可能に配設された複数本の
周辺突き一ヒげ針とを備えているので、ダイの欠け1割
れ及び吸着ミスが生じないで、ウェハーシートからダイ
を良好に分離することができる。
[Effects of the Invention] As is clear from the above description, according to the present invention, the thruster is arranged such that it can move up and down between the adsorbent body and the center thruster needle with a cylinder centered on the central thruster needle. Equipped with a barbed cylinder and a plurality of peripheral stabbing needles that are movable up and down on the outside of this stabbing L barbed body, no die chipping or suction errors occur. This allows good separation of the die from the wafer sheet.

【図面の簡単な説明】[Brief explanation of drawings]

第1図(a)乃至(止)は本発明の一実施例を示す動作
説明図、第2図は第1図のA−A線断面図、第3図(a
)  (b)は本発明の他の実施例を示す周辺突き上げ
針の配近因、第4図(a)乃至(d)及び第5図(a)
乃至(d)はそれぞれ従来例の動作説明図である。 l:ダイ、       2:ウェハーシート、3:吸
着体、      4:中心突き上げ針、5.6:吸着
ノズル、  10:突き上げ筒体、ll二周辺突き上げ
針。
1(a) to (stop) are operation explanatory diagrams showing one embodiment of the present invention, FIG. 2 is a sectional view taken along the line A-A in FIG. 1, and FIG.
) (b) shows the proximal causes of peripheral thrusting needles showing other embodiments of the present invention, FIGS. 4(a) to (d) and FIG. 5(a)
7(d) are respectively explanatory diagrams of the operation of the conventional example. 1: die, 2: wafer sheet, 3: suction body, 4: central push-up needle, 5.6: suction nozzle, 10: push-up cylinder, ll two peripheral push-up needles.

Claims (1)

【特許請求の範囲】[Claims] ダイが粘着されたウエハーシートを吸着する吸着体と、
この吸着体の内部に配設され吸着体でウエハーシートを
吸着している状態でウエハーシート上のダイを突き上げ
る中心突き上げ針と、突き上げられたダイを吸着して移
送する吸着ノズルとを備えたダイボンデイング装置にお
いて、前記中心突き上げ針を中心とする筒で前記吸着体
と前記中心突き上げ針の間に上下動可能に配設された突
き上げ筒体と、この突き上げ筒体の外側に上下動可能に
配設された複数本の周辺突き上げ針とを備えていること
を特徴とするダイボンデイング装置。
an adsorbent that adsorbs the wafer sheet to which the die is attached;
A die is provided with a central push-up needle that is disposed inside the suction body and pushes up the die on the wafer sheet while the suction body is sucking the wafer sheet, and a suction nozzle that sucks and transfers the pushed-up die. In the bonding device, a push-up cylinder is provided with a cylinder centered on the center push-up needle and is vertically movably arranged between the adsorbent body and the center push-up needle, and a push-up cylinder is arranged outside of the push-up cylinder so as to be vertically movable. A die bonding device comprising a plurality of peripheral push-up needles.
JP23819685A 1985-10-24 1985-10-24 Die-bonding device Granted JPS6298638A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23819685A JPS6298638A (en) 1985-10-24 1985-10-24 Die-bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23819685A JPS6298638A (en) 1985-10-24 1985-10-24 Die-bonding device

Publications (2)

Publication Number Publication Date
JPS6298638A true JPS6298638A (en) 1987-05-08
JPH0354858B2 JPH0354858B2 (en) 1991-08-21

Family

ID=17026585

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23819685A Granted JPS6298638A (en) 1985-10-24 1985-10-24 Die-bonding device

Country Status (1)

Country Link
JP (1) JPS6298638A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0224549U (en) * 1988-07-29 1990-02-19
US4907790A (en) * 1987-12-15 1990-03-13 Kabushiki Kaisha Shinkawa Pellet-lifting apparatus
JPH0376139A (en) * 1989-08-18 1991-04-02 Nec Corp Upward pushing movement of semiconductor element
JPH04137043U (en) * 1991-06-12 1992-12-21 山形日本電気株式会社 Die push-up mechanism of semiconductor die bonding equipment
US7238258B2 (en) * 2005-04-22 2007-07-03 Stats Chippac Ltd. System for peeling semiconductor chips from tape
US7445688B2 (en) * 2003-07-09 2008-11-04 Tdk Corporation Method and apparatus for picking up work piece and mounting machine
WO2009056469A1 (en) * 2007-10-31 2009-05-07 Oerlikon Assembly Equipment Ag, Steinhausen Foil perforating needle for detaching a small die from a foil
JP2010165835A (en) * 2009-01-15 2010-07-29 Tdk Corp Pickup method and pickup device for electronic component

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4907790A (en) * 1987-12-15 1990-03-13 Kabushiki Kaisha Shinkawa Pellet-lifting apparatus
JPH0224549U (en) * 1988-07-29 1990-02-19
JPH0625963Y2 (en) * 1988-07-29 1994-07-06 松下電器産業株式会社 Electronic component mounting device
JPH0376139A (en) * 1989-08-18 1991-04-02 Nec Corp Upward pushing movement of semiconductor element
JPH04137043U (en) * 1991-06-12 1992-12-21 山形日本電気株式会社 Die push-up mechanism of semiconductor die bonding equipment
US7445688B2 (en) * 2003-07-09 2008-11-04 Tdk Corporation Method and apparatus for picking up work piece and mounting machine
US7238258B2 (en) * 2005-04-22 2007-07-03 Stats Chippac Ltd. System for peeling semiconductor chips from tape
WO2009056469A1 (en) * 2007-10-31 2009-05-07 Oerlikon Assembly Equipment Ag, Steinhausen Foil perforating needle for detaching a small die from a foil
JP2010165835A (en) * 2009-01-15 2010-07-29 Tdk Corp Pickup method and pickup device for electronic component

Also Published As

Publication number Publication date
JPH0354858B2 (en) 1991-08-21

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