JPS6298638A - Die-bonding device - Google Patents

Abstract

PURPOSE:To prevent a break, a crack and a misattraction from being generated in and to a die by a method wherein, in the cylinder constituted with the center thrust-up needle as its center, the thrust-up cylindrical body arranged so as to be movable vertically is provided between the attracting bodies and the center thrust-up needle and a plurality of peripheral thrust-up needles arranged so as to be movable vertically are provided outside of this thrust-up cylindrical body. CONSTITUTION:A thrust-up cylindrical body 10 is first made to ascend, whereby the four corners of a die 1 are peeled already from a wafer sheet 2. Then, a center thrust-up needle 4 and peripheral thrust-up needles 11 only are made to ascend and thrust up the die 1, whereby the die 1 is placed on the center thrust-up needle 4 and the peripheral thrust-up needles 11. At this time, attracting nozzles 6 keep a slight gap between the die 1 to be attracted. Since the die 1 is placed on the needle 4 and the needles 11 in such a way, the die is attracted to the attracting nozzles 6 by the suction force of the nozzles 6.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention involves pushing up a die on a wafer sheet with a central push-up needle while the wafer sheet is being attracted by an adsorbent, and lifting up the pushed-up die. The present invention relates to a die bonding device that uses a suction nozzle to adsorb and transfer.

[Prior Art] Conventionally, such die bonding apparatuses have a flat type in which the suction surface of the suction nozzle is shown in FIG. Pyramid-shaped ones are known.

In FIGS. 4 and 5, the wafer sheet 2 to which the die 1 is attached is fixed to a frame (not shown) that moves in the x and Y directions. An adsorbent 3 in which a vacuum hole 3a is formed is disposed on the f side of the unihull sheet 2, and a central push-up needle 4 for pushing a die I is disposed in the center of the adsorbent 3. A suction nozzle 5 with a flat suction surface or a suction nozzle 6 with a pyramidal suction surface, which suctions the thrust-up die l by vacuum, is placed on the side of the center needle 4 for vertical and XY movement.
The suction nozzle 5.6 is biased in the F direction by a spring (not shown).

Next, the operation of this device will be briefly explained. Here, the fifth
The figure shows the case of suction error. First, Figures 4(a) and 5
As shown in FIG. 4), the pyramidal inner surface of the suction nozzle 6 and the die l to be suctioned
The suction nozzle 5.6 is lowered so as to have a Sz (approximately 0.3 to 0.5 mm) (in the case of FIG. 5). The gap S
1, Sz is provided to prevent the suction nozzle 6 from descending and applying an impact load to the die 1. Next, Figure 4(b)
As shown in FIG. 5(c) and FIGS. 5(b) and 5(c), the central punching needle 4 rises and punches the die 1, and the die 1 is sucked by the suction nozzles 5 and 6. At this time, suction nozzle 5.6
is raised together with the die 1 against the spring that urges the suction nozzle 5 in the opposite direction. Thereafter, as shown in FIGS. 4(d) and 5(d), the pivot needle 4 descends.

Problems to be Solved by the Invention] The flat suction nozzle 5 shown in FIG. 4 has a flat suction surface and a gap St between the suction nozzle 5 and the die l of approximately 0.01. Due to the extremely small size of ~0.1mm, the die l was punched with the center punching needle 4.
is in contact with the suction nozzle 5 in a horizontal state and is suctioned, so
No suction mistakes will occur.

However, since the suction nozzle 5 has a flat suction surface, the positional deviation of the die 1 with respect to the suction nozzle 5 is not corrected, and since it comes into contact with the pattern surface of the die 1, the surface of the die 1 is easily damaged.

Particularly in recent years, with the miniaturization of IC patterns, scratches on the surface of the gooey 1 are becoming a problem. For these reasons, a pyramid-shaped suction nozzle 6 shown in FIG. 5 is generally used.

However, in the case of the pyramid-shaped suction nozzle 6 shown in FIG.
Since the die 1 is sandwiched between the central push-up needle 4 and the suction nozzle 6 and then pushed up and separated, there is a problem that cracks and chips occur at the edges of the die 1.

Furthermore, as is clear from FIG. 5(a), when the tip of the suction nozzle 6 descends so that there is a slight gap from the surface of the die 1, the die 1 is attracted to the pyramidal inner surface of the suction nozzle 6.
Since the gap S2 between the two and It often comes into contact with the nozzle 6. When the die l is tilted and comes into contact with the suction nozzle 6 in this way, a slight gap is created between the outer periphery of the die l and the suction nozzle 6, and vacuum leakage occurs from this gap, causing a suction error. There were four points where the die 1 could not be successfully separated from the wafer sheet 2.

SUMMARY OF THE INVENTION An object of the present invention is to provide a die bonding device that can effectively separate die from a wafer sheet without chipping, cracking, or adsorption errors in the die.

[Means for Solving the Problems] The structure of the present invention for solving the problems of the prior art will be explained below with reference to FIGS. 1 and 2, which correspond to embodiments. A cylindrical push-up cylinder 10 centered on the center push-up needle 4 is disposed between the suction body 3 and the center push-up needle 4 so as to be movable downward. Further, on the outside of the stabbing cylinder 10, four peripheral pushing needles 11 are arranged in a vertical movement nT (@) so as to stab the peripheral part of the die 1.

[Operation] As shown in FIG. 1(b), first, the push-up cylinder lO is 1:
rise As a result, the four corners of the die l have already been peeled off from the wafer sheet 2. Next, as shown in FIG. 4(C), only the central push-up needle 4 and the peripheral push-up needle 11 rise one level to push up the die 1. As a result, the die 1 is placed on the central push-up needle 4 and the peripheral push-up needles 11-h. At this time, the suction nozzle 6 maintains a small gap with the die l to be suctioned. In this way, since the die l is placed on the central thrust needle 4 and the peripheral thrust needle ll, it is attracted to the suction nozzle 6 by the suction force of the suction nozzle 6, as shown in FIG. .

[Example] An example of the present invention will be described below with reference to FIGS. 1 and 2. Note that the same or equivalent members as in FIGS. 4 and 5 are designated by the same reference numerals, and their explanations will be omitted. Between the suction body 3 and the center push-up needle 4, a cylindrical push-up cylinder 10 centered on the center push-up needle 4 is arranged so as to be movable up and down. Further, on the outside of the push-up cylinder 10, four peripheral push-up needles 11 are arranged so as to be movable up and down so as to push up the peripheral portion of the die l. Here, after the die 1 is pushed up by the push-up cylinder lO, the die 1 is further pushed up by the center push-up needle 4 and the peripheral push-up needle 11.

Next, the effect will be explained. As shown in FIG. 1(L), with the sea urchin l\-sheet 2 being adsorbed by the suction body 3, as shown in FIG. The die 1 to be picked up is pushed up slightly by the cylindrical body 10. In this way, when the die 1 is pushed up slightly with the push-up cylinder 10, the four corners of the die 1
It can be peeled off. At this time, the tips of the central push-up needle 4 and the peripheral push-up needles 11 are not protruding from the upper surface of the push-up cylinder 10. Simultaneously with, after, or before the above operation, the suction nozzle 6 descends, and a large gap S3 is maintained between the pyramidal inner surface of the suction nozzle 6 and the die l to be suctioned.

Next, as shown in the same figure (C), only the center push-up needle 4 and the peripheral push-up needle 11 are further toyed.

As a result, only the die l is pushed upward, and the die l
is separated from the wafer sheet 2. In this case, the die 1 to be sucked has a central push-up needle 4 and a peripheral push-up needle 11.
, the lower surface of the suction nozzle 6 does not hit the adjacent die l, and the gap S between the sucked die 1 and the pyramidal inner surface of the suction nozzle 6 is 0. The gap can be as small as 0.01-0.1 mm.

In this way, the die l to be sucked is separated from the wafer sheet 2, and the center punching needle 4 and the peripheral punching needle 11
Ji on top! , so the suction γi nozzle 6
Due to the suction force of the suction nozzle 6 as shown in the same figure (d),
is adsorbed to. Thereafter, as shown in FIG. 2(e), the thrusting cylinder lO1, the central thrusting needle 4, and the peripheral thrusting needle 11 descend below the wafer sheet 2.

As is clear from the above explanation, the four corners of the die 1 have already been peeled off from the wafer sheet 2 by the process shown in FIG. When the die l is pushed up by the wafer sheet 11, the die l is more easily separated from the wafer sheet 2. In addition, as shown in the same figure (C), a central needle 4 and a peripheral needle 1
Since the die l cut out on the die l is adsorbed by the suction force of the suction nozzle 6 as shown in the same figure (d), the die l will not be chipped or cracked. In this state, the gap between the die 1 and the pyramidal inner surface of the suction nozzle 6 can be made very small, so the die 1 is attracted to the suction nozzle 6 without tilting, and no suction errors occur.

FIG. 3 shows another embodiment of the present invention. In the above embodiment, the case where four peripheral prick needles 11 are arranged is explained, but the number of peripheral prick needles 11 can be adjusted as needed. l
The number of trees is not particularly limited as long as it can stably support the tree.For example, it may be three as shown in FIG. 3(a), or eight as shown in FIG. 3(b).

In the above embodiment, the center thrust needle 4 and the peripheral thrust needle 11 were raised through the steps shown in FIG. 10 may be raised, and then only the central thrusting needle 4 and the peripheral thrusting needle 11 may be raised as shown in FIG. Although the effect is remarkable, it goes without saying that it can also be applied to the suction nozzle 5 with a flat suction surface as shown in FIG. Further, in the illustrated embodiment, the push-up cylinder 10 is formed in a cylindrical shape, but it may also be angular.

[Effects of the Invention] As is clear from the above description, according to the present invention, the thruster is arranged such that it can move up and down between the adsorbent body and the center thruster needle with a cylinder centered on the central thruster needle. Equipped with a barbed cylinder and a plurality of peripheral stabbing needles that are movable up and down on the outside of this stabbing L barbed body, no die chipping or suction errors occur. This allows good separation of the die from the wafer sheet.

[Brief explanation of drawings]

1(a) to (stop) are operation explanatory diagrams showing one embodiment of the present invention, FIG. 2 is a sectional view taken along the line A-A in FIG. 1, and FIG.
) (b) shows the proximal causes of peripheral thrusting needles showing other embodiments of the present invention, FIGS. 4(a) to (d) and FIG. 5(a)
7(d) are respectively explanatory diagrams of the operation of the conventional example. 1: die, 2: wafer sheet, 3: suction body, 4: central push-up needle, 5.6: suction nozzle, 10: push-up cylinder, ll two peripheral push-up needles.

Claims (1)

[Claims] an adsorbent that adsorbs the wafer sheet to which the die is attached;
A die is provided with a central push-up needle that is disposed inside the suction body and pushes up the die on the wafer sheet while the suction body is sucking the wafer sheet, and a suction nozzle that sucks and transfers the pushed-up die. In the bonding device, a push-up cylinder is provided with a cylinder centered on the center push-up needle and is vertically movably arranged between the adsorbent body and the center push-up needle, and a push-up cylinder is arranged outside of the push-up cylinder so as to be vertically movable. A die bonding device comprising a plurality of peripheral push-up needles.