JPH07201957A - Wafer tape mounter - Google Patents

Abstract

PURPOSE:To stick to wafers having different dimensions without replacing a wafer support table by a method wherein the wafer support table which has a diameter matching the wafer, which has a multi-coaxial structure and which can be moved vertically is made to ascend and descend between a wafer attracting position and a separated retreating position. CONSTITUTION:A wafer tape mounter has an outer table 12 on which a tape is stuck to an 8'' wafer and an inner table 14 which is provided inside the outer table 12 coaxially and on which a tape is stuck to a 6'' wafer. Suction paths 28 are provided so as to pierce through the walls of an outer support part 18 and an inner support part 22 and connected to a negative pressure source. An air path 38 is provided in an outer table board 20 and connected to a pressurized air source. When the tape is stuck to the 8'' wafer, the inner table 14 is made to descend to a retreating position and, when the tape is stuck to the 6'' wafer, the inner table 14 is made to ascend to an attracting position.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer tape mounter used to attach a tape to a wafer before dicing the wafer in a semiconductor device manufacturing process, and more particularly, to replace a wafer support table. The present invention relates to a wafer tape mounter improved so that a single wafer tape mounter can attach tapes to wafers having different sizes.

[0002]

2. Description of the Related Art In a semiconductor manufacturing process, a dicing process is known in which a kerf is formed in a wafer in order to divide the wafer into individual dies. As a semiconductor assembling apparatus used in such a dicing process, there is one having a configuration including a wafer tape mounter for sticking a tape onto a wafer and a dicing apparatus or a dicer for cutting the wafer with a blade rotating at high speed. Are known.

The wafer tape mounter is a device used for sticking the tape in close contact with the entire surface of the wafer without generating bubbles between the tape and the wafer. And a wafer support table that holds the wafer by the wafer suction means provided on the upper surface of the support section and pressurizes the wafer outward by introducing pressurized air into the support section. And a tape adhering means for adhering a sheet-shaped tape to the formed wafer. Below, FIG. 4 and FIG.
A conventional wafer tape mounter will be described with reference to FIG.

FIG. 4 is a perspective view showing a wafer supporting table and a tape attaching means of a conventional wafer tape mounter in a semiconductor assembling apparatus, and FIG. 5 is a vertical sectional view of the wafer supporting table shown in FIG. is there. In addition, FIG.
[FIG. 6] is a perspective view showing a step of cutting a wafer having a tape attached thereto with a rotary blade. As shown in FIG. 4A, the wafer support table 1 includes a table substrate 3 made of a plate-like member having a generally circular outer peripheral contour, and a substantially cylindrical support extending on the table substrate 3 in the circumferential direction. And part 2. The wafer W and the tape T are placed on the upper end surface of the support portion 2. As shown in FIGS. 4 (b) and 5 (a), the roller 4 constituting the tape adhering means moves in the diameter direction of the wafer W while rolling on the tape T, and the tape T of the wafer W is moved. Stick on top.

The wafer support table 1 is provided with a vacuum chuck means for holding the wafer W on the support portion 2 and an air pressure means for ensuring a close contact between the tape T and the upper surface of the wafer W. There is. As shown in FIG. 5A, the vacuum chuck means includes an opening (not shown) at the upper end surface of the support portion 2, and a suction passage 5 penetrating the wall of the support portion 2 from the opening to the lower surface of the table substrate. , And a negative pressure source (not shown) connected to the suction passage 5.
The negative pressure acts on the outer peripheral portion of the wafer W via the suction passage 5, so that the wafer W is attracted to the upper end surface of the support portion 2 and held on the wafer support table 1.

On the other hand, the air pressing means is substantially composed of an air passage 7 penetrating the wafer support table 1 and a pressure source (not shown) connected to the air passage 7.
Are connected to the pressurizing chamber 8 in the supporting portion 2 via a boss portion 6 arranged at the center of the wafer supporting table 1. The pressurizing chamber 8 in the supporting portion 2 formed below the wafer W
Is pressurized by a pressure source connected to the air passage 7. As a result, as shown in FIG. 5B, the central region of the wafer W is slightly swollen upward due to the pressure increase in the pressure chamber 8. When the roller 4 is rolled on the wafer W in such a state, the tape T is brought into close contact with the entire surface of the wafer W without being pressed by the roller 4 and forming bubbles with the wafer W.

The wafer W attached to the tape T is shown in FIG.
As shown in FIG. 3, the blade is fixed on the ring R of the dicer and cut (full cut) by the rotary blade 9 of the dicer equipped with an extremely thin outer peripheral cutting blade.

[0008]

However, in the conventional wafer tape mounter having the above-described structure, the tape can be attached only to the wafer having a size larger than the diameter of the supporting portion, The tape cannot be attached to a wafer having a size smaller than the diameter of the supporting portion. Therefore, when dicing large and small wafers such as 6-inch wafers or 8-inch wafers, a plurality of wafer support tables adaptable to the wafer size are prepared in advance, and each time the wafer size is changed,
The wafer support table had to be replaced.
Therefore, the dicing process is complicated and the workability or productivity of the dicing process is reduced.

The present invention has been made in view of the above problems, and an object of the present invention is to attach a tape to wafers of different sizes without replacing the wafer support table. To provide a mounter.

[0010]

In order to achieve the above object, a wafer tape mounter according to the present invention is provided with a cylindrical support portion, and a wafer attracting means is provided on the upper surface thereof to attract and hold a wafer. Together with a wafer supporting table adapted to pressurize the wafer outward by introducing pressurized air to the inside of the supporting portion, and a tape attaching means for attaching a sheet-shaped tape to the wafer held on the wafer supporting table. In the wafer tape mounter that has, a plurality of wafer support tables that have different diameter dimensions according to the size of the wafer, and are arranged in multiple concentric fashion and are formed to be relatively displaceable vertically. Table lifting means for individually lifting and lowering each wafer support table is provided, and each wafer support table has a diameter of the wafer support table. A support portion for size corresponding to,
It is characterized in that the table elevating means selectively moves up and down between an operating position where the wafer can be sucked and a retracted position where it is separated from the wafer.

The wafer support table used in the present invention has substantially the same structure as the conventional wafer support table, and moves up and down while sliding between the concentric wafer support tables. The wafer suction means is a commonly-used vacuum suction means provided on the wafer support surface of the support part for sucking the wafer, and for example, an opening is provided on the wafer support surface and a negative pressure is applied to the wafer through the opening. By doing so, the wafer can be adsorbed. The table lifting means is
It is a commonly used lifting mechanism that uses a hydraulic actuator or a combination of a pinion and a rack, and is provided below the table. The means for introducing the pressurized air to press the wafer outward is the same as the conventional air introducing means, and by providing such air introducing means on the innermost wafer supporting table, it is shared by each wafer supporting table. it can.

A wafer tape mounter that can be suitably applied when there are two types of dimensions such as a 6-inch wafer and an 8-inch wafer is a wafer tape mounter in which the wafer support table has two large and small wafer support tables. It is characterized in that it is composed of a wafer support table, and the smaller one of the wafer support tables is selectively moved up and down by a table elevating means between an operation position capable of adsorbing a wafer and a retracted position separated from the wafer.

[0013]

According to the invention of claim 1, each wafer support table has different diameters according to the size of the wafer, and is arranged in multiple concentric shapes and is formed so as to be vertically displaceable relative to each other. By further lowering the wafer support table, which has a supporting part corresponding to the size of the wafer, and is not required for wafer suction by the wafer lifting means to the retracted position, and positioning only the required wafer support table at the wafer suction position. , The wafer can be held by suction on the wafer support table that matches the size of the wafer.
According to the invention of claim 2, the wafer tape mounter is large and small in order to attach the tape to the large and small wafers.
It consists of individual wafer support tables.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will now be described in detail with reference to the accompanying drawings. FIG. 1 is a perspective view of a wafer support table of a wafer tape mounter according to an embodiment of the present invention, and FIGS. 2 (a) and 2 (b) are wafer perspective views.
It is a longitudinal cross-sectional view and a perspective view showing a tape mounter and a roller. The wafer tape mounter 10 has two types of wafers, that is, an 8-inch wafer W1 and a 6-inch wafer W2.
It is a device designed so that tapes can be attached to both sides. As shown in FIG. 1, the wafer tape mounter 10 includes an outer wafer support table (hereinafter, referred to as an outer table) 12 having a large outer diameter, which is used when a tape is attached to a large 8-inch wafer W1. An inner wafer support table (hereinafter, referred to as “inner wafer support table” having a small outer diameter, which is concentrically arranged inside the outer table 12 and is used when a tape is attached to a small 6-inch wafer W2.
Inner table) 14 and a two-stage table is formed.

The outer table 12 includes a circular flat outer table substrate 16 and a substantially cylindrical outer support portion 18 concentrically arranged on the table substrate. The inner table 14 has a circular flat inner table substrate 20 (the outer table substrate 16 in FIG. 1) similar to the outer table 12.
It is hidden underneath and is labeled as (20).
And a substantially cylindrical inner support portion 22 arranged concentrically on the inner table substrate 14.

The outer support portion 18 provided on the outer table 12 is a substantially cylindrical hollow body having a diameter smaller than that of the outer table substrate 16, and its inner diameter is slightly smaller than the outer dimension of the 8-inch wafer W1. It has a small size. The upper end surface of the outer supporting portion 18 constitutes the outer wafer suction surface 24, and is formed as a flat annular surface as a wafer suction surface so as to fit to the wafer. The outer wafer suction surface 24 is provided with a large number of small-diameter openings 26 along its circumferential direction. In order to adsorb the wafer, suction passages 28 are respectively provided through the walls of the outer supporting portion 18 from the respective openings 26 to the lower surface of the outer table substrate 16 in the vertical direction, and the pipes (see FIG. It is connected to a negative pressure source (not shown) via a not shown).

The bottom of the outer table substrate 16 is shown in FIG.
As shown in (a), it is formed of a relatively thick annular outer bottom wall 30 arranged on the outer peripheral portion and a relatively thin inner bottom wall 32 arranged inside the bottom wall, Outer bottom wall 3
The upper surface of 0 and the upper surface of the inner bottom wall 32 are aligned on the same plane level. The outer support portion 18 stands upright from the outer bottom wall 30, and between the outer bottom wall 30 and the inner bottom wall 32, an opening having the same shape and size as the cross section of the wall of the inner support portion 22 is formed. An annular opening 34 having a shape is formed.
The inner support portion 22 penetrates the annular opening 34 in a vertically slidable manner and in a relatively airtight manner.

An annular opening 34 is formed between the outer bottom wall 30 and the inner bottom wall 32, and the outer bottom wall 30 and the inner bottom wall 32 are formed.
In order to keep the connection between and, they are connected by a simple connection means, for example, a spoke-shaped rod member (not shown), and the connection means is provided vertically on the inner support portion 18. It penetrates through a hole-shaped through hole (not shown). A boss portion 36 is formed at the center of the inner bottom wall 32 so as to protrude vertically. Further, an air passage 38 which constitutes an air pressurizing unit penetrates the boss portion 36 in the vertical direction and is connected to a pressurizing source (not shown) at a lower end thereof via a pipe (not shown). . When pressurized air is introduced through the air passage 38, a pressure chamber 40 formed by air is formed inside the outer support portion 18 and inside the inner support portion 22.

The inner support portion 22 provided on the inner table 14 has substantially the same structure as the outer support portion 18, and is a substantially cylindrical hollow body having the same outer diameter as the inner table substrate 20. The inner diameter is formed to be slightly smaller than the outer dimension of the 6-inch wafer W2. The upper end surface of the inner support portion 22 constitutes an inner wafer suction surface 42, and is formed as a flat annular surface as a wafer suction surface so as to fit to the wafer. The inner wafer suction surface 42 has a large number of small-diameter openings 4 along its circumferential direction.
4 is provided. In order to adsorb the wafer, suction passages 46 are provided up and down through the wall of the inner support portion 22 from each opening to the lower surface of the inner table substrate 20, respectively, and a pipe line (not shown) is provided at the lower end thereof. Via a negative pressure source (not shown).

The inner support portion 22 is connected at its lower end to the outer peripheral portion of the inner table substrate 20. The inner table substrate 20 is provided below the outer table substrate 16 of the outer table 12, and has a through hole 48 that is in sliding contact with the outer peripheral surface of the boss portion 36 of the outer table substrate 16. The inner table substrate 20 is lifted and lowered by a lifting mechanism (not shown). When the inner table substrate 20 moves up and down, the inner support portion 22 moves up and down together with the inner table substrate 20 through the annular opening 34 of the outer table substrate 16. Since the outer table substrate 16 is provided with the annular opening 34 and the inner table substrate 20 is provided with the through hole 48, the inner table substrate 20 and the inner supporting portion 22 are vertically moved by an elevating device (not shown).
Can be moved up and down freely.

Further, the wafer tape mounter 10
Includes a cylindrical roller 50 that has been conventionally used as a tape adhering means.

A method of using the wafer tape mounter 10 of this embodiment will be described below with reference to FIGS. 2 and 3. As shown in FIG. 2A, the inner table 14
Is lowered to the lower position, that is, the retracted position. In this state, the wafer suction surface 4 of the inner support 22 is
2 is located below the wafer suction surface 24 of the outer supporting portion 18. Next, the 8-inch wafer W1 is positioned on the wafer suction surface 24 of the outer supporting portion 18, and the tape T is placed on the upper surface of the wafer W1. When a negative pressure is applied to the wafer suction surface 24 via the suction passage 28, the wafer W1 is suctioned to the wafer suction surface 24. The gas pressure of the pressure source is applied to the pressure chamber 40 formed on the lower side of the wafer W1 through the air passage 38 to increase the pressure in the pressure chamber 40. As a result, the central region of the wafer W is
When the pressure is increased to 0, it slightly bulges upward and bends (Fig. 5).
(See (b)).

Then, as shown in FIGS. 2A and 2B, the roller 50 is moved on the tape T in the diametrical direction of the wafer W1 while rolling, and the tape T is attached to the upper surface of the wafer W1. To do. In this embodiment, since the inner table 12 is retracted to the retracted position when the 8-inch wafer W1 is tape-attached, the pressurizing chamber 40 does not move to the outer support portion 18 in spite of the presence of the inner support portion 22. It is formed on the entire inside. Therefore, since the pressure of the pressurized air can be applied to almost the entire surface of the wafer W1, almost the entire surface of the wafer W1 is slightly swollen upward and warped. The tape T can be tightly adhered to the entire surface of the wafer W1 without forming bubbles between them, and can be reliably attached.

3A and 3B are a longitudinal sectional view and a perspective view showing a step of adhering the tape T to the 6-inch wafer W2. As shown in FIG. 3A, the inner table 14 is raised to an upper position, that is, an operating position by the operation of the lifting mechanism. In the operating position, the wafer suction surface 42 of the inner support 22 is
Rise to a plane level that is the same as or slightly higher than the wafer suction surface 24 of the outer support 18. 6 inch wafer W
2 is positioned on the wafer suction surface 42 of the inner support portion 22, and the tape T is placed on the upper surface of the wafer W2. When a negative pressure is applied to the wafer suction surface 42 via the suction passage 46, the wafer W2 is suctioned to the wafer suction surface. Pressurized air is introduced into the pressurizing chamber 40 via the air passage 38.
When the pressure in the pressurizing chamber 40 is increased, the wafer W2 swells and slightly warps upward.

Then, as shown in FIG. 3B, the tape T
While rolling the roller 50 upward, it moves in the diameter direction of the wafer W, and the tape T is attached to the upper surface of the wafer W. At this time, since the wafer suction surface 42 of the inner support portion 22 is at the same position as or slightly higher than the wafer suction surface 24 of the outer support portion 18, when the tape T is attached and the roller 50 is rolled. The outer supporting portion 18 does not become an obstacle. After the tape T is attached to the wafers W1 and W2 as described above, the wafer is fixed on the ring R of the dicer as shown in FIG. 6, and the rotary blade of the dicer equipped with an ultrathin outer peripheral cutting blade. Cut (full cut) with 9.

As described above, the wafer tape,
When the tape T is attached to the 8-inch wafer W1, the mounter 10 lowers the inner table 14 to the retracted position to apply air pressure to the entire inner side of the support portion 16 of the outer table 12, and By not hindering the rolling of the roller 50, the tape T can be completely adhered to the wafer W1.
On the other hand, when the tape T is attached to the 6-inch wafer W2, the wafer tape mounter 10 uses the inner table 1
4 to the working position, the outer table 1
The roller 50 can be moved without being disturbed by 2. As described above, the wafer tape mounter 10
Is an 8-inch wafer W without changing the table.
The tape T can be attached to both the 1-inch and 6-inch wafers W2.

The preferred embodiments of the present invention have been described above in detail, but the present invention is not limited to the above embodiments, and various modifications and variations are possible within the scope of the present invention described in the claims. It goes without saying that these are also possible and they are also included within the scope of the present invention. For example, in the above embodiment, the wafer tape mounter is
Although two wafer support tables 12, 14 are provided, the wafer tape mounter may be provided with more wafer support tables.

[0028]

According to the above configuration of the present invention, the wafer
The tape mounter lowers the unnecessary wafer support table to the retreat position and positions only the necessary wafer support table at the wafer suction operation position in order to operate the tape attaching means, and sucks the wafer at that position.
Pressurized air can be applied. Therefore, in the wafer tape mounter according to the present invention, the tape can be adhered to the wafers of various sizes in a close contact state without replacing the wafer support table. By using the wafer tape mounter of the present invention, it is not necessary to replace the wafer supporting tape according to the size of the wafer as in the conventional case, so that the work efficiency of the wafer dicing operation can be improved.

[Brief description of drawings]

FIG. 1 is a perspective view showing a wafer support table of a wafer tape mounter according to an embodiment of the present invention.

2 (a) and 2 (b) are a longitudinal sectional view of a wafer supporting table and a perspective view showing a wafer supporting table and a tape adhering means, respectively.

3 (a) and 3 (b) are a longitudinal sectional view showing a step of attaching a tape to a 6-inch wafer and a perspective view showing a wafer supporting table and a tape attaching means, respectively.

FIG. 4 (a) and FIG. 4 (b) are perspective views showing a wafer supporting table and a tape attaching means of a conventional wafer tape mounter, respectively.

5 (a) and 5 (b) are vertical sectional views of the wafer support table shown in FIG. 4, respectively.

FIG. 6 is a perspective view showing a step of cutting a wafer having a tape attached thereto with a rotary blade.

[Explanation of symbols]

 W1 8 inch wafer W2 6 inch wafer T tape 10 wafer tape mounter 12 outer wafer supporting table 14 inner wafer supporting table 16 outer table substrate 18 outer supporting portion 20 inner table substrate 22 inner supporting portion 24 outer wafer adsorbing surface 26 opening 28 Suction passage 30 Outer bottom wall 32 Inner bottom wall 34 Annular opening 36 Boss portion 38 Air passage 40 Pressurizing chamber 42 Inner wafer suction surface 44 Opening 46 Suction passage 48 Through hole 50 Roller

Claims (2)

[Claims] 1. A wafer provided with a cylindrical support part, wherein a wafer adsorbing means provided on an upper surface of the support part adsorbs and holds the wafer and pressurizes air inside the support part to press the wafer outward. In a wafer tape mounter having a support table and a tape adhering means for adhering a sheet-shaped tape to the wafer held on the wafer support table, the wafer tape mounter has different diameters according to the size of the wafer,
And multiple concentrically arranged, a plurality of wafer support table formed to be relatively displaceable vertically, and a table elevating means for individually elevating each wafer support table, each wafer support table, The wafer supporting table has a supporting portion having a size corresponding to the diameter of the wafer supporting table, and selectively moves up and down between the operating position capable of sucking the wafer and the retracted position separated from the wafer by the table elevating means. Wafer tape mounter. 2. A wafer supporting table is composed of two large and small wafer supporting tables, and the smaller wafer supporting table moves between a working position capable of sucking a wafer and a retracted position separated from the wafer. The wafer tape mounter according to claim 1, wherein the wafer tape mounter is selectively moved up and down by means of.