JP4676247B2 - Tape applicator - Google Patents

Tape applicator Download PDF

Info

Publication number
JP4676247B2
JP4676247B2 JP2005146814A JP2005146814A JP4676247B2 JP 4676247 B2 JP4676247 B2 JP 4676247B2 JP 2005146814 A JP2005146814 A JP 2005146814A JP 2005146814 A JP2005146814 A JP 2005146814A JP 4676247 B2 JP4676247 B2 JP 4676247B2
Authority
JP
Japan
Prior art keywords
wafer
plurality
holding
frame
chuck table
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2005146814A
Other languages
Japanese (ja)
Other versions
JP2006324502A (en
Inventor
幸容 増田
仁志 星野
Original Assignee
株式会社ディスコ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社ディスコ filed Critical 株式会社ディスコ
Priority to JP2005146814A priority Critical patent/JP4676247B2/en
Publication of JP2006324502A publication Critical patent/JP2006324502A/en
Application granted granted Critical
Publication of JP4676247B2 publication Critical patent/JP4676247B2/en
Application status is Active legal-status Critical
Anticipated expiration legal-status Critical

Links

Images

Description

  The present invention relates to a tape applicator for attaching a wafer such as an optical device wafer to an adhesive tape mounted on an annular frame.

  An optical device wafer in which a plurality of regions are defined by division lines formed in a lattice pattern on the surface of a sapphire substrate or the like, and an optical device wafer such as a gallium nitride compound semiconductor is laminated on the divided regions, It is divided into optical devices such as individual light-emitting diodes along and widely used in electrical equipment.

  Such cutting along the division line of the optical device wafer is usually performed by a cutting apparatus that rotates the cutting blade at a high speed. However, since the sapphire substrate has a high Mohs hardness and is a difficult-to-cut material, there is a problem that it is necessary to slow the processing speed and the productivity is poor.

On the other hand, there is a method in which a laser processing groove is formed by irradiating a sapphire substrate with a pulsed laser beam having an absorptivity for the substrate along a line to be divided, and cleaving by a mechanical braking device along the laser processing groove. Proposed. (For example, refer to Patent Document 1.)
JP-A-10-305420

  However, the sapphire substrate forming the above-described optical device wafer has a diameter of about 50 mm and is relatively small. On the other hand, a chuck table for holding a wafer of a laser processing apparatus is configured to have a size corresponding to a semiconductor wafer having a diameter of 200 to 300 mm. Therefore, in order to effectively utilize the holding surface of the chuck table, a plurality of optical device wafers are attached to an adhesive tape attached to an annular frame, and a plurality of optical device wafers attached to the adhesive tape are attached. Productivity is improved by holding the chuck table and performing laser processing.

  Thus, the work of attaching a plurality of optical device wafers to the adhesive tape attached to the annular frame is carried out at the operator's scale, resulting in a problem of individual differences and poor productivity. is there. Further, there are cases where air bubbles are stuck between an adhesive tape mounted on an annular frame and an optical device wafer. As described above, when air bubbles are interposed between the adhesive tape and the optical device wafer, the height position of the processing surface of the wafer held by the chuck table becomes non-uniform, and high-precision laser processing cannot be performed. There is.

  The present invention has been made in view of the above-mentioned facts, and its main technical problem is that a plurality of wafers are attached to predetermined positions of an adhesive tape attached to an annular frame without causing individual differences among workers. It is to provide a tape applicator that can be used.

In order to solve the main technical problem, according to the present invention, a tape applicator for attaching a plurality of wafers to an adhesive tape attached to an annular frame,
A housing with an open top;
A chuck table provided with a plurality of wafer holding portions having a holding surface arranged in the housing and holding the wafer;
A plurality of insertion holes provided on the upper surface of the chuck table and having a frame holding portion for holding the annular frame on the upper surface, and loosely fitting the plurality of wafer holding portions inside the frame holding portion. A wafer positioning frame comprising:
A pressing means comprising a pressing member for pressing toward the upper surface of the wafer positioning frame;
Advancing and retracting means for advancing and retracting the chuck table with respect to the wafer positioning frame body,
A tape applicator is provided.

  The chuck table is provided with suction holes that open to the holding surfaces of a plurality of wafer holding portions, and the suction ports are connected to suction means. The pressing means includes a lid that supports the pressing member via an elastic member. The inside of the housing is preferably connected to a decompression unit. The wafer positioning frame is preferably formed of a synthetic resin material having a weak adhesive strength with respect to the adhesive tape.

  According to the tape applicator according to the present invention, the wafer is placed on the holding surface of the plurality of wafer holding portions of the chuck table through the plurality of insertion holes formed in the wafer positioning frame. Can be arranged in a predetermined positional relationship. Accordingly, the plurality of wafers placed on the holding surfaces of the plurality of wafer holding portions are accurately placed at predetermined positions of the adhesive tape attached to the annular frame held by the frame holding portion of the wafer positioning frame. Can be attached to. Thus, the tape applicator according to the present invention does not cause individual differences among workers, and can always apply a plurality of wafers to a predetermined position of the adhesive tape accurately.

  Preferred embodiments of a tape applicator configured according to the present invention will be described below in further detail with reference to the accompanying drawings.

1 shows a perspective view of a tape applicator constructed in accordance with the present invention, FIG. 2 shows an exploded perspective view of the tape applicator shown in FIG. 1, and FIG. The principal part sectional drawing of the tape applicator shown is shown.
The tape applicator shown in FIGS. 1 to 3 includes a box-shaped housing 2 having an open upper surface, a chuck table 3 for holding a wafer, a wafer mounting position and a wafer mounting position to be described later. Advancing / retreating means 4 positioned at a higher wafer attaching position, a wafer positioning frame body 5 for positioning the wafer and supporting an annular frame to be described later, and a pressing member for pressing toward the upper surface of the wafer positioning frame body 5 are provided. The pressing means 6 is provided. The housing 2 is formed in a rectangular parallelepiped shape in the illustrated embodiment, and its upper surface is formed in a square shape and is open. A connecting pipe 211 is disposed on the side wall 21 of the housing 2, and the connecting pipe 211 is connected to the pressure reducing means 35 via a pipe 34 as shown in FIG. 3.

  The chuck table 3 protrudes from a circular base 31, a plurality (seven in the illustrated embodiment) of wafer holders 32 disposed on the upper surface of the base 31, and a lower surface of the central portion of the base 31. The formed support part 33 is provided. Each of the plurality of wafer holding portions 32 is formed in a circular shape, and its upper surface functions as a holding surface 321 on which the wafer is placed. The plurality of wafer holding portions 32 formed in this way are formed with a plurality of suction holes 322 that open to the holding surface 321 respectively. As shown in FIG. 3, the suction hole 322 communicates with a suction passage 331 provided in the base portion 31 and the support portion 33. The suction passage 331 is connected to the suction means 38 via the flexible pipe 36, the connection pipe 212 and the pipe 37 provided on the side wall 21 of the housing 2. In addition, you may form the part which forms the holding surface 321 in the some wafer holding part 32 with porous ceramics.

  The advancing / retreating means 4 includes an air cylinder 41 and a piston rod 42 connected to a piston (not shown) disposed in the air cylinder 41, and the tip of the piston rod 42 is a support portion 33 of the chuck table 3. It is connected to. The advancing / retreating means 4 and the chuck table 3 configured as described above are disposed in the housing 2 and disposed at predetermined positions on the bottom wall 22. The advancing / retreating means 4 configured in this manner moves the chuck table 3 forward and backward with respect to the wafer positioning frame 5 and moves it to the wafer mounting position indicated by the solid line and the adhering position indicated by the two-dot chain line in FIG.

  The wafer positioning frame 5 is formed in a square shape corresponding to the upper surface of the housing 2, and a frame holding portion 51 for holding an annular frame described later is formed on the upper surface with a step on the lower side. . The wafer positioning frame 5 is fitted with a plurality of circular pieces (seven in the illustrated embodiment) in which the plurality of wafer holding parts 32 of the chuck table 3 are loosely fitted inside the frame holding part 51. An insertion hole 52 is provided. The inner diameter of the insertion hole 52 is slightly larger than the outer diameter of the wafer holding part 32. The wafer positioning frame 5 is preferably made of a synthetic resin material having a weak adhesive strength with respect to an adhesive tape described later, such as polytetrafluoroethylene or polyacetal. The wafer positioning frame 5 configured as described above is placed on the upper surface of the housing 2. In the state where the wafer positioning frame 5 is placed on the upper surface of the housing 2, the lower portions of the plurality of insertion holes 52 provided in the wafer positioning frame 5 as shown in FIG. The chuck table 3 is positioned at a position so as to be fitted to the upper end portions of the plurality of wafer holding portions 32. When the chuck table 3 is positioned at the above-described sticking position, the holding surface 321 of the wafer holding portion 32 is substantially at the same height as the upper surface of the wafer positioning frame 5 as shown by a two-dot chain line in FIG. .

  The pressing means 6 includes a pressing member 61 that presses an adhesive tape, which will be described later, and a lid 62 that supports the pressing member 61. The pressing member 61 is formed in a circular shape corresponding to a region where the plurality of wafer holding portions 32 of the chuck table 3 are disposed. A plurality of support columns 63 are erected on the upper surface of the pressing member 61 formed in this way, and a locking portion 631 is formed on the upper end of the support column 63. A coil spring 64 as an elastic member is inserted into the support column 63.

The lid 62 is formed in a square shape corresponding to the wafer positioning frame 5 and is configured to support the pressing member 61 on the lower wall 621 thereof as shown in FIG. In other words, the lower wall 621 of the lid 62 is provided with a guide hole 621 a having an inner diameter slightly larger than the outer diameter of the support column 63 erected on the upper surface of the pressing member 61. Further, the lower wall 621 of the lid 62 is provided with an insertion hole 621b formed adjacent to the guide hole 621a and having an inner diameter larger than the outer diameter of the locking portion 631 provided at the upper end of the support column 63. . And the guide hole 621a and the insertion hole 621b are connected by the communication hole 621c. Therefore, the locking portion 631 provided at the upper end of the support column 63 is inserted from the lower side of the lower wall 621 of the lid 62 through the insertion hole 621b, and the support column 63 is inserted into the communication hole 621c in a state where the coil spring 64 is compressed. Along the guide hole 621a. As a result, the locking portion 631 provided at the upper end of the support column 63 is locked to the upper surface of the lower wall 621 constituting the lid 62, and the pressing member 61 on which the support column 63 is erected is supported by the lid 62. Is done. As described above, the pressing member 61 supported by the lid 62 is urged in the direction away from the lid 62 by the coil spring 64.
In the pressing means 6 configured as described above, the lid 62 is hinged to the wafer positioning frame 5 by a hinge 65 as shown in FIG.

The tape applicator in the illustrated embodiment is configured as described above, and the operation thereof will be described below.
Here, the wafer and the pressure-sensitive adhesive tape attached to the annular frame for attaching the wafer will be described.
FIG. 5 shows a plurality of optical device wafers 10 (seven corresponding to the number of the plurality of wafer holding portions 32 of the chuck table 3). In this optical device wafer 10, a plurality of optical devices 101 are formed in a matrix on a surface 10a of a substrate made of sapphire.
FIG. 6 shows a state in which the adhesive tape 8 is attached to one surface (upper surface in FIG. 6) of the annular frame 7 formed of a metal material such as stainless steel.

Next, a procedure for attaching a plurality of optical device wafers 10 to the adhesive tape 8 attached to the annular frame 7 using the above-described tape applicator will be described.
First, as shown in FIG. 1, the pressing means 6 of the tape applicator is pivoted upward about a hinge 65 and opened. At this time, the chuck table 3 is positioned at the wafer mounting position described above.

  If the pressing means 6 is opened, the optical device wafer 10 is placed on the holding surfaces 321 of the plurality of wafer holding portions 32 of the chuck table 3 through the plurality of insertion holes 52 formed in the wafer positioning frame 5. To do. At this time, the optical device wafer 10 is placed on the holding surface 321 with the surface 10a facing upward (wafer placing step). Then, by operating the suction means 38, the plurality of optical device wafers 10 placed on the holding surfaces 321 of the plurality of wafer holding portions 32 are sucked and held on the holding surfaces 321 of the wafer holding portions 32, respectively. (Wafer holding step).

When the wafer holding step is performed, the pressing means 6 is closed at one end, the advancing / retreating means 4 is operated and the chuck table 3 is positioned at the sticking position, so that the wafer is placed on the plurality of wafer holding portions 32. A plurality of optical device wafers 10 are sandwiched between the pressing members 61 (wafer clamping step). As a result, the plurality of optical device wafers 10 are in close contact with the plurality of wafer holding portions 32 on the holding surfaces 321. By operating the suction means 38 in this state, the plurality of optical device wafers 10 placed on the holding surfaces 321 of the plurality of wafer holding portions 32 can be held by the wafer holding portion 32 even if they are slightly curved. It is reliably sucked and held on the surface 321.
Then, the advancing / retreating means 4 is operated to return the chuck table 3 to the wafer mounting position described above, and the pressing means 6 is set to the open state shown in FIG.

  Next, the annular frame 7 on which the adhesive tape 8 is mounted is placed on the frame holding portion 51 of the wafer positioning frame 5 (frame holding step). At this time, the annular frame 7 is placed so that the adhesive surface of the adhesive tape 8 faces the wafer positioning frame 5.

  When the frame holding step is performed in this way, the pressing means 6 that has been opened is turned around the hinge 65 and closed, and the pressing member 61 is placed on the adhesive tape 8 mounted on the annular frame 7. Place. As a result, the pressing member 61 of the pressing means 6 presses the adhesive tape 8 by the urging force of the coil spring 64 (tape pressing process).

  Next, the decompression means 35 is operated to decompress the inside of the housing 2 by, for example, about 0.2 atmosphere (2027 Pa) from the atmospheric pressure. As a result, as shown in FIG. 7, negative pressure acts on the adhesive tape 8 mounted on the annular frame 7 through the plurality of insertion holes 52 provided in the wafer positioning frame body 5. Is inserted into the insertion hole 52. The adhesive tape 8 sucked into the plurality of insertion holes 52 in this way has a form in which the central portion bulges downward in a region corresponding to each of the insertion holes 52 (tape bulging step).

  If the tape bulging process described above is performed, the advancing / retreating means 4 is actuated to position the chuck table 3 at the sticking position as shown in FIG. As a result, the plurality of optical device wafers 10 held by the plurality of wafer holding portions 32 of the chuck table 3 are pressed against regions corresponding to the plurality of insertion holes 52 of the wafer positioning frame 5 in the adhesive tape 8. Then, it is attached to the adhesive tape 8 (wafer attaching step). At this time, as described above, since the region corresponding to the insertion hole 52 in the adhesive tape 8 bulges downward (on the optical device wafer 10 side), the optical device wafer 10 is directed from the center toward the outer periphery. Thus, the optical device wafer 10 can be attached to the tape without any bubbles being interposed between the optical device wafer 10 and the adhesive tape 8.

  If the wafer sticking step described above is performed, the operation of the pressure reducing means 35 is stopped to release the pressure reduction in the housing 2, and the operation of the suction means 38 is stopped to stop a plurality of wafer holding portions of the chuck table 3. The suction holding of the optical device wafer 10 by 32 is released. Next, the pressing means 6 is rotated upward about the hinge 65, and the pressing means 6 is opened as shown in FIG. Then, as described above, the annular frame 7 on which the adhesive tape 8 to which the plurality of optical device wafers 10 are attached is mounted from the wafer positioning frame 5 (unloading step). At this time, the adhesive surface of the adhesive tape 8 is adhered to the upper surface of the wafer positioning frame 5, but the wafer positioning frame 5 is made of a synthetic resin material having a weak adhesive force with respect to the adhesive tape as described above. Therefore, the adhesive tape 8 is easily peeled from the wafer positioning frame 5. As shown in FIG. 9, a plurality of optical device wafers 10 are attached to the adhesive tape 8 mounted on the annular frame 7 carried out of the tape applicator in this manner in a predetermined positional relationship.

  As described above, according to the tape applicator according to the present invention, the holding surface of the plurality of wafer holders 32 of the chuck table 3 through the optical device wafer 10 through the plurality of insertion holes 52 formed in the wafer positioning frame 5. Since the optical device wafers 10 are placed on the H.321, the plurality of optical device wafers 10 can be arranged in a predetermined positional relationship. Accordingly, the wafer is placed on the holding surface 321 of the plurality of wafer holding portions 32 at a predetermined position of the adhesive tape 8 attached to the annular frame 7 held by the frame holding portion 51 of the wafer positioning frame 5. A plurality of optical device wafers 10 can be accurately attached. As described above, by using the tape applicator according to the present invention, there is no individual difference among workers, and a plurality of wafers can always be accurately attached to predetermined positions of the adhesive tape.

1 is a perspective view of a tape applicator configured in accordance with the present invention. The disassembled perspective view of the tape applicator shown in FIG. The principal part sectional drawing of the tape applicator shown in FIG. Sectional drawing of the press means which comprises the tape applicator shown in FIG. The perspective view of the some optical device wafer affixed on the adhesive tape with which the annular frame was mounted | worn with the tape applicator comprised according to this invention. FIG. 3 is a perspective view showing a state where an adhesive tape is attached to an annular frame. Explanatory drawing which shows the state which implemented the tape bulging process using the tape applicator shown in FIG. Explanatory drawing which shows the state which implemented the wafer sticking process using the tape sticking machine shown in FIG. The perspective view which shows the state by which the some optical device wafer was affixed on the adhesive tape with which the cyclic | annular flame | frame was mounted | worn using the tape applicator comprised according to this invention.

Explanation of symbols

2: Housing 3: Chuck table 32: Wafer holding part 35: Pressure reducing means 38: Suction means 4: Advance / retract means 41: Air cylinder 5: Wafer positioning frame 51: Frame holding part 52: Insertion hole 6: Pressing means 61: Press member 62: Lid 63: Support column 64: Coil spring 65: Hinge 7: Ring frame 8: Adhesive tape 10: Optical device wafer

Claims (5)

  1. A tape applicator for attaching a plurality of wafers to an adhesive tape mounted on an annular frame,
    A housing with an open top;
    A chuck table provided with a plurality of wafer holding portions having a holding surface arranged in the housing and holding the wafer;
    A plurality of insertion holes provided on the upper surface of the chuck table and having a frame holding portion for holding the annular frame on the upper surface, and loosely fitting the plurality of wafer holding portions inside the frame holding portion. A wafer positioning frame comprising:
    A pressing means comprising a pressing member for pressing toward the upper surface of the wafer positioning frame;
    Advancing and retracting means for advancing and retracting the chuck table with respect to the wafer positioning frame body,
    A tape applicator characterized by that.
  2.   2. The tape applicator according to claim 1, wherein the chuck table includes suction holes that open to the holding surfaces of the plurality of wafer holding portions, and the suction ports are connected to suction means.
  3.   The tape applicator according to claim 1, wherein the pressing means includes a lid that supports the pressing member via an elastic member.
  4.   The tape applicator according to claim 1, wherein the inside of the housing is connected to a decompression means.
  5.   The tape applicator according to claim 1, wherein the wafer positioning frame is formed of a synthetic resin material having a weak adhesive force with respect to the adhesive tape.
JP2005146814A 2005-05-19 2005-05-19 Tape applicator Active JP4676247B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005146814A JP4676247B2 (en) 2005-05-19 2005-05-19 Tape applicator

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005146814A JP4676247B2 (en) 2005-05-19 2005-05-19 Tape applicator
TW095113975A TWI371058B (en) 2005-05-19 2006-04-19

Publications (2)

Publication Number Publication Date
JP2006324502A JP2006324502A (en) 2006-11-30
JP4676247B2 true JP4676247B2 (en) 2011-04-27

Family

ID=37543954

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005146814A Active JP4676247B2 (en) 2005-05-19 2005-05-19 Tape applicator

Country Status (2)

Country Link
JP (1) JP4676247B2 (en)
TW (1) TWI371058B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100941984B1 (en) * 2007-09-28 2010-02-11 삼성전기주식회사 Packaging method of wafer
JP5558300B2 (en) * 2010-09-30 2014-07-23 株式会社ディスコ Auxiliary jig for pasting adhesive sheets

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6351244A (en) * 1986-08-20 1988-03-04 Disco Abrasive Syst Ltd Magnet method tape frame positioning device
JPH10233430A (en) * 1997-02-19 1998-09-02 Nitto Denko Corp Adhesive tape pasting device
JPH10305420A (en) * 1997-03-04 1998-11-17 Ngk Insulators Ltd Method for fabricating matrix made up of oxide single crystal and method for manufacturing functional device
JP2003045943A (en) * 2001-07-31 2003-02-14 Sony Corp Semiconductor device handling apparatus
JP2004063644A (en) * 2002-07-26 2004-02-26 Enzan Seisakusho:Kk Method and apparatus for attaching and detaching protection sheet of semiconductor wafer

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6351244A (en) * 1986-08-20 1988-03-04 Disco Abrasive Syst Ltd Magnet method tape frame positioning device
JPH10233430A (en) * 1997-02-19 1998-09-02 Nitto Denko Corp Adhesive tape pasting device
JPH10305420A (en) * 1997-03-04 1998-11-17 Ngk Insulators Ltd Method for fabricating matrix made up of oxide single crystal and method for manufacturing functional device
JP2003045943A (en) * 2001-07-31 2003-02-14 Sony Corp Semiconductor device handling apparatus
JP2004063644A (en) * 2002-07-26 2004-02-26 Enzan Seisakusho:Kk Method and apparatus for attaching and detaching protection sheet of semiconductor wafer

Also Published As

Publication number Publication date
TWI371058B (en) 2012-08-21
TW200644053A (en) 2006-12-16
JP2006324502A (en) 2006-11-30

Similar Documents

Publication Publication Date Title
JP4379435B2 (en) Board assembly apparatus and board assembly method using the same
US6672576B1 (en) Apparatus for and method of utilizing vacuum in machine tool operations
TW480552B (en) Split-mold and method for manufacturing semiconductor device by using the same
JP2004510334A (en) Method for back-polishing a wafer while leaving a back polishing tape on the chuck
KR101170587B1 (en) Method and device for breaking work, method for scribing and breaking work, and scribing device with breaking function
JPH1187468A (en) Method and support device for treatment of wafer-shaped product
TW200718662A (en) Device and method for cutting off substrate of fragile material
JP6039363B2 (en) Method and apparatus for dividing brittle material substrate
TW200514188A (en) Mounting device and mounting method
DE10260233B4 (en) Method of attaching a workpiece to a solid on a workpiece carrier and workpiece carrier
MY143090A (en) Apparatus and method for thin die detachment
JP2009531191A (en) Fixture for holding workpiece and method for holding and peeling workpiece by fixture
EP1791163A3 (en) Method and apparatus for attaching a peeling tape
KR930005466B1 (en) Cutting method and apparatus
JP2010118584A (en) Mounting device for wafer
JP2534196B2 (en) Weather - Ha sticking method
JP2004233473A (en) Device and method for assembling large-sized substrate
JP4221271B2 (en) Tape applicator
WO2003069660A1 (en) Plate-like object carrying mechanism and dicing device with carrying mechanism
JP4534876B2 (en) Subject supply apparatus and subject supply method
KR20130007585A (en) Substrate separation device, load lock device, substrate adhesion device and substrate separation method
KR20140043678A (en) Chuck table
KR20090039626A (en) Carrier frame for electronic components and production method for electronic components
JP2002059363A (en) Wafer base material
US7520309B2 (en) Method for adhering protecting tape of wafer and adhering apparatus

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20080403

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20110125

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20110127

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140204

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 4676247

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140204

Year of fee payment: 3

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250