JPS63228638A - Chip taking out apparatus - Google Patents

Chip taking out apparatus

Info

Publication number
JPS63228638A
JPS63228638A JP6218587A JP6218587A JPS63228638A JP S63228638 A JPS63228638 A JP S63228638A JP 6218587 A JP6218587 A JP 6218587A JP 6218587 A JP6218587 A JP 6218587A JP S63228638 A JPS63228638 A JP S63228638A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
chip
surface
sheet
means
rear
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6218587A
Inventor
Takeshi Aiba
Hitoshi Tamaki
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Abstract

PURPOSE: To prevent damage to the surface of a chip and dust yielding from the chip in a step for taking out the chip from a sheet, by forming an apparatus by a pushing means, which pushes up the chip, whose rear surface is stuck to one surface of the sheet, from the other surface of the sheet at an area smaller than the area of the rear surface of the chip and moves the chip; and a sucking and holding mean, which sucks a part, which is separated and floated from the sheet at the outer side of the rear surface of the chip.
CONSTITUTION: A chip taking out apparatus is formed with a pushing means 1 and a sucking and holding means 2. The pushing means 1 pushes a chip 102a, which is to be taken out, among a plurality of chips 102...102 from the other surface of a sheet 101. The rear surfaces of the chips are stuck to one surface of the sheet 101. The pushing means 1 contacts a part including the central part of the rear surface. The area of the part is smaller than the area of the rear surface of the chip 102a. The chip 102a is moved upward. The sucking and holding means 2 is moved in the direction of an arrow to a position shown by a broken line from a position shown by a solid line. The means 2 sucks and holds a part of the chip 102a, which is separated and floated from the sheet 101 at the outer side of a part, where the pushing means 1 is in contact with the rear surface of the chip 102a by way of the sheet 101. Thus damage to the surface of the chip is avoided, and dust yielding due to breaking of the chip can be prevented.
COPYRIGHT: (C)1988,JPO&Japio
JP6218587A 1987-03-17 1987-03-17 Chip taking out apparatus Pending JPS63228638A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6218587A JPS63228638A (en) 1987-03-17 1987-03-17 Chip taking out apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6218587A JPS63228638A (en) 1987-03-17 1987-03-17 Chip taking out apparatus

Publications (1)

Publication Number Publication Date
JPS63228638A true true JPS63228638A (en) 1988-09-22

Family

ID=13192821

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6218587A Pending JPS63228638A (en) 1987-03-17 1987-03-17 Chip taking out apparatus

Country Status (1)

Country Link
JP (1) JPS63228638A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005117072A1 (en) * 2004-05-19 2005-12-08 Alphasem Ag Method and device for detaching a component which is attached to a flexible film
JP2008004936A (en) * 2006-06-19 2008-01-10 Samsung Electronics Co Ltd Device for detaching semiconductor chip with pair of ejector and method for detaching semiconductor chip using the same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005117072A1 (en) * 2004-05-19 2005-12-08 Alphasem Ag Method and device for detaching a component which is attached to a flexible film
EP2306496A2 (en) 2004-05-19 2011-04-06 Kulicke & Soffa Die Bonding GmbH Method and device for detaching a component which is attached to a flexible film
US7981246B2 (en) 2004-05-19 2011-07-19 Kulicke And Soffa Die Bonding Gmbh Method and device for detaching a component which is attached to a flexible film
EP2306496A3 (en) * 2004-05-19 2012-10-10 Kulicke & Soffa Die Bonding GmbH Method and device for detaching a component which is attached to a flexible film
JP2008004936A (en) * 2006-06-19 2008-01-10 Samsung Electronics Co Ltd Device for detaching semiconductor chip with pair of ejector and method for detaching semiconductor chip using the same

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