JPS63228638A - Chip taking out apparatus - Google Patents

Abstract

PURPOSE:To prevent damage to the surface of a chip and dust yielding from the chip in a step for taking out the chip from a sheet, by forming an apparatus by a pushing means, which pushes up the chip, whose rear surface is stuck to one surface of the sheet, from the other surface of the sheet at an area smaller than the area of the rear surface of the chip and moves the chip; and a sucking and holding mean, which sucks a part, which is separated and floated from the sheet at the outer side of the rear surface of the chip. CONSTITUTION:A chip taking out apparatus is formed with a pushing means 1 and a sucking and holding means 2. The pushing means 1 pushes a chip 102a, which is to be taken out, among a plurality of chips 102...102 from the other surface of a sheet 101. The rear surfaces of the chips are stuck to one surface of the sheet 101. The pushing means 1 contacts a part including the central part of the rear surface. The area of the part is smaller than the area of the rear surface of the chip 102a. The chip 102a is moved upward. The sucking and holding means 2 is moved in the direction of an arrow to a position shown by a broken line from a position shown by a solid line. The means 2 sucks and holds a part of the chip 102a, which is separated and floated from the sheet 101 at the outer side of a part, where the pushing means 1 is in contact with the rear surface of the chip 102a by way of the sheet 101. Thus damage to the surface of the chip is avoided, and dust yielding due to breaking of the chip can be prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a chip extraction device used in manufacturing semiconductor chips and the like.

C. Summary of the Invention] The present invention relates to a chip ejecting device used in the manufacture of semiconductor chips, etc., in which a chip whose back side is adhered to one side of a sheet is removed from the other side of the sheet in an area smaller than the area of the back side of the chip. By using a protruding means that presses and moves the chip further, and an adsorption holding means that adsorbs the part of the back surface of the chip that has peeled off and floated from the sheet, it is possible to prevent damage to the surface of the chip during the process of removing the chip from the sheet. The present invention provides a chip ejecting device that prevents dust from being generated from chips.

[Conventional technology]

Conventionally, as an apparatus used in manufacturing semiconductor chips, there is an apparatus such as that used in the manufacturing method described in Japanese Patent Publication No. 45-4145. This manufacturing method involves, for example, processing the surface of one large semiconductor wafer by processing such as diffusion or vapor deposition, and arranging a large number of semiconductor chips of the same shape in a regular grid pattern, and then turning the back surface of the semiconductor wafer into a sheet. This relates to the step of separating the adhesive into individual chips and taking out each chip from the sheet. As shown in FIG. 12, the apparatus used in the above manufacturing method stretches the sheet 101 to create gaps between the individual chips 102, . By pressing and moving the protruding chip 103 through the sheet 101, one chip "102a" is transferred to another chip 10.
2. . . 102, the surface of the chip 102a is sucked by suction means 104 such as vacuum tweezers, and the chip 102a is taken out from the sheet 101. Further, as the suction means 104, as shown in FIG. 13, there is also known a type in which the chip 102a is brought into contact with the ridges on the surface and side surfaces thereof to be suctioned.

[Problem that the invention seeks to solve]

By the way, in the conventionally used device mentioned above,
Since the suction means touches the surface of the chip, the surface of the chip may be damaged due to relative positional deviation between the suction means and the chip.

In addition, when using a type of adsorption means that contacts the ridges on the surface and side surfaces of the chip, the contact area is small, so that so-called chipping is likely to occur at the contact portions.
This causes dust generation. The above-mentioned phenomena such as damage and dust generation cause the above-mentioned chips to fail, and in particular,
If the chip is an element that receives light and converts it into an electrical signal, such as an image sensor, this can cause a fatal defect in the chip.

SUMMARY OF THE INVENTION The present invention has been devised in view of the above-mentioned circumstances, and it is an object of the present invention to provide a chip ejecting device that prevents damage to the surface of the chips and generation of dust from the chips during the process of taking out the chips from the sheet. With the goal.

[Means for solving problems]

In order to solve the above-mentioned problems and achieve the above-mentioned object, a chip ejecting device according to the present invention takes a chip whose back side is adhered to one side of a sheet and picks it up at the center of the back side, which has an area smaller than the area of the back side of the chip. a protruding means for pressing and moving the sheet from the other surface at a portion including the chip; and a protruding means for pressing and moving the sheet from the other surface at a portion including the chip, and peeling and floating from the sheet on the outer peripheral side of the portion where the protruding means on the back surface of the chip are in contact with each other via the sheet. The device is characterized by being equipped with suction and holding means for suctioning the part that is present.

[Effect]

In the chip ejecting device according to the present invention, the protruding means picks up the chip whose back surface is adhered to one surface of the sheet, and moves the chip onto the other side of the sheet at a portion including the central portion of the back surface having an area smaller than the area of the back surface of the chip. The suction holding means adsorbs the part of the back surface of the chip which is peeled off and floating from the sheet on the outer circumferential side of the part where the protrusion means contacts through the sheet and removes the chip from the sheet. Take out the above chip.

〔Example〕

An embodiment of the present invention will be described below.

As shown in FIG. 1, the chip ejecting device according to the present invention comprises a protrusion means 1 and an adsorption/holding means 2. The protruding means 1 includes a plurality of chips 102 whose back surfaces are adhered to one surface of the sheet 101. . . . A chip 102a to be taken out among the chips 102 is pressed against the other surface of the sheet 101 with a portion including the central portion of the back surface, which has an area smaller than the area of the back surface of the chip 102a, and is moved upward in the figure. . The suction holding means 2 moves in the direction of the arrow in the figure from the position shown by the solid line in the figure to the position shown by the broken line in the figure, and the protrusion means 1 on the back surface of the chip 102a moves the sheet 101. The portion of the sheet 101 on the outer peripheral side of the portion that is in contact with the sheet 101 is held by suction.

The suction holding means 2 has a fork-type chuck 10 as a suction-holding part, and as shown in FIG. Each protrudes continuously from the side surface. And the fork-shaped chuck 10
is held by a holding and moving means (not shown) and is movable in any direction and position. A suction opening 13 is provided on the upper surface of the fork portion 12.12 in the figure.
．． It has 13. The suction openings 13.13 are connected to a vacuum pump (not shown) through vent holes 14.14 formed in the main body 12, respectively, so that the vacuum pump draws suction from the suction openings 13.13. ing.

Note that the chip 102. which is to be taken out by the chip taking out device according to the present invention. . . 102 is a large number of semiconductor chips 102 . ...10
As shown in FIG. 11, a large semiconductor web 105 in which chips 2 are arranged in a regular grid pattern is attached to the individual chips 1 with its back side adhered to one surface of the sheet 101.
02, . . . 102.

Below, the specific structure and operation of the chip take-out device according to the present invention will be explained along with the steps of separating and taking out chips.

With the chip ejecting device according to the present invention, the above sea) l
To take out the chips 102 stuck to the ot, first, as shown in FIG. 3, a plurality of chips 102. ...
The sheet 101 to which the chips 102 are adhered is stretched by a stretching means (not shown) to form the chips 102. ...102 The above-mentioned sheet 101 is placed in a state where a gap is created between each sheet.
The other side is suctioned to the suction plate 3 of this chip extraction device. This suction plate 3 is provided with an annular suction hole 4 . Furthermore, a protruding hole 5 is bored in a portion of the suction plate 3 surrounded by the suction hole 4 .

The sheet 101 is brought into close contact with the suction plate 3 so as to close the suction holes 4, and when the air pressure inside the suction holes 4 is lowered by a vacuum pump (not shown), the sheet 101
is attracted to the suction plate 3. At this time, since the protrusion means 1 is provided inside the protrusion hole 5, the plurality of chips 102. ...out of 102,
The sheet 101 is positioned so that the chip 102a to be taken out is located in the center of the protruding hole 5, and the chip 102a is attracted thereto. Note that the suction hole 4 is not limited to one, but may be a plurality of concentric annular holes, or may have other shapes. Further, in this embodiment, the suction plate 3 is arranged horizontally, but
It can be tilted as required or can also be stood vertically.

Next, as shown in FIG. 4, the cylindrical needle 6, which is one of the protrusion means 1 of this device, is moved upward in the figure from inside the protrusion hole 5 to the outside by a moving means (not shown). , its tip 7 is brought into contact with the other surface of the sheet 101. The tip 7 of the cylindrical needle 6 is moved so as to pass through the center of the protruding hole 5 and protrude outward, so that the tip 7 of the sheet 101 is in contact with the tip 7 of the sheet 101. The chip 102a is adhered to the opposite side. When the cylindrical needle 6 is further moved, the tip 102a is pressed together with the sheet 101, and as shown in FIG. 5, the sheet 101 is stretched and the tip 102a is moved. At this time, since the portion of the sheet 101 in contact with the suction plate 3 remains suctioned by the suction plate 3, only the portion of the sheet 101 facing the protrusion hole 5 is expanded. Further, since the tip 7 has an annular but flat shape, the tip 102a can be moved in parallel while maintaining a horizontal state.

Next, the rod-shaped needle 8, which is another component of the protrusion means 1 built in the cylindrical needle 6, is moved from the tip @7 to the tip @9 of the cylindrical needle 6 by a moving means (not shown). The sheet #A9 is moved upward in the figure, and the tip #A9 is brought into contact with the other surface of the sheet 101. Then, when the bar-shaped needle 8 is further moved, the tip 102a is pressed together with the sheet 101, and as shown in FIG. 6, the sheet 101 is further stretched and the tip 102a is further moved. Since the tip 9 has a flat shape, the tip 102a can be moved in parallel while maintaining a horizontal state. In this state, the chip 102a is connected to the other chips 102a.
．． . . . 102 and is located at a location away from the suction plate 3. Further, the area of the tip surface of the tip 9 is the same as that of the tip 102. .

As shown in FIG. 7, this fork-type chuck 10 is arranged so that the upper surface of the fork portion 12.12 of the fork-type chuck 10 in FIG. move.

This fork-type chuck 10, as shown in FIG. The space between the fork portions 12 and the rear surface 107 that is generated can be entered into, and the distance between the fork portions 12 and 12 is shorter than one side of the chip 102a, and the protruding means 1 It is longer than the diameter of the tip. And this fork part 1
The suction openings 13.13 of 2.12 face the back surface 107, and the distance W between the outer edges of each of the suction openings 13.13 is shorter than one side of the chip 102a. That is, the fork portion 12.12
When the chip 102a is placed on the upper surface in the figure, the rack can be placed across the fork portions 12.12, and at that time, both the suction openings 13.13 are closed by the chip 102a. It becomes a state.

As shown in FIG. 8, the fork portion 12.1
2 is brought into contact with the back surface 107 and the chip 10 is sucked from the suction opening 13.13 by the vacuum pump.
2a is held by suction on the fork portion 12.12.

In this state, the rod-shaped needle 8 and the cylindrical needle 6
When the chip 102a is moved back into the protrusion hole 5, as shown in FIG. The adhesive layer 101 is peeled off and the sheet 101 returns to its flat state.

Through the above process, the chip 102a is attached to the sheet 1.
01, it is peeled off and taken out, and is held by suction on the fork-type chuck 10. If the fork-type chuck lO is moved to an arbitrary location and the suction by the suction opening 13.13 is released,
The chip 102a can be transported to any location.

Furthermore, when it is desired to take out another chip 102, the sheet 101 is released from adsorption to the suction plate 3, the sheet 101 is moved, and the next chip to be taken out is positioned in the center of the protruding hole 5. The same steps as those described above may be performed again.

It should be noted that the shapes of the above-mentioned protruding means and suction/holding means and the suction means are not limited to this embodiment, and can be changed without departing from the gist of the present invention. For example, in the above-mentioned embodiment, the ejecting means 1 is of a type that performs a two-step ejecting operation, but is not limited to this; it may be of a type that performs a one-step ejecting operation, or it may be of a type that performs an ejecting operation of three or more steps. It is possible to apply a method in which the diameter of the tip surface changes or a method in which the diameter of the tip surface changes.

〔Effect of the invention〕

As described above, in the chip ejecting device according to the present invention, since the suction holding means contacts only the back surface of the chip, there is no risk of damaging the surface of the chip.
Moreover, since a sufficient contact area is ensured, so-called chipping of the chip and generation of dust due to the chipping are also prevented.

This contributes to reducing defects in the process in which this chip ejecting device is used, that is, improving yield, and is particularly effective for large semiconductor devices such as SRAMs, DRAMs, and solid-state image sensors. Further, in the chip extracting device according to the present invention, since the suction holding means contacts only the back surface of the chip, uniform work can be performed without being affected by the skill level of the operator of the device. , which facilitates automation of the above steps.

[Brief explanation of drawings]

FIG. 1 is a schematic side sectional view showing the structure of the chip take-out device according to the present invention, and FIG. 3 to 9 are longitudinal cross-sectional views of main parts showing the chip ejecting process using the chip ejecting device according to the present invention in order of process, FIG. 3 is a longitudinal cross-sectional view of main parts showing the process start state, and FIG. 4 is a longitudinal sectional view of the main part showing the operation start state of the ejecting means, FIG. 5 is a longitudinal sectional view of the main part showing the operation of the ejecting means, and FIG. 6 is a longitudinal sectional view of the main part showing the operation of the ejecting means. FIG. 7 is a vertical cross-sectional view of the main part showing the operation of the suction holding means, and FIG. 8 is a longitudinal cross-sectional view of the main part showing the operation of the suction holding means.
FIG. 9 is a vertical cross-sectional view of the main part showing the next operation in the figure, and FIG. 9 is a vertical cross-sectional view of the main part showing the state at the completion of the process. FIG. 10 is a plan view showing an example of the shape of a semiconductor wafer on which semiconductor chips are disposed, and FIG. 11 is a schematic cross-sectional view showing an example of the shape of the semiconductor web with the sheet adhered. FIG. 12 is a schematic vertical cross-sectional view showing an apparatus used in the conventional manufacturing method, and FIG. 13 is a schematic vertical cross-sectional view showing another example of the suction means of the apparatus used in the conventional manufacturing method. 1...Protrusion means 2...
...Adsorption holding means 101...
... Sheet 102 ...... Chip 10
7・・・・・・・・・・・・Reverse patent applicant N21 Co., Ltd. agent Patent attorney Mimi Koike 1) Sakae Mura
-Figure 1Figure 2Figure 3Figure 4Figure 5Figure 9Figure 10Figure 1IFigure 12Figure 13

Claims (1)

[Claims] a protruding means for pressing and moving a chip whose back surface is adhered to one surface of the sheet from the other surface of the sheet with a portion including a central portion of the back surface having an area smaller than the area of the back surface of the chip; A chip extraction device comprising suction and holding means for adsorbing a part of the back surface of the chip which is peeled off and floating from the sheet on the outer circumferential side of the part where the protrusion means contacts via the sheet.