JPH05286568A - Wafer sucking device and manufacture of semiconductor - Google Patents

Abstract

PURPOSE:To provide a wafer sucking device which does not affect to a semiconductor element and the manufacture of a semiconductor device by using this wafer sucking device. CONSTITUTION:A plurality of sucking blocks 31 which are capable of vertically moving to the position corresponding to the array of a semiconductor element 10a are inserted into a stage 2 as a sucking blocks group to suck the wafer 10, and a groove of the specified depth is provided between the respective sucking blocks. The wafer 10 is sucked on this sucking blocks group 3 and cut to be divided into the individual semiconductor elements 10a. This semiconductor element 10a is mounted on the wiring members arranged on the stage 2 by lifting the sucking block 31 which is sucked upward by the specified semiconductor element 10a.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer suction device for sucking a wafer on which semiconductor elements are formed, and a semiconductor device manufacturing method using the wafer suction device.

[0002]

2. Description of the Related Art A plurality of semiconductor elements are formed on a wafer made of silicon or the like, and are cut into individual semiconductor elements by cutting along a grid-shaped street. Each semiconductor element is connected to a wiring member such as a lead frame or a film carrier tape, and is housed in a package made of plastic or the like to form a semiconductor device.

A method of manufacturing a semiconductor device from the division of the wafer to the connection to the wiring member will be described with reference to the sectional views of FIGS. 6 and 7. First, as a wafer bonding step, FIG.
The wafer 10 is bonded onto the resin sheet 11 as shown in FIG. That is, the wafer 10 on which the plurality of semiconductor elements 10a are formed is changed to the resin sheet 11 to which the adhesive 11a is applied.
Adhere and fix on top.

Next, as a cutting step, as shown in FIG. 6B, the wafer 10 adhered to the resin sheet 11 is mounted on the stage 2 and divided into individual semiconductor elements 10a using a diamond blade or the like. ..

Next, as an expansion step, as shown in FIG. 7A, the resin sheet 11 is stretched to widen the intervals between the individual semiconductor elements 10a. In this way, by widening the gap between the semiconductor elements 10a, the predetermined semiconductor element 10a can be easily taken out.

Then, as shown in FIG. 7B, as a take-out step, the pin 1 is inserted from below the predetermined semiconductor element 10a.
4 is pushed up and peeled off from the resin sheet 11, and this semiconductor element 10 is attached by using the suction collet 13 and the like.
Take out a. The suction collet 13 that has sucked the semiconductor element 10a is moved to connect the semiconductor element 10a to a wiring member such as a lead frame or a film carrier tape (not shown).

As described above, the wafer 10 and the semiconductor element 10a are bonded and fixed on the resin sheet 11 from the wafer bonding step to the taking-out step.
The individual semiconductor elements 10a formed by cutting are held so as not to fall apart.

[0008]

However, such a resin sheet and a semiconductor device manufacturing method using the same have the following problems. That is, due to the elasticity of the resin sheet, when the wafer is divided, vibration is generated due to contact with the rotating diamond blade, which causes quality problems such as chipping, chipping, and cracks in the semiconductor element. Moreover, the pressure-sensitive adhesive applied to the resin sheet is uneconomical since it cannot be reused once its adhesive strength is reduced.

Further, in the method of manufacturing a semiconductor device using a resin sheet, in the step of taking out the individual semiconductor elements from the resin sheet, the semiconductor elements are pushed up by the pins, so that cracks occur in the semiconductor elements and the mechanical strength is lowered. May lead to Further, when the suction collet is used for suction, the active pattern of the semiconductor element and the suction collet may come into contact with each other to damage the active pattern, which adversely affects the electrical characteristics of the semiconductor element. Therefore, an object of the present invention is to provide a wafer suction device that does not adversely affect the semiconductor element and a semiconductor device manufacturing method using the same.

[0010]

SUMMARY OF THE INVENTION The present invention is a wafer suction device and a semiconductor device manufacturing method using the same, which have been made to solve the above problems. That is, this wafer suction device is configured to suction a wafer, on which a plurality of semiconductor elements are formed in a predetermined arrangement, by a suction block group provided on a stage. This suction block group is one in which a plurality of vertically movable suction blocks are inserted in a stage at a position corresponding to the arrangement of semiconductor elements, and a groove having a predetermined depth is provided between the suction blocks. An adsorption surface having suction holes for individually adsorbing semiconductor elements is provided on the upper surface of each adsorption block.

In the method of manufacturing a semiconductor device using this wafer suction apparatus, first, as a first step, a wafer is sucked onto a suction block group formed by arranging suction blocks at positions corresponding to the arrangement of semiconductor elements. Next, as a second step, this wafer is divided into the individual semiconductor elements. Then, as a third step, a wiring member is arranged above the stage, and the suction block on which a predetermined semiconductor element is sucked is pushed upward to connect the semiconductor element to the wiring member.

[0012]

A vacuum source is attached to each suction block, and air is sucked through the suction holes provided on each suction surface, so that the entire suction block group sucks the wafer. Also,
Each suction block corresponds to the size of the semiconductor element, and since a groove having a predetermined depth is provided between each suction block, the suction block is cut by cutting the wafer in accordance with the groove. The wafer can be divided into individual semiconductor devices without cutting.

Further, the individual semiconductor elements divided by cutting the wafer are held on the suction surfaces of the respective suction blocks. Of these, the suction blocks holding the semiconductor elements required for connection with the wiring member are held. If you push it up,
Since the semiconductor element projects above other semiconductor elements, it can be easily taken out. Also, by disposing this wiring member above the stage, it is possible to push up the suction block upward and at the same time obtain the connection between the wiring member and the semiconductor element.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A wafer suction device according to the present invention and a semiconductor device manufacturing method using the same will be described below with reference to the drawings. Figure 1
FIG. 3 is a sectional view illustrating a wafer suction device of the present invention.
That is, the wafer suction device 1 is composed of a stage 2 and a suction block group 3 provided on the stage 2, and sucks the wafer 10 having the semiconductor element 10 a formed on the suction block group 3. ..

The suction block group 3 is one in which a number of suction blocks 31 equal to the number of semiconductor elements 10a are inserted and installed in the stage 2 in a vertically movable state, and the arrangement thereof is the arrangement of the semiconductor elements 10a. It corresponds. Further, a groove 34 having a predetermined depth is provided between the suction blocks 31. That is, the groove 34 is formed in the wafer 10.
Corresponding to a boundary portion of each semiconductor element 10a formed on the upper surface of the so-called street 10b, and a state in which the position of the groove 34 and the street 10b coincide with each other when the wafer 10 is mounted on the suction block group 3. Becomes In addition,
The groove 34 has a width and a depth that can accommodate a diamond blade used when the wafer 10 is divided,
For example, the width is about 1 mm and the depth is about 3 mm.

An adsorption surface 33 corresponding to the size of the semiconductor element 10a is provided on the upper surface of each adsorption block 31, and an air intake hole 32 is formed in the substantially central portion of each adsorption surface 33. The intake holes 32 communicate with the flow holes 35 provided in the suction block 31, and the vacuum sources 4 are attached to the flow holes 35, respectively. Therefore, by using the negative pressure of the vacuum source 4, the air is sucked from each of the suction holes 32, and the suction force attracts the wafer 10 onto the suction block group 3.

Next, the operating state of the wafer suction device 1 will be described with reference to the sectional view of FIG. That is, the wafer 1
In the state where 0 is cut along the streets 10b and divided into individual semiconductor elements 10a, the semiconductor elements 10a are respectively adsorbed on the adsorption blocks 31. In this state, the suction block 31 to which the required semiconductor element 10a is sucked is pushed upward, and the semiconductor element 10a is held by the handling robot 5 or the like. In this state,
When the operation of the vacuum source 4 is stopped, the semiconductor element 10a can be removed from the suction surface 33.

As described above, since the suction block 31 can be accurately and surely pushed upward by using the stage 2 as a support, another semiconductor is held in a state where the desired semiconductor element 10a is suctioned to the suction block 31. Element 10a
It can be projected further upward. Therefore, the handling robot 5 can reliably sandwich the side surface side of the semiconductor element 10 without contacting the upper surface (active pattern side) of the semiconductor element 10a.

Next, a semiconductor device manufacturing method using the wafer suction device 1 will be described with reference to the drawings. 3 to 5
FIG. 4A is a cross-sectional view illustrating a method of manufacturing a semiconductor device using the wafer suction device 1 of the present invention in the order of steps. The steps will be described below in this order.

First, as a wafer suction step, as shown in FIG. 3, a wafer 10 having a plurality of semiconductor elements 10a formed thereon is sucked onto a suction block group 3 provided on a stage 2. In this state, the suction surfaces 33 of the respective suction blocks 3 are substantially on the same plane, and the wafer 10 is held by the suction block group 3
It is evenly adsorbed on top. When the wafer 10 is suctioned, the wafer 10 is positioned so that the positions of the streets 10b of the wafer 10 and the positions of the grooves 34 of the suction block group 3 coincide with each other.

Next, as a step of cutting the wafer 10, as shown in FIG. 4, the wafer 10 is cut along the streets 10b. That is, the lattice-shaped streets 10b are cut by using a diamond blade or the like (not shown) to divide into individual semiconductor elements 10a. At this time, the wafer 10
Is completely cut (full cut), the cutting depth by the diamond blade is made larger than the thickness of the wafer 10. Therefore, the cut diamond blade penetrates the wafer 10 and reaches the groove 34.

As a mounting step, as shown in FIG. 5, a wiring member 6 such as a lead frame or a film carrier tape is arranged above the stage 2 and a suction block 31 to which the semiconductor element 10a necessary for mounting is sucked. Push up. Simultaneously with this pushing up, contact between the semiconductor element 10a and the wiring member 6 is obtained, and connection is made using solder, adhesive, or the like. Then, by stopping the operation of the vacuum source 4, the semiconductor element 10a is removed from the suction surface 33, and the suction block 3 is lowered and returned into the stage 2.
After the mounting of one semiconductor element 10a is completed, the wiring member 6 is moved by a certain amount, and another semiconductor element 10a is mounted in the same procedure.

Since the suction block 3 is supported by the stage 2, it can be reliably pushed upward. Therefore, the semiconductor element 10a can be accurately connected to the predetermined position of the wiring member 6 at the same time when the suction block 3 is moved.

[0024]

As described above, the wafer suction device of the present invention and the semiconductor device manufacturing method using the same have the following effects. That is, when the wafer is held on the stage by using this wafer suction device, the vibration generated at the time of dividing the wafer can be made smaller than that when the resin sheet is used, so that the chipping or the chipping on the semiconductor element can be prevented. Occurrence of chips, cracks, etc. can be reduced.
Further, since the wafer and the semiconductor element are adsorbed by using the negative pressure of the vacuum source, the wafer can be used any number of times and the cost can be reduced.

Further, in the method of manufacturing a semiconductor device using this wafer suction device, no pins are used when the semiconductor element is removed, so that the semiconductor element is not cracked. Furthermore, if the semiconductor element and the wiring member are connected at the same time when the suction block is pushed upward, the semiconductor element does not have to be moved using a suction collet or a handling robot. Therefore, the semiconductor element can be mounted without touching the active pattern of the semiconductor element, so that the semiconductor element can be mounted without adversely affecting the semiconductor element.
As a result, the production yield of semiconductor devices can be improved.

[Brief description of drawings]

FIG. 1 is a sectional view illustrating a wafer suction device of the present invention.

FIG. 2 is a cross-sectional view illustrating an operating state of the wafer suction device.

FIG. 3 is a sectional view illustrating a wafer suction step.

FIG. 4 is a cross-sectional view illustrating a cutting process.

FIG. 5 is a cross-sectional view illustrating a mounting process.

FIG. 6 is a cross-sectional view (1) explaining a conventional example, (a)
Is a wafer bonding step, and (b) is a cutting step.

FIG. 7 is a cross-sectional view (2) explaining a conventional example, (c).
Is an expansion process, and (d) is a removal process.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Wafer suction device 2 Stage 3 Suction block group 4 Vacuum source 5 Handling robot 6 Wiring member 10 Wafer 10a Semiconductor element 10b Street 11 Resin sheet 11a Adhesive agent 13 Adsorption collet 14 Pin 31 Adsorption block 32 Intake hole 33 Adsorption surface 34 Groove 35 Distribution Hole

Claims (2)

[Claims] 1. A wafer suction device for sucking a wafer, in which a plurality of semiconductor elements are formed in a predetermined array, by a suction block group provided on a stage, wherein the suction block group is an array of the semiconductor elements. A plurality of vertically movable suction blocks are inserted in the stage at positions corresponding to, and a groove having a predetermined depth is provided between the suction blocks. A wafer suction apparatus, wherein a suction surface having suction holes for individually sucking the semiconductor elements is provided on an upper surface of the block. 2. A wafer suction device comprising: a wafer on which semiconductor elements are formed in a predetermined arrangement, is sucked onto a stage, the wafer is divided into individual semiconductor elements, and the semiconductor elements are connected to wiring members. In the method of manufacturing a semiconductor device used, a first step of adsorbing the wafer to an adsorption block group comprising adsorption blocks arranged at positions corresponding to the arrangement of the semiconductor elements; And a second step of connecting the semiconductor element to the wiring member by arranging the wiring member above the stage and pushing up the suction block on which a predetermined semiconductor element is sucked up. A semiconductor device manufacturing method using a wafer suction device comprising three steps.