TW201810445A - Apparatus for manufacturing semiconductor and method of manufacturing semiconductor device - Google Patents

Abstract

An object of the present invention is to provide an apparatus for manufacturing a semiconductor which is able to easily change a push-up unit according to kinds. The apparatus for manufacturing a semiconductor comprises: a push-up unit for pushing a die up from the bottom of a dicing tape; and a collet for adsorbing the die. The push-up unit comprises: a first unit having a plurality of square shape blocks contacting with the dicing tape; and a second unit having a plurality of concentric blocks transferring vertical movement to each of the blocks, respectively, wherein the first unit is mounted on the top of the second unit.

Description

Semiconductor manufacturing device and method for manufacturing semiconductor device

The present disclosure relates to a semiconductor manufacturing apparatus, and is applicable to, for example, a die attacher having an ejector unit.

Generally, a semiconductor wafer called a die is mounted on a die attacher such as a wiring board or a lead frame (hereinafter collectively referred to as a substrate). Generally, a suction nozzle such as a suction tool is used to mount the semiconductor wafer. The die is transferred to the substrate, and a pressing operation is performed while the bonding material is heated to perform the bonding operation (operation), which is repeated.

In the die bonding process by a semiconductor manufacturing device such as a die attacher, there is a peeling process for peeling off the die separated from a semiconductor wafer (hereinafter referred to as a wafer). In the peeling process, the crystal grains are ejected by the ejection unit from the back of the dicing tape, and the dicing tape held by the crystal grain supply part is peeled off one by one, and the suction nozzles are used. It is carried on the substrate.

For example, according to Japanese Patent Application Laid-Open No. 2012-4393 (Patent Document 1), when a grain to be peeled is ejected from a plurality of grains adhered to a dicing tape, and the crystalline grain is peeled from the dicing tape, Peripheral The dicing tape in the predetermined portion is ejected to form a peeling starting point, and thereafter, the dicing tape in a portion other than the predetermined portion is ejected to peel off the crystal grains from the dicing tape.

[Prior technical literature] [Patent Literature]

[Patent Document 1] Japanese Patent Application Publication No. 2012-4393

When picking up a die from a wafer, a jig must be set in accordance with the variety (eg, die size). However, adjustments at the time of variety change are complicated and take time. In the case where the pick-up operation is a multi-stage ejection as in Patent Document 1, the ejection unit is prepared in a structure that matches the operation specifications in advance, so the ejection unit cannot be changed afterwards.

The subject of the present disclosure is to provide a semiconductor manufacturing device that can easily change the ejection unit according to the type.

Other problems and novel features should be apparent from the description in this specification and the accompanying drawings.

To briefly explain the representative of this disclosure, it is as follows.

That is, the semiconductor manufacturing apparatus includes: an ejection unit, It is ejected from under the cutting belt; and the sucker is used to adsorb the previous grains. The prescriptive ejection unit includes: a first unit having a plurality of quadrangular blocks in contact with the precut cutting zone; and a second unit having concentric circles that independently convey the up-and-down motion to each of the preamble plural blocks Plural blocks of states. The preamble first unit is mounted on the preamble second unit.

According to the semiconductor manufacturing apparatus described above, the ejection unit can be easily changed according to the product.

1‧‧‧Crystal Supply Department

11‧‧‧ wafer

13‧‧‧ ejection unit

13a‧‧‧Unit 1

13a1‧‧‧ Block Department

13a2‧‧‧Adsorption Unit

13a3‧‧‧‧Attraction

13a4‧‧‧‧Attraction

A1 ~ A6‧‧‧‧Concentric quadrangular blocks

13b‧‧‧Unit 2

B1 ~ B6‧‧‧‧Concentric circles

13c‧‧‧Unit 3

13c0‧‧‧ Central

13c1 ~ 13c6‧‧‧ Peripheral

C1 ~ C6‧‧‧‧Output section

16‧‧‧ cutting tape

2‧‧‧Pick up department

21‧‧‧Pickup head

3‧‧‧Middle Platform Department

31‧‧‧ intermediate platform

4‧‧‧ Knotting Department

41‧‧‧ tied his head

7‧‧‧Control Department

10‧‧‧ Sticky Crystal Machine

D‧‧‧ Grain

P‧‧‧ substrate

[Figure 1] Conceptual view of the crystal sticking machine described in the embodiment from above

[Fig. 2] Explanatory diagram of the movement of the pickup head and the head when viewed from the direction of arrow A in Fig. 1

[Fig. 3] An illustration of an external perspective view of the die supply section of Fig. 1. [Fig.

[Fig. 4] A schematic cross-sectional view of a main part of the crystal grain supplying section of Fig. 1

[Fig. 5] An external oblique view of the ejection unit according to the embodiment

[Fig. 6A] A top view of a part of the first unit of Fig. 5

[Fig. 6B] A top view of a part of the second unit of Fig. 5

[Fig. 6C] A top view of a part of the third unit of Fig. 5

[Fig. 7] A longitudinal sectional view of the ejection unit of Fig. 5

[Fig. 8] A longitudinal sectional view of the ejection unit of Fig. 5

[Fig. 9] The suction unit in the ejection unit and the pickup head according to the embodiment Diagram of the composition

[Fig. 10] A flowchart for explaining the picking operation of the die attacher according to the embodiment

11 is a flowchart for explaining a method of manufacturing a semiconductor device according to an embodiment

[Fig. 12A] Appearance perspective view of an ejection unit according to a modification

[Fig. 12B] Appearance perspective view of the ejection unit according to the modification

[Fig. 13] A longitudinal sectional view of the first unit of Fig. 12A

[Fig. 14A] A longitudinal sectional view of a part of the ejection unit of Fig. 12A

[FIG. 14B] A longitudinal sectional view of a state where the first unit is removed from a part of the ejection unit of FIG. 14A

[Fig. 15] An external perspective view of an ejection unit according to Modification 2

16 A longitudinal sectional view of a third unit of FIG. 15

[Fig. 17] A top view of a part of the third unit of Fig. 16

[Fig. 18] A top view of a part of a modification of the third unit of Fig. 15

Hereinafter, examples and modifications will be described using drawings. However, in the following description, the same constituent elements are denoted by the same reference numerals, and duplicate descriptions will be omitted. In addition, in order to make the description clearer, the width, thickness, and shape of each part may be schematically illustrated in comparison with the actual appearance. However, this is only an example and is not intended to limit it. Explanation of the invention.

[Example]

FIG. 1 is a schematic top view of a die attacher according to the embodiment. FIG. 2 is an explanatory diagram of the movement of the pickup head and the head when viewed from the direction of arrow A in FIG. 1.

The die attacher 10 generally includes a die supply section 1, a picking section 2, an intermediate stage section 3, a bonding section 4, a conveyance section 5, a substrate supply section 6, a substrate carry-out section 7, and monitoring operations of various sections. And control unit 8 for controlling.

First, the die supply unit 1 supplies the die D to be mounted on the substrate P. The die supply unit 1 includes a wafer holding table 12 that holds the wafer 11, and an ejection unit 13 indicated by a broken line to eject the die D from the wafer 11. The die supply unit 1 moves in the XY direction by a driving means (not shown) to move the die D to be picked up to the position of the ejection unit 13.

The picking section 2 includes a picking head 21 for picking up the die D, a Y driving section 23 of the picking head that moves the picking head 21 in the Y direction, and a not-shown illustration of lifting, rotating, and moving the suction tool 22 in the X direction. Of each driving section. The pick-up head 21 includes a suction tool 22 (see also FIG. 2) that sucks and holds the ejected crystal grains D at the tip, picks the crystal grains D from the crystal grain supply unit 1, and places them on the intermediate platform 31. The pick-up head 21 includes drive units (not shown) for lifting, rotating, and moving the suction tool 22 in the X direction.

The intermediate platform section 3 includes an intermediate platform 31 on which the die D is temporarily placed, and a platform identification camera 32 required to identify the die D on the intermediate platform 31.

The bonding part 4 picks up the die D from the intermediate platform 31 and is bonded to the transferred substrate P, or is laminated on the die already bonded to the substrate P. Knotted. The bonding section 4 includes a bonding head 41 having a suction tool 42 (see also FIG. 2) for holding and holding the crystal grain D on the tip in the same manner as the pickup head 21, and a Y drive for moving the bonding head 41 in the Y direction. The unit 43 captures a position identification mark (not shown) of the substrate P, and recognizes the substrate identification camera 44 where the position is attached.

With this structure, the head 41 is bound to correct the pickup position and posture based on the imaging data of the platform recognition camera 32, pick up the die D from the intermediate platform 31, and bind the die D based on the imaging data of the substrate recognition camera 44. A substrate P.

The conveying section 5 includes a substrate conveying tray 51 on which one or a plurality of substrates P (four in FIG. 1 are shown), and a tray rail 52 for moving the substrate conveying tray 51. The conveying section 5 has a first structure having the same structure and provided in parallel. 2. The second transportation unit. The substrate transfer tray 51 is moved by driving a non-illustrated nut provided on the substrate transfer tray 51 by a ball screw (not shown) provided along the disk rail 52.

With this structure, the substrate transfer tray 51 carries the substrate P by the substrate supply unit 6 and moves to the bonding position along the disk rail 52. After the bonding, the substrate transfer tray 51 is moved to the substrate carrying portion 7 and the substrate P is delivered. Give the substrate carrying-out section 7. The first and second conveying sections are driven independently of each other. When the substrate P placed on one substrate conveying tray 51 is being bonded to the die D, the other substrate conveying tray 51 is used to convey the substrate P. It is carried out and returned to the substrate supply unit 6 to prepare for placing a new substrate P or the like.

The control unit 8 is provided with a memory that stores programs (software) that monitor and control the operations of the various parts of the die attacher 10, and a central processing unit (CPU) that executes the programs stored in the memory.

Next, the structure of the crystal grain supply part 1 is demonstrated using FIG. 3 and FIG. 4. FIG. FIG. 3 is a diagram showing an external perspective view of a die supply unit. FIG. 4 is a schematic cross-sectional view of a main part of a crystal grain supply unit.

The die supply unit 1 includes a wafer holding table 12 that moves in the horizontal direction (XY direction), and an ejection unit 13 that moves in the vertical direction. The wafer holding table 12 includes an expansion ring 15 that holds the wafer ring 14, and a support ring 17 that horizontally positions a dicing tape 16 to which a plurality of dies D held by the wafer ring 14 are attached. The ejection unit 13 is arranged inside the support ring 17.

The die supply unit 1 lowers the expansion ring 15 holding the wafer ring 14 when the die D is ejected. As a result, the dicing tape 16 held by the wafer ring 14 is stretched to expand the interval between the crystal grains D, and the ejection unit 13 ejects the crystal grains D from below the crystal grains D, thereby increasing the crystal grains D. Pickup. In addition, the adhesive that adheres the crystal grains to the substrate as the thickness decreases has changed from a liquid state to a thin film state, and a type of grain adhesion film (DAF) 18 is pasted between the wafer 11 and the dicing tape 16. Film-like adhesive material. In the wafer 11 having the die bonding film 18, dicing is performed on the wafer 11 and the die bonding film 18. Therefore, in the peeling process, the wafer 11 and the die bonding film 18 are peeled from the dicing tape 16. In addition, the following will explain the peeling process regardless of the existence of the crystal grain adhesive film 18.

Next, for the ejection unit 13, FIGS. 5 and 6A are used. 6D, 7, 8 to explain. FIG. 5 is an external perspective view of the ejection unit according to the embodiment. FIG. 6A is a top view of a part of the first unit of FIG. 5. FIG. FIG. 6B is a top view of a part of the second unit of FIG. 5. FIG. FIG. 6C is a top view of a part of the third unit of FIG. 5. FIG. FIG. 7 is a longitudinal sectional view of the ejection unit of FIG. 5. FIG. 8 is a longitudinal sectional view of the ejection unit of FIG. 5.

The ejection unit 13 includes a first unit 13a, a second unit 13b on which the first unit 13a is mounted, and a third unit 13c on which the second unit 13b is mounted. The second unit 13b and the third unit 13c are common parts regardless of the variety, and the first unit 13a is a part that can be replaced with each variety.

The first unit 13a includes: a block portion 13a1 having blocks A1 to A6, a steam drum head 13a2 having a plurality of adsorption holes, a suction hole 13a3, and a suction hole 13a4 adsorbed by the steam drum; and a concentric circle of the second unit 13b The up and down movements of blocks B1 to B6 are transformed into the up and down movements of the six blocks A1 to A6 in concentric quadrangular shape. The six blocks A1 ~ A6 can move up and down independently. The planar shapes of the concentric quadrangular blocks A1 to A6 are configured to conform to the shape of the crystal grain D. When the grain size is small, the number of concentric quadrangular blocks is less than six. In this case, for example, the output unit of the third unit and the concentric block of the second unit are not used. This is made possible by the plural output units of the third unit and the concentric circle-shaped blocks of the second unit being able to move up and down (or without doing up and down movement) independently of each other.

The second unit 13b is a block B1 ~ B6, outer peripheral portion 13b2; converting up and down movements of the output portions C1 to C6 arranged on the circumference of the first unit 13a into up and down movements of the six blocks B1 to B6 in a concentric circle shape. The six blocks B1 ~ B6 can move up and down independently.

The third unit 13c includes a central portion 13c0 and six peripheral portions 13c1 to 13c6. The central portion 13c0 has six output portions C1 to C6 that are arranged at equal intervals on the upper circumference and move independently up and down. The peripheral portions 13c1 to 13c6 can drive the output portions C1 to C6 independently of each other. The peripheral portions 13c1 to 13c6 are provided with motors M1 to M6, respectively, and the central portion 13c0 series is provided with plunger mechanisms P1 to P6 that convert the rotation of the motor into a vertical movement by a cam or a link. The plunger mechanisms P1 to P6 give up and down movements to the output portions C1 to C6. The motors M2 and M5 and the plunger mechanisms P2 and P5 are not shown.

Next, the relationship between the ejection unit and the suction tool will be described using FIG. 9. FIG. 9 is a diagram showing the configurations of the suction unit in the ejection unit and the pickup head according to the embodiment.

As shown in FIG. 9, the sucker unit 20 includes a sucker 22, a sucker holder 24 for holding the sucker 22, and suction holes 22v and 23v required for sucking the crystal grain D, respectively.

The first unit 13a is provided with a drum head 13a2 at a peripheral portion of the upper surface. The drum head 13 a 2 has a plurality of suction holes HL and cavity portions CV, and sucks through the suction holes 13 a 3 to suck the crystal grains Dd around the crystal grains D picked up by the suction tool 22 through the cutting tape 16. In FIG. 9, only one row of suction holes HL is shown around the block portion 13 a 1. It is assumed that the crystal grains Dd which are not the objects to be picked up are provided with a plurality of columns. Through the gaps A1v, A2v, A3v, A4v, A5v and the cavity in the steam drum of the first unit 13a through the gaps A1v, A2v, A3v, A4v, A5v of the concentric quadrangular blocks A1 to A6, they are attracted from the suction holes 13a4 absorbed by the drum , The grain D picked up by the suction tool 22 is attracted through the cutting tape 16. The suction from the suction hole 13a3 and the suction system from the suction hole 13a4 can be performed independently.

The ejection unit 13 of this embodiment can be applied to various grains by changing the shape and number of blocks of the first unit. For example, when the number of blocks is 6, the grain size is applicable. It is a grain below 20mm □. By increasing the number of output units of the third unit, the number of concentric circular blocks of the second unit, and the number of concentric quadrangular blocks of the first unit, it is also possible to apply crystal grains with a grain size larger than 20 mm. .

Next, the pick-up operation by the ejection unit 13 due to the above configuration will be described using FIG. 10. FIG. 10 is a flowchart of a processing flow of a pickup operation.

Step S1: The control unit 8 moves the wafer holding table 12 so that the die D to be picked up is located directly above the ejection unit 13, so that the back surface of the dicing tape 16 contacts the upper surface of the third unit And the ejector unit 13 is moved. At this time, as shown in FIG. 9, the control unit 8 makes the blocks A1 to A6 of the block portion 13a1 form the same plane as the surface of the drum head 13a2 through the suction holes HL of the drum head 13a2, And the gaps A1v, A2v, A3v, A4v, A5v between the blocks, and the cutting tape 16 is adsorbed.

Step 2: The control unit 8 lowers and positions the suction unit 20 On the grain D to be picked up, the grain D is adsorbed by the suction holes 22v and 24v.

Step 3: The control section 8 gradually lifts the blocks of the block section 13a1 from the outside to perform a peeling operation. That is, the control unit 8 drives the plunger mechanism P6 with the motor M6, and only raises the outermost block A6 by several tens μm to several hundreds μm, and then stops. As a result, a cutting part 16 is formed as a bulge on the periphery of the block A6, and a minute space can be created between the cutting band 16 and the die bonding film 18, that is, the starting point of peeling. This space can greatly reduce the anchoring effect, that is, the stress applied to the crystal grain D can be greatly reduced, and the subsequent peeling operation can be performed reliably. Next, the control unit 8 drives the plunger mechanism P5 with the motor M5, and only the block A5 on the second outer side rises higher than the block A6 and stops. Next, the control unit 8 drives the plunger mechanism P4 with the motor M4, and only the block A4 on the third outer side rises higher than the block A5 and stops. Next, the control unit 8 drives the plunger mechanism P3 with the motor M3, and only the block A3 on the fourth outer side rises higher than the block A4 and stops. Next, the control unit 8 drives the plunger mechanism P2 with the motor M2, and only the block A2 on the fifth outer side rises higher than the block A3 and stops. Finally, the control unit 8 uses the motor M1 to drive the plunger mechanism P1, and only the innermost block A1 rises higher than the block A2 and stops.

Step S4: The control unit 8 raises the suction tool. In the final state of step S3, the contact area between the dicing tape 16 and the crystal grain D becomes an area that can be peeled off by the lifting of the suction tool, and the crystal grain D can be peeled off by the lifting of the suction tool 22.

Step S5: The control unit 8 stops the adsorption holes HL of the drum head 13a2, the gap A1v, Adsorption of cutting tape 16 by A2v, A3v, A4v, A5v. The control unit 8 moves the ejection unit 13 so that the upper surface of the first unit is away from the rear surface of the cutting tape 16.

The control unit 8 repeats steps S1 to S5 to pick up the good crystal grains of the wafer 11.

Next, a method for manufacturing a semiconductor device using the die attacher described in the examples will be described with reference to FIG. 11. FIG. 11 is a flowchart of a method of manufacturing a semiconductor device.

Step S11: The wafer ring 14 holding the dicing tape 16 to which the die D divided from the wafer 11 is adhered is put into a wafer cassette (not shown), and carried into the die attacher 10. The control unit 8 supplies the wafer ring 14 to the die supply unit 1 from a wafer cassette filled with the wafer ring 14. The substrate P is prepared and carried into the die attacher 10. The control unit 8 places the substrate P on the substrate transfer tray 51 with the substrate supply unit 6.

Step S12: The control unit 8 picks up the dies that have been divided in steps S1 to S5 from the wafer.

Step S13: The control unit 8 mounts the picked-up crystal grains on the substrate P or laminates the crystal grains already deposited. The control unit 8 places the die D picked up from the wafer 11 on the intermediate stage 31, picks up the die D again from the intermediate stage 31 with a head 41, and binds the die D to the substrate P that has been transferred.

Step S14: The control unit 8 uses the substrate carrying-out unit 7 to take out the substrate P to which the crystal grains D are bound from the substrate carrying tray 51. The substrate P is carried out from the die attacher 10.

<Modification 1>

Next, a modification example 1 of the ejection unit will be described using FIGS. 12A, 12B, 13, 14A, and 14B. FIG. 12A is an external perspective view of an ejection unit according to Modification 1. FIG. FIG. 12B is an external perspective view of the ejection unit according to Modification 1. FIG. FIG. 13 is a longitudinal sectional view of a first unit of FIG. 12A. 14A is a longitudinal sectional view of a part of the first unit and the second unit of the ejection unit of FIG. 12A. FIG. 14B is a longitudinal sectional view showing a state where the first unit of FIG. 12A is removed. FIG.

The ejection unit 13A includes a first unit 13Aa and a second unit 13Ab on which the first unit 13Aa is mounted. The second unit 13Ab is a common part regardless of the variety, and the first unit 13Aa is a part that can be replaced with each variety.

The first unit 13Aa is different from the first unit 13a in the embodiment, and the other units are the same as the first unit 13a. The first unit 13Aa is provided with a block portion 13Aa1 having blocks AA1 to AA4, a steam drum head 13Aa2 having a plurality of adsorption holes, a suction hole 13a3, a suction hole 13a4 adsorbed by a steam drum, and a concentric circle formed by the second unit 13Ab. The up and down movements of the blocks BA1 to BA4 are transmitted to the components aA1 to aA4 of the four blocks A1 to A4 in a concentric quadrilateral shape.

The second unit 13Ab includes: an outer peripheral portion 13Ab1, A member 13Ab2 covering the outer periphery 13Ab1 and containing the first unit 13Aa2, a member 13Ab2 locked (fixed) to the member 12Ab3 of the outer periphery 13Ab1, a coaxial circular tubular (tubular) block BA1 to BA4, a block BA1 to BA4 The driving sections CA1 to CA4 which are respectively driven. By releasing the lock of the member 12Ab3, the member 13Ab2 can move upward, and the first unit 13Aa can release the second unit 13Ab. The driving sections CA1 to CA4 are in the up-down direction, and the driving sections CA1, CA2, CA3, and CA4 are arranged in order from the top. The four driving sections CA1 to CA4 can drive the four blocks BA1 to BA4 independently. As a result, the four blocks AA1 to AA4 can move up and down independently. In order to arrange the driving portions CA1 to CA4 in the up-down direction, the size in the horizontal direction can be made smaller than in the embodiment.

The pickup action by the ejection unit 13A is the same as the action by the ejection unit 13 of the embodiment shown in FIG. 10. The manufacturing method of the semiconductor device using the die attacher provided with the ejection unit 13A is the same as the manufacturing method of the semiconductor device of the embodiment shown in FIG. 11.

<Modification 2>

Next, a second modification of the ejection unit will be described using FIGS. 15 to 17. FIG. 15 is an external perspective view of an ejection unit according to Modification 2. FIG. FIG. 16 is a longitudinal sectional view of a third unit of FIG. 15. FIG. 17 is a top view of a part of the third unit of FIG. 16. FIG.

The ejection unit 13B includes a first unit 13Ba, a second unit 13Bb on which the first unit 13Ba is mounted, and a third unit 13Bc on which the second unit 13Bb is mounted. Unit 2 13Bb and Unit 3 13Bc is a common part regardless of the variety, and the first unit 13Ba is a part that can be replaced with each variety.

The first unit 13Ba is different from the first unit 13a in the number of blocks but has the same structure, and has a maximum of 12 blocks. The second unit 13Bb has the same number of blocks as the second unit 13b but has the same structure, and has a maximum of 12 blocks.

The third unit 13Bc includes a central portion 13Bc0 and 12 peripheral portions 13c1 to 13c6 and 13d1 to 13d6. The central portion 13Bc0 has six output portions C1 to C6 that are arranged at equal intervals on the outer periphery on the upper side and move independently up and down, and six output portions that are arranged on the inner circumference on the inner periphery to move up and down independently. Output sections D1 ~ D6. The peripheral portions 13c1 to 13c6 are arranged above the peripheral portions 13d1 to 13d6. The peripheral portions 13c1 to 13c6 and 13d1 to 13d6 can drive the output portions C1 to C6 and D1 to D6 independently of each other. The peripheral parts 13c1 to 13c6 and 13d1 to 13d6 are equipped with motors M1 to M6 and Md1 to Md6, respectively. The central part 13Bc0 is equipped with a plunger mechanism P1 to P6 that converts the rotation of the motor into a vertical movement by a cam or a link. , Pd1 ~ Pd6. The plunger mechanisms P1 to P6 and Pd1 to Pd6 give up and down movements to the output portions C1 to C6 and D1 to D6. The motors M1, M2, M4, M5, Md1, Md2, Md4, Md5, and the plunger mechanism P1, P2, P4, P5, Pd1, Pd2, Pd4, and Pd5 are not shown.

By increasing the output unit by vertically stacking the third unit, more blocks can be operated. The third unit must be installed in the upper section. In addition to the output section, the shaft of the plunger used in the lower section must be through. between. In the second modification, the rotation of the motors of the third unit of the upper and lower stages is converted into the cam or link position of the plunger mechanism that moves up and down, and the inner and outer peripheral parts on the concentric circles are staggered and arranged, but As shown in FIG. 18, the angle of the third unit above and below (180 ° / number of set points, for example, 30 ° for the third unit with 6 outputs) can be staggered to ensure that the The shaft makes through space. With this two-layer stacking, it is possible to cope with around 12 o'clock together with the output section. In addition, the output unit of the upper stage unit can be reduced by 1 to 3 to secure space.

In the embodiment, in the third unit, the operating point where the rotation of the motor is moved up and down by a cam or a connecting rod has 6 points on the circumference. In the second unit, the operation points on the 6-point circle are expanded into 6-point concentric circles. In the first unit, each part is connected from an operation circle on a concentric circle to a corner block of a grain size. In the modification 1, in the second unit, an operation circle expanded from four operation points arranged in the up-down direction into four concentric circles is developed. In the first unit, each part is connected from an operation circle on a concentric circle to a corner block of a grain size. In the second modification, the operating point of the third unit can be arranged up to 12 points. By disassembling it into a maximum of 12, 6, or 4 stages, it is possible to share parts and processes for grains of multiple sizes.

Moreover, in the embodiment and the modification, by realizing the ejection strokes in which the segments do not affect each other (no interference occurs), the ejection direction / pull-in direction can be set freely by programming, and such a type can be provided. Eject the mechanism. That is, since the segments are independent and do not interfere with each other, the design is easy. In addition, the ejection height, the up-down timing, and the like can be freely selected.

Since it is common to the concentric circle structure above the ejection jig, the variety change due to the grain size can be completed by changing the variety switching part (the first unit). It is easy to design the system of the variety switching parts. Variety switching parts can be designed quickly, reducing lead time / price. We are moving towards the sharing of parts. In addition, it is possible to shorten the time involved in the variety change.

Although the invention made by the present inventors has been specifically described based on the embodiments and the modifications, the present invention is not limited to the embodiments and the modifications described above, and of course, various modifications can be made.

For example, in the embodiment, the up-and-down movement of the plunger mechanism is performed using a motor, but it is also possible to use a flat cam to convert the back-and-forth movement of a shaft such as a cylinder into an up-and-down movement without using a motor.

In addition, when a large output or stroke is required, the size of the rotating cam or the connecting rod of the motor will increase, and if it cannot be accommodated in a predetermined space, it is still possible to reduce each segment of the third unit. To reduce the output, and the reduction can be compensated by lamination.

In addition, the plunger mechanism that raises the block of the second unit from the output unit of the third unit can also be designed to move the metal wire-shaped core back and forth in the elastic guide rail like the release of the camera's shutter. structure. In this case, the arrangement of the driving portion of the plunger cam such as a motor or an air cylinder can be arranged at a relatively remote position, and the degree of freedom of arrangement can be improved.

In addition, although the example in which the number of the plural blocks of the first unit is 12, 6, or 4 has been described, it is only necessary that the number is 3 or more. Although it is explained that the number of the plural blocks of the second unit is 12, 6 Examples of four or four, but as long as the number of plural blocks of the first unit is the same. Although an example in which the number of the plural driving output units of the third unit is 12 or 6 has been described, it is sufficient if it is the same as the number of the plural blocks of the second unit.

In addition, although the plural blocks of the first unit have been described as being concentric quadrangular, the quadrangular blocks may be arranged in parallel.

Furthermore, in the embodiment, although the pick-up target grains and the surrounding grains are adsorbed / released at the same timing, the pick-up target grains and the peripheral grains may be adsorbed / released at different timings. Thereby, more reliable peeling can be performed.

In addition, although the blocks of each segment are ejected sequentially in the embodiment, since the segments can operate independently and differently, the ejection / pulling motions in both directions can also be mixed.

Moreover, in the embodiment, although an example in which the die is ejected by using a block in the first unit is described, a pin (pin) may be used instead of the block.

Moreover, although the example which used the die-bonding film was demonstrated in the Example, the preform part for apply | coating an adhesive agent may be provided in a board | substrate without using a die-bonding film.

In addition, in the examples, it was explained that the die is picked up by the pick-up head from the die supply unit and placed on the intermediate stage, and the die placed on the intermediate stage is bound to the substrate by a head. The die attacher is not limited to this, and can be applied to a semiconductor manufacturing apparatus that picks up a die from a die supply unit.

For example, the present invention is also applicable to a die attacher that does not have an intermediate stage and a pick-up head, and binds the crystal grains of the crystal grain supply unit to the substrate with a head.

In addition, it can also be applied to a flip-type adhesive that does not have an intermediate platform, picks up the die from the die supply unit, and rotates the die picking head upward to hand over the die to the head and attach the head to the substrate. Crystal machine.

The present invention is also applicable to a grain aligning machine that does not have an intermediate stage and a head, and places the grains picked up by the pick-up head from the grain supply section on a tray.

13‧‧‧ ejection unit

13a‧‧‧Unit 1

13b‧‧‧Unit 2

13c‧‧‧Unit 3

13c0‧‧‧ Central

13c1 ~ 13c6‧‧‧ Peripheral

Claims (18)

A semiconductor manufacturing device includes: an ejection unit for ejecting crystal grains from under a dicing tape; and a suction tool for adsorbing the former crystal grains; the pre-ejection unit includes: a first unit, which has The quadrangular plural block in contact with the precut cutting band; and the second unit is a concentric circular plural block that independently conveys the up-and-down movement to each of the plural preblocks; the first unit of the prescript is installed Focus on the second unit of the preface. The semiconductor manufacturing apparatus according to claim 1, wherein the first unit of the preamble converts the up-and-down movement of the concentric plural block of the preamble into the up-and-down movement of the plural block of the preamble quadrilateral. The semiconductor manufacturing apparatus according to claim 1, wherein the first unit system of the preamble further includes: a first adsorption unit, which is located outside the plural blocks of the preamble, and adsorbs peripheral crystal grains on the outer side of the preceeding grains; and a second adsorption unit, It consists of the gaps between the preceding plural blocks that adsorb the preceding crystal grains. The semiconductor manufacturing apparatus according to claim 3, wherein the first adsorption unit and the second adsorption unit can independently set the adsorption timing. The semiconductor manufacturing apparatus according to claim 4, wherein the number of the plurality of blocks in the first unit of the preamble is three or more. The semiconductor manufacturing apparatus according to claim 1, wherein the preamble quadrangular plural blocks are configured to be concentric. For example, the semiconductor manufacturing apparatus according to claim 1, wherein the preamble first unit is provided with a plurality of pins arranged in a quadrangular shape instead of the quadrangular plural blocks in the preamble. The semiconductor manufacturing apparatus according to claim 1, further comprising: a third unit having a plurality of driving output units arranged on a circumference, and each of the plurality of blocks of the preceding second unit is independently provided with an upper and a lower unit. motion. The semiconductor manufacturing device according to claim 8, wherein the preamble second unit converts the up-and-down movement of the complex output portion arranged on the circumference of the preamble into the up-and-down movement of the concentric circle-shaped complex block. The semiconductor manufacturing apparatus according to claim 8, wherein the preamble third unit is further provided with a plurality of drive units on the side, and the preamble plural drive units respectively provide vertical movement to the preamble plural output unit. For example, the semiconductor manufacturing apparatus according to claim 8, wherein the number of the plural blocks of the preamble second unit and the number of the plural drive output sections of the preamble third unit are all 3 or more. The semiconductor manufacturing apparatus according to claim 8, wherein the third unit described above is laminated and further includes a plurality of driving units. The semiconductor manufacturing device according to claim 1, wherein the preceding grain system is further provided between the preceding grain and the preceding cutting band, Granular conjunctiva. The semiconductor manufacturing apparatus according to claim 1, further comprising: a pick-up head, which is used to mount a pre-charging tool. The semiconductor manufacturing apparatus according to claim 14, further comprising: an intermediate stage for holding the crystal grains picked up by the preamble pick-up head; and a head bonded to the die chips to be placed on the pre-processed intermediate stage, Bonded to a substrate or a die that is already bonded. A method for manufacturing a semiconductor device, comprising: (a) preparing a semiconductor manufacturing device as claimed in any one of claims 1 to 15; and (b) preparing a wafer ring for holding a wafer ring having a dicing tape with a die Engineering; and (c) the preparation of the substrate mentioned above; and (d) the engineering of the previous ejection unit to eject the previous grain and then the previous suction tool to pick up the previous grain. The method for manufacturing a semiconductor device according to claim 16, further comprising: (e) a process of bonding the aforementioned crystal grains to the substrate or the crystal grains already bonded. The method for manufacturing a semiconductor device according to claim 17, wherein the preamble (d) engineering system further includes: a process of placing the crystal grains picked up in the preamble on an intermediate platform; the preamble (e) engineering system further includes: the preliminary intermediate platform The process of picking the previous grain.