JPS5645036A - Mounting method and apparatus for semiconductor pellet - Google Patents

Mounting method and apparatus for semiconductor pellet

Info

Publication number
JPS5645036A
JPS5645036A JP12005979A JP12005979A JPS5645036A JP S5645036 A JPS5645036 A JP S5645036A JP 12005979 A JP12005979 A JP 12005979A JP 12005979 A JP12005979 A JP 12005979A JP S5645036 A JPS5645036 A JP S5645036A
Authority
JP
Japan
Prior art keywords
paste
mounting
island
pellet
head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12005979A
Other languages
Japanese (ja)
Inventor
Tatsuo Oketa
Fumio Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP12005979A priority Critical patent/JPS5645036A/en
Publication of JPS5645036A publication Critical patent/JPS5645036A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

Abstract

PURPOSE:To prevent a semiconductor pellet from being placed out of position or lost by discriminating the paste applying conditions at a given position by using a noncontact sensor after the paste applying process. CONSTITUTION:A lead frame 5 stops at a give position, and conductive paste 17 is applied from a nozzle 9 to a given position on an island 4. Then the lead frame 5 moves by a given distance, and the portion coated with the paste 17 reaches beneath a sensor 17; which applys light to the mounting position to which the paste 17 has been applied, converts the reflecting power into a binary signal to be compared with a value previously set, and discriminates between presence and absence of the paste applied. When no application of the paste is detected, a mounting head 8 is stopped after mounting a pellet on the front island, but a frame feeder 2, paste dispenser 6 and the sensor 7 are continued to operate. When the application of the paste is confirmed the head 8 starts operation: The head 8 attracts a pellet 3 on a table 15 by means of a collect 11, and mounts it at a given position on the island to which the paste has been applied. The constitution permits a highly reliable mounting.
JP12005979A 1979-09-20 1979-09-20 Mounting method and apparatus for semiconductor pellet Pending JPS5645036A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12005979A JPS5645036A (en) 1979-09-20 1979-09-20 Mounting method and apparatus for semiconductor pellet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12005979A JPS5645036A (en) 1979-09-20 1979-09-20 Mounting method and apparatus for semiconductor pellet

Publications (1)

Publication Number Publication Date
JPS5645036A true JPS5645036A (en) 1981-04-24

Family

ID=14776866

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12005979A Pending JPS5645036A (en) 1979-09-20 1979-09-20 Mounting method and apparatus for semiconductor pellet

Country Status (1)

Country Link
JP (1) JPS5645036A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03129837A (en) * 1989-10-16 1991-06-03 Nec Kyushu Ltd Mounter
JPH0515423U (en) * 1991-08-06 1993-02-26 鹿児島日本電気株式会社 Die bonding equipment
WO2005013351A1 (en) * 2003-07-31 2005-02-10 Nec Machinery Corporation Method for recognizing work in die bonder and die bonder
JP2010118468A (en) * 2008-11-12 2010-05-27 Toshiba Corp Apparatus and method for manufacturing semiconductor device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03129837A (en) * 1989-10-16 1991-06-03 Nec Kyushu Ltd Mounter
JPH0515423U (en) * 1991-08-06 1993-02-26 鹿児島日本電気株式会社 Die bonding equipment
WO2005013351A1 (en) * 2003-07-31 2005-02-10 Nec Machinery Corporation Method for recognizing work in die bonder and die bonder
CN100383940C (en) * 2003-07-31 2008-04-23 佳能机械株式会社 Method for recognizing work in die bonder and die bonder
JP2010118468A (en) * 2008-11-12 2010-05-27 Toshiba Corp Apparatus and method for manufacturing semiconductor device

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