JPS53108276A - Laser scribing device - Google Patents

Laser scribing device

Info

Publication number
JPS53108276A
JPS53108276A JP2317377A JP2317377A JPS53108276A JP S53108276 A JPS53108276 A JP S53108276A JP 2317377 A JP2317377 A JP 2317377A JP 2317377 A JP2317377 A JP 2317377A JP S53108276 A JPS53108276 A JP S53108276A
Authority
JP
Japan
Prior art keywords
laser scribing
scribing device
substrate
sticking
prevent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2317377A
Other languages
Japanese (ja)
Inventor
Sokichi Yamagishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP2317377A priority Critical patent/JPS53108276A/en
Publication of JPS53108276A publication Critical patent/JPS53108276A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B6/00—Cleaning by electrostatic means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)

Abstract

PURPOSE:To prevent the splashes caused at the laser scribing time from sticking to the substrate, by providing an electrostatic dust collector mechanism near the substrate surface.
JP2317377A 1977-03-02 1977-03-02 Laser scribing device Pending JPS53108276A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2317377A JPS53108276A (en) 1977-03-02 1977-03-02 Laser scribing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2317377A JPS53108276A (en) 1977-03-02 1977-03-02 Laser scribing device

Publications (1)

Publication Number Publication Date
JPS53108276A true JPS53108276A (en) 1978-09-20

Family

ID=12103226

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2317377A Pending JPS53108276A (en) 1977-03-02 1977-03-02 Laser scribing device

Country Status (1)

Country Link
JP (1) JPS53108276A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0633073A1 (en) * 1993-07-01 1995-01-11 E.C.H. WILL GmbH Method and apparatus for cutting and electrostatic dedusting of moving webs
US6924456B2 (en) * 2003-04-21 2005-08-02 Intel Corporation Method and apparatus for particle removal
JP2005313196A (en) * 2004-04-28 2005-11-10 Hitachi Zosen Corp Dust collection method and dust collection device in laser beam machining
JP2007141997A (en) * 2005-11-16 2007-06-07 Denso Corp Apparatus and method of separating semiconductor substrate
US7662668B2 (en) 2005-11-16 2010-02-16 Denso Corporation Method for separating a semiconductor substrate into a plurality of chips along with a cutting line on the semiconductor substrate

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0633073A1 (en) * 1993-07-01 1995-01-11 E.C.H. WILL GmbH Method and apparatus for cutting and electrostatic dedusting of moving webs
US6924456B2 (en) * 2003-04-21 2005-08-02 Intel Corporation Method and apparatus for particle removal
JP2005313196A (en) * 2004-04-28 2005-11-10 Hitachi Zosen Corp Dust collection method and dust collection device in laser beam machining
JP4551690B2 (en) * 2004-04-28 2010-09-29 日立造船株式会社 Dust collector in laser processing
JP2007141997A (en) * 2005-11-16 2007-06-07 Denso Corp Apparatus and method of separating semiconductor substrate
US7662668B2 (en) 2005-11-16 2010-02-16 Denso Corporation Method for separating a semiconductor substrate into a plurality of chips along with a cutting line on the semiconductor substrate
DE102006054087B4 (en) * 2005-11-16 2010-11-11 DENSO CORPORATION, Kariya-shi A separator for separating a semiconductor substrate and a method for separating the same

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