JPS5474370A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5474370A
JPS5474370A JP14182377A JP14182377A JPS5474370A JP S5474370 A JPS5474370 A JP S5474370A JP 14182377 A JP14182377 A JP 14182377A JP 14182377 A JP14182377 A JP 14182377A JP S5474370 A JPS5474370 A JP S5474370A
Authority
JP
Japan
Prior art keywords
beam lead
chip
curve
semiconductor device
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14182377A
Other languages
Japanese (ja)
Other versions
JPS6020897B2 (en
Inventor
Kunihiko Hayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP52141823A priority Critical patent/JPS6020897B2/en
Publication of JPS5474370A publication Critical patent/JPS5474370A/en
Publication of JPS6020897B2 publication Critical patent/JPS6020897B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To obtain a semiconductor device of simple constitution with improved radiation characteristics of a beam lead element.
CONSTITUTION: After the beam lead element is bonded to base S, chip C is pushed down by applying pressure to its back surface, thereby making chip c in contact with base S. Here, although pushing the beam lead element down may curve beam lead L, simple pushing down causes beam lead L to curve greatly near the edge part of chip C and, in conseauence, chip C may be shorted by beam lead L. For the purpose, deformation part L' is formed on the beam lead and at the time when force strong enough to curve beam lead L is applied, the part isolated from the edge of chip C is allowed to curve invariably as shown by broken line.
COPYRIGHT: (C)1979,JPO&Japio
JP52141823A 1977-11-26 1977-11-26 semiconductor equipment Expired JPS6020897B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP52141823A JPS6020897B2 (en) 1977-11-26 1977-11-26 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP52141823A JPS6020897B2 (en) 1977-11-26 1977-11-26 semiconductor equipment

Publications (2)

Publication Number Publication Date
JPS5474370A true JPS5474370A (en) 1979-06-14
JPS6020897B2 JPS6020897B2 (en) 1985-05-24

Family

ID=15300948

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52141823A Expired JPS6020897B2 (en) 1977-11-26 1977-11-26 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS6020897B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02244650A (en) * 1989-03-16 1990-09-28 Fujitsu Ltd Semiconductor device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6375287U (en) * 1986-11-07 1988-05-19

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02244650A (en) * 1989-03-16 1990-09-28 Fujitsu Ltd Semiconductor device

Also Published As

Publication number Publication date
JPS6020897B2 (en) 1985-05-24

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