JPS5414161A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5414161A
JPS5414161A JP8029277A JP8029277A JPS5414161A JP S5414161 A JPS5414161 A JP S5414161A JP 8029277 A JP8029277 A JP 8029277A JP 8029277 A JP8029277 A JP 8029277A JP S5414161 A JPS5414161 A JP S5414161A
Authority
JP
Japan
Prior art keywords
semiconductor device
substrate
bonding
eaves
provision
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8029277A
Other languages
Japanese (ja)
Other versions
JPS6110977B2 (en
Inventor
Masaru Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP8029277A priority Critical patent/JPS5414161A/en
Publication of JPS5414161A publication Critical patent/JPS5414161A/en
Publication of JPS6110977B2 publication Critical patent/JPS6110977B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To make easy for bonding, by avoiding swelling out of the bonding material used when the substrate is contacted with the fixed substrate, through the provision of the projected region than the eaves at the side surface of the semiconductor substrate on which the element region is placed.
COPYRIGHT: (C)1979,JPO&Japio
JP8029277A 1977-07-04 1977-07-04 Semiconductor device Granted JPS5414161A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8029277A JPS5414161A (en) 1977-07-04 1977-07-04 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8029277A JPS5414161A (en) 1977-07-04 1977-07-04 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS5414161A true JPS5414161A (en) 1979-02-02
JPS6110977B2 JPS6110977B2 (en) 1986-04-01

Family

ID=13714186

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8029277A Granted JPS5414161A (en) 1977-07-04 1977-07-04 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5414161A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003060120A (en) * 2001-08-21 2003-02-28 Oki Electric Ind Co Ltd Semiconductor device and method for manufacturing the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003060120A (en) * 2001-08-21 2003-02-28 Oki Electric Ind Co Ltd Semiconductor device and method for manufacturing the same

Also Published As

Publication number Publication date
JPS6110977B2 (en) 1986-04-01

Similar Documents

Publication Publication Date Title
JPS5395571A (en) Semiconductor device
JPS5380966A (en) Manufacture of electrode fdr semiconductor device
JPS5414161A (en) Semiconductor device
JPS52128063A (en) Manufacture of semiconductor device
JPS54974A (en) Manufacture for semiconductor device
JPS538072A (en) Semiconductor device
JPS5437468A (en) Breaking device for semiconductor wafer
JPS5384414A (en) Manufacture of solid state pickup device
JPS5251880A (en) Moisture sensitive element
JPS52119067A (en) Semiconductor device
JPS5372567A (en) Semiconductor device
JPS51142795A (en) Grinding device
JPS532071A (en) Manufacture of semiconductor device
JPS5422775A (en) Semiconductor device
JPS52134387A (en) Semiconductor laser device
JPS5210676A (en) Semiconductor device
JPS5431272A (en) Semiconductor device
JPS5373979A (en) Transistor device
JPS53128980A (en) Positioning device for bonding
JPS5399764A (en) Semiconductor device having bonding pad
JPS5258370A (en) Semiconductor device
JPS5325363A (en) Semiconductor element
JPS5355959A (en) Manufacture of semiconductor device
JPS5397368A (en) Semiconductor device
JPS51145912A (en) Storage device of liquid material on water