JPS5414161A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5414161A JPS5414161A JP8029277A JP8029277A JPS5414161A JP S5414161 A JPS5414161 A JP S5414161A JP 8029277 A JP8029277 A JP 8029277A JP 8029277 A JP8029277 A JP 8029277A JP S5414161 A JPS5414161 A JP S5414161A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- substrate
- bonding
- eaves
- provision
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Die Bonding (AREA)
- Wire Bonding (AREA)
Abstract
PURPOSE: To make easy for bonding, by avoiding swelling out of the bonding material used when the substrate is contacted with the fixed substrate, through the provision of the projected region than the eaves at the side surface of the semiconductor substrate on which the element region is placed.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8029277A JPS5414161A (en) | 1977-07-04 | 1977-07-04 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8029277A JPS5414161A (en) | 1977-07-04 | 1977-07-04 | Semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5414161A true JPS5414161A (en) | 1979-02-02 |
JPS6110977B2 JPS6110977B2 (en) | 1986-04-01 |
Family
ID=13714186
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8029277A Granted JPS5414161A (en) | 1977-07-04 | 1977-07-04 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5414161A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003060120A (en) * | 2001-08-21 | 2003-02-28 | Oki Electric Ind Co Ltd | Semiconductor device and method for manufacturing the same |
-
1977
- 1977-07-04 JP JP8029277A patent/JPS5414161A/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003060120A (en) * | 2001-08-21 | 2003-02-28 | Oki Electric Ind Co Ltd | Semiconductor device and method for manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
JPS6110977B2 (en) | 1986-04-01 |
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