CN112838024A - Semiconductor package multiple clip bonding device and semiconductor package manufactured by the same - Google Patents

Semiconductor package multiple clip bonding device and semiconductor package manufactured by the same Download PDF

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Publication number
CN112838024A
CN112838024A CN202010878222.9A CN202010878222A CN112838024A CN 112838024 A CN112838024 A CN 112838024A CN 202010878222 A CN202010878222 A CN 202010878222A CN 112838024 A CN112838024 A CN 112838024A
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CN
China
Prior art keywords
lead frame
clip
clamping piece
bonding apparatus
clips
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Granted
Application number
CN202010878222.9A
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Chinese (zh)
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CN112838024B (en
Inventor
崔伦华
朴廷敏
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Jmj Korea Co ltd
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Jmj Korea Co ltd
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Publication of CN112838024A publication Critical patent/CN112838024A/en
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Publication of CN112838024B publication Critical patent/CN112838024B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/90—Methods for connecting semiconductor or solid state bodies using means for bonding not being attached to, or not being formed on, the body surface to be connected, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

The invention provides a multiple clamping piece bonding device for semiconductor packaging, comprising: a lead frame carrier 110 for supplying the lead frames 10 in which the semiconductor chips 11 are arranged at a first pitch; a clip carrying part 120 for supplying a clip matrix 20 in which the clips 21 are arranged at a pitch of the second pitch P; a clip clipping section 130 for clipping the clip matrix 20 one by clips 21; a clip loading part 140 for loading the clips 21; a lead frame arrangement portion 150 for arranging the lead frames 10 to the clip attachment position a; a first inspection part 160 for inspecting an arrangement state or an arrangement error of the clip bonding position a of the lead frame 10; a clip attaching part 170 for selecting the clips 21 and arranging them again at the first pitch to attach them to the upper part of the lead frame 10; a lead frame unloading section 180 for discharging the lead frame 10 to which the clip is attached; a control part (not shown) for controlling the supply, arrangement, inspection and discharge of the lead frames 10 and the supply, cutting and bonding of the clips 21.

Description

Semiconductor package multiple clip bonding device and semiconductor package manufactured by the same
Technical Field
The present invention relates to a multiple clip bonding device for semiconductor packaging and a semiconductor package manufactured by the same, which minimizes the arrangement error of a lead frame, improves the bonding accuracy of the lead frame and a clip, and sequentially checks the clip bonding process, thereby minimizing the failure rate of the semiconductor package.
Background
In general, when a high-voltage high-current semiconductor package for realizing a power semiconductor device uses a conductive clip instead of a bonding wire, the clip is attached to a semiconductor chip after being arranged on the semiconductor chip in order to attach the clip to the semiconductor chip.
In addition, a plurality of clips are arranged to a plurality of semiconductor chips, respectively, and the pitch of the clips and the pitch of the semiconductor chips are required to be uniform for bonding.
For example, in terms of efficiency, the pitch of the clips arranged in the clip matrix is smaller than the pitch of the semiconductor chips bonded to the lead frame, and after the clips are cut, the pitch of the clips is adjusted again and the clips are arranged on the lead frame, thereby bonding the clips.
In order to perform the clip bonding process as described above, the lead frame to which the semiconductor chip is bonded is stably fixed and positioned at the clip bonding fixing position, and the lead frame is arranged within an error tolerance range to minimize the product reject ratio.
Also, the present invention provides a multi-clip bonding apparatus technology which can improve product yield and solve electrical problems caused by burrs of clips by checking not only the arrangement of lead frames but also errors or failures of the lead frames, eliminating the possibility of error occurrence before and after selecting clips, and checking the bonding state of the lead frames and the clips to correct the errors or errors.
Documents of the prior art
[ patent document ]
(patent document 1) Korean registered patent publication No. 1949334 (clip attaching apparatus and clip selection for semiconductor package, 2019.02.18)
(patent document 2) korean registered patent publication No. 1544086 (clip bonding method for semiconductor package, and multiple clip bonding apparatus for use therein, 2015.08.12)
(patent document 3) korean registered patent publication No. 1612730 (clip bonding method for semiconductor package and multiple clip bonding apparatus therefor, 2016.04.26)
Disclosure of the invention
Technical problem to be solved by the invention
The technical problem to be solved by the idea of the invention is to provide a multiple clamping piece bonding device for semiconductor packaging and a semiconductor package manufactured by the same, which minimizes the arrangement error of a lead frame, improves the bonding accuracy of the lead frame and a clamping piece, and sequentially checks the clamping piece bonding process, thereby minimizing the reject ratio of the semiconductor package.
Means for solving the problems
In order to achieve the above object, the present invention provides a multiple clip bonding apparatus for a semiconductor package, comprising: a lead frame carrying portion for supplying a lead frame in which semiconductor chips are arranged at a first pitch; the clamping piece bearing part is used for supplying power to clamping piece matrixes of clamping pieces of the reeds for connecting the semiconductor chip and the lead frame, and the clamping pieces are arranged according to a second pitch interval; a clamping piece clipping part for clipping the clamping piece square matrix one by one according to the clamping pieces; a clip loading part loading the clips of the second pitch interval which are cut; a lead frame arrangement portion for arranging the lead frames to clip attachment positions; a first inspection unit for inspecting an arrangement state or an arrangement error of the bonding positions of the clips of the lead frame; a clip attaching portion that selects the clips by the clip loading portion to be arranged again at the first pitch, transfers the clips to clip attaching positions of the lead frame arranging portion, arranges the upper portions of the lead frames of the semiconductor chips at the first pitch, and attaches the clips to the upper portions of the corresponding lead frames; a lead frame unloading part for discharging the lead frame with the clamping piece attached; and a control part for controlling the supply, arrangement, inspection and discharge of the lead frame, and the supply, cutting and bonding of the clip.
Here, the control unit checks the alignment error checked by the first checking unit and corrects the bonding position of the clip formed by the clip bonding unit.
At this time, the first inspection portion is formed by combining the XYR axis platform formed separately on the upper portion of the lead frame arrangement portion, and the arrangement state of the lead frames is inspected by imaging the left and right edges of the lead frames while reciprocating from the upper portion of the clip bonding position.
The first inspection unit is a flight vision camera or a step vision camera.
Further, the lead frame array section includes: the platform forms the joint position of the clamping piece; a front slide rail for transferring the lead frame from the lead frame carrying portion to the stage; a rear slide rail for transferring the lead frame from the stage to the lead frame unloading section; a front end catching rail unit for pressing one side surface of the lead frame and transferring the lead frame along a rail formed on one side of the front section slide rail; a rear end catching rail unit which presses one side surface of the lead frame and transfers the lead frame along a rail formed on one side of the rear stage slide rail; a limit sensor detecting supply from the lead frame carrying portion of the lead frame; and a limit sensor that detects discharge from the lead frame unloading section of the lead frame.
Here, the stage is a vacuum adsorption stage that vacuum adsorbs the lead frame to form a clip attaching position, and includes: a vacuum adsorption plate composed of porous ceramics for installing the lead frame; and a negative pressure supply unit formed at a lower end of the vacuum adsorption plate to supply a negative pressure to the vacuum adsorption plate.
And, still include: and a second inspection unit separately formed at an upper end of a front side portion of the front slide rail, and inspecting whether or not the semiconductor chip, the conductive paste volume, and the two-dimensional code of the lead frame transferred to the stage are at least one of.
Further, the method includes: and a third inspection part which is formed at the upper end of the front side part of the rear section slide rail in a separated manner and inspects the joint state or joint error of the clamping piece transferred by the platform.
Here, the second inspection unit is a flight vision camera or a step vision camera.
And, still include: and the fourth inspection part is formed at the lower end of the clamping piece attaching part in a separated mode, the inspection is carried out through the clamping piece attaching part, the lead frame arrangement part is used for arranging the attaching state of the clamping piece or the lead frame is used for attaching the clamping piece, and the clamping piece attaching part is used for removing the clamping piece.
Here, the control unit checks an error in the attached state or the removed state of the clip checked by the fourth checking unit, and when the error is checked, the control unit transfers the clip to a waste box and removes the clip.
The fourth inspection unit is a flight vision camera or a step vision camera.
The clip trimming section trims the clip matrix downward one by clips.
And cutting burrs (burr) of the clip-by-clip trimmed by the clip trim are formed downward.
And, still include: and an adhesive coating device for coating conductive adhesive on the upper part of the lead frame for arranging the semiconductor chips before the clamping pieces are attached.
Further, the method includes: and the adhesive coating device is used for coating conductive adhesive on the semiconductor chip and the reed of the lead frame on the upper part of the lead frame for arranging the semiconductor chip before the clamping piece is attached.
The present invention provides a semiconductor package manufactured by the multi-clip bonding apparatus for a semiconductor package.
ADVANTAGEOUS EFFECTS OF INVENTION
The present invention has the effects of minimizing the arrangement error of the lead frame to improve the bonding accuracy of the lead frame and the clip, checking the presence or absence of a semiconductor chip, the presence or absence of a conductive adhesive, the volume of the conductive adhesive and at least one of two-dimensional codes on the lead frame when the lead frame is supplied before the bonding process (prebond), checking the bonding state and the bonding error of the clip after the bonding process (postbond), comparing a reference value, identifying an error allowable range, confirming the bonding state or the removal state error of the clip, and sequentially checking the clip bonding process to minimize the reject ratio of the semiconductor package, thereby improving the product yield.
Further, the vacuum suction plate made of porous ceramic uniformly vacuum-sucks the lead frames of various sizes or shapes, and even if the lead frames of various sizes or shapes are sucked by only one vacuum suction plate, the dust and particles generated by the vacuum suction plate are reduced, the scratch of the lead frames is prevented, and the lead frames are discharged and removed by static electricity, thereby providing high vacuum and high strength suction force.
Drawings
Fig. 1 is a perspective view showing a multiple clip bonding apparatus of a semiconductor package according to an embodiment of the present invention;
fig. 2 and 3 are a plan view and a side view, respectively, showing a multiple clip bonding apparatus of the semiconductor package of fig. 1;
FIG. 4 is a drawing showing a clip matrix of the multiple clip bonding apparatus of the semiconductor package of FIG. 1 in isolation;
fig. 5 is a view showing a clip trimming section of the multiple clip bonding apparatus of the semiconductor package of fig. 1 separated;
fig. 6 is a drawing showing a main structure of a multiple clip bonding apparatus of the semiconductor package of fig. 1 separated;
fig. 7 is a view showing an enlarged view of the clip attaching portion and the lead frame arranging portion of fig. 6;
fig. 8 is a drawing showing a lead frame carrying portion of the multiple clip bonding apparatus of the semiconductor package of fig. 1 separated;
fig. 9 is an exploded view showing a clip attaching part of the multiple clip bonding apparatus of the semiconductor package of fig. 1;
fig. 10 is a view illustrating pitch adjustment of the clip attaching portion of fig. 9;
fig. 11 is a diagram illustrating a cross-sectional structure of a semiconductor package that is attached by a multiple clip attaching device of the semiconductor package of fig. 1.
Description of the reference numerals
110 lead frame bearing part 111 material loading storehouse
112, motor 113 and conveyer belt
114 charge picker 115 pusher
120 clip carrying part 121 clip reel
122 substrate reel 123 supply roll
124, a motor 125 and an adjusting handle
130 clip cutting part 131 cutting belt
132 puncher 133 pressurizing plate
134 cutting cylinder 135 guide plate
136 first waste material box 140 and clip loading part
141 clip mounting device 142 loading cylinder
143 guide rail 144 drive unit
150 lead frame arrangement part 151 vacuum adsorption platform
152 front slide rail 153 rear slide rail
154 guide rail 155 front end catching rail unit
156 rear end grabbing track units 157 and 158 limit sensors
160 first inspection part 161 XYR axis stage
162 CCTV 170 clamping piece jointing part
171 bonding tip 172 variable block
173 vacuum pipe 174 linear guide
175 fixed plate 176 variable cam plate
177 linear motor 180 lead frame unloading part
181 discharge warehouse 191, second inspection part
192 third inspection part 193 fourth inspection part
194 second waste box 10 lead frame
11: semiconductor chip 12: spring plate
13 conductive adhesive 14 conductive adhesive
20: clamping piece square matrix 21: clamping piece
22 connecting pile 23 clip frame
Detailed Description
Embodiments of the present invention will be described in detail below with reference to the accompanying drawings so that those skilled in the art can easily implement the invention. The present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
The multiple clip bonding apparatus of a semiconductor package according to an embodiment of the present invention is described in detail below with reference to fig. 1 to 11.
The multiple clip bonding device of a semiconductor package of an embodiment of the present invention specifically includes: a lead frame carrier 110 for supplying the lead frames 10 in which the semiconductor chips 11 are arranged at a first pitch; a clip carrying part 120 for supplying a clip matrix 20 in which the clips 21 are arranged at a pitch of the second pitch P; a clip clipping section 130 for clipping the clip matrix 20 one by clips 21; a clip loading part 140 for loading the clips 21; a lead frame arrangement portion 150 for arranging the lead frames 10 to the clip attachment position a; a first inspection part 160 for inspecting an arrangement state or an arrangement error of the clip bonding position a of the lead frame 10; a clip attaching part 170 for selecting the clips 21 and arranging them again at the first pitch to attach them to the upper part of the lead frame 10; a lead frame unloading section 180 for discharging the lead frame 10 to which the clip is attached; the controller (not shown) controls the supply, alignment, inspection, and discharge of the lead frames 10, the supply, cutting, and bonding of the clips 21, and also inspects the alignment state or alignment error of the lead frames 10.
First, as shown in fig. 1 and 8, the lead frame loading unit 110 introduces a plurality of lead frames 10, in which semiconductor chips 11 (see fig. 11) are arrayed at a first pitch, into the magazine 111, loads the plurality of lead frames, transfers the magazine 111 to the loading picker 114 by the conveyor belt 113 driven by the motor 112, and arranges the plurality of lead frames to the front stage slide rail 152, and then supplies the plurality of lead frames 10 to the lead frame arraying unit 150 by the forward sliding of the pusher 115.
Here, the pusher 115 includes: a T-bar 115a pushing one end of the lead frame 10 loaded to the stocker 111; a rack gear 115b formed by being combined with a rear end of the T-bar 115 a; a pinion gear (not shown) that meshes with the rack gear 115 b; the motor 115c rotates the pinion gear, and slides the T-bar 115a forward and backward.
In addition, although the lead frame loading portion 110 is disclosed as an example of the lead frame loading portion for introducing the lead frames 10 in which the semiconductor chips 11 are arranged at the first pitch into the stocker 111 and loading and supplying the lead frames 10, the present invention is not limited thereto, and various modifications of the lead frames 10 in which the semiconductor chips 11 are arranged at the first pitch may be made.
For example, in the case where the preceding stage associated with the multi-clip bonding apparatus for semiconductor packages according to the embodiment of the present invention arranges the semiconductor chips 11 on the lead frame 10 at the first pitch, the lead frame loading portion 110 plays a role of loading the lead frame 10 transferred from the preceding stage onto the multi-clip bonding apparatus for semiconductor packages according to the embodiment of the present invention.
For reference, a MOSFET semiconductor or an IGBT semiconductor is applied as the semiconductor chip 11, but the semiconductor chip is not limited to this, and is formed of a power semiconductor of a Silicon Controlled Rectifier (SCR), a power transistor, a power rectifier, a power regulator, or a combination thereof.
Next, the clip receiving portion 120 winds the clip matrix 20 in which the clips 21 electrically connecting the semiconductor chip 11 and the clips 12 of the lead frame 10 via the conductive paste 13 are arranged at the pitch of the second pitch P into a roll shape and supplies the roll shape to the clip trimming portion 130.
Here, as shown in fig. 4, the clip matrix 20 includes: the clamping pieces 21 are arranged in a matrix form of the minimum pitch capable of being cut; a connection pile 22 interconnecting the clips 21; the clip frame 23 connects both ends of the connection pile 22 in the longitudinal direction.
Specifically, as shown in fig. 1 to 3, the clip carrying portion 120 includes: a clip reel 121 for winding the clip matrix 20; a substrate reel 122 to remove the substrate from the clip matrix 20; a supply roller 123 for transferring the clip matrix 20 to the clip trimming section 130; a motor 124 that rotationally drives the supply roller 123; the adjusting handle 125 adjusts the transferring width of the clip matrix 20.
The clip receiving section 120 according to the embodiment of the present invention is disclosed as a reel type constituted by the clip reel 121 on which the clip matrix 20 is wound, but the present invention is not limited to this type, and the clip matrix 20 may be supplied in a strip shape instead of a reel type, and various modifications may be made.
In addition, an adhesive coating device (not shown) for coating the conductive adhesive 13 is added before the semiconductor chip 11 and the spring 12 of the lead frame 10 are attached to the clip 21. As the conductive paste 13, a solder series containing a tin or lead component, a sintering (sintering) material containing a silver or copper component, a eutectic (eutectic) reaction material to which a gold component is added are used.
Next, the clip trimming section 130 cuts the connection pile 22 to separate the clip matrix 20 into the clips 21 one by one.
Specifically, as shown in fig. 5 and 6A, the clip trimming section 130 includes: the cutting belt 131 guides the clip matrix 20, and the cutting holes 131a of the positioning clips 21 are formed by arranging at intervals of a second pitch P; a punch 132 formed at the upper end of the cutting tape 131 and descending to penetrate the cutting hole 131a downward to cut the clip matrix 20; a pressing plate 133 for forming the punch 132 in combination; a trimming cylinder 134 for driving the pressurizing plate 133 to ascend and descend; a guide plate 135 formed at an upper end of the cutting belt 131 in a spaced manner, for forming a punched hole 135a through which the punch 132 passes and guiding the punch 132 to move up and down; the first waste box 136 recovers the clip matrix 20 from which the clips 21 are removed.
Here, the cutout holes 131a are formed to penetrate in accordance with the shape of the clip 21, the clip matrix 20 is cut out in the downward direction by the cutout holes 131a of the cutout tape 131 as shown by an arrow direction (see fig. 5) by the punch 132, and burrs (burr) generated at the edges of the cut surfaces of the clip 21 cut out and separated are formed downward, so that the possibility of occurrence of electrical problems due to abnormal contact with the semiconductor chip 11 caused by the burrs is completely eliminated when the semiconductor chip 11 and the clip 21 are bonded.
Next, the clip loading part 140 includes: a clip mounting device 141 for mounting the clip 21 cut at the second pitch P and slidably moving the clip 21 to a selected position with respect to the lead frame arranging portion 150, and as shown in fig. 6 and 7, mounting the cut clip 21 by lifting up and drawing the clip into the cutting hole 131a of the cutting belt 131; a loading cylinder 142 that ascends to drive the clip mounter 141; a guide rail 143 which guides the clip 21 mounted to the clip mounter 141 to slide back and forth in an arrow direction in such a manner as to move to a selected position; the driving unit 144 is driven forward and backward along the guide rail 143, and the driving unit 144 is composed of a wheel rotating in close contact with the guide rail 143 and a motor for rotating the wheel.
Next, the lead frame arrangement portion 150 vacuum-sucks the lead frames 10 and arranges them at the clip bonding position a (see fig. 2 (b)). .
Specifically, as shown in fig. 2, 6 and 8, the lead frame arrangement portion 150 includes: a vacuum adsorption platform 151 forming a clip attaching position a of the vacuum adsorption lead frame 10; a front slide rail 152 for transferring the lead frame 10 from the lead frame support portion 110 to the vacuum suction table 151; a rear stage slide 153 for transferring the lead frame 10 from the vacuum suction table 151 to the lead frame unloading section 180; a front end catching rail unit 155 for pressing one side surface of the lead frame 10 and transferring the lead frame 10 along a guide rail 154 formed on one side of the front stage slide rail 152; a rear-end catching rail unit 156 that presses one side surface of the lead frame 10 and transfers the lead frame 10 along a guide rail 154 formed on one side of the rear-stage slide rail 153; a limit sensor 157 that detects supply from the lead frame carrier 110 of the lead frame 10; the limit sensor 158 detects discharge through the lead frame unloading section 180 of the lead frame 10.
Here, the vacuum suction table 151 is composed of a vacuum suction plate made of porous ceramic to which the lead frame 10 is attached and a negative pressure supply unit formed at a lower end of the vacuum suction plate to supply a negative pressure to the vacuum suction plate, and stably fixes the lead frame 10 when attached to the clip 21.
The vacuum adsorption plate is formed by sintering at 1300 deg.C for 10 days in a furnace, maintains uniform pore distribution and pore size of 2-3 μm, uniformly adsorbs lead frames with various sizes or shapes, and can adsorb lead frames with various sizes or shapes by only one vacuum adsorption plate without generating dust or particles to prevent attractionScratch of the wire frame 10, and has 103·Ωcm2To 109·Ωcm2The surface resistivity characteristics of the lead frame 10, and the electrostatic discharge to the semiconductor chip 11 and the lead frame 10 is removed, and a high vacuum and a high strength suction force are provided.
As shown in fig. 1A and 6(b), the first inspection unit 160 is configured by a flight vision camera or a step vision camera, and inspects the arrangement state or arrangement error of the clip bonding position a of the lead frame 10.
For example, the first inspection portion 160 is formed by being coupled to the XYR axis platform 161 separately formed on the upper portion of the lead frame arrangement portion 150, the arrangement state of the lead frame 10 is inspected by continuously photographing (for example, 2 times of reciprocating and 16-shot photographing) the left and right edges of the lead frame 10 to and fro from the clip bonding position a, and the control portion confirms the arrangement error of the lead frame 10 inspected by the first inspection portion 160, corrects the clip bonding position a of the clip bonding portion 170, and improves the bonding accuracy between the lead frame 10 and the clip 21.
Thereafter, as shown in fig. 7 and 9, the clip bonding section 170 is formed by being combined with the XYR axis table 161, and the clip 21 of the second pitch P is selected by the clip mounter 141 of the clip loading section 140 to be arranged again at the first pitch P, and is transferred to the upper portion of the lead frame 10 where the semiconductor chips 11 are arranged at the first pitch P of the clip bonding position a of the lead frame arrangement section 150, and is pressed at a predetermined pressure to be bonded to the upper portion of the corresponding lead frame 10.
Specifically, the clip fitting portion 170 includes: a bonding tip 171, a vacuum suction clip 21; a plurality of variable blocks 172 which are bonded to the bonding tip 171 at the lower end and are separated from each other to be engaged with each other so as to change the pitch interval; a vacuum pipe 173 for supplying a negative pressure to the bonding tip 171; a linear guide 174 for guiding pitch adjustment of the variable block 172; a fixing plate 175 for fixing a linear guide 174 forming a slot 175a extended left and right to guide a cam follower 172a coupled with the variable block 172; a variable cam plate 176 which is formed with a cam insertion groove 176a having a predetermined shape for adjusting a pitch by drawing in the cam follower 172 a; the linear motor 177 for sliding the variable cam plate 176 back and forth. At this time, the cam insertion groove 176a formed to adjust the pitch may be formed in a fan shape to change the two pitch distances, or may be formed in a curved (banana) shape to change the three pitch distances, but it is not limited thereto, and may be formed in an appropriate shape according to the number of pitches.
Thus, referring to fig. 10, by the front-rear sliding of the linear motor 177 to move the variable cam plate 176 forward and backward, the separation between the cam followers 172a is expanded or reduced according to the cam insertion grooves 176a, the pitch of the bonding tips 171 is changed from the second pitch P of the clip pieces 21 to the first pitch so as to match the first pitch of the semiconductor chip 11, and the clip pieces 21 are arranged again at the first pitch.
As shown in fig. 6(b), the present invention further includes: and a monitor (CCTV)162 formed at a rear side portion of the clip attaching portion 170 to photograph a pitch adjustment state of the clip attaching portion 170 in an image manner, whereby a manager can easily recognize the pitch adjustment state.
Next, the lead frame unloading unit 180 discharges the lead frame 10, which has been subjected to the clip bonding by the vacuum suction table 151. The thus-discharged clip-bonded lead frame 10 is loaded in a discharge magazine (181) for a subsequent process such as soldering or adhesive curing, or is transported by a separately provided rail (not shown) or is transferred to a subsequent process stage by a separate selection arm (not shown).
The lower control part controls the supply, arrangement, inspection and discharge of the lead frame 10 and the supply, cutting and bonding of the clip 21, confirms an arrangement error of the lead frame 10 generated by the first inspection part 160, and corrects the bonding position of the clip generated by the clip bonding part 170 to improve the bonding accuracy of the lead frame 10 and the clip 21.
The second inspection unit (191) is composed of a flight vision camera or a step vision camera, and as shown in fig. 6(b), is formed separately from the upper end of the front side portion of the front stage slide rail 152 to inspect the presence or absence of the semiconductor chip 11, the presence or absence of the conductive paste 13, the volume of the conductive paste 13, and/or the two-dimensional code of the lead frame 10 transferred to the vacuum suction stage 151, and determines whether or not the clip bonding process is performed by the control unit when an error is detected.
The third inspection unit 192 is formed of a flight vision camera or a step vision camera, and as shown in fig. 6(b), is formed separately from the upper end of the front side portion of the rear stage slide rail 153, inspects the bonding state and/or the bonding error of the clip 21 transferred by the vacuum suction table 151, and identifies the error allowable range from the reference value.
The fourth inspection part 193 is formed by a flight vision camera or a step vision camera, and as shown in fig. 7, is formed at the lower end of the clip bonding part 170 in a partitioned manner to inspect the bonding state of the clip 21 of the lead frame arrangement part 150 formed by the clip bonding part 170, and/or after the bonding of the lead frame 10 and the clip 21, inspects the removal state of the clip 21 of the clip bonding part 170, that is, to confirm whether the bonding tip 171 of the clip bonding part 170 normally selects the clip 21 or whether the bonding tip 171 is free after the bonding of the clip 21, and the control part confirms an error in the bonding state or the removal state of the clip 21 inspected by the fourth inspection part 193, and when the error is confirmed, the clip 21 is transferred to the second waste material box 194 (see fig. 8) to be separated, recovered, and removed.
Therefore, in order to construct the above-described multiple clip bonding apparatus for semiconductor packages, the arrangement error of the lead frame is minimized to improve the bonding accuracy of the lead frame and the clips, before the bonding process (prebond), the presence or absence of the semiconductor chip 11, the presence or absence of the conductive paste 13, the volume of the conductive paste 13, and the two-dimensional code on the lead frame when the lead frame is supplied are checked, after the bonding process (postbond), the bonding state and the bonding error of the clips are checked, the allowable range of the reference value identification error is compared, the error of the bonding state or the removal state of the clips is confirmed, and the clip bonding process is sequentially checked to minimize the fraction defective of the semiconductor package, thereby improving the product yield.
The multiple clip bonding apparatus for semiconductor packages according to the embodiments of the present invention can be used by itself in association with various stages that advance or retreat.
Specifically, the lead frame carrier 110 according to an embodiment of the present invention is associated with a preceding stage for arranging the semiconductor chips 11 on the lead frame 10 at the first pitch, and the lead frame 10 supplied from the preceding stage is put into the multi-clip bonding apparatus for semiconductor package according to the present invention through a rail or another selection arm separately provided. In this process, the conductive paste 13 is supplied from the preceding stage to the lead frame receiving portion 110 in a state where the conductive paste 13 is completely applied to the semiconductor chip 11 and the lead pieces 12 of the lead frame 10, or a separate adhesive applying device (not shown) is provided in the multiple clip bonding device of the semiconductor package of the present invention, and the conductive paste 13 is applied before the clip bonding.
In the lead frame unloading section 180 according to an embodiment of the present invention, the lead frame 10 to which the clip is attached is loaded into the unloading magazine 181 for a subsequent process such as soldering or curing of an adhesive, or is transferred to a subsequent stage by a rail (not shown) or a selection arm (not shown).
While the preferred embodiments of the present invention have been described above, the present invention is not limited thereto, and various modifications can be made within the scope of the claims, the detailed description of the invention and the drawings, and the scope of the present invention is defined by the claims.

Claims (18)

1. A multi-clip bonding apparatus for semiconductor packaging is characterized in that,
the method comprises the following steps: a lead frame carrying portion for supplying a lead frame in which semiconductor chips are arranged at a first pitch;
the clamping piece bearing part is used for supplying power to clamping piece matrixes of clamping pieces of the reeds for connecting the semiconductor chip and the lead frame, and the clamping pieces are arranged according to a second pitch interval;
a clamping piece clipping part for clipping the clamping piece square matrix one by one according to the clamping pieces;
a clip loading part loading the clips of the second pitch interval which are cut;
a lead frame arrangement portion for arranging the lead frames to clip attachment positions;
a first inspection unit for inspecting an arrangement state or an arrangement error of the bonding positions of the clips of the lead frame;
a clip attaching portion that selects the clips by the clip loading portion to be arranged again at the first pitch, transfers the clips to clip attaching positions of the lead frame arranging portion, arranges the upper portions of the lead frames of the semiconductor chips at the first pitch, and attaches the clips to the upper portions of the corresponding lead frames;
a lead frame unloading part for discharging the lead frame with the clamping piece attached; and
and a control part for controlling the supply, arrangement, inspection and discharge of the lead frame, and the supply, cutting and bonding of the clip.
2. The multi-clip bonding apparatus for semiconductor packages according to claim 1,
the control part confirms the arrangement error checked by the first checking part and corrects the joint position of the clamping piece formed by the clamping piece joint part.
3. The multi-clip bonding apparatus for semiconductor packages according to claim 2,
the first inspection part is combined with an XYR shaft platform which is formed on the upper part of the lead frame arrangement part in a separated mode, and the upper part of the clamping piece attaching position reciprocates and shoots the left edge and the right edge of the lead frame to inspect the arrangement state of the lead frame.
4. The multi-clip bonding apparatus for semiconductor packages according to claim 1,
the first inspection part is a flight vision camera or a stepping vision camera.
5. The multi-clip bonding apparatus for semiconductor packages according to claim 1,
the lead frame arrangement portion includes:
the platform forms the joint position of the clamping piece;
a front slide rail for transferring the lead frame from the lead frame carrying portion to the stage;
a rear slide rail for transferring the lead frame from the stage to the lead frame unloading section;
a front end catching rail unit for pressing one side surface of the lead frame and transferring the lead frame along a rail formed on one side of the front section slide rail;
a rear end catching rail unit which presses one side surface of the lead frame and transfers the lead frame along a rail formed on one side of the rear stage slide rail;
a limit sensor detecting supply from the lead frame carrying portion of the lead frame; and
and a limit sensor that detects discharge from the lead frame unloading section of the lead frame.
6. The multi-clip bonding apparatus for semiconductor packages according to claim 5,
the platform is a vacuum adsorption platform for vacuum adsorption of the lead frame to form a clamping piece attaching position,
and comprises the following steps:
a vacuum adsorption plate composed of porous ceramics for installing the lead frame;
and a negative pressure supply unit formed at a lower end of the vacuum adsorption plate to supply a negative pressure to the vacuum adsorption plate.
7. The multi-clip bonding apparatus for semiconductor packages according to claim 5,
further comprising:
and a second inspection unit separately formed at an upper end of a front side portion of the front slide rail, and inspecting whether or not the semiconductor chip, the conductive paste volume, and the two-dimensional code of the lead frame transferred to the stage are at least one of.
8. The multi-clip bonding apparatus for semiconductor packages according to claim 5,
further comprising:
and a third inspection part which is formed at the upper end of the front side part of the rear section slide rail in a separated manner and inspects the joint state or joint error of the clamping piece transferred by the platform.
9. The multi-clip bonding apparatus for semiconductor packages according to claim 7,
the second inspection part is a flight vision camera or a stepping vision camera.
10. The multi-clip bonding apparatus for semiconductor packages according to claim 1,
further comprising:
the fourth inspection portion, separate form in the lower extreme of clamping piece laminating portion, the inspection passes through the clamping piece laminating portion and produce the lead frame arrangement portion the laminating state of clamping piece, or the lead frame with after the clamping piece laminating, the clamping piece laminating portion the removal state of clamping piece.
11. The multi-clip bonding apparatus for semiconductor packages according to claim 10,
the control unit checks an error in the attachment state or the removal state of the clip detected by the fourth detection unit, and when the error is checked, the control unit transfers the clip to a waste box and removes the clip.
12. The multi-clip bonding apparatus for semiconductor packages according to claim 10,
the fourth inspection part is a flight vision camera or a stepping vision camera.
13. The multi-clip bonding apparatus for semiconductor packages according to claim 1,
the clamping piece clipping part clips the clamping piece square matrix downwards one by one according to the clamping pieces.
14. The multiple clip bonding apparatus for semiconductor package according to claim 1, wherein cutting burrs of the respective clips cut by the clip cutting portions are formed downward.
15. The multi-clip bonding apparatus for semiconductor packages according to claim 1,
further comprising:
and an adhesive coating device for coating conductive adhesive on the upper part of the lead frame for arranging the semiconductor chips before the clamping pieces are attached.
16. The multi-clip bonding apparatus for semiconductor packages according to claim 8,
the third inspection part is a flight vision camera or a stepping vision camera.
17. The multi-clip bonding apparatus for semiconductor packages according to claim 1,
further comprising:
and the adhesive coating device is used for coating conductive adhesive on the semiconductor chip and the reed of the lead frame on the upper part of the lead frame for arranging the semiconductor chip before the clamping piece is attached.
18. A semiconductor package manufactured by the multiple clip bonding apparatus of a semiconductor package of claim 1.
CN202010878222.9A 2019-11-22 2020-08-27 Semiconductor package multiple clip bonding apparatus and semiconductor package manufactured by the same Active CN112838024B (en)

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CN112838024B (en) 2023-09-15

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