KR102271499B1 - Mounting head and apparatus for mounting component comprising the same - Google Patents

Abstract

The present invention relates to a mounting head and a component mounting apparatus, and more particularly, to a mounting head used for sequentially mounting a plurality of components on a substrate, and a component mounting apparatus including the mounting head, capable of reducing mounting defects when mounting a component applied with a paste on a substrate. The mounting head includes a mounting unit for sequentially mounting a plurality of components attached to a sheet of a first substrate on a second substrate. The mounting unit includes: a z-axis frame extended in the z-axis direction; and a z-axis transfer unit installed to be movable along the z-axis frame.

Description

Mounting head and component mounting device including the same

The present invention relates to a mounting head and a component mounting apparatus, and more particularly, to a mounting head used for sequentially mounting a plurality of components on a substrate and a component mounting apparatus including the mounting head.

As the size of components mounted on the board is gradually reduced, a surface mounting technology (SMT), which facilitates mass production and high integration, is being used in the component mounting process.

In this surface mounting method, solder paste and flux are applied to the substrate, the components to be mounted are individually placed, and the applied metal is dissolved by passing it through a reflow device, The method of hardening by cooling is mainly used.

For example, like μLED, the size of the component is in the micrometer unit, and as the number of components mounted on one board increases and the distance between components becomes narrower, paste as a means for fixing and electrically conducting components to the board There is a problem in that the difficulty of applying is increased, and it takes a lot of time to individually attach the parts to each of the pastes applied to the substrate, so there is a problem of low mass productivity.

In addition, as a mounting device mainly used in the prior art, referring to Korean Patent Publication No. 10-1322531 (Patent Document 1), the conventional mounting device includes a pickup unit for picking up one element, and is stored in a tray. A method in which one of the plurality of devices is picked up (eg, sucked by a vacuum method) and transferred to a substrate at a mounting position for mounting is adopted.

However, this mounting method is disadvantageous as the size of the components is small and the spacing between the components mounted on the board is narrowed.

Accordingly, there is a need to develop a component mounting device capable of improving the problems of the conventional method described above.

Korean Patent Publication No. 10-1322531

Under this technical background, the market is demanding a more efficient component mounting apparatus, and for this purpose, it is necessary to reduce the tact time of a series of assembly steps performed in the component mounting apparatus.

For example, according to Korea Patent Publication No. 10-1322531 (Patent Document 1), the mounting device should include a means (pickup unit) for picking up the parts and transporting them to the assembly position, and using the pickup unit In order to pick up the component mounted on the tray (vacuum adsorption), it is necessary to separately provide a space in the tray in which the pickup unit can be supported when the component is adsorbed. Such a method is inevitably very sensitive to the size and spacing of the components to be mounted, and in particular, has a disadvantage in that it is difficult to apply to the mounting of μLEDs as a target of the component mounting device according to the present invention.

Accordingly, the present invention provides an apparatus for sequentially mounting a plurality of components on a substrate, but does not accommodate the plurality of components in a tray, but provides them in a state of being temporarily attached to a predetermined film, thereby providing a conventional pick and place (pick and place) An object of the present invention is to provide a component mounting apparatus capable of rapidly mounting a plurality of components on a board without adopting a & place) method.

In addition, the present invention adds a process of applying the paste to the parts attached to the film in the mounting device instead of applying the paste to the board on which the parts are mounted, and directly mounting the parts to which the paste is applied to the board to improve the component mounting efficiency. An object of the present invention is to provide a component mounting device capable of improving and simultaneously reducing the defect rate of the paste applied to the component.

Another object of the present invention is to provide a component mounting apparatus capable of reducing mounting defects when mounting a component coated with a paste on a substrate.

The objects of the present invention are not limited to the above-mentioned objects (eg, for an electric vehicle), and other objects and advantages of the present invention not mentioned can be understood by the following description and can be understood by the embodiments of the present invention. will be understood more clearly. It will also be readily apparent that the objects and advantages of the present invention can be realized by the means and combinations thereof indicated in the claims.

According to an aspect of the present invention, there is provided a mounting head including a mounting unit for sequentially mounting a plurality of components attached to one surface of a first substrate on a second substrate, wherein the mounting unit extends in a z-axis direction. A frame and a z-axis transfer unit installed to be movable along the z-axis frame, wherein the z-axis transfer unit has a part attached to one surface of the first substrate by irradiating laser light toward the other surface of the first substrate. A laser irradiation unit that deforms a substrate to reduce an adhesion area between the first substrate and the component and surrounds the laser irradiation unit, and the adhesion area is reduced with respect to the first substrate by lowering of the z-axis transfer unit. There is provided a mounting head in which a guide pressing pin for pressing a component to be mounted on the second substrate is installed to be spaced apart.

In an embodiment, the guide pressing pin may have a lower surface corresponding to an adhesion area between the first substrate and the component reduced due to laser light irradiation by the laser irradiation unit.

In addition, the laser irradiation unit may be lowered by the z-axis transfer unit and irradiate the laser light when positioned within a predetermined distance range from the first substrate to deform the first substrate.

In an additional embodiment, the mounting unit may be provided to be able to be raised and lowered independently with respect to the z-axis transfer unit, or the guide push pin may be provided to be able to move up and down independently with respect to the z-axis transfer unit.

According to another aspect of the present invention, a component supply unit for supplying a first substrate having a plurality of components attached to one surface, an index unit for applying paste to the plurality of components attached to the first substrate supplied from the component supply unit, the a board supply unit for supplying a second board having a region on which a plurality of components are mounted to a mounting position, and the above-described mounting head, wherein the first board is received from the index unit and paste is applied at the mounting position There is provided a component mounting apparatus including a gantry unit for sequentially mounting a plurality of components on the second substrate.

In an embodiment, the first substrate may include a sheet to which the plurality of components are attached, an inner ring supporting an edge of the sheet, and an outer ring supporting an edge of the inner ring.

In an embodiment, the index unit is a first substrate input unit that receives the first substrate from the component supply unit and puts it into a stage, is located downstream of the first substrate input unit, and is disposed on one surface of the first substrate. It may include a dipping unit for applying the paste to the plurality of attached parts, and a squeezing unit for planarizing the paste applied to the plurality of parts.

In an embodiment, the squeezing unit includes a dipping table having a paste accommodated therein, a squeezing head for flattening the paste accommodated in the dipping table, and a squeezing for measuring the flatness of the paste flattened by the squeezing head. It may include a sensor.

In an embodiment, the gantry unit picks up the first substrate on which the paste is applied to a plurality of components by the index unit and transfers the first substrate pickup unit to the mounting position, and transferred by the first substrate pickup unit A second alignment unit for aligning the first substrate with the second substrate, and a plurality of components attached to the first substrate in a state in which the first substrate and the second substrate are aligned with the second substrate It may include a mounting unit sequentially mounted on the substrate.

As described above, according to the present invention, a plurality of parts are provided in a state of being temporarily attached to a predetermined film without being accommodated in a tray, thereby providing a plurality of parts without adopting a conventional pick and place method. There is an advantage that it is possible to quickly mount the substrate on the substrate.

In addition, according to the present invention, instead of applying the paste to the substrate on which the parts are mounted, a process of applying the paste to the parts attached to the film in the mounting device is added, and the parts to which the paste is applied are directly mounted on the board to mount the parts. It is possible to improve the efficiency and at the same time reduce the defect rate of the paste applied to the part.

In addition, according to the present invention, it is possible to dramatically reduce mounting defects by applying a paste to a component to be mounted on a substrate and allowing the process of mounting the component to which the paste is applied to the substrate to be performed in one device.

1 is a top view schematically showing a component mounting apparatus according to an embodiment of the present invention.
2 is (a) a top view and (b) a side view schematically showing a first substrate used in the component mounting apparatus shown in FIG. 1 .
FIG. 3 is a top view schematically illustrating an index unit included in the component mounting apparatus illustrated in FIG. 1 .
FIG. 4 is a side view of the index unit shown in FIG. 3 .
FIG. 5 is a side view schematically illustrating an operation sequence of a squeezing unit included in the index unit illustrated in FIG. 3 .
6 is a side view schematically illustrating an operation sequence of a dipping unit included in the index unit shown in FIG. 3 .
7 is a side view schematically illustrating an operation sequence in which paste is applied to a plurality of components attached to the first substrate by the dipping unit shown in FIG. 6 .
8 is a perspective view schematically illustrating an operation sequence of an alignment unit included in the index unit illustrated in FIG. 3 .
9 is a top view schematically illustrating a gantry unit included in the component mounting apparatus shown in FIG. 1 .
10 is a perspective view schematically illustrating an operation sequence of a mounting head included in the gantry unit shown in FIG. 9 .
11 to 13 schematically show an order in which a plurality of components attached to a first substrate are mounted on a second substrate by a mounting unit according to an embodiment of the present invention.
14 is a top view schematically illustrating a substrate supply unit included in the component mounting apparatus shown in FIG. 1 .

In order to better understand the present invention, certain terms are defined herein for convenience. Unless defined otherwise herein, scientific and technical terms used herein shall have the meanings commonly understood by one of ordinary skill in the art. Also, unless the context specifically dictates otherwise, it is to be understood that a term in the singular includes its plural form, and a term in the plural form also includes its singular form.

Hereinafter, a component mounting apparatus according to some embodiments of the present invention will be described in more detail.

1 is a schematic front view of a component mounting apparatus 1000 according to an embodiment of the present invention.

Referring to FIG. 1 , a component mounting apparatus 1000 according to an embodiment of the present invention includes a component supply unit 100 for supplying a first substrate having a plurality of components attached to one surface, and the component supply unit 100 supplied from the The index unit 200 for applying paste to the plurality of components attached to the first substrate, the substrate supply unit 400 for supplying the second substrate in which the area on which the plurality of components are mounted is defined to the mounting position, and the index unit and a gantry unit 300 that receives the first substrate from 200 and sequentially mounts the plurality of components to which the paste is applied at the mounting position on the second substrate.

In the component supply unit 100, the first board to which the components mounted on the second board are attached are accommodated in the first board magazine 110a, and the magazine pickup unit 110b is the plurality of first boards accommodated. The first substrate magazine 110a is picked up and transferred to a position where the first substrate is inserted into the index unit 200 .

Here, one end of the magazine pickup unit 110b may be installed in the magazine transfer unit 120 to be movable in the y-axis direction. Accordingly, the first substrate magazine 110a may be continuously supplied to the index unit 200 by a series of operations of the magazine pickup unit 110b and the magazine transfer unit 120 .

In addition, although not shown separately, the first substrate from the first substrate magazine 110a transferred to the position where the first substrate is put into the index unit 200 is manually or by a separate unit to be described later. (200) can be supplied.

2 is (a) a top view and (b) a side view schematically showing a first substrate used in the component mounting apparatus shown in FIG. 1 .

Referring to FIGS. 2A and 2B , the first substrate 130 includes a sheet 131 to which the plurality of components are attached, an inner ring 132 supporting an edge of the sheet 131 and the and an outer ring 133 supporting the edge of the inner ring 132 .

The sheet 131 is a film made of an adhesive material, and on one surface of the sheet 131, a plurality of components, for example, electronic components such as a general light emitting device (LED) or a micro light emitting device (μLED) are provided. It may be in a temporarily attached state. The sheet 131 is preferably attached to the inner ring 132 in a fully unfolded state. The inner ring 132 may be selectively attached to the edge of the sheet 131 to prevent the sheet 131 from being wrinkled.

In addition, an edge of the inner ring 132 may be supported by an outer ring 133 , and the outer ring 133 is picked up or gripped by the first substrate 130 in the component mounting apparatus 1000 . It can serve as a part to be gripped by various instruments, etc. The outer ring 133 is selectively picked up or gripped to prevent damage to the sheet 131 or a component (LED) attached to the sheet 131 in the process of picking up or gripping the first substrate 130 . can do.

FIG. 3 is a top view schematically illustrating an index unit included in the component mounting apparatus illustrated in FIG. 1 .

Referring to FIG. 3 , the index unit 200 includes a plurality of spaces into which the first substrate 130 is inserted, and the first substrate ( 130) is sequentially supplied to the first substrate input unit 220 for inputting into the stage 210, located downstream of the first substrate input unit 220, and on one surface of the first substrate 130 and a dipping unit 230 for applying a paste to the plurality of attached parts, and a squeezing unit 240 for flattening the paste applied to the plurality of parts.

As described above, the stage 210 is provided in a rotational manner so that when the first substrate 130 is loaded by the first substrate input unit 220, the stage 210 is rotated by a predetermined angle so that the first substrate 130 is formed. It may be placed at a processing position by the dipping unit 230 located downstream of the first substrate input unit 220 . In addition, when the dipping unit 230 completes the application of the paste to the first substrate 130 , the stage 210 rotates again by a predetermined angle so that the first substrate 130 is aligned to be described later. may be placed in a processing position by unit 250 . Subsequently, the stage 210 may be rotated again by a predetermined angle so that the first substrate 130R, which has been pre-mounted in the index unit 200 , is placed in the discharge position.

3 shows that the rotation angle of the stage 210 for each process unit is 90 degrees, but is not limited thereto, and a process performed with respect to the first substrate 130 in the index unit 200 . The rotation angle may vary according to the number of units and/or a position of a unit performing a process unit to be processed with respect to the first substrate 130 .

FIG. 4 is a side view of the index unit shown in FIG. 3 .

3 and 4 , the squeezing unit 240 is positioned adjacent to the dipping unit 230 , and the paste is attached to the first substrate 130 by the dipping unit 240 . A process of planarizing the paste is performed before applying it to a plurality of components.

To this end, after the paste contained in the dipping table 241 is planarized by the squeezing unit 240 (refer to (a) of FIG. 4 ), the dipping table 241 is removed from the dipping unit 240 . It is transferred to the lower part to prepare the paste application by the dipping unit 230 (refer to FIG. 4(b)).

FIG. 5 is a side view schematically illustrating an operation sequence of a squeezing unit included in the index unit illustrated in FIG. 3 .

Referring to FIG. 5 , the squeezing unit 240 includes a frame 242 and a squeezing base 243 installed on the frame 242 to be transportable in the transverse direction. A squeezing sensor 244 , a front squeezing head 245 , and a rear squeezing head 246 may be installed on the squeezing base 243 .

Referring to FIGS. 5A and 5B , the front squeezing head 245 of the front squeezing head 245 and the rear squeezing head 246 installed on the squeezing base 243 is By selectively descending and moving forward while in contact with the paste P contained in the interior 241 of the dipping table, the paste P contained in the interior 241 of the dipping table may be primarily planarized. At this time, at the same time as the front squeezing head 245 moves, the squeezing sensor 244 may measure the flatness of the upper surface of the paste P. As shown in FIG. In addition, the squeezing sensor 244 is installed in front of the front squeezing head 245 and measures the flatness of the top surface of the paste P by the front squeezing head 245 . The degree to which the paste P is pressed can be adjusted.

Then, referring to FIGS. 5 (c) and 5 (d), the front squeezing head 245 installed on the squeezing base 243 rises, and the rear squeegee head 246 descends to cause the dipping. The paste P flattened in one direction by the front squeezing head 245 is planarized again in the reverse direction by moving backward while in contact with the paste P accommodated in the interior 241 of the table. Similarly, at the same time as the rear squeezing head 246 moves, the squeezing sensor 244 may measure the flatness of the top surface of the paste P. As shown in FIG.

6 is a side view schematically illustrating an operation sequence of a dipping unit included in the index unit illustrated in FIG. 3 , and FIG. 7 is a paste applied to a plurality of components attached to the first substrate by the dipping unit illustrated in FIG. 6 . It is a side view schematically showing the sequence of operations.

As described above, after the paste contained in the dipping table 241 is planarized by the squeezing unit 240 , the dipping table 241 is transferred to the lower portion of the dipping unit 240 and the dipping unit The paste application is prepared according to (230).

Referring to FIGS. 6 (a) and (b) and 7 (a), the dipping unit 230 includes an adsorption head 231 and a z-axis transfer unit 232 in which the adsorption head 231 is installed at a lower portion. ), and by the lowering of the z-axis transfer unit 232 in the z-axis direction, the adsorption head 231 contacts the first substrate 130 and adsorbs the first substrate 130 (eg, for example, vacuum adsorption). At this time, the adsorption head 231 adsorbs the back surface of the sheet 131 to which the plurality of components LED are attached.

Then, referring to FIGS. 6 (c), 7 (b) and (c), the first substrate 130 is adsorbed by the suction head 231 and the planarized paste is accommodated therein. The dipping table 241 and the dipping housing 247 are raised to perform a paste application process on the plurality of components attached to the first substrate 130 .

In this way, when the dipping table 241 for receiving the paste rises while the suction head 231 adsorbs the first substrate 130 to perform the paste application process, the first substrate 130 is It is possible to more delicately apply the paste to a plurality of parts attached to the . Accordingly, the paste is applied to a part other than the surface on which the part is mounted on the second substrate, or the paste is immersed between the plurality of parts. It is possible to prevent problems such as short circuit in advance.

In addition, since it is possible to simultaneously apply the paste to a plurality of components attached to one surface of the first substrate by the paste application method according to the present invention, there is an advantage that it is possible to improve the efficiency of the application process.

On the other hand, although not shown separately, according to another embodiment of the present invention, the dipping table 241 and the dipping housing 247 for accommodating the planarized paste therein rise, instead of adsorbing the first substrate 130 . The suction head 231 may perform an additional lowering operation to apply paste to the plurality of components attached to the first substrate 130 .

8 is a perspective view schematically illustrating an operation sequence of an alignment unit included in the index unit illustrated in FIG. 3 .

The index unit 200 further includes a first alignment unit 250 located downstream of the dipping unit 230 , and the first alignment unit 250 is formed by the dipping unit 230 . Before supplying the first substrate 130 to which the paste is applied to the parts of the gantry unit 300 may be aligned.

Referring to FIG. 8 , the first alignment unit 250 may include an alignment base 251 and an alignment member 252 provided on the alignment base 251 . The alignment member 252 serves to primarily hold the alignment of the first substrate 130 while fixing the first substrate 130 , and for this purpose, an upper portion of the alignment base 251 is provided. At least one may be provided. For example, the alignment member 252 may be provided in a shape such as a needle, and the alignment member 252 penetrates the sheet 131 of the first substrate 130 to the first substrate ( 130 ) may be fixed by the alignment member 252 .

The alignment base 251 on which the alignment member 252 is provided may be installed on the z-axis transfer unit 253 , and the upper portion of the alignment base 251 is generated by the rotation of the stage 210 . When the first substrate 130 on which the paste is applied to a plurality of components is located on the , the alignment base 251 is raised by the z-axis transfer unit 253 to align the first substrate 130 with the first substrate 130 . The phosphorus process may be performed.

9 is a top view schematically illustrating a gantry unit included in the component mounting apparatus shown in FIG. 1 .

Referring to FIG. 9 , the gantry unit 300 includes a y-axis frame 310 extending in the y-axis direction, and a y-axis transfer unit 320 installed to be movable along the y-axis frame 310 . In addition, an x-axis frame 330 extending in the x-axis direction is installed on one side of the y-axis transfer unit 320 , and one side of the x-axis frame 330 (here, the x-axis frame 330 ) One side of the first substrate 130R on which the paste is applied by the index unit 200 is picked up and transferred to the mounting stage 350 on one side (meaning an area adjacent to the index unit 200 ). A substrate pickup unit 340 may be installed.

After picking up the first substrate 130R on which the paste application process is completed in the index unit 200 by the first substrate pickup unit 340 , the x-axis frame in which the first substrate pickup unit 340 is installed As the 330 moves in the y-axis direction by the y-axis transfer unit 320, the first substrate pickup unit 340 is positioned above the mounting stage 350, and the picked-up first substrate ( 130R) is discharged to the mounting position of the mounting stage 350 .

When the first substrate 130R on which the paste application process is completed is picked up by the first substrate pickup unit 340 in the index unit 200 , the stage 210 of the index unit 200 moves at a predetermined angle. The first substrate 130R, on which the paste application process is subsequently completed, can be put back to the pickup position by the first substrate pickup unit 340 by rotating the same.

In addition, after discharging the first substrate 130R to the mounting position of the mounting stage 350 , the y-axis transfer unit 320 moves in the reverse direction along the y-axis again to the first substrate pickup unit 340 . ) by the pick-up operation can be performed.

At this time, the other side of the x-axis frame 330 (here, the other side of the x-axis frame 330 is opposite to the one side on which the first substrate pickup unit 340 is installed, that is, the mounting stage 350 ) A mounting head 360 for mounting a plurality of components attached to the first substrate 130R with respect to the second substrate transferred to the mounting stage 350 may be installed in the region adjacent to the .

10 is a perspective view schematically illustrating an operation sequence of a mounting head included in the gantry unit shown in FIG. 9 .

Referring to FIG. 10 , a second substrate 410 supplied by a substrate supply unit, which will be described later, is positioned at a mounting position of the mounting stage 350 , and the first substrate pickup unit is positioned above the second substrate 410 . The first substrate 130 transferred by 340 is positioned.

The mounting head 360 includes a second alignment unit 361 for aligning the first substrate 130 transferred by the first substrate pickup unit 340 with the second substrate 410 and the A mounting unit 362 for sequentially mounting a plurality of components attached to the first substrate 130 on the second substrate 410 in a state in which the first substrate 130 and the second substrate 410 are aligned. ) may be included.

At this time, referring to FIGS. 10A and 10B , after aligning the first substrate 130 with the second substrate 410 by the second alignment unit 361 , the A mounting process by the mounting unit 362 may be performed. If it is determined by the second alignment unit 361 that the wing first substrate 130 is not aligned with the second substrate 410, the first substrate 130 through a separate adjustment means. ) and/or the position and/or angle of the second substrate 410 may be adjusted.

11 to 13 schematically show an order in which a plurality of components attached to a first substrate are mounted on a second substrate by a mounting unit according to an embodiment of the present invention.

11 to 13 , the mounting unit 362 includes a z-axis frame 363 extending in the z-axis direction and a z-axis transfer unit 364 installed to be movable along the z-axis frame 363. may include In FIG. 11 , the z-axis direction refers to a vertical direction from a plane on which the sheet 131 and/or the second substrate 410 are placed.

Although not shown separately, the z-axis transfer unit 364 may receive a driving force by a driving unit such as a VCM and move up and down along the z-axis frame 363 in the z-axis direction.

On the other hand, the z-axis transfer unit 364, the laser irradiation unit (366a) and the guide pressing pin (366b) may be installed to be spaced apart, the guide pressing pin (366b) is a shape surrounding the laser irradiation unit (366a) can be provided as

At this time, the laser irradiation unit 366a and the guide pressing pin 366b surrounding the laser irradiation unit 366a may be installed directly spaced apart from the z-axis transfer unit 364, but as shown in FIG. 11, a separate moving block (365) may be installed as a medium.

As the laser irradiation unit 366a irradiates laser light toward the other surface of the first substrate, that is, the sheet 131 to which a component (LED) is attached to one surface, by the laser pulse energy of the laser light. The sheet 131 is deformed so that the bonding area between the sheet 131 and the component LED is reduced. If the laser pulse energy of the laser beam irradiated by the laser irradiation unit 366a is excessively strong and thus penetrates the sheet 131, the component ( LED) may be damaged and a defect may occur, or a defect may occur due to scattering of by-products of the sheet 131 decomposed by the laser light.

That is, as shown in FIG. 12 , the laser light irradiated by the laser irradiation unit 366a deforms the sheet 131 within a range that does not penetrate the sheet 131 , so that A curved line C is formed in the opposite direction, and an adhesion area between the sheet 131 and the component LED may be reduced by the curved line C.

In addition, the laser irradiation unit 366a is descended by the z-axis transfer unit 364 and irradiates laser light when positioned within a predetermined distance range with the sheet 131 to deform the sheet 131 . have. As such, the extent to which the sheet 131 is deformed in an area to which a plurality of LEDs are attached by irradiating laser light when the laser irradiation unit 366a is positioned within a predetermined distance range from the sheet 131 . can be maintained uniformly, and the possibility that by-products of the sheet 131 decomposed by the laser light are scattered to other areas can be reduced.

Subsequently, as shown in FIG. 13 , the component LED having a reduced adhesive area with respect to the sheet 131 is pressed by the lowering of the guide pressing pin 366b to be mounted on the second substrate 410 . can

The guide pressing pin 366b may have a shape surrounding the laser irradiation unit 366a, and the sheet 131 and the component (LED) reduced due to laser light irradiation by the laser irradiation unit 366a. It is preferable to have an adhesion area of or a lower surface corresponding to the curvature (C).

The guide pressing pin 366b does not have a bonding area between the sheet 131 and the component LED or a lower surface corresponding to the curve C, and an bonding area between the sheet 131 and the component LED. Alternatively, when it has a lower surface exceeding the curvature C, the component LED is separated from the sheet 131 to be mounted on the second substrate 410 substantially by the guide pressing pin 366b. Since the pressure applied to the device increases, the mounting quality of the component LED on the second substrate 410 may be deteriorated.

Therefore, preferably, the guide pressing pin 366b has a tapered lower shape that becomes narrower from the upper part to the lower part, thereby separating the component (LED) from the sheet 131 and the second substrate 410 . When mounted on the sheet 131 and the component (LED), the region where the pressure substantially applied by the guide pressing pin 366b is concentrated is reduced due to the laser light irradiation by the laser irradiation unit 366a. It may be limited to an adhesion area of or a region corresponding to the curvature (C).

On the other hand, the guide pressing pin 366b may be provided to be able to move up and down independently with respect to the z-axis transfer unit 364 . That is, the laser irradiation unit 366a is lowered by the z-axis transfer unit 364 and the z-axis transfer unit 364 is further lowered at a position lying within a predetermined distance range with the sheet 131, so that the laser The guide pressing pin 366b surrounding the irradiation unit 366a may allow the component (LED) attached to the sheet 131 to be mounted on the second substrate 410, but the z-axis transfer unit 364 ) in a fixed state, the guide pressing pin 366b may independently descend so that the component (LED) attached to the sheet 131 may be mounted on the second substrate 410 .

At this time, the guide pressing pin 366b is lowered integrally with the laser irradiation unit 366a, or the guide pressing pin 366b independently descends while the laser irradiation unit 366a located in the center is fixed. Thus, the second substrate 410 may mount the component (LED) attached to the sheet 131 .

14 is a top view schematically illustrating a substrate supply unit included in the component mounting apparatus shown in FIG. 1 .

Referring to FIG. 14 , the substrate supply unit 400 includes an x-axis frame 430 extending in the x-axis direction and an x-axis transfer unit 420 installed to be movable along the x-axis frame 430 . The second substrate 410 may be accommodated on the x-axis transfer unit 420 . Also, the x-axis frame 430 may be installed on the y-axis frame 440 extending in the y-axis direction to be movable along the y-axis frame 440 .

Accordingly, after the second substrate 410 is manually or automatically supplied to the upper portion of the x-axis transfer unit 420 at the supply position of the second substrate 410, the x-axis transfer unit 420 is The second substrate 410 may be discharged to the mounting stage 350 by moving in the y-axis direction along the y-axis frame 440 .

As described above, the embodiments of the present invention have been described, but those of ordinary skill in the art may add, change, delete or add components within the scope that does not depart from the spirit of the present invention described in the claims. The present invention may be variously modified and changed by the present invention, and this will also be included within the scope of the present invention.

1000 parts mounting device 100 parts supply unit
110a first substrate magazine 110b magazine pickup unit
120 Magazine transfer unit 130 First board
131 seat 132 inner ring
133 outer ring 200 index part
210 stage 220 first substrate input unit
230 dipping unit 231 suction head
232 z-axis feed unit 240 squeezing unit
241 Dipping Table 242 Frame
243 squeezing base 244 squeezing sensor
245 Front squeezing head 246 Rear squeezing head
250 first alignment unit 251 alignment base
252 Alignment member 253 Z-axis feed unit
300 gantry unit 310 y-axis frame
320 y-axis feed unit 330 x-axis frame
340 first substrate pickup unit 350 mounting stage
360 Mounting Head 361 2nd Alignment Unit
362 mounting unit 400 board supply
410 second substrate 420 x-axis transfer unit
430 x-axis frame 440 y-axis frame

Claims (10)

A mounting head including a mounting unit for sequentially mounting a plurality of components attached to a sheet of a first substrate on a second substrate,
The mounting unit is
a z-axis frame extending in the z-axis direction; and
a z-axis transfer unit installed to be movable along the z-axis frame;
including,
In the z-axis transfer unit,
a laser irradiation unit that deforms the sheet as it irradiates laser light toward the other surface of the sheet to which the component is attached to one surface, thereby reducing the bonding area between the sheet and the component; and
a guide pressing pin surrounding the laser irradiation unit and mounted on the second substrate by pressing the part having a reduced adhesive area with respect to the sheet by the descent of the z-axis transfer unit;
It is installed spaced apart,
A bend is formed in the direction opposite to the direction in which the laser light is irradiated to the sheet through the irradiation of the laser light by the laser irradiation unit, and the bonding area between the sheet and the component is reduced by the bending,
The guide pressing pin has a lower surface corresponding to the curvature, the lower surface does not exceed the curvature,
mounting head.
According to claim 1,
As the laser irradiation unit surrounded by the guide pressing pin is installed in a state drawn in by a predetermined depth to the inside of the guide pressing pin, the lower end of the guide pressing pin protrudes further downward than the lower end of the laser irradiation unit. having a shape,
mounting head.
According to claim 1,
The laser irradiation unit is descended by the z-axis transfer unit to deform the sheet by irradiating laser light when positioned within a predetermined distance range with the first substrate,
mounting head.
According to claim 1,
The guide pressing pin is provided to be able to elevate independently with respect to the z-axis transfer unit,
mounting head.
According to claim 1,
The mounting head further comprises an alignment unit for aligning the first substrate with respect to the second substrate,
mounting head.
a component supply unit for supplying a first substrate to which a plurality of components are attached to one surface;
an index unit for applying paste to the plurality of components attached to the first substrate supplied from the component supply unit;
a board supply unit for supplying a second board having a region on which the plurality of components are mounted to a mounting position; and
A mounting head comprising the mounting head according to any one of claims 1 to 5, receiving the first substrate from the index unit, and sequentially applying the plurality of components to which the paste is applied to the second substrate at the mounting position. a gantry unit to be mounted;
containing,
component mounting device.
7. The method of claim 6,
The first substrate is
a sheet to which the plurality of parts are attached;
an inner ring for supporting the edge of the sheet; and
an outer ring supporting the edge of the inner ring;
comprising,
component mounting device.
7. The method of claim 6,
The index unit,
a first substrate input unit receiving the first substrate from the component supply unit and inputting the first substrate into the stage;
a dipping unit positioned downstream of the first substrate input unit and configured to apply paste to a plurality of components attached to one surface of the first substrate; and
a squeezing unit for planarizing the paste applied to the plurality of components;
comprising,
component mounting device.
9. The method of claim 8,
The squeezing unit is
a dipping table with a paste housed therein;
a squeezing head for planarizing the paste contained in the dipping table; and
a squeezing sensor for measuring the flatness of the paste flattened by the squeezing head;
containing,
component mounting device.
7. The method of claim 6,
The gantry unit includes a first substrate pickup unit that picks up the first substrate on which the paste is applied to a plurality of components by the index unit and transfers it to the mounting position,
The alignment unit aligns the first substrate transferred by the first substrate pickup unit with respect to the second substrate,
The mounting unit sequentially mounts a plurality of components attached to the first substrate on the second substrate in a state in which the first substrate and the second substrate are aligned,
component mounting device.

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