JP2016009726A - Light emitting device, light emitting substrate, exposure apparatus, image forming apparatus, manufacturing method of light emitting substrate, and manufacturing method of exposure apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light emitting device in which when the light emitting device is inclined (fallen), a direction to raise up the light emitting device can be set in a fixed direction, and a manufacturing method of the same.SOLUTION: A light emitting device 200 includes: a main body part 210 that is long in one direction and has a plurality of light emitting points arranged on its surface along the one direction; and a leg part 250 that is long in one direction and is provided on the rear side of the main body part 210, where the length of the short direction is shorter than the short direction of the main body part 210 and the center of the short direction is shifted from the center of the short direction of the main body part 210.

Description

  The present invention relates to a light emitting element, a light emitting substrate, an exposure apparatus, an image forming apparatus, a method for manufacturing a light emitting substrate, and a method for manufacturing an exposure apparatus.

  Patent Document 1 discloses a method for manufacturing a semiconductor device in which grooves are formed on the surface of a wafer by etching, and the wafer is cut with a dancing saw from the back surface of the wafer toward the grooves by etching.

JP 61-267343 A

  As a semiconductor device, there is a light-emitting element which is formed in a long shape and whose cross section viewed in the longitudinal direction is formed in a T shape. In the light emitting element having a T-shaped cross section, since the center of gravity is in the center when the cross-sectional shape is configured to be bilaterally symmetrical, when the light emitting element tilts (falls down) when the light emitting element is disposed on the substrate, I don't know whether the light emitting element tends to tilt in the left or right direction. For this reason, the direction which raises a light emitting element cannot be preset in the fixed direction which is hard to incline (it is hard to fall down).

  An object of the present invention is to make it possible to set a direction in which a light emitting element is raised when the light emitting element is tilted (falls) to a certain direction.

  The invention of claim 1 is a main body portion that is long in one direction and has a plurality of light emitting points arranged on the surface along the one direction, and a leg portion that is long in the one direction and is provided on the back surface of the main body portion. The leg portion has a length in the short direction shorter than a length in the short direction of the main body, and a center in the short direction is deviated from a center in the short direction of the main body.

  The invention according to claim 2 is characterized in that the plurality of light emitting points are arranged along the one direction at one end in the short direction on the surface of the main body, and the center of the leg in the short direction is the main body. It is located on the other end side in the short direction of the main body part from the center in the short direction.

  According to a third aspect of the present invention, a plurality of the light-emitting elements according to the second aspect are staggered along the one direction so that one end portions in the short direction of the main body face each other when viewed from the one direction. And a substrate provided with the light emitting element.

  According to a fourth aspect of the present invention, there is provided a curved reinforcing portion that reinforces a corner portion at a boundary between the one end side in the short direction of the main body portion and the leg portion.

  The invention of claim 5 is an exposure apparatus comprising the light emitting substrate according to claim 3 or 4.

  A sixth aspect of the present invention is an image forming apparatus including the exposure apparatus according to the fifth aspect.

  The invention of claim 7 is a main body portion that is long in one direction, wherein the main body portion has a plurality of light emitting points arranged along the one direction at one end portion in the short direction on the surface, and the one direction. A leg portion that is long and is provided on the back surface of the main body, the length in the short direction is shorter than the length in the short direction of the main body, and the center in the short direction is the short direction of the main body. A first step of placing a light-emitting element on the positioning part, the leg part positioned on the other end part side of the main body part in the short direction of the main body part, and the other end part side of the main body part in the traveling direction The second step of positioning the light emitting element by moving the light emitting element at the positioning portion, and the one direction along the one direction so that one end portions of the main body portion in the short direction are opposed to each other when viewed from the one direction. A third step of arranging a plurality of the light emitting elements positioned on the positioning portion on the substrate in a staggered manner.

  In the invention of claim 8, in the second step, the light emitting element is moved and positioned while the positioning member sucks the side surface of the leg portion on the one end side in the short side direction, and in the third step, The light emitting element sucked by the positioning member is moved to the other end side in the short side direction and peeled off from the positioning part to hold the light emitting element, and the light emitting element is disposed on the substrate.

  The invention of claim 9 is a method of manufacturing an exposure apparatus using the light emitting substrate manufactured by the manufacturing method of claim 7 or 8.

  According to the configuration of the first aspect of the present invention, when the light emitting element is tilted (falls down), the direction in which the light emitting element is raised can be set to a certain direction.

  According to the configuration of the second aspect of the present invention, the light emitting element is compared with the case where the center of the leg portion in the short direction is located closer to the one end side in the short direction of the main body than the center of the main body. When is tilted (falls down), the light emitting point is prevented from colliding with a member such as a holder that holds the light emitting element from the surface side of the main body.

  According to the configuration of the third aspect of the present invention, when the light emitting element is inclined (falls down) on the substrate in the step of disposing the light emitting element on the substrate, the main body portions facing each other in the direction in which the light emitting element is raised Can be set in a direction in which one end portions in the short direction are separated from each other.

  According to the configuration of claim 4 of the present invention, compared to the configuration in which the boundary between the one end side in the short direction of the main body portion and the leg portion is not reinforced, the one end side and the leg portion in the short direction of the main body portion. It is possible to improve the strength of the boundary.

  According to the structure of Claim 5 of this invention, compared with the case where the light-emitting substrate of Claim 3 or 4 is not provided, the manufacturing efficiency of the exposure apparatus manufactured improves.

  According to the configuration of the sixth aspect of the present invention, the cost of the manufactured image forming apparatus can be reduced as compared with the case where the exposure apparatus according to the fifth aspect is not provided.

  According to the manufacturing method of claim 7 of the present invention, compared with the case where the light emitting element whose center in the short direction of the main body and the center in the short direction of the leg coincide with each other is moved and positioned, A light emitting substrate can be manufactured while suppressing the inclination (falling) of the light emitting element.

  According to the manufacturing method of claim 8 of the present invention, compared with the case where the light emitting element whose center in the short direction of the main body portion coincides with the center in the short direction of the leg portion is moved and peeled off from the positioning portion. The light emitting substrate can be manufactured while suppressing the inclination (falling) of the light emitting element at the portion.

  According to the manufacturing method of claim 9 of the present invention, the manufacturing efficiency of the manufactured exposure apparatus is improved as compared with the case where the light emitting substrate manufactured by the manufacturing method of claim 7 or 8 is not used.

It is a top view which shows the structure of the light emitting substrate which concerns on this embodiment. It is the figure which looked at the light emitting substrate shown in FIG. 1 in the longitudinal direction. It is a figure which shows the procedure which cuts out a light emitting element from a wafer. It is a figure which shows the procedure which cuts out a light emitting element from a wafer. It is a figure which shows the procedure of the comparative example which cuts out a light emitting element from a wafer. It is the schematic which shows the structure of the image forming apparatus with which the light emission board | substrate shown in FIG. 1 is applied. It is a perspective view which shows the structure of the manufacturing apparatus which concerns on this embodiment. It is a top view which shows the structure of the plate of the positioning base and positioning member which concern on this embodiment. It is a perspective view which expands and partially shows the structure of the positioning member which concerns on this embodiment. It is a perspective view which shows the structure of the collet which concerns on this embodiment. It is an operation | movement figure which shows the process of putting a light emitting element on a positioning stand. It is an operation | movement figure which shows the process of positioning a light emitting element on a positioning stand. It is an operation | movement figure which shows the process of hold | maintaining a light emitting element on a positioning stand. It is an operation | movement figure which shows the process of arrange | positioning a light emitting element on a printed circuit board. It is a figure which shows the modification of a light emitting element. It is a figure which shows the method of cutting out the light emitting element shown in FIG. 15 from a wafer. It is a figure which shows the modification of the light emitting element shown in FIG.

  Below, an example of an embodiment concerning the present invention is described based on a drawing.

(Light emitting substrate 100)
First, the configuration of the light emitting substrate 100 will be described. 1 and 2 show the configuration of the light emitting substrate 100. FIG. The following X (−X) direction, Y (−Y) direction, and Z (−Z) direction indicate coordinate systems orthogonal to each other, and the X direction, −X direction, Y direction, −Y direction, The Z direction (upward) and the -Z direction (downward) are arrow directions shown in the figure. Unless otherwise specified, “X direction” is “X direction or −X direction”, “Y direction” is “Y direction or −Y direction”, and “Z direction” is “Z direction or −Z direction”. I mean. In addition, “x” in “○” in the figure means an arrow from the front to the back of the page, and “•” in “○” in the figure. Means an arrow heading from the back of the page to the front. Further, the dimensional ratios of the members in the X direction, Y direction, and Z direction and the dimensional ratios of the X direction, Y direction, and Z direction between the members shown in the drawings are not limited to the illustrated dimensional ratios.

  As shown in FIG. 1, the light emitting substrate 100 includes a printed circuit board 102 as an example of a substrate, and a light emitting element 200 disposed (mounted) on the printed circuit board 102. The printed circuit board 102 is formed in a plate shape elongated in the X direction, for example.

(Light emitting element 200)
As the light emitting element 200, for example, a long semiconductor element (for example, an LED chip) is used as shown in FIG. As shown in FIG. 2, the light emitting element 200 has a T shape when viewed in the longitudinal direction (X direction) (cross-sectional shape). The light emitting element 200 includes a main body portion 210 constituting a T-shaped horizontal bar portion and leg portions 250 constituting a T-shaped vertical bar portion.

  The main body part 210 and the leg part 250 are elongated in the X direction, the longitudinal direction of the main body part 210 and the longitudinal direction of the leg part 250 are the X direction, and the short side direction of the main body part 210 and the short side direction of the leg part 250. Is the Y direction.

  The main body 210 has projecting portions 213 and 214 that project from the leg portion 250 in the −Y and Y directions. Accordingly, the overhang portion 213 constitutes one end portion in the short direction of the main body portion 210, and the overhang portion 214 constitutes the other end portion in the short direction of the main body portion 210. Corners 293 and 294 at the boundary between the overhang portions 213 and 214 and the leg portion 250 have a right-angle shape.

  On the surface (upper surface) of the main body 210, functional parts such as a light emitting point 218 and a circuit pattern are provided. Specifically, a plurality of light emitting points 218 are arranged along the X direction (longitudinal direction) on the surface (upper surface) of the overhang portion 213. In FIG. 1, a plurality of light emitting points 218 are illustrated in a line. Further, as shown in FIG. 1, recognition marks 270 that are recognized by an imaging camera 82 described later are formed at both ends in the longitudinal direction on the surface (upper surface) of the light emitting element 200.

  As shown in FIG. 2, the leg portion 250 is provided on the back surface so as to protrude from the back surface (lower surface) of the main body portion 210. The length of the leg part 250 in the short direction (Y direction) is shorter than the length of the main body part 210 in the short direction (Y direction). Thereby, the area of the bottom surface 259 of the leg part 250 joined to the printed circuit board 102 is made smaller than the area of the surface (upper surface) of the main body part 210.

  Further, the center of the leg portion 250 in the short direction is located closer to the overhanging portion 214 than the center of the main body portion 210 in the short direction. That is, the leg portion 250 is eccentric with respect to the main body portion 210. As a result, the amount of overhang of the overhang portions 213 and 214 of the main body 210 is large at the overhang portion 213 on one side.

  Specifically, the light emitting element 200 has, for example, a length (length in the X direction) of 6 mm, a height (length in the Z direction) of 300 μm, a width of the main body portion 210 (length in the Y direction) of 115 μm, and a width of the leg portion 250. (Length in the Y direction) is 90 μm, the overhang amount of the overhang portion 213 is 25 μm, and the overhang amount of the overhang portion 214 is 5 μm. Note that the dimensions of the light emitting element 200 are not limited to the above dimensions.

  The light emitting element 200 is staggered along the longitudinal direction (X direction) of the printed circuit board 102 so that the protruding portions 213 of the light emitting element 200 face each other when viewed in the longitudinal direction (X direction) of the printed circuit board 102. A plurality are arranged in a shape.

  Specifically, as shown in FIG. 1, a plurality of light emitting elements 200 form two rows arranged at intervals along the X direction. The odd-numbered light emitting elements 200 and the even-numbered light emitting elements 200, which are counted in the X direction from the longitudinal end portion (−X direction end portion) of the printed circuit board 102, constitute each column. The gaps between the light emitting elements 200 in one row and the light emitting elements 200 in the other row are arranged so as to overlap in the Y direction. In the present embodiment, the longitudinal end portion (X direction end) of the nth (except for the final) light emitting element 200 is counted from the longitudinal end portion (−X direction end portion) of the printed circuit board 102 in the X direction. Portion) and a longitudinal end portion (−X direction end portion) of the (n + 1) th light emitting element 200 are arranged so as to overlap in the Y direction.

  The light emitting element 200 having a T-shaped cross section is manufactured by being cut out from the wafer 14 as shown in FIGS. 3 and 4. Specifically, for example, a slit-like resist pattern is formed on the surface (upper surface) of the wafer 14, and the surface (upper surface) of the wafer 14 is etched with an etching solution, an etching gas, or the like using the resist pattern as a mask. Thereby, as shown in FIG. 3, a plurality of grooves 14 </ b> A of, for example, 5 μm are formed on the surface (upper surface) of the wafer 14.

  As shown in FIG. 4, the wafer 14 is cut by a cutting means 11 such as a dicing saw from the back surface (lower surface) of the wafer 14 toward the groove 14A. As a result, a plurality of grooves 14B having a width larger than that of the grooves 14A are formed. The width of the groove 14B is, for example, 30 μm. The center in the width direction (Y direction) of the groove 14B is shifted in the Y direction with respect to the center in the width direction (Y direction) of the groove 14A. Thereby, in the light emitting element 200 cut out from the wafer 14, the overhang amount of the overhang portion 213 on one side is larger than the overhang amount of the overhang portion 214.

  Note that by setting the overhang amount of the overhang portion 214 to, for example, 5 μm, the wafer 14 can be cut by connecting the groove 14A and the groove 14B even if they are displaced in the Y direction within a range of 5 μm. The means 11 is allowed to shift in the Y direction due to an error within a range of 5 μm.

  Here, in the comparative example (see FIG. 5) in which the light emitting element 200 is cut out from the wafer 14 only by cutting by the cutting unit 11, the light emitting element 200 is cut out at intervals determined by the width of the cutting unit 11 (for example, 30 μm). On the other hand, according to the cutting combined with the etching and cutting unit 11 as in the present embodiment, the interval determined by the width of the cutting unit 11 (for example, the required width of the surface of the light emitting element 200 (for example, The light emitting elements 200 are cut out from the wafer 14 at intervals (for example, 5 μm) narrower than 30 μm). For this reason, according to this embodiment, the number of light emitting elements 200 cut out from the wafer 14 is increased as compared with the comparative example (see FIG. 5).

  Note that the light-emitting element 200 may not have a T-shaped cross section and may have an L-shaped cross section. Therefore, the light emitting element 200 may have a configuration in which the overhang portion 214 is not provided, that is, a configuration in which the overhang amount of the overhang portion 214 is zero.

(Image forming apparatus 400)
Next, the configuration of the image forming apparatus 400 to which the light emitting substrate 100 is applied will be described. FIG. 6 is a schematic diagram illustrating the configuration of the image forming apparatus 400.

  As shown in FIG. 6, the image forming apparatus 400 is formed on the recording medium P, an accommodating portion 412 that accommodates a recording medium P such as paper, an image forming portion 414 that forms an image on the recording medium P, and the recording medium P. And a fixing device 460 that fixes the image on the recording medium P. Further, the image forming apparatus 400 has a plurality of rollers, a transport unit 416 that transports the recording medium P from the storage unit 412 to the image forming unit 414, and the recording medium P on which the image is fixed by the fixing device 460. A discharge unit 418.

  The image forming unit 414 includes image forming units 422Y, 422M, 422C, and 422K (hereinafter referred to as 422Y to 422K) that form toner images of colors of yellow (Y), magenta (M), cyan (C), and black (K). And an intermediate transfer belt 424 to which the toner image formed by the image forming units 422Y to 422K is transferred. Note that the image forming unit 414 is not limited to the above configuration, and may have another configuration as long as it forms an image on the recording medium P.

  Each of the image forming units 422Y to 422K includes a photoreceptor 432 that rotates in one direction (for example, the counterclockwise direction in FIG. 6). Around each photosensitive member 432, a charging roll 423 as a charging device for charging the photosensitive member 432 and a photosensitive member 432 charged by the charging roll 423 are exposed in order from the upstream side in the rotation direction of the photosensitive member 432 to expose the photosensitive member. An exposure device 436 that forms an electrostatic latent image on 432 and a developing device 438 that develops the electrostatic latent image formed on the photoconductor 432 by the exposure device 436 to form a toner image are provided.

  The exposure apparatus 436 includes the light emitting substrate 100 described above, and light is irradiated from the light emitting substrate 100 to the photoconductor 432.

(Manufacturing apparatus 10)
Next, the configuration of the manufacturing apparatus 10 that manufactures the light emitting substrate 100 will be described. FIG. 7 is a perspective view showing the configuration of the manufacturing apparatus 10.

  As shown in FIG. 7, the manufacturing apparatus 10 includes a supply unit 13 that supplies the light emitting element 200, an element positioning device 20 that positions the light emitting element 200, and a substrate positioning device 40 that positions the printed circuit board 102. ing.

  In addition, the manufacturing apparatus 10 includes a transfer device 50 that transfers the light emitting element 200 from the supply unit 13 to the element positioning device 20, and a printed circuit board 102 in which the light emitting element 200 positioned by the element positioning device 20 is positioned by the substrate positioning device 40. And a transfer device 60 for transferring to.

(Supply unit 13)
As shown in FIG. 7, the supply unit 13 includes a holding unit 15 that holds the wafer 14 and a moving mechanism 17 that moves the holding unit 15 in the X direction and the Y direction. In the supply unit 13, as described above, the plurality of light emitting elements 200 are cut out from the wafer 14 by cutting the wafer 14. Further, in the supply unit 13, the moving mechanism 17 moves the holding unit 15 in the X direction and the Y direction, so that the light emitting element 200 to be disposed is positioned at a predetermined pickup position by the transfer device 50. ing.

(Transfer device 50)
As shown in FIG. 7, the transfer device 50 includes a suction device 52 that sucks the light emitting element 200 with the suction nozzle 54, and a moving mechanism 53 that moves the suction device 52. In the transfer device 50, the suction device 52 holds the light emitting element 200 on the suction nozzle 54 by sucking the light emitting element 200 located at the pickup position in the supply unit 13 with the suction nozzle 54. In the transfer device 50, the light emitting element 200 is held on the plate 34 of the positioning table 30 described later by moving the suction device 52 in the direction of arrow E by the moving mechanism 53 while the light emitting element 200 is held by the suction nozzle 54. Is supposed to be transported. As the moving mechanism 53 of the transfer device 50, for example, a three-axis robot that can move in the X direction, the Y direction, and the Z direction is used.

(Element positioning device 20)
As shown in FIG. 7, the element positioning device 20 has a positioning table 30 as an example of a positioning unit on which the light emitting element 200 is placed (mounted), and a light emitting element 200 placed on the positioning table 30 in advance. A positioning member 22 for positioning at the positioning position and a moving mechanism 29 for moving the positioning member 22 in the X direction and the Y direction are provided.

  The positioning table 30 sucks the air in the internal space of the cylindrical portion 32 by sucking the internal space of the cylindrical portion 32 having the opening portion 33 in the upper portion, the plate 34 provided in the opening portion 33 of the cylindrical portion 32, and negative pressure in the internal space. A suction device 36. A plurality of suction holes 38 are formed in the plate 34. The plurality of suction holes 38 pass through the plate 34 and communicate with the internal space of the cylindrical portion 32.

  As shown in FIG. 8, the plate 34 has a high density region 34A in which a plurality of suction holes 38 are arranged at a high density, and a low density in which a plurality of suction holes 38 are arranged at a lower density than the high density region 34A. Density region 34B. The high density region 34A is a region where the light emitting element 200 is placed, and the low density region 34B is a region where the positioning member 22 moves. The positioning member 22 is moved while maintaining a non-contact state with respect to the plate 34 so that the positioning member 22 is not attracted to the plate 34 and receives movement resistance.

  As shown in FIG. 7, the positioning member 22 has a plate shape and includes a main body 22A and a pair of claw portions 22B extending from the main body 22A in the X direction. The pair of claw portions 22B are provided apart in the Y direction so that the light emitting element 200 can be disposed therebetween.

  Further, on the opposite side of each claw portion 22B that faces the other claw portion 22B, as shown in FIG. 8, the claw portion 22B has a convex shape toward the other claw portion 22B, and the side surface of the leg portion 250 of the light emitting element 200. An abutting portion 22C that abuts against 252 (see FIG. 2) is formed. The abutting portion 22C is composed of a pair arranged separately in the X direction in each claw portion 22B.

  As shown in FIG. 9, each claw portion 22 </ b> B is formed with a suction path 23 formed in a U-shape (U-shape) in plan view (-Z direction view). Each suction path 23 is opened at the lower side (−Z direction side), and has a suction port 23A that opens at each of the tip portions of the pair of abutting portions 22C. 38 through.

  Thereby, in the positioning member 22, the suction force through the suction hole 38 in the low density region 34B sucks the side surface 252 abutted against the distal end portions of the pair of abutting portions 22C via the suction path 23, and the light emitting element The abutting state 200 is maintained against the tip portions of the pair of abutting portions 22C.

  Thus, in the element positioning device 20, the suction device 36 sucks the bottom surface 259 (see FIG. 2) of the leg portion 250 of the light emitting element 200 placed on the high density region 34A through the plurality of suction holes 38, and The side surface 252 is sucked through the suction hole 38 and the suction path 23 with a suction force weaker than the suction force with respect to the bottom surface 259.

  In the element positioning device 20, the light emitting element 200 is moved to a predetermined positioning position on the high-density region 34A and positioned (positioned) with the pair of abutting portions 22C abutting against the side surface 252. It has become.

  In the present embodiment, one of the pair of claws 22B is used when positioning the odd-numbered light emitting elements 200 from the longitudinal direction end (−X direction end) of the printed circuit board 102 in the X direction. Then, the light emitting element 200 is positioned. When positioning the even-numbered light emitting elements 200 from the longitudinal end (−X direction end) of the printed board 102 in the X direction, the positioning of the light emitting elements 200 is performed using the other of the pair of claws 22B. Do.

(Substrate positioning device 40)
As shown in FIG. 7, the board positioning device 40 includes a pair of transport members (for example, conveyors) 42 that transport the printed circuit board 102 in the X direction. The pair of conveying members 42 are arranged apart in the Y direction so that the printed circuit board 102 can be introduced therebetween.

  In the substrate positioning device 40, the printed circuit board 102 introduced between the pair of transport members 42 is positioned in the X direction, the Y direction, and the Z direction with respect to the pair of transport members 42. The pair of transport members 42 transport the printed circuit board 102 in the X direction, so that the printed circuit board 102 moves relative to the collet 70 described later in the X direction while being positioned in the Y direction. ing.

  Note that the substrate positioning device 40 is a dispenser for applying an epoxy-based adhesive 104 (see FIG. 14) containing silver (Ag) at a position where the light emitting element 200 is disposed on the printed circuit board 102. Application device (not shown).

(Transfer device 60)
As shown in FIG. 7, the transfer device 60 includes a collet 70 as a holder for holding the light emitting element 200, and an aspirator that is attached with the collet 70 and generates a suction force for the collet 70 to hold the light emitting element 200. 62.

  Further, the transfer device 60 includes an imaging camera 82 as an imaging means for imaging the recognition mark 270 of the light emitting element 200, a support 84 for supporting the suction device 62 and the imaging camera 82, the collet 70 and the imaging camera 82 on a printed board. And a moving mechanism 63 that moves relative to 102.

  Specifically, the suction device 62 has a suction nozzle 64 to which the collet 70 is attached. As shown in FIG. 10, the collet 70 has a connection portion 74 connected to the suction nozzle 64 and an abutting portion that abuts against a ridge line 271 (see FIG. 2) on the protruding portion 213 side of the main body portion 210 of the light emitting element 200. 86, abutting portion 76 that abuts against the ridge line 272 (see FIG. 2) on the overhanging portion 214 side of the main body 210 of the light emitting element 200, and abutting against at least one of the end surface 286 and the ridgeline 285 on the X direction side of the light emitting element 200. And an abutment claw 80. As shown in FIG. 14, each of the abutting portion 86 and the abutting portion 76 is configured by an inclined surface, and forms an inverted V shape.

  The connection part 74 is formed in a cylindrical shape, and is connected by being inserted into a cylindrical suction nozzle 64. A connection port 74 </ b> A that communicates with the suction nozzle 64 is formed in the connection portion 74. Between the abutting portion 86 and the abutting portion 76, a suction port 75 (see FIG. 14) communicating with the connection port 74A is formed.

  In the collet 70, the ridge line 271 of the light emitting element 200 abuts against the abutting portion 86, and the ridge line 272 of the light emitting element 200 abuts against the abutting portion 76, whereby the light emitting element 200 is positioned in the Y direction and the Z direction. It has become so.

  Further, in the collet 70, at least one of the end surface 286 and the ridge line 285 on the X direction side of the light emitting element 200 abuts against the abutting claw 80 so that the recognition mark 270 at the other longitudinal end of the light emitting element 200 is exposed. The light emitting element 200 is positioned in the X direction.

  Further, in the collet 70, the light emitting element 200 is sucked by the suction device 62 through the suction port 75, and the light emitting element 200 positioned in the Y direction, the Z direction, and the X direction is held. Moreover, in the collet 70, the holding | maintenance state of the light emitting element 200 by the collet 70 is cancelled | released by stopping the suction by the suction device 62. FIG.

  The moving mechanism 63 moves the collet 70 and the imaging camera 82 relative to the printed circuit board 102 in the Y direction by moving the suction device 62 and the imaging camera 82 in the Y direction. That is, in this embodiment, the collet 70 and the imaging camera 82 are moved in the Y direction by the moving mechanism 63, and the printed board 102 is moved in the X direction by the transport member 42 of the board positioning device 40. 82 is moved relative to the printed circuit board 102 in the X and Y directions.

  The moving mechanism 63 moves the collet 70 in the vertical direction (Z direction) relative to the printed circuit board 102 by moving the suction device 62 in the vertical direction (Z direction). In the present embodiment, the collet 70 is moved relative to the printed board 102 in the X direction and the Y direction, and then the collet 70 is lowered downward (−Z direction), whereby the light emitting element 200 is placed on the printed board 102. It is arranged.

  As the moving mechanism 63, for example, a biaxial robot that can move in the Y direction and the Z direction is used.

(Method for manufacturing light emitting substrate 100)
In the method for manufacturing the light emitting substrate 100 according to the present embodiment, as shown in FIG. 7, first, in the supply unit 13, the moving mechanism 17 moves the holding unit 15 in the X direction and the Y direction, thereby arranging objects. The light emitting element 200 is positioned at a predetermined pickup position.

  Next, the transfer device 50 transfers the light emitting element 200 located at the pickup position of the supply unit 13 onto the plate 34 of the positioning table 30, and places the light emitting element 200 on the high density region 34A of the plate 34 (first). Process).

  Specifically, the first step is performed as follows. That is, first, the light emitting element 200 located at the pickup position of the supply unit 13 is held by the suction nozzle 54 by the suction of the suction device 52, and the suction nozzle 54 moves onto the plate 34. As shown in FIG. 11A, the suction nozzle 54 is moved by a predetermined gap between the bottom surface 259 of the leg portion 250 of the light emitting element 200 and the upper surface of the high-density region 34A in the plate 34. Stop at the position where it is formed.

  The suction device 36 starts suction through the plurality of suction holes 38 and stops suction by the suction device 52. Accordingly, a downward suction force by the suction hole 38 acts on the light emitting element 200, and the light emitting element 200 is detached from the suction nozzle 54 as shown in FIG. Is placed on the high density region 34A.

  Next, with respect to the light emitting element 200 placed on the high density region 34A, as shown in FIG. 12A from the outside (Y direction side) of the low density region 34B, the positioning member 22 moves in the −Y direction. The abutting portion 22 </ b> C is abutted against the side surface 252 of the leg portion 250 of the light emitting element 200.

  In the abutting state of the abutting portion 22C, the suction device 36 sucks the bottom surface 259 of the light emitting element 200 placed on the high density region 34A through the plurality of suction holes 38 and lowers the side surface 252 of the light emitting element 200. Suction is performed with a suction force that is weaker than the suction force with respect to the bottom surface 259 of the light emitting element 200 through the suction holes 38 and the suction path 23 having the density.

  Then, as shown in FIG. 12B, the light emitting element 200 is moved in the −Y direction to a predetermined positioning position on the high-density region 34A in the abutting state of the abutting portion 22C to be positioned (position). (Second step). That is, the light emitting element 200 is moved and positioned so that the overhanging portion 214 side is in the traveling direction.

  Next, in the board positioning device 40, the pair of transport members 42 positions the printed board 102. The positioning of the printed circuit board 102 is not necessarily performed after the positioning of the light emitting element 200, and may be performed before or simultaneously with the positioning of the light emitting element 200.

  Next, the light emitting element 200 is held by the collet 70 of the transfer device 60. Specifically, the light emitting element 200 is held as follows. That is, first, as shown in FIG. 13A, the collet 70 is lowered with respect to the light emitting element 200 located at the positioning position, and the abutting portion 86 in the collet 70 is first ridgeline of the light emitting element 200. 271 (contact). Further, as collet 70 descends, as shown in FIG. 13B, abutting portion 86 pushes ridge line 271 of light emitting element 200 in the −Y direction, and light emitting element 200 is abutting portion of positioning member 22. Remove from 22C. That is, the abutting portion 86 moves the light emitting element 200 toward the projecting portion 214 and peels it from the abutting portion 22C.

  In addition to the abutting portion 86, the abutting portion 76 and the abutting claw 80 are abutted against the light emitting element 200, and the light emitting element 200 is positioned with respect to the collet 70 in the Y direction, the Z direction, and the X direction.

  Then, suction by the suction device 62 of the transfer device 60 is started, and suction at the positioning table 30 through the plurality of suction holes 38 is stopped. Accordingly, the light emitting element 200 positioned in the Y direction, the Z direction, and the X direction by the abutting portion 86, the abutting portion 76, and the abutting claw 80 is held by the collet 70.

  Next, as shown in FIG. 14, the light emitting element 200 held by the collet 70 is disposed on the printed board 102 positioned by the board positioning device 40 (third step). Specifically, the light emitting element 200 is disposed on the printed board 102 as follows.

  First, the adhesive 104 is applied to the arrangement position of the light emitting element 200 on the printed circuit board 102 by a coating apparatus (not shown). Then, when viewed in the longitudinal direction (X direction) of the printed circuit board 102, the protruding portions 213 of the light emitting elements 200 are arranged in a staggered manner along the longitudinal direction (X direction) of the printed circuit board 102. (See FIGS. 1 and 2).

  At this time, a recognition mark 270 (see FIG. 1) of the light emitting element 200 is imaged by the imaging camera 82 (see FIG. 7), and the light emitting element 200 is transferred to an arrangement position on the printed circuit board 102 based on the recognition mark 270. To do. When the light emitting element 200 tilts (falls down) in the collet 70 when the light emitting element 200 is placed on the adhesive 104 of the printed circuit board 102, the reflected light from the light emitting element 200 does not enter the imaging camera 82. The recognition mark 270 cannot be recognized. Thus, in this embodiment, the inclination (falling) of the light emitting element 200 is detected depending on whether or not the recognition mark 270 can be recognized.

  As shown in FIG. 14, when the light emitting element 200 is placed on the adhesive 104 of the printed circuit board 102 and an inclination (falling) of the light emitting element 200 in the collet 70 is detected, as shown in FIG. The collet 70 is moved in the -Y direction (the B direction in FIG. 2), and the light emitting element 200 is raised, assuming that the collet 70 is tilted (fallen) in the Y direction (the A direction in FIG. 2). In addition, instead of moving the collet 70 in the −Y direction, the conveyance member 42 of the substrate positioning device 40 is configured so that the printed circuit board 102 can be moved in the Y direction, and the printed circuit board 102 is moved in the Y direction to emit light. The element 200 may be raised.

  As described above, the light emitting substrate 100 is manufactured by disposing the light emitting element 200 on the printed circuit board 102. Further, an exposure apparatus 436 is manufactured using the manufactured light emitting substrate 100. Specifically, for example, the manufactured light emitting substrate 100 is incorporated into the housing of the exposure apparatus 436, and the exposure apparatus 436 is manufactured.

(Operation of this embodiment)
In the present embodiment, as shown in FIG. 2, in the light emitting element 200, the length of the leg portion 250 in the short direction is shorter than the length of the main body portion 210 in the short direction. Is located closer to the overhanging portion 214 than the center of the main body 210 in the short direction. As a result, the amount of overhang of the overhang portions 213 and 214 of the main body 210 is large at the overhang portion 213 on one side. Therefore, the center of gravity of the light emitting element 200 is located on one side (the overhanging portion 213 side), and the light emitting element 200 is likely to tilt (fall down) on one side (A direction in FIG. 2).

  The side where the light emitting element 200 is likely to tilt (fall down) (direction A in FIG. 2) is the side where the light emitting point 218 is disposed on the surface of the main body 210 of the light emitting element 200. Is tilted (fallen) on the printed circuit board 102, the light emitting point 218 is tilted away from the collet 70 (−Z direction side). For this reason, it is suppressed that the light emission point 218 collides with members, such as the collet 70 holding the light emitting element 200 from the surface side of the main-body part 210. FIG.

  In the present embodiment, as illustrated in FIG. 2, the light emitting elements 200 adjacent in the Y direction are arranged so that the overhang portions 213 having a large overhang amount face each other. For this reason, compared with the case where the overhang | projection parts 214 or the overhang | projection parts 213 and 214 oppose, the leg part 250 of the light emitting element 200 adjacent to a Y direction spaces apart. Accordingly, the adhesive 104 (see FIG. 14) that adheres the light emitting element 200 is prevented from being sucked up between the light emitting elements 200 by a capillary phenomenon and attached to the light emitting point 218.

  In the present embodiment, as described above, the light emitting element 200 is easy to tilt (fall down) in the A direction. Therefore, when the tilt (falling) of the light emitting element 200 is detected, the light emitting element 200 tilts (falls down) in the A direction. Is set to execute the operation of raising the light emitting element 200 in the B direction side.

  That is, by detecting in advance whether the light emitting element 200 is tilted (tilted) in the A direction or the B direction, the direction in which the light emitting element 200 is raised is set in a certain direction (B direction) in advance. The attitude of the element 200 is corrected.

  The B direction, which is the direction in which the light emitting element 200 is raised, is a direction in which the overhang portions 213 of the main body portion 210 facing each other are separated from each other. For example, when one light emitting element 200 is raised in the direction in which the overhang portions 213 approach each other (direction A), the collet 70 holding the light emitting element 200 may collide with the other adjacent light emitting element 200. is there. On the other hand, in the present embodiment, the light emitting element 200 is raised in the direction in which the overhang portions 213 are separated from each other (direction B), and therefore, when the one light emitting element 200 is operated, the other light emitting element 200 is colleted. It is suppressed that 70 collides.

Since the collision of the collet 70 with the other light emitting element 200 is suppressed, defects of the light emitting substrate 100 to be manufactured and the exposure apparatus 436 including the light emitting substrate 100 are reduced, and the yield is improved.
As described above, when the light emitting element 200 is raised in the B direction and the reflected light from the recognition mark of the light emitting element 200 enters the imaging camera 82, and when the light emitting element 200 is not tilted, imaging is performed from the beginning. When the reflected light from the recognition mark of the light emitting element 200 enters the camera 82, the collet 70 for positioning the light emitting element 200 is operated. Since the operation is a normal positioning operation of the light emitting element 200, the light emitting element 200 is positioned so as to approach and separate from the other light emitting element 200 within a range that does not collide with the other adjacent light emitting element 200. The

  Further, in the present embodiment, since it is not necessary to detect whether the light emitting element 200 is inclined (tilted) in the A direction or the B direction, the light emitting substrate to be manufactured can be manufactured by reducing the manufacturing process and the manufacturing time. 100 and the manufacturing efficiency of the exposure apparatus 436 including the light emitting substrate 100 are improved. Thereby, cost reduction of the image forming apparatus 400 provided with the exposure apparatus 436 can be achieved.

  Furthermore, in the present embodiment, in the second step of the manufacturing method described above, the light emitting element 200 is moved so that the overhanging portion 214 side is in the traveling direction, and is positioned on the plate 34 of the positioning table 30. As described above, the light emitting element 200 is moved to the side where it is difficult to tilt, and positioning is performed. Therefore, it is possible to manufacture the light emitting substrate while suppressing the tilt of the light emitting element on the plate 34 of the positioning table 30.

  In the present embodiment, in the second step of the manufacturing method described above, the light emitting element 200 is moved to the overhanging portion 214 side, and the light emitting element 200 is peeled off from the abutting portion 22C of the positioning member 22. Thus, since the light emitting element 200 is moved to the side where it is difficult to tilt and the light emitting element 200 is peeled off from the positioning member 22, the light emitting substrate can be manufactured while suppressing the tilt of the light emitting element on the plate 34 of the positioning table 30. .

(Modification)
In the present embodiment, as shown in FIG. 2, the corner 293 at the boundary between the projecting portion 213 and the leg portion 250 has a right-angled shape, but the present invention is not limited to this. For example, as shown in FIG. 15, the light emitting element 200 includes a curved (R-shaped) reinforcing portion 298 that reinforces a corner 293 at the boundary between the overhang portion 213 and the leg portion 250. May be.

  The reinforcement part 298 is formed as follows, for example. As shown in FIG. 16, the corner 11A on the tooth tip side of the cutting means 11 such as a dicing saw is formed in a curved shape (R shape) in advance, and the cutting means 11 is formed from the back surface (lower surface) of the wafer 14 to the groove 14A. Then, the wafer 14 is cut. As a result, the corner portion 293 becomes thick, and a curved (R-shaped) reinforcing portion 298 is formed.

  According to the configuration of this modified example, the strength of the boundary between the protruding portion 213 and the leg portion 250 is improved as compared with the configuration in which the corner 293 at the boundary between the protruding portion 213 and the leg portion 250 is not reinforced.

  In the present embodiment, the light emitting element 200 is damaged particularly by providing the reinforcing portion 298 to the overhanging portion 213 having a large load at the boundary with the leg portion 250 because the overhanging amount is larger than that of the overhanging portion 214. Is suppressed.

  As shown in FIG. 17, a curved (R-shaped) reinforcing portion 299 may also be provided at the corner 294 at the boundary between the overhang portion 213 and the leg portion 250. The reinforcing portion 299 is formed by using, for example, the cutting unit 11 in which the corner portion 11B (see FIG. 16) on the tooth tip side is configured in a curved shape (R shape) in advance. In this configuration, for example, the radius of the reinforcing portion 298 on the protruding portion 213 side where the protruding amount is large may be larger than the radius of the reinforcing portion 299.

  The present invention is not limited to the above-described embodiment, and various modifications, changes, and improvements can be made without departing from the spirit of the present invention.

100 light emitting substrate 102 printed circuit board (an example of a substrate)
200 Light-Emitting Element 210 Main Body 218 Light-Emitting Point 250 Leg 293 Corner 298 Reinforcement Part 400 Image Forming Apparatus 436 Exposure Apparatus

Claims (9)

A body portion that is long in one direction and has a plurality of light emitting points arranged on the surface along the one direction;
A leg portion that is long in the one direction and is provided on the back surface of the main body portion, the length in the short direction is shorter than the length in the short direction of the main body portion, and the center in the short direction is the main body portion. The leg that is offset from the center of the short direction of
A light emitting device having: The plurality of light emitting points are arranged along the one direction at one end in the short direction on the surface of the main body,
The light emitting element according to claim 1, wherein a center of the leg portion in a short direction is located on a side of the other end portion of the main body portion in the short direction with respect to a center in a short side direction of the main body portion. The light emitting device according to claim 2;
A substrate on which a plurality of the light emitting elements are arranged in a staggered manner along the one direction so that one end portions in the short direction of the main body part are opposed to each other when viewed from the one direction;
A light emitting substrate comprising: The light emitting substrate according to claim 3, further comprising a curved reinforcing portion that reinforces a corner portion at a boundary between the one end side in the short direction of the main body portion and the leg portion.   An exposure apparatus comprising the light emitting substrate according to claim 3.   An image forming apparatus comprising the exposure apparatus according to claim 5. A main body portion that is long in one direction, wherein a plurality of light emitting points are arranged along the one direction at one end portion in a short direction on the surface;
A leg portion that is long in the one direction and is provided on the back surface of the main body portion, the length in the short direction is shorter than the length in the short direction of the main body portion, and the center in the short direction is the main body portion. The leg portion located on the other end side in the short direction of the main body portion from the center in the short direction,
A first step of placing a light emitting element having a positioning part on the positioning part;
A second step of positioning the light emitting element with the positioning portion so that the other end side of the main body portion is in the traveling direction;
A plurality of light emitting elements positioned on the positioning portion are arranged on the substrate in a zigzag manner along the one direction so that one end portions in the short direction of the main body portion face each other when viewed from the one direction. 3 steps,
A method for manufacturing a light-emitting substrate. In the second step, the light emitting element is moved and positioned while the positioning member sucks the side surface of the leg portion on the one end side in the short direction,
In the third step, the light emitting element sucked by the positioning member is moved to the other end side in the short side direction and is peeled off from the positioning portion to hold the light emitting element, and the light emitting element is attached to the substrate. The method for manufacturing a light emitting substrate according to claim 7.   An exposure apparatus manufacturing method using the light emitting substrate manufactured by the manufacturing method according to claim 7.

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