CN210778526U - Substrate conveying device - Google Patents

Substrate conveying device Download PDF

Info

Publication number
CN210778526U
CN210778526U CN201921606395.4U CN201921606395U CN210778526U CN 210778526 U CN210778526 U CN 210778526U CN 201921606395 U CN201921606395 U CN 201921606395U CN 210778526 U CN210778526 U CN 210778526U
Authority
CN
China
Prior art keywords
unit
substrate
adsorption
contact member
loading table
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201921606395.4U
Other languages
Chinese (zh)
Inventor
成昊映
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Top Engineering Co Ltd
Original Assignee
Top Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Top Engineering Co Ltd filed Critical Top Engineering Co Ltd
Application granted granted Critical
Publication of CN210778526U publication Critical patent/CN210778526U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • B65G47/917—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers control arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B65G2201/0214—Articles of special size, shape or weigh
    • B65G2201/022—Flat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2203/00—Indexing code relating to control or detection of the articles or the load carriers during conveying
    • B65G2203/02—Control or detection
    • B65G2203/0208—Control or detection relating to the transported articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2203/00—Indexing code relating to control or detection of the articles or the load carriers during conveying
    • B65G2203/04—Detection means
    • B65G2203/042—Sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2207/00—Indexing codes relating to constructional details, configuration and additional features of a handling device, e.g. Conveyors
    • B65G2207/28—Impact protection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The embodiment of the utility model provides a base plate remove device include: an adsorption unit configured to adsorb a unit substrate separated from the mother substrate and placed on the loading table; a driving unit connected to the adsorption unit and capable of moving the adsorption unit toward the unit substrate; a distance measuring unit capable of measuring a distance between the unit substrate placed on the loading table and the adsorption unit; and a control unit controlling the driving unit based on the distance between the unit substrate and the adsorption unit measured by the distance measuring unit.

Description

Substrate conveying device
Technical Field
The utility model relates to a base plate removes and send device, its constitution is for removing and send the disconnected unit base plate of follow mother substrate.
Background
In general, a display panel is manufactured through a cutting process of cutting a large-area mother glass panel (hereinafter, referred to as a "mother substrate") into a plurality of unit panels (hereinafter, referred to as unit substrates).
In order to break the mother substrate into a plurality of unit substrates, a scribing process of forming a scribing line on the mother substrate and a breaking process of pressing the mother substrate along the scribing line to divide the mother substrate into a plurality of unit substrates are performed.
A plurality of unit substrates separated from the mother substrate are placed on a loading table. Then, the substrate transfer device sucks the plurality of unit substrates and transfers the unit substrates to the subsequent step in a state where the plurality of unit substrates are placed on the loading table.
On the other hand, there is a possibility that the flatness of the loading table is not uniform for various reasons, and in the case where the flatness of the loading table is not uniform, the heights of the plurality of unit substrates placed on the loading table are different.
Therefore, in the process of sucking the unit substrates located at a relatively higher position than the other unit substrates, the sucking unit of the substrate transfer apparatus excessively presses the unit substrates, so that the side surfaces of the plurality of unit substrates (see fig. 1) located adjacent to each other are rubbed with each other, the side surfaces of the plurality of unit substrates are scratched (scratch), and the like, thereby causing damage and chipping between the plurality of unit substrates.
On the other hand, in the process of sucking the unit substrate located at a relatively lower position than the other unit substrates, the suction unit of the substrate transfer device cannot be lowered to an appropriate height with respect to the unit substrate, and a space is generated between the suction unit of the substrate transfer device and the unit substrate, so that the suction unit of the substrate transfer device cannot properly suck the unit substrate.
Therefore, in the case where the flatness of the loading table is not uniform, a technique for preventing the unit substrate from being damaged and stably adsorbing the unit substrate is required.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a base plate carrying device, under the inhomogeneous condition of the flatness of loading platform, also can prevent that unit base plate from taking place the damage to adsorb unit base plate steadily.
In order to achieve the above object, according to the present invention, a substrate carrying device may include: an adsorption unit configured to adsorb a unit substrate separated from the mother substrate and placed on the loading table; a driving unit connected to the adsorption unit and capable of moving the adsorption unit toward the unit substrate; a distance measuring unit capable of measuring a distance between the unit substrate placed on the loading table and the adsorption unit; and a control unit controlling the driving unit based on the distance between the unit substrate and the adsorption unit measured by the distance measuring unit.
The control unit may include a target height calculating module calculating a plurality of target heights at a plurality of locations of the loading table at which the adsorption unit is to be located with respect to the unit substrate, based on distances between the unit substrate and the adsorption unit measured at the plurality of locations of the loading table; a target height storage module that stores a plurality of target heights at a plurality of points of the loading table calculated by the target height calculation module as map data; and a control module for controlling the driving unit based on a plurality of target heights stored at a plurality of positions of the loading table of the target height storage module to adjust the height of the adsorption unit at a certain position relative to the unit substrate.
The distance measuring unit may include: a main body fixed to the adsorption unit; a contact member provided to the body so as to be movable in a direction adjacent to or spaced apart from the unit substrate, a tip of the contact member facing the unit substrate being in contact with the unit substrate; a moving module capable of moving the contact member in a direction adjacent to or spaced apart from the unit substrate; and a displacement measuring module disposed between the main body and the contact member, for measuring a displacement of the contact member relative to the main body.
The front end of the contact member may have an impact absorbing member made of a material that can be elastically deformed by an external force.
The pitch measuring unit may be a non-contact sensor disposed opposite to the unit substrate.
The pitch measuring unit may be coupled to the adsorption unit.
Effect of the utility model
According to the utility model provides a base plate handling device is provided with the interval measuring unit who is used for measuring the vertical interval between absorption unit and the unit base plate, and absorption unit is at the in-process of absorption unit base plate to the interval between absorption unit and the unit base plate that each place of loading platform was measured is the basis, can adjust the height of absorption unit. Therefore, in the case where the flatness of the loading table is not uniform, the adsorption unit can be lowered to an appropriate position with respect to the unit substrate. Therefore, the negative pressure applied to the adsorption unit can be properly applied to the unit substrate, and the unit substrate can be stably adsorbed by the adsorption unit. In addition, since the suction unit is prevented from excessively pressurizing the unit substrates, it is possible to prevent friction from occurring between the plurality of unit substrates mounted on the loading table, and thus it is possible to prevent the unit substrates from being damaged due to a scratch (scratch) or the like, or to prevent the unit substrates from being chipped.
Drawings
Fig. 1 is a perspective view schematically showing a substrate conveyance device according to embodiment 1 of the present invention.
Fig. 2 is a side view schematically showing a substrate transfer apparatus according to embodiment 1 of the present invention.
Fig. 3 is a control block diagram schematically showing a substrate conveyance device according to embodiment 1 of the present invention.
Fig. 4 is a side view schematically showing a state in which a pitch measuring unit provided in a substrate transfer apparatus according to embodiment 1 of the present invention operates.
Fig. 5 is a side view schematically showing a state in which a unit substrate is adsorbed by the adsorption unit included in the substrate transport apparatus according to embodiment 1 of the present invention.
Fig. 6 is a side view schematically showing a substrate transfer apparatus according to embodiment 2 of the present invention.
Description of the reference numerals
100,300 substrate carrying device
110 adsorption unit
120,320 pitch measurement unit
121: main body
122 contact part
123 impact absorbing member
130 drive unit
Detailed Description
Hereinafter, a substrate conveyance device according to an embodiment of the present invention will be described with reference to the drawings.
Referring to fig. 1 to 5, a substrate carrying device 100 according to embodiment 1 of the present invention includes an adsorption unit 110, a distance measuring unit 120, a driving unit 130, and a control unit 200.
Hereinafter, a direction perpendicular to an X-Y plane on which the unit substrate S is placed is defined as a Z-axis direction. The unit substrate S placed on the loading table 10 may be lifted in the Z-axis direction after being adsorbed by the adsorption unit 110.
A plurality of unit substrates S divided by the mother substrate are mounted on the loading table 10. For example, the loading table 10 may be formed of a belt, and thus the flatness of the loading table 10 is not uniform over the entire loading table 10.
The suction unit 110 is configured to be able to suck the unit substrate S placed on the loading table 10. As an example, the adsorption unit 110 may include a plurality of vacuum adsorption pads, a pickup head, a vacuum pump, an air suction pipe, and the like. The adsorption unit 110 defined in the present invention supplies vacuum pressure to the adsorption pad 111 through various components, and the adsorption pad 111 can adsorb the surface of the unit substrate S in a vacuum manner. The number of the adsorption pads 111 included in the adsorption unit 110 is not limited to a specific number.
As shown in fig. 1 and 2, the distance measuring unit 120 may be coupled to the adsorption unit 110. The pitch measuring unit 120 measures pitches H between the adsorption unit 110 and the unit substrates S at a plurality of points of the loading table 10. The pitch H between the adsorption unit 110 and the unit substrate S is a vertical pitch between the adsorption unit 110 and the unit substrate S in the Z-axis direction. The pitch measuring unit 120 measures the pitch H between the suction unit 110 and the unit substrate S in a state where the suction unit 110 is spaced apart from the unit substrate S without contacting the unit substrate S.
As an example, the distance measuring unit 120 includes: the displacement measuring device includes a body 121, a contact member 122 provided movably with respect to the body 121, a moving module 127 that moves the contact member 122 with respect to the body 121, and a displacement measuring module that is provided between the body 121 and the contact member 122 and measures a displacement of the contact member 122 with respect to the body 121.
The body 121 may be fixed to the adsorption unit 110. As an example, the body 121 may be a cylindrical (cylinder) shape including an inner space. The inner space of the body 121 may be shaped to accommodate a contact member 122 to be described later. The longitudinal direction of such a body 121 may be a direction parallel to the Z-axis direction which is the moving direction of the suction unit 110. The Z-axis direction here may be a vertical direction (a direction perpendicular to one surface of the unit substrate).
In the case of measuring a distance H other than the distance H between the adsorption unit 110 and the unit substrate S, the contact member 122 may be received in the inner space of the body 121, and thus, the contact member 122 may be prevented from interfering with other peripheral members.
On the other hand, as shown in fig. 2, in a state where the contact member 122 is accommodated in the body 121, the body 121 is preferably coupled to the suction unit 110 so that the body 121 does not protrude toward the unit substrate S than the suction pad 111 of the suction unit 110. This is to prevent mutual interference between the contact member 122 and the unit substrate S during the adsorption of the unit substrate S by the adsorption unit 110.
The contact member 122 may be coupled to the body 121 such that the contact member 122 can reciprocate in a direction approaching or departing from the unit substrate S. And, the contact member 122 moves toward the unit substrate S so that the front end of the contact member 122 facing the unit substrate S can contact the unit substrate S.
More specifically, the contact member 122 is first accommodated in the body 121 and then exposed to the outside, and the tip exposed to the outside from the contact member 122 can contact the unit substrate S. At this time, the moving distance of the contact member 122 may be the interval H between the adsorption unit 110 and the unit substrate S. For example, the contact member 122 may have a pillar shape that is exposed to the outside after being accommodated in the body 121. For example, the contact member (122) may be cylindrical in shape.
On the other hand, the distance measuring unit 120 may further include an impact absorbing member 123 at the front end of the contact member 122.
The impact absorbing member 123 may be located at a portion contacting the unit substrate S on the contact member 122. Such an impact absorbing member 123 may be made of a material that can be elastically deformed by an external force. For example, the impact absorbing member 123 may be made of a material such as rubber or silicone, but the present invention is not limited thereto, and any material may be used as long as it can absorb the impact applied to the unit substrate S during the contact between the contact member 122 and the unit substrate S.
The moving module 127 may be constituted by a linear moving mechanism connected to the contact member 122, and as the linear moving mechanism, for example, an actuator operated by air pressure or oil pressure, a linear motor operated by electromagnetic interaction, or a ball screw device may be applied.
The moving module 127 is configured to move the contact member 122 toward the unit substrate S. When the contact member 122 contacts the unit substrate S, the load of the moving module 127 increases. Accordingly, the pitch measuring unit 120 senses an increase in the load of the moving module 127, thereby detecting whether the contact member 122 is in contact with the unit substrate S.
In order to measure the distance H between the unit substrate S and the adsorption unit 110, the adsorption unit 110 is located at a preset reference height, and thus, the distance measuring unit 120 is also located at the reference height; and, in a state where the pitch measuring unit 120 is located at the reference height, the contact member 122 is moved toward the unit substrate S by the moving module 127. Then, the pitch measuring unit 120 measures the moving distance of the contact member 122 until the contact member 122 comes into contact with the unit substrate S. Therefore, the pitch H between the unit substrate S and the adsorption unit 110 can be measured based on the moving distance of the contact member 122 and the vertical position of the adsorption unit 110 with respect to the pitch measurement unit 120 (i.e., the vertical positional relationship between the pitch measurement unit 120 and the adsorption unit 110).
The displacement measuring module is configured to measure a displacement of the contact member 122 with respect to the body 121 when the contact member 122 moves. In the process when the contact member 122 moves from the reference height to the time of contact with the unit substrate S, the displacement measuring module measures the displacement of the contact member 122 with respect to the body 121, and the moving distance of the contact member 122 can be calculated from the displacement of the contact member 122 with respect to the body 121. Also, the distance H between the unit substrate S and the adsorption unit 110 may be measured based on the moving distance of the contact member 122.
For example, the displacement measuring module may include a reference part 128 provided to the body 121, and a sensing part 129 provided to the contact part 122. As another example, the reference member 128 may be provided on the contact member 122, and the sensing member 129 may be provided on the body 121.
The displacement measuring module measures the displacement of the contact member 122 relative to the body 121 using the interaction of the reference member 128 and the sensing member 129.
As an example, the reference member 128 may be constituted by a scale having a predetermined scale, and the sensing member 129 may be constituted by a camera that photographs the scale. In this case, the relative position between the reference member 128 and the sensing member 129 can be measured based on the image of the scale captured by the sensing member 129, and the displacement of the contact member 122 relative to the body 121 can be measured based on the measured relative position.
As another example, the reference member 128 may be configured by a reflection surface having a different reflection angle depending on the position, and the sensing member 129 may be configured by a light emitting sensor that emits light to the reflection surface and a light receiving sensor that receives light reflected from the reflection surface. In this case, by measuring the reflection angle of the light reflected by the reflection surface, the relative position between the reference member 128 and the sensing member 129 is measured, and the displacement of the contact member 122 with respect to the body 121 can be measured with the measured relative position as a reference.
The driving unit 130 may drive the adsorption unit 110 to move toward the unit substrates S at various points of the loading table 10 based on the measured pitch H. The driving unit 130 for realizing this function may be, for example, one of a rack (rack) and a pinion (pinion gear), a piston (piston) and a cylinder (cylinder), a roller, and a belt (rollerbelt), but is not limited thereto as long as it can lift and lower the object. The driving unit 130 may adjust the height of the adsorption unit 110 corresponding to pitch data including information of the pitch H between the adsorption unit 110 and the unit substrate S.
On one hand, the driving unit 130 may also move the adsorption unit 110 in the X-axis direction and the Y-axis direction. A manner in which the driving unit 130 moves the adsorption unit 110 in the X-axis direction and the Y-axis direction may be a manner in which the adsorption unit is moved in multiple directions in a general substrate transfer apparatus, and thus a detailed description thereof will be omitted.
As shown in fig. 3, the control unit 200 is connected to the pitch measuring unit 120 and the driving unit 130, and controls the driving unit 130 to adjust the vertical position of the suction unit 110 with respect to the unit substrate S based on the pitch H between the unit substrate S and the suction unit 110 measured by the pitch measuring unit 120.
The process of measuring the pitch H between the unit substrate S and the adsorption unit 110 by the pitch measurement unit 120 may be performed every time a plurality of unit substrates S are adsorbed and conveyed.
However, in order to shorten the time required for the process, the process of measuring the pitch H between the unit substrate S and the suction unit 110 may be performed during the process of first sucking and conveying a plurality of unit substrates S located at a plurality of positions of the loading stage 10. As another example, the process of measuring the pitch H between the unit substrates S and the adsorption unit 110 may be performed after adsorbing and conveying a predetermined number of unit substrates S, or may be performed at a predetermined cycle.
On the other hand, the distance H between the adsorption unit 110 and the unit substrate S may be different according to the flatness of the loading table 10. Therefore, the pitches H between the suction units 110 and the unit substrates S are measured at a plurality of points on the loading table 10, and the target heights of the suction units 110 with respect to the unit substrates S can be determined based on the pitches H between the suction units 110 and the unit substrates S at the respective points.
Here, the target height is a position obtained through a plurality of experiments and simulations, and is also a vertical position at which the adsorption pad 111 of the adsorption unit 110 can stably adsorb the unit substrate S. The target height may vary according to the kind of the unit substrate S or the structure of the adsorption unit 110.
The control unit 200 may include a target height calculating module 210, a target height storing module 220, and a control module 230, wherein the target height calculating module 210 calculates a plurality of target heights at which the adsorption unit 110 is to be located with respect to the unit substrate S on a plurality of X-Y coordinates of the loading table 10 based on the distance H between the unit substrate S and the adsorption unit 110 measured by the distance measuring unit 120 in the process of respectively adsorbing the plurality of unit substrates located at a plurality of places of the loading table 10; the target height storage module 220 stores a plurality of target heights on a plurality of X-Y coordinates of the loading table 10 calculated by the target height calculation module 210 as map data (map data); the control module 230 controls the driving unit 130 based on a plurality of target heights on a plurality of X-Y coordinates of the loading table 10 stored in the target height storage module 220 to adjust the height of the adsorption unit 110 located at one of the X-Y coordinates with respect to the unit substrate S.
The target height calculation module 210 calculates the height of the surface of the unit substrate S based on the distance H between the unit substrate S and the adsorption unit 110, and calculates the target height of the adsorption unit 110 at which the unit substrate S can be stably adsorbed by the adsorption pad 111 of the adsorption unit 110 based on the height of the surface of the unit substrate S. The target height here may be a relative height with respect to the reference height.
The target height storage module 220 stores a plurality of target heights corresponding to a plurality of locations of a plurality of X-Y coordinates of the loading table 10 as map data (map data).
The control module 230 controls the driving unit 130 based on a plurality of target height-related map data (mapdata) on a plurality of X-Y coordinates of the loading table 10. Therefore, when the adsorption unit 110 is located at any one of the plurality of X-Y coordinates, the height of the adsorption unit 110 located at the X-Y coordinate with respect to the unit substrate S can be adjusted based on the map data.
The following describes the operation of the substrate conveyance device 100 according to embodiment 1 of the present invention.
According to the substrate carrier device 100 of embodiment 1 of the present invention, first, as shown in fig. 2, the suction unit 110 is located at a reference height in the Z-axis direction at a specific point among a plurality of points of the loading table 10.
Then, as shown in fig. 4, in a state where the suction unit 110 is not moved in the Z-axis direction with respect to the unit substrate S, the contact member 122 is moved toward the unit substrate S and then brought into contact with the unit substrate S, whereby the pitch measuring unit 120 measures the pitch H between the suction unit 110 and the unit substrate S.
The process of measuring the distance H between the adsorption unit 110 and the unit substrate S is performed on a plurality of X-Y coordinates of the loading table 10. Then, the control unit 200 calculates a plurality of target heights at which the adsorption unit 110 is to be located with respect to the unit substrate S at a plurality of X-Y coordinates of the loading table 10 based on the distances H between the adsorption unit 110 and the unit substrate S measured at the plurality of X-Y coordinates of the loading table 10, and stores them as map data.
Then, as shown in fig. 5, the control unit 200 controls the driving unit 130 based on the map data, and thus, the target height of the adsorption unit 110 located at a certain X-Y coordinate with respect to the unit substrate S can be adjusted. Accordingly, the adsorption unit 110 may be moved to a target height with respect to the unit substrate S at each of the plurality of locations of the loading table 10.
As described above, according to the substrate transfer apparatus 100 of embodiment 1 of the present invention, the distance measuring unit 120 for measuring the distance H between the suction unit 110 and the unit substrate S is provided, and the height of the suction unit 110 can be adjusted based on the distance H between the suction unit 110 and the unit substrate S measured at each position of the loading table 10. Therefore, even when the flatness of the loading table 10 is not uniform, the adsorption unit 110 can be lowered to an appropriate position with respect to the unit substrate S.
Accordingly, the negative pressure acting on the adsorption pad 111 may be appropriately applied to the unit substrate S, so that the unit substrate S may be stably adsorbed on the adsorption pad 111.
Further, the suction pad 111 may be prevented from being excessively pressed against the unit substrates S, and the plurality of unit substrates S may be prevented from being rubbed against each other, so that the unit substrates S may be prevented from being damaged due to a scratch (scratch) or the like, and the plurality of unit substrates S may be prevented from being chipped against each other.
As shown in fig. 6, in the substrate conveying apparatus 300 according to embodiment 2 of the present invention, the distance measuring unit 320 may be a non-contact sensor, such as an ultrasonic displacement sensor and an infrared displacement sensor, which are disposed opposite to the unit substrate S.
The other components and effects of the substrate carrying device 300 according to the second embodiment of the present invention are the same as those of the substrate carrying device 100 according to the first embodiment of the present invention.
The preferred embodiments of the present invention have been described by way of example, but the scope of the present invention is not limited to the specific embodiments, and may be modified as appropriate within the scope of the claims.

Claims (5)

1. A substrate conveyance apparatus, wherein the substrate conveyance apparatus comprises:
an adsorption unit configured to adsorb the unit substrate separated from the mother substrate and placed on the loading table;
a driving unit connected to the suction unit and capable of moving the suction unit toward the unit substrate;
a distance measuring unit capable of measuring a distance between the unit substrate mounted on the loading stage and the adsorption unit; and
a control unit that controls the driving unit based on the distance between the unit substrate and the adsorption unit measured by the distance measuring unit;
the control unit includes:
a target height calculating module calculating a plurality of target heights at a plurality of locations of the loading table at which the adsorption unit is located with respect to the unit substrates, based on the distances between the unit substrates and the adsorption unit measured at the plurality of locations of the loading table;
a target height storage module that stores a plurality of target heights at a plurality of points of the loading platform calculated by the target height calculation module as map data; and
and a control module which controls the driving unit based on a plurality of target heights stored at a plurality of positions of the loading table in the target height storage module to adjust a height of the suction unit located at a certain position with respect to the unit substrate.
2. The substrate carrier device according to claim 1, wherein,
the distance measuring unit includes:
a main body fixed to the adsorption unit;
a contact member provided to the body so as to be movable in a direction adjacent to or spaced apart from the unit substrate, a distal end of the contact member facing the unit substrate being in contact with the unit substrate;
a moving module that moves the contact member in a direction adjacent to or spaced apart from the unit substrate; and
and a displacement measuring module disposed between the main body and the contact member, and measuring a displacement of the contact member with respect to the main body.
3. The substrate carrier device according to claim 2, wherein,
the front end of the contact member is provided with an impact absorbing member made of a material elastically deformed by an external force.
4. The substrate carrier device according to claim 1, wherein,
the pitch measuring unit is a non-contact sensor disposed opposite to the unit substrate.
5. The substrate carrier device according to claim 1, wherein,
the distance measuring unit is coupled to the adsorption unit.
CN201921606395.4U 2018-11-29 2019-09-25 Substrate conveying device Expired - Fee Related CN210778526U (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2018-0151401 2018-11-29
KR1020180151401A KR20200065208A (en) 2018-11-29 2018-11-29 Apparatus for transferring substrate

Publications (1)

Publication Number Publication Date
CN210778526U true CN210778526U (en) 2020-06-16

Family

ID=71048445

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201921606395.4U Expired - Fee Related CN210778526U (en) 2018-11-29 2019-09-25 Substrate conveying device

Country Status (2)

Country Link
KR (1) KR20200065208A (en)
CN (1) CN210778526U (en)

Also Published As

Publication number Publication date
KR20200065208A (en) 2020-06-09

Similar Documents

Publication Publication Date Title
WO2017017718A1 (en) Component mounting machine and component mounting system
JP2010082782A (en) Suction device and suction method
JP2007112626A (en) Substrate carrying device, substrate inspection device and substrate carrying method
KR20180069676A (en) Substrate cutting apparatus
KR102067983B1 (en) Apparatus for cutting substrate
CN210778526U (en) Substrate conveying device
TWI759410B (en) Panel handling robots and panel handling systems
JP6103745B2 (en) Thrust height measurement system
WO2018139244A1 (en) Alignment device
KR20020084127A (en) Component mounting apparatus and component mounting method, and recognition apparatus for component mount panel, component mounting apparatus for liquid crystal panel, and component mounting method for liquid crystal panel
CN108628106B (en) Exposure device
JP2003289199A (en) Working system for board
TWI762558B (en) Panel handling robot
CN214878370U (en) Transfer device and detection equipment
CN116222441A (en) PCB flatness detection device
KR102059567B1 (en) Apparatus for transferring substrate
KR20190037830A (en) Substrate cutting apparatus
KR20190059577A (en) Apparatus for cutting substrate
CN216039273U (en) Scribing device
JP5849187B2 (en) Component mounting apparatus and component mounting method
JP7060431B2 (en) Film-shaped electronic component supply stand, punching supply device and electronic component mounting device
CN108455164B (en) Conveying assembly and conveying device
KR20190059576A (en) Apparatus for cutting substrate
JP2020167256A (en) Panel transfer device and panel transfer system
JP2020021896A (en) Carrier robot and carrier system

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20200616

Termination date: 20210925

CF01 Termination of patent right due to non-payment of annual fee