JP4189946B2 - Mounting machine having nozzle cleaning unit - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
In an electronic board production line, after solder is printed on the board surface or adhesive is applied to the board surface, the electronic component on the component supply unit is attracted to the tip of the nozzle in the mounting machine and then moved onto the board surface. Wearing.
The present invention is a mounting machine for use in an electronic board production line as described above, and when the electronic component is mounted on the board, the mounting machine that is not mounted and cannot be taken home, and such a mounting machine. It is related with the nozzle cleaning unit required in order to provide.
[0002]
[Prior art]
In a mounting machine, as a main cause of bringing back an electronic component adsorbed by a nozzle without mounting it on a substrate surface, it is cited that a sticky material such as grease, solder or adhesive adheres to the tip of the nozzle.
JP-A-4-274399 and JP-A-10-313198 have been proposed as inventions aimed at cleaning nozzles.
JP-A-4-274399 proposes an invention for attaching an ultrasonic cleaning device, an invention for dissolving and removing with a chemical, and an invention for removing by thermal decomposition from the viewpoint of preventing the suction nozzle from being clogged.
However, although an invention for attaching an ultrasonic cleaning device is described, there is no description about a specific configuration or method for efficiently removing adhesives such as grease, solder, and adhesive. Further, the ultrasonic cleaning apparatus itself is expensive and cannot be easily adopted.
Furthermore, although the invention for dissolving and removing with chemicals and the invention for removing by thermal decomposition are described, what kind of structure can be used to efficiently remove adhesives such as solder and adhesive, The specific configuration is not described to the extent that can be implemented by those skilled in the art, and the invention is incomplete.
On the other hand, Japanese Patent Application Laid-Open No. 10-313198 describes an invention for picking up a suction nozzle, recognizing dirt, and cleaning the nozzle. However, as a cleaning means for cleaning the nozzle end face, only a brush is installed. is there.
However, by simply bringing the nozzle into contact with the brush, it is not possible to efficiently remove the sticky material such as grease, solder, or adhesive, and such an invention cannot be expected to have a sufficient effect.
[0003]
[Problems to be solved by the invention]
The present invention has been made to eliminate the above-mentioned drawbacks of the prior art, and the object of the present invention is to efficiently use adhesives such as solder and adhesive without using an expensive ultrasonic cleaning device. It is an object of the present invention to provide a nozzle cleaning unit capable of removing the components having the following.
In addition to bringing the nozzle into contact with the brush, to provide a nozzle cleaning unit that has a function of physically wiping with a wiper while actively dissolving grease, solder, adhesive, etc. using a cleaning liquid. is there.
In addition, a mounting machine having such a nozzle cleaning unit, which can perform nozzle cleaning at the same time when performing calibration, has a negative effect on the production efficiency. An object of the present invention is to provide a mounting machine that can be carried out without affecting.
Here, calibration refers to the work of taking a nozzle image and calculating the displacement of each nozzle. Normally, calibration is performed once at the start of each day, and the displacement of each nozzle calculated as a result of calibration is performed. Is fed back to the correction of the nozzle position when the electronic component is picked up.
[0004]
[Means for Solving the Problems]
The invention of claim 1, the cleaning liquid and Ri Do from the washing liquid and the liquid tank for storing the the rotary drum and wiper attached to the outer periphery of the rotary drum, the cleaning solution has a cleaning unit of the nozzle that is configured to contact the wiper It is assumed that the mounting machine for mounting electronic components on a substrate is configured to be capable of cleaning the nozzle with the wiper containing a cleaning liquid while turning the nozzle.
A second aspect of the present invention is the mounting machine according to the first aspect, wherein the wiper has a nozzle cleaning unit to which a groove is provided in the wiper and a slide device for reciprocating the wiper in the axial direction of the rotary drum is attached. In the mounting machine, the tip of the nozzle is inserted into the groove of the wiper, and the nozzle can be cleaned by the wiper while the nozzle is swiveled.
A third aspect of the present invention is the mounting machine according to the first aspect, wherein the mounting machine has a nozzle cleaning unit provided with a serpentine groove in the wiper .
A fourth aspect of the present invention, a mounting apparatus according to claim 1, a structure assembled by compressing together a plurality of divided portions of the wiper, split surface of the portion formed by providing a recess in the cleaning of the nozzle unit A mounting machine having
A fifth aspect of the present invention is the mounting machine according to any one of the first to fourth aspects, wherein the mounting machine has a nozzle cleaning unit provided with a lid.
A sixth aspect of the present invention is the mounting machine according to any one of the first to fifth aspects, wherein the nozzle cleaning can be performed at the same time when the calibration is performed by the operator's selection. And
[0005]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings. In the first embodiment shown in FIGS. 1 and 2, cleaning liquid 53 is stored in a liquid tank 51 having a lid 52. The cleaning unit 50 is configured by attaching a rotating drum 54 that is rotated by driving of the actuator 54 a and attaching a wiper 55 that is formed by overlapping a plurality of woven fabrics on the outer periphery of the rotating drum 54. Further, a slide device 59 is provided, and the cleaning unit 50 is configured to be movable in the axial direction 59a of the rotary drum.
In the description of the second to fourth embodiments shown in FIGS. 3 to 5, only portions different from the first embodiment are described in order to avoid redundant description. Further, the depth of the grooves 46a, 47a, the recess 48b, etc. is about 0.5 mm because the nozzle tip 25a and the rising 25b near the nozzle tip and about 0.5 mm from the nozzle tip 25a may be cleaned. It was.
In the second embodiment shown in FIG. 3, a cleaning unit 50a having a plurality of grooves 46a having a width corresponding to the thickness of the nozzle 25 and attached with a wiper 46 made of a brush is used.
In the third embodiment shown in FIG. 4, the cleaning unit 50 b is provided with a wiper 47 made of a nonwoven fabric having a plurality of meandering grooves 47 a having a width corresponding to the thickness of the nozzle 25.
The fourth embodiment shown in FIG. 5 is a wiper 48 in which a plurality of divided portions 48c made of sponge are compressed and attached, and a concave portion 48b slightly larger than the thickness of the nozzle 25 is provided in one portion of each divided surface 48a. It was set as the unit 50c.
As the cleaning agent 53, it is preferable to use hydrocarbon type solvents such as thinner, toluene and benzene, and alcohol type solvents such as methyl alcohol and ethyl alcohol. Further, the liquid level 53a of the cleaning liquid is maintained at a height at which it comes into contact with the wipers 55, 46, 47, and 48.
[0006]
An embodiment of the mounting machine 21 having the cleaning unit 50 of the first embodiment will be described with reference to FIG.
The mounting machine 21 according to the present invention includes a component supply unit 31, an index device 22, 16 mounting units 23 held by the index device 22, a conveyor 42, a positioning mechanism 43, and the like, and a computer that controls them. It is the mounting machine 21 which consists of.
The component supply unit 31 includes a plurality of feeders 32 that send different electronic components toward the Y-axis direction suction station 1. The component supply unit 31 is supported by the X-axis moving mechanism 33 so as to be movable in the X-axis direction.
The index device 22 has 16 stop stations (1 to 16), and is configured to repeat the process of turning and stopping by 22.5 degrees in the direction of the index turning 26. For this reason, the 16 mounting units 23 stop and move to each stop station (1-16) one after another.
The 16 stop stations are: suction station 1, θ-axis large turning station 3, planar image photographing station 5, θ-axis correction station 8, mounting station 9, θ-axis original position returning station 10, parts disposal station 13, nozzle type switching. The station 14 and the nozzle type confirmation station 15 are included.
The mounting units 23 each have a vertical lifting mechanism and a θ-axis turning 27 mechanism, and a bracket 24 at the lower end. A rotation shaft 28 is rotatably attached to the bracket 24, a block 29 is attached to the rotation shaft 28, and six nozzles 25 are attached to the block 29.
Therefore, the mounting machine 21 according to the present embodiment has a total of 96 nozzles 25. Each nozzle 25 was slidably held by a block 29, and a force was applied in a pushing direction by a spring (not shown), and each nozzle 25 was connected to a vacuum device or a compressed air source via a valve.
A planar image sensor 45 is attached to the planar image photographing station 5. A cleaning unit 50 is attached to the θ-axis correction station 8.
Conveyor 42 serves to carry the board 41 completing the mounting of electronic components from the positioning mechanism 43, and configured to carry the board 41 for mounting electronic components on the next to the positioning mechanism 43.
Positioning mechanism 43, X-axis and holds the base plate 41, has a configuration having a Y-axis and the vertical direction is moved in the Z-axis direction function to stop.
[0007]
Next, the operation of the cleaning units 50, 50a, 50b, and 50c will be described. When the cleaning units 50, 50a, 50b, 50c are not used, the lid 52 is closed in order to prevent the cleaning liquid 53 from evaporating and useless consumption.
When the nozzle 25 is cleaned by the cleaning unit 50 according to the first embodiment, the rotary drum 54 is rotated while the nozzle 25 is rotated about the θ axis 27 while the nozzle tip 25 a is pressed against the wiper 55. Since the wiper 55 contains cleaning liquid, the cleaning liquid is attached to the nozzle tip 25a and the rise 25b, and grease, solder, adhesive, etc. are dissolved by the cleaning liquid, and the wiper 55 is attached to the nozzle tip 25 and the rise 25b. Wipe off the sticky material.
When the nozzle 25 is cleaned by the cleaning unit 50a of the second embodiment, the nozzle 25 is rotated by the θ axis 27 while the tip end 25a of the nozzle is inserted into the groove 46a of the wiper 46 and pressed against the wiper 46, and the rotary drum 54 is moved. The wiper 46 is reciprocated in the axial direction 59a of the rotating drum while rotating.
The tip 25a of the nozzle is pressed against the bottom surface of the groove 46a of the wiper, and the rise 25b at the tip of the nozzle is pressed against the wall surface of the groove 46a that reciprocates, and both are subjected to the dissolving action by the cleaning liquid and the wiping action by the wiper 46.
When the nozzle 25 is cleaned by the cleaning unit 50 b of the third embodiment, the nozzle 25 is rotated around the θ axis 27 while the nozzle tip 25 a is inserted into the meandering groove 47 a of the wiper 47 and pressed against the wiper 47. 54 is rotated.
The tip 25a of the nozzle is pressed against the bottom surface of the groove 47a of the wiper, and the rising edge 25b of the nozzle is pressed against the wall surface of the meandering groove 47a, and both are subjected to the dissolving action by the cleaning liquid and the wiping action by the wiper 47.
When the nozzle 25 is cleaned by the cleaning unit 50 c of the fourth embodiment, the nozzle is inserted into the recess 48 b of the wiper 48 and the rotary drum 54 is rotated.
The nozzle tip 25 a and the rising edge 25 b are sandwiched between the dividing surfaces 48 a as the rotary drum 54 rotates. Since the wiper 48 is formed by compressing and attaching a plurality of divided portions 48 c made of sponge, both the nozzle tip 25 a and the riser 25 b are subjected to a dissolving action by the cleaning liquid and a wiping action by the wiper 47.
[0008]
Next, the electronic component mounting operation of the mounting machine 21 will be described. A plurality of electronic components are respectively sent to the suction station 1 on the Y axis by individual feeders 32. The component supply unit 31 is moved by the X-axis moving mechanism 33 so that the electronic component to be sucked next is positioned immediately below the suction station 1.
At the suction station 1, the mounting unit 23 pushes down the bracket 24, touches the top end 25 a of the nozzle with the upper surface of the electronic component 18 and presses it with an appropriate force by a spring, and connects the nozzle and the vacuum device by switching the valve. . In this way, the electronic component 18 is attracted to the nozzle 25. Thereafter, when the bracket 24 is pushed up, the electronic component moves together with the movement of the mounting unit 23 while being attracted to the nozzle 25.
At the θ-axis large turning station 3, the mounting unit 23 performs θ-axis turning 27 to roughly adjust the angle in plan view. Thereafter, the planar image capturing station 5 captures a planar image by the planar image sensor 45 and analyzes the image data to discard the electronic component having a defective planar dimension, or the final correction of the electronic component in the θ-axis correction station 8. To give feedback.
At the θ-axis correction station 8, the mounting unit 23 feeds back the analysis result of the planar image data, and performs θ-axis rotation 27 to perform final angle correction so that it can be mounted on the substrate 41 accurately.
In mounting station 9, when mounting the electronic components 18, the positioning mechanism 43 based on the position to mount the X-axis, Y-axis and Z-axis moving in the direction the next electronic component 18 to hold the board 41 The plate 41 is moved and stopped.
Then, the mounting unit 23 is pushed down the bracket 24, in the state of pressing the electronic component 18 with a suitable force by a spring mounted on the base plate 41, is open to the atmosphere by switching the valve of the nozzle. In this way, the electronic component 18 moves away from the nozzle 25. Thereafter, the mounting unit 23 pushes up the bracket 24.
On the other hand, if the electronic component 18 has a poor planar size as a result of analyzing the planar image and the electronic component 18 is not mounted, the electronic component 18 is attracted to the nozzle 25 and moved to the next station.
At the θ-axis original position returning station 10, the mounting unit 23 performs a θ-axis rotation 27 and returns to a predetermined original position.
In the component disposal station 13, when the mounting unit 23 has an electronic component 18 having a poor planar size or an electronic component 18 that is not mounted on the board and brought home, the valve is switched to introduce compressed air into the nozzle. The part 18 is discarded.
At the nozzle type switching station 14, the mounting unit 23 rotates the block 29 based on the nozzle type switching command, and switches the nozzle 25 to be used next to the lowermost position.
In the nozzle type confirmation station 15, it is confirmed whether the type of the nozzle 25 actually used at the lowermost position and the type of the nozzle 25 to be used next are the same.
[0009]
Next, an operation when an operator selects to perform nozzle cleaning when performing calibration will be described.
In accordance with the index rotation 26 of the index device 22, the 16 mounting units 23 stop one after another at the planar image photographing station 5, the θ-axis correction station 8, and the parts disposal station 13.
In the planar image photographing station 5, an image of the nozzle 25 is captured by the planar image sensor 45. The rotation shaft 28 of the mounting unit 23 is rotated to capture all images of the six nozzles 25 attached to each mounting unit 23, and then the process proceeds to the next station.
At the θ-axis correction station 8, the cleaning unit 50 is moved in the axial direction 59a of the rotary drum 54, the wiper 55 suitable for the nozzle 25 to be cleaned is aligned, the vertical lift mechanism of the mounting unit 23 is operated, and the tip of the nozzle 25a is pressed against the wiper 55.
Thereafter, the cleaning unit 50 is operated while the nozzle 25 is rotated by the θ axis 27. Since six nozzles 25 are attached to one mounting unit 23, after cleaning all the nozzles 25 attached to each mounting unit 23 while rotating the rotating shaft 28 and switching the nozzles 25, Proceed to the next station.
Subsequently, in the component disposal station 13, while rotating the rotating shaft 28 to switch the nozzle 25, the valve is switched to introduce compressed air into each nozzle 25, and the cleaning liquid remaining in the nozzle is ejected.
[0010]
In each of the above embodiments, different types of wipers such as a woven fabric, a brush, a non-woven fabric, and a sponge are used. However, the type of wiper is not limited for each embodiment. For example, the wiper of the first embodiment can be used as a wiper. The combination is free, such as using a wiper.
Further, the material of the wiper is not particularly limited, and may include a cleaning agent, and may have a function of physically wiping off an adhesive such as grease, solder, or adhesive from the surface of the nozzle 25. That's fine. For example, a woven or non-woven fabric made of nylon, tetron, or animal or plant fiber, or a brush made of resin or metal is preferable.
In the above embodiment, the cleaning unit 50 is attached to the θ-axis correction station 8, but it may be attached anywhere as long as it does not get in the way. However, it is preferable to install it in the θ axis large turning station 3, the θ axis correcting station 8, the θ axis original position returning station 10 and the like because it is possible to use the existing θ axis turning function.
In the embodiment described above, the mounting unit 23 is moved up and down. However, when the cleaning unit 50 is attached to a stop station that does not have the function of moving up and down, the cleaning unit 50 may be moved up and down. .
[0011]
【The invention's effect】
According to the present invention, it is possible to provide a nozzle cleaning unit that can efficiently remove adhesives such as solder and adhesive without using an expensive ultrasonic cleaning apparatus.
Also, it is possible to provide a nozzle cleaning unit that has a function of physically wiping with a wiper while not only bringing the nozzle into contact with the brush but also actively dissolving grease, solder, adhesive, etc. using a cleaning liquid. did it.
In addition, since the mounting machine having such a nozzle cleaning unit is capable of performing nozzle cleaning at the same time when calibration is performed according to the selection of the operator, the nozzle cleaning work is performed at a production efficiency. It was possible to provide a mounting machine that can be performed at a timing that does not adversely affect the machine.
[Brief description of the drawings]
FIG. 1 is a front sectional view of a first embodiment of a cleaning unit according to the present invention.
FIG. 2 is a cross-sectional view of the side view of FIG.
FIG. 3 is a front sectional view of a second embodiment of the cleaning unit according to the present invention.
FIG. 4 is a front sectional view of a third embodiment of the cleaning unit according to the present invention.
FIG. 5 is a front sectional view of a fourth embodiment of the cleaning unit according to the present invention.
FIG. 6 is a configuration diagram in plan view of the mounting machine according to the present invention.
FIG. 7 is a side view showing a mounting state of the nozzle of the mounting machine according to the present invention.
[Explanation of sign]
21: Mounting machine 25: Nozzle 25a: Tip 25b: Upright 46: Wiper 46a: Groove 47: Wiper 47a: Groove 48: Wiper 48a: Dividing surface 48b: Recessed part 48c: Dividing part 50: Cleaning unit 50a: Cleaning unit 50b: Cleaning unit 50c: Cleaning unit 51: Liquid tank 52: Lid 53: Cleaning liquid 54: Rotating drum 55: Wiper 59: Slide device 59a: Axial direction

Claims (6)

Washing liquid and Ri Do and a wiper attached to the outer periphery of the rotary drum and the rotary drum and the liquid bath for storing the cleaning liquid, the cleaning liquid and having a cleaning unit of the nozzle that is configured to contact with the wiper pivot the nozzle A mounting machine for mounting electronic components on a substrate, wherein the nozzle can be cleaned with the wiper containing a cleaning liquid. The mounting machine according to claim 1, further comprising a nozzle cleaning unit provided with a slide device for providing a groove in the wiper and reciprocating the wiper in the axial direction of the rotary drum. A mounting machine characterized in that the nozzle can be cleaned by the wiper while inserting the tip of the nozzle and turning the nozzle. The mounting machine according to claim 1, further comprising a nozzle cleaning unit provided with a serpentine groove in the wiper . The mounting machine according to claim 1 , wherein the wiper has a configuration in which a plurality of divided portions are compressed and assembled to each other, and has a nozzle cleaning unit in which a concave portion is provided in a part of the divided surface. Mounting machine. The mounting machine according to any one of claims 1 to 4, further comprising a nozzle cleaning unit provided with a lid. The mounting machine according to any one of claims 1 to 5, wherein nozzle mounting can be performed simultaneously with calibration.

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