JP4246110B2 - Printing mask cleaning device - Google Patents

Description

  The present invention relates to a printing mask cleaning apparatus and method in a cream solder printing apparatus.

  In the manufacture of electronic circuit boards, cream solder is mainly used when soldering electronic components such as chips on a printed circuit board. A cream solder printing apparatus is used to print and apply the cream solder in a desired pattern.

  The cream solder printing apparatus uses a printing mask (screen) having an opening. The opening is formed along the desired pattern described above. By placing a printing mask on the printed board and filling the opening with cream solder, the cream solder is printed and applied in a desired pattern on the printed board.

  After printing the cream solder, it is necessary to remove the cream solder attached to the opening of the printing mask. FIG. 5 shows an example of the printing mask cleaning apparatuses 100 and 101. As illustrated in FIG. 5A, the cleaning device 100 includes an air injection unit 109 and an air suction unit 111. First, the cleaning apparatus 100 moves to a position where the entire pattern of the opening (not shown) of the printing mask 105 can be covered. Then, the air injection unit 109 is lowered, the air suction unit 111 is raised, and the respective tips contact the printing mask 105. While this state is maintained, air is jetted and sucked into the opening by the air sprayer 108 and the air suction unit 110, whereby the cream solder adhering to the opening flows out or scatters to the back side of the printing mask 105. . The scattered cream solder is collected by the cleaning paper 113 and the filter 112. After the removal of the cream solder 104 adhering to the opening is finished, the air injection and suction by the air injection device 108 and the air suction device 110 are stopped, the air injection portion 109 is raised, the air suction portion 111 is lowered and the initial Return to position.

  Thereafter, the printing mask 105 is moved to the cleaning device 101 shown in FIG. Alternatively, the cleaning device 101 may be moved to the printing mask 105. The cleaning device 101 includes a cleaning squeegee 117, a cleaning paper (roll cloth) 118, a supply unit 119 for the cleaning paper 118, and a winding unit 120. The cleaning squeegee 117 rises and contacts the printing mask 105 through the cleaning paper 118. The cleaning device 101 moves in a predetermined direction while maintaining this state. Thereby, the cream solder that has flowed out to the back side of the printing mask 105 and the cream solder that still adheres to the opening are removed.

JP-A-4-230958

  However, it is difficult to completely remove the cream solder adhering to the opening even after the air jet and suction described above. Moreover, the cream solder adhering to the cleaning paper may enter the opening again. Therefore, in addition to cleaning by the cleaning device, cleaning by hand wiping may be required (for example, one wiping after cleaning by 100 cleaning devices). This hand wiping may deteriorate the productivity of the printed circuit board.

  It is an object of the present invention to provide a printing mask cleaning apparatus and method capable of improving cream solder removal efficiency.

  The cleaning device for a printing mask according to the present invention is disposed on the first surface side of the printing mask having an opening, and directly contacts the cream solder attached to the opening to remove the cream solder from the opening. The removal member, the suction mechanism that is disposed on the second surface side of the printing mask and sucks the cream solder removed by the removal member, and the timing of the removal of the cream solder by the removal member is the same as the suction of the cream solder by the suction mechanism. And a control device that controls the removal member and the suction mechanism to interlock with each other so as to be substantially synchronized with the timing.

  The removal member is preferably composed of a brush. This brush may be circular or long. The brush may have a rotation axis arranged substantially parallel to the first surface of the printing mask or a rotation axis arranged substantially perpendicular to the first surface of the printing mask.

  The cleaning device of the present invention may be provided with a sensor for detecting the presence or absence of the cream solder residue in the opening.

  Further, the cleaning device of the present invention may be provided with a wiping member that is disposed between the second surface of the printing mask and the suction mechanism and wipes the cream solder removed to the outside of the opening. Roll paper can be used as the wiping member.

  Furthermore, the cleaning device of the present invention may be provided with a cleaning device for the removal member that removes the cream solder adhering to the removal member. This cleaning device can be composed of a cleaning tank for storing the removing member and the cream solder solvent, a pump for circulating the solvent, and a filter unit for filtering the cream solder eluted in the solvent. An ultrasonic generation unit may be provided in the cleaning tank.

  From another aspect of the present invention, a removing means for mechanically removing the cream solder adhering to the opening of the printing mask to the outside of the opening, and a suction means for sucking the removed cream solder; There is provided a printing mask cleaning device having a timing for removing the cream solder by the removing means and a control means for substantially synchronizing the timing for sucking the cream solder by the suction means.

  From still another aspect of the present invention, the cream solder adhered to the opening of the printing mask is mechanically removed outside the opening, the removed cream solder is sucked, and the cream solder is removed at the timing, A printing mask cleaning method is provided that substantially synchronizes the timing of cream solder suction.

  According to the present invention, the cream solder attached to the printing mask can be removed mechanically or physically, so that the removal of cream solder can be improved.

  Hereinafter, embodiments according to the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 shows an overall view of a cleaning device 1 and a brush cleaning device 2 for a printing mask (screen) 7 according to the present invention. The cleaning device 1 includes a circular brush 3 and a long brush 4 as a removing member, a suction mechanism 5, and a control device 6 that links the brush and the suction mechanism.

  The printing mask 7 has an opening 8 as shown in the enlarged view of FIG. In order to solder electronic components such as chips on the printed board, cream solder is printed and applied on the printed board in a desired pattern. The opening 8 is formed along this pattern. The cream solder is filled in the opening 8 using the squeegee 9 that is driven up and down by the elevating mechanism 10a, whereby the cream solder is printed and applied in a desired pattern on the printed board. The squeegee 9 may be provided with a cover that prevents the attached cream solder from dripping.

  After printing the cream solder, it is necessary to remove the cream solder adhering to the opening 8 of the printing mask 7. The cleaning device 1 of the present invention is used for removing the cream solder.

  The brushes 3 and 4 are in direct contact with the cream solder adhered to the printing mask 7 and the opening 8. That is, the brush physically or mechanically contacts the cream solder adhered to the printing mask opening 8 and performs a cleaning action on the printing mask 7. The contact strength, rotation speed, and the like can be appropriately adjusted according to the characteristics of cream solder or printing mask, the required degree of cleaning, and the like.

  The brushes 3 and 4 are made of nylon. The side-view circular brush 3 has a rotation axis arranged parallel to the upper surface (first surface) of the printing mask 7 and rotates in the direction of arrow A. On the other hand, the long brush 4 in side view has a rotation axis arranged perpendicularly to the upper surface of the printing mask 7 and rotates in the direction of arrow B. Normally, the circular brush 3 is used, but when cleaning only a specific portion of the printing mask 7, the long brush 4 is often used. Further, only one of the circular brush 3 and the long brush 4 may be provided. Further, the relationship of “parallel” or “vertical” with respect to the upper surface of the printing mask at the rotation axis of each brush need not be strict, and may be “substantially parallel” or “substantially vertical”.

  The elevating mechanisms 10b and 10c drive the brushes 3 and 4 up and down (in the Z direction) relative to the printing mask 7, respectively. Further, the horizontal movement mechanism 12 drives the brushes 3 and 4 in the horizontal direction indicated by the arrow C (in the XY direction) via the elevating mechanisms 10b and 10c and the squeegee elevating mechanism 10a. The elevating mechanisms 10a, 10b, and 10c are each formed by individual sliding blocks in the illustrated embodiment, but can be combined into an integral sliding block.

  Sensors 11a and 11b connected to the lifting mechanisms 10b and 10c and provided adjacent to the brushes 3 and 4 are used to detect cream solder still remaining in the opening 8 after cleaning. When the sensors 11a and 11b detect residual cream solder, only the openings where the residual cream solder exists may be intensively cleaned by the brushes 3 and 4. The type of sensor is not limited as long as it can detect cream solder.

  The suction mechanism 5 is disposed on the lower surface (second surface) of the printing mask 7 and is driven in the horizontal direction (XY direction) indicated by the arrow D by the horizontal movement mechanism 13. The cream solder removed by the brushes 3 and 4 is sucked by the suction mechanism 5. The type of the suction device 5 is not particularly limited, and an existing one can be used.

  The control device 6 causes the brushes 3, 4 and the suction mechanism 5 to interlock with each other so that the cream solder removal timing by the brushes 3, 4 is substantially synchronized with the cream solder suction timing by the suction mechanism 5. That is, the control device 6 controls the movement of the brushes 3 and 4 in the C direction and the movement of the suction mechanism 5 in the D direction via the horizontal movement mechanisms 12 and 13. As a result, the brushes 3 and 4 and the suction mechanism 5 can be coordinated. “Substantially synchronize” may be a state in which the cream solder removed from the opening 8 by the brushes 3 and 4 can be sucked by the suction mechanism 5, and the opening to be removed of the brushes 3 and 4; The suction target openings of the suction mechanism 5 do not have to be exactly the same. The cream solder suction operation may be turned on / off according to the positions of the brushes 3 and 4 and the position of the opening, or may be constantly sucked during cleaning. Various hardware, software, and programs can be used for the control device 6.

  A roll paper (roll cloth) 14 as a wiping member is disposed between the lower surface of the printing mask 7 and the suction mechanism 5 and wipes the cream solder removed to the outside of the opening 8. After the roll paper 14 comes into contact with the lower surface of the printing mask 7, the suction mechanism 5 starts suction. The roll paper 14 is supplied from a supply unit (not shown), and is wound after the cream solder is wiped off by a winding unit (not shown). The roll paper 14 may be a dry one (dry type), or may be one in which alcohol or the like is soaked into a base paper (wet type). The type of roll paper is not particularly limited.

  Next, the operation of the cleaning device of the present invention will be described.

  After the cream solder is printed, the circular brush 3 or the long brush 4 is brought into contact with the printing mask 7 by the lifting mechanism 10b or 10c. Then, the control device 6 moves the circular brush 3 or the long brush 4 and the suction mechanism 5 in the horizontal direction using the horizontal movement mechanisms 12 and 13. FIG. 2 shows a state where the horizontal positions of the circular brush 3 and the suction mechanism 5 are thus aligned with the printing mask 7 in the vertical direction for cleaning. The same applies when the long brush 4 is used.

  Note that the rotation direction of the circular brush 3 preferably coincides with the horizontal movement direction of the suction mechanism 5. That is, as shown in FIG. 2A, when the suction mechanism 5 moves from right to left (arrow E direction), it is preferable to rotate the brush to the right (arrow F direction). On the other hand, as shown in FIG. 2B, when the suction mechanism 5 moves from the left to the right (arrow G direction), it is preferable to rotate the brush to the left (arrow H direction). With such a configuration, the cream solder S can be efficiently removed from the opening 8.

  Moreover, it may be necessary to remove the cream solder adhering to the brush. In this embodiment, the brush cleaning device 2 and the suction mechanism 5 shown in FIGS. 1 and 3 are used. Any one of these is effective. The brush cleaning apparatus includes a cleaning tank 15, an ultrasonic generation unit 16, a pump 17, and a filter unit 18. The cleaning tank 15 is filled with a solvent 19 such as various alcohols.

  First, as shown by a dotted line in FIG. 1, the horizontal brush 12 is arranged in the cleaning tank 15 by operating the horizontal movement mechanism 12 and the lifting mechanism 10 b. Subsequently, the brush 3 is rotated. And the cream solder adhering to the brush 3 is melt | dissolved in the solvent 19 in a container. As a result, the cream solder adhering to the brush 3 can be removed.

  Further, a fine vibration wave may be generated from the ultrasonic wave generation unit 16. This minute vibration wave promotes the removal of cream solder.

  Further, the solvent 19 is circulated in the cleaning tank 15 by using the pump 17, and the cream solder is removed from the solvent 19 by filtration in the filter unit 18. With this configuration, the solvent 19 in the cleaning tank 15 can be kept clean at all times.

  When the brush is not cleaned, a lid can be provided on the upper portion of the cleaning tank 15 to prevent the solvent from volatilizing.

  Further, as shown by a broken line in FIG. 1, the suction mechanism 5 is moved to a position away from the position of the printing mask 7, and as shown in FIG. 4, the brush 3 is lowered on the suction mechanism 5, Contact the roll paper 14. Then, the brush 3 is rotated, and the roll paper 14 is moved in the direction opposite to the rotation direction of the brush 3. Thereby, the cream solder adhering to the brush 3 can be removed. The suction mechanism 5 can be used after the brush 3 is cleaned by the brush cleaning device 2 to remove the solvent adhering to the brush 3 and the cream solder left behind by the brush cleaning device 2 described above.

  The above-described cleaning process of the circular brush 3 can also be applied to the long brush 4.

  In the above embodiment, the printing mask is fixed, and the brush and the suction mechanism are moved. However, the brush and the suction mechanism may be fixed and the printing mask may be moved in the X, Y, and Z directions.

  In the above embodiment, the brush is made of nylon, but there is no particular limitation. Further, the brush may be neutralized.

  In this embodiment, circular and long brushes were used. However, as long as it is a removal member that directly acts on the mask for printing and cream solder to remove the cream solder, a polygonal brush such as a triangle or a brush having another shape can be used. Further, instead of a brush, a member such as a mop, sponge, or sponge may be used.

  In this embodiment, a circular brush that rotates is used as the removal member. However, the movement of the removal member is not limited to the rotation. Any movement in the three-dimensional direction that can remove the cream solder can be adopted as the movement of the removing member. For example, the brush may be reciprocated in any of up / down, vertical / horizontal, and front / rear directions, or two or three of the vertical / vertical / horizontal and front / rear directions may be combined. Of course, the removing member applied to the present invention is not limited to the configuration described in the specification and the drawings, and equivalents thereof.

  According to the present embodiment, the cream solder attached to the printing mask can be mechanically and physically removed using the removing member, so that the removal of the cream solder can be improved. It is also possible to remove cream solder that may not be removed only by air ejection and suction. In particular, when the flux in the cream solder evaporates and the cream solder is cured, there is a possibility of clogging the opening of the printing mask. The present embodiment can particularly exert its effect on the removal of such hardened cream solder.

  Further, the cleaning device of the present invention is not limited to the one that removes the cream solder adhering to the opening of the printing mask, and is naturally used for removing the cream solder adhering to other places of the printing mask. It is.

  Although various embodiments of the present invention have been described above, the present invention is not limited to the matters shown in the above-described embodiments, and those skilled in the art will be able to understand based on the claims and the description of the specification and well-known techniques. Such changes and applications are also within the scope of the present invention, and are included in the scope for which protection is sought.

  ADVANTAGE OF THE INVENTION According to this invention, the cleaning apparatus and cleaning method of a printing mask which can remove the cream solder adhering to the printing mask efficiently are provided.

It is a side view of the cleaning apparatus of the printing mask of this invention. It is the schematic diagram which showed the process of removing cream solder with the cleaning apparatus of the mask for printing of this invention. It is the schematic diagram which showed the state which wash | cleans a brush with a brush washing | cleaning apparatus. It is the schematic diagram which showed the process of removing the solvent adhering to a brush after the process shown in FIG. It is a side view of the cleaning apparatus of the mask for printing of a prior art example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Cleaning apparatus 2 Brush cleaning apparatus 3 Circular brush 4 Long brush 5 Suction mechanism 6 Control apparatus 7 Printing mask 8 Opening S Cream solder

Claims (1)

A brush which is disposed on the first surface side of the printing mask having an opening, directly contacts the cream solder attached to the opening, and removes the cream solder out of the opening;
A suction mechanism that is disposed on the second surface side of the printing mask and sucks the cream solder removed by the brush ;
A control device for controlling the brush and the suction mechanism to interlock with each other so that the timing of the removal of the cream solder by the brush is substantially synchronized with the timing of the suction of the cream solder by the suction mechanism;
A printing mask cleaning device comprising:

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