KR100651564B1 - Cleaning apparatus for screen printer - Google Patents

Abstract

A cleaning apparatus of a screen printer is provided to improve a cleaning function of a mask, by constituting a first and a second cleaning apparatus part for cleaning residue of a solder on the top/bottom of the mask. According to a cleaning apparatus of a screen printer cleaning residues of a cream solder provided to a mask, a first cleaning apparatus part(200) is comprised on the top of the mask, and removes the residues of the solder attached to a hole of the mask by exhausting air pressure and cleaning solution through the upper plane of the mask. A second cleaning apparatus(300) is comprised on the bottom of the mask, and absorbs the residues of the solder removed from the hole, as air pressure and cleaning solution of the first cleaning apparatus pass through the hole of the mask. A wiper apparatus part(400) removes the residue removed from the hole of the mask and the residue remained in the mask, by being installed on an outer surrounding of the first and the second cleaning apparatus part.

Description

Cleaning device for screen printers {CLEANING APPARATUS FOR SCREEN PRINTER}

1 is a view showing a washing apparatus according to the prior art,

Figure 2 is a side cross-sectional view showing a state of use of the cleaning device according to the prior art.

Figure 3 is a plan view showing the configuration of a cleaning device for a screen printer according to an embodiment of the present invention.

Figure 4 is a side cross-sectional view showing a first cleaning device of the configuration of the cleaning device of the screen printer according to an embodiment of the present invention.

FIG. 5 shows a bottom view of the first cleaning device shown in FIG. 4; FIG.

Figure 6 is a side cross-sectional view showing a second cleaning device of the configuration of the cleaning device of the screen printer according to an embodiment of the present invention.

FIG. 7 shows a bottom view of the second cleaning device part shown in FIG. 6. FIG.

8 is a side view showing a state of use of the cleaning device of the screen printer according to an embodiment of the present invention.

The present invention relates to a cleaning device for a screen printer comprising a cleaning device for cleaning the residue of the solder on the upper and lower parts of the mask.

Typically, on a printed circuit board, which is an essential component of an electronic device product, various parts and an entire circuit are connected by soldering so that each function can be exhibited.

For this purpose, when mounting parts on both sides of the printed circuit board, the insert mounting method and the surface mounting method are used together. Due to the technical differences in soldering, the surface mounting method is preceded by the insert mounting method and then the printed circuit board is applied. And various parts are soldered. At this time, the solder used in the surface mounting method is made of a cream type having some viscosity and fluidity because the powder solder and the liquid flux are mixed at a predetermined ratio.

Therefore, in the case of neglecting management of printing pressure, speed, mask, etc. in the screen printing process, a soldering failure occurs.

Referring to the screen printer process as shown in FIGS. 1 and 2, the mask 1 is installed in the equipment by the mask fixing part 7, and in this state, a printed circuit board (not shown) to proceed with the process. After inserting the mask 1 and the hole (not shown) of the mask (1) and the pad of the circuit board by using the image recognition mark of the mask and the circuit board and check, and check the cream solder (6) Supply the surface of 1) with a spatula.

The cream solder 6 is supplied with the cream solder 6 uniformly applied to the mask 1 in the hole (not shown) by the pressure in the gravity direction of the squeegee 3 and the movement in the straight direction. Solder 6 is applied in the same pattern as the electronic circuit pattern formed on the printed circuit board (not shown) through the holes (not shown) of the mask (1). The squeegee 3 is moved by the squeegee driver 4.

Then, in order to reprint the cream solder 6 on the new substrate, an apparatus for cleanly cleaning the bottom of the mask 1 is required.

The cream solder cleaning apparatus 10 of the conventional screen printer is located in the lower side of the mask 1, as shown in Figs. 1 and 2, and moves in a zigzag to remove the residue of the cream solder remaining under the mask 1. The cleaning wiper 20 and the roller unit 40 is connected to one end of the cleaning wiper 20 to change the rotational motion of the drive motor 30 into a linear motion.

The cleaning wiper 20 is buried with a cleaning agent.

However, the cleaning device of the conventional screen printer has a disadvantage in that it does not remove the residue of the cream solder in the hole provided in the corner of the mask by moving the cleaning wiper provided on the bottom of the mask in a zigzag to remove the residue of the cream solder, When the size of the hole of the mask is small, it cannot be removed even by repeated movement of the zigzag of the cleaning wiper, resulting in a poor printing of the screen printer, which impairs process quality and product stabilization.

In addition, the cleaning wiper provided on the bottom side of the lower side of the mask cleans only the lower side of the mask, so that the hole of the mask may be large, but the hole of the mask is too small in small chips used in high density products. There was a disadvantage of not completely removing the residue.

Accordingly, the present invention is to solve the above conventional problems, the object of the present invention is to configure the first and second cleaning device for cleaning the residue of the solder on the upper and lower parts of the mask, the cleaning function of the mask It is to provide a cleaning device of a screen printer to improve.

Another object of the present invention is to provide a cleaning device for a screen printer, which is capable of cleaning even small and high density products regardless of the size of the substrate by configuring the first and second cleaning device parts for cleaning solder residues on the upper and lower parts of the mask. It is.

Still another object of the present invention is to clean the mask, and the remaining solder residue is removed by the wiper device provided on the upper and lower portions of the mask, so that the cleaning function of the mask can be further improved To provide.

In order to achieve the above object, the present invention, in the cleaning device of the screen printer for cleaning the residue of the cream solder provided in the mask,

A first cleaning device unit disposed above the mask to discharge air pressure and a cleaning liquid supplied from an external device to an upper surface of the mask to remove residue of the solder attached to the hole of the mask;

A second cleaning device unit provided below the mask to suck air debris from the hole and the air pressure of the first cleaning device unit and the cleaning liquid through the holes of the mask; And

And a wiper device unit rotatably mounted on the outer circumference of the first and second cleaning device units to remove the solder dregs and the remaining dregs from the holes of the mask.

Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the present invention. In addition, it should be noted that the same reference numerals are used for the same functions as the conventional functions among the components of the drawings.

As shown in FIG. 3, the cleaning device 100 of the screen printer includes first and second cleaning device parts 200 and 300 and a wiper device part 400, and the first cleaning device part 200 is a mask. (1) The mask 1 is fixed by the fixing part 7, and the air pressure A1 and the cleaning liquid (not shown) supplied from an external device (not shown) are applied to the upper surface of the mask 1. It is provided on the upper portion of the mask 1 to remove the residue (6a) of the cream solder (6) attached to the hole (8) of the mask (1), the second cleaning device 300 The air pressure A1 and the cleaning liquid (not shown) of the first cleaning device unit 200 pass through the hole 8 of the mask 1 and the hole 8 of the mask 1. Is provided in the lower portion of the mask 1 to suck the debris 6a of the solder 6 removed from the wiper device 400, and the wiper device 400 is removed from the hole 8 of the mask 1. Leftovers of solder (6) (6a) and a left itdoen is rotatably mounted on the outer periphery of the first and second cleaning device 200 (300) so as to wash the residue (6a) of the solder (6).

4 and 5, the first cleaning device 200 includes a supply housing 201, a supply pipe 202, at least one discharge pipe 203, and at least one supply housing ( 201) side pipe hole 204, the supply housing 201 is provided with a receiving space 201a to accommodate the supply pipe 202, the discharge pipe 203, the supply Pipe 202 is mounted on the top surface of the supply housing 201 to supply the air pressure A1 and the cleaning liquid (not shown) supplied from an external device (not shown) into the supply housing 201. The supply pipe 203 is connected to the supply pipe 202 and the supply to distribute the air pressure A1 and the cleaning liquid (not shown) evenly on the bottom surface of the supply housing 201. It is provided in the housing 201, the supply housing The pipe hole 204 on the side of the gong 201 is formed in the bottom surface of the supply housing 201 so as to penetrate with the discharge pipe 203.

As illustrated in FIG. 5, the pipe housing 204 of the supply housing 201 is provided to be elongated in the longitudinal direction of the supply housing 201, and the discharge pipe is provided in the pipe hole 204 of the supply housing 201. The air pressure A1 of 203 and the cleaning liquid can be inserted at regular intervals along the length of the hole 204 so as to spray the mask 1.

6 and 7, the second cleaning device 300 may include a suction housing 301, a pressure pipe 302, at least one suction pipe 303, and at least one suction housing ( 301 side pipe hole 304, the suction housing 301 is provided with a receiving space 301a to accommodate the pressure pipe 302, the suction pipe 303, the pressure pipe 302 absorbs the air pressure A1 and the cleaning liquid (not shown) passing through the mask 1, and removes the solder 6 residue 6a separated from the hole 8 of the mask 1. It is mounted on the bottom surface of the suction housing 301 to provide a suction pressure (A2) in the external device (not shown) for the discharge, and the suction pipe 303 is connected to the suction pipe 303 and In addition, the suction pressure (A2) evenly distributed on the upper surface of the suction housing 301 to the solder (6) The suction housing 301 is provided in the suction housing 301 so that the suction 6a can be sucked, and the pipe hole 8 of the suction housing 301 is connected to the suction pipe 303 so as to penetrate the suction housing 301. It is formed on the top surface.

As shown in FIG. 7, the pipe hole 304 of the suction housing 301 is formed at a predetermined interval along the longitudinal direction of the suction housing 301, and the pipe hole 304 of the suction housing 301 is Residue 6a of the solder 6 removed from the mask 1 and a cleaning liquid (not shown) are fitted into the hole 304 to suck through the suction pipe 303.

As shown in FIG. 3, the wiper device 400 includes first and second wiper roller parts 401 and 402, and the first wiper roller part 401 is formed of the second wiper roller part 402. The neighboring of the first and second cleaning device parts 200 and 300 to wind the wiper 500 and to supply the wiper 500 to the appearance of the first and second cleaning device parts 200 and 300. It is provided at the position, the second wiper roller portion 402 is the wiper 500 supplied from the first wiper roller portion 401 is the outer periphery of the first, second cleaning device unit 200, 300 It is rotated along the circumference and wound so as to remove the residue 6a of the solder 6 removed from the hole 8 of the mask 1 and the residue 6a of the solder 6 remaining. The first wiper roller 401 is provided at a position adjacent to each other.

Referring to Figures 3 to 8 attached to the operation of the cleaning device of the screen printer according to an embodiment of the present invention having the configuration as described above in detail as follows.

As shown in FIG. 3, the cleaning device 100 of the screen printer includes a first and second cleaning device parts 200 and 300 and a wiper device part 400.

As shown in FIGS. 4 and 6, the first and second cleaning device parts 200 (above and below the mask 1) to remove the residue 6a of the cream solder 6 provided in the mask 1 ( 300).

In this state, as shown in Figure 4, when removing the solder (6) residue (6a) of the mask (1) through the supply pipe 202 installed on the upper surface of the first cleaning device 200 1 The air pressure A1 and the cleaning liquid (not shown) are supplied into the supply housing 201 of the cleaning device unit 200.

In this case, the supply pipe 202 is connected to an external device (not shown) to supply the air pressure A1 and the cleaning liquid (not shown) provided from the external device through the supply pipe 202 to the supply housing ( It is supplied into the accommodation space 201a of 201.

The at least one discharge pipe 203 is provided in the supply housing 201, and the discharge pipe 203 is connected to the supply pipe 202 to supply air pressure supplied through the supply pipe 202. A1) and the washing liquid are evenly distributed on the bottom surface of the supply pipe 202.

In this case, as illustrated in FIG. 5, the discharge pipe 203 penetrates through at least one pipe hole 204 in which the supply housing 201 is formed at the bottom surface thereof, so that the inlet of the discharge pipe 203 is the mask 1. The air pressure A1 and the cleaning liquid (not shown) discharged from the discharge pipe 203 are discharged to the top surface of the mask 1 in correspondence with the top surface of the mask 1. The discharge pipe 203 is disposed at regular intervals along the pipe hole 204 formed in the longitudinal direction of the supply housing 201.

At this time, as shown in FIG. 8, the solder 6 residue 6a attached to the hole 8 of the mask 1 by the air pressure A1 discharged from the discharge pipe 203 and a cleaning liquid (not shown). ).

At this time, as shown in Figure 3, the wiper device 400 is rotatably mounted around the outer periphery of the first cleaning device 200, the wiper device 400 is a wiper 500 to the first The outer periphery of the cleaning device unit 200 is wrapped.

In this state, when the second wiper roller portion 402 of the wiper device portion 400 winds up the wiper 500, the first wiper roller portion 401 is wound up. The wiper 500 rotates along an outer circumference of the first cleaning device 200.

At this time, the wiper 500 removes the residue 6a of the solder 6 attached to the hole 8 of the mask 1.

Here, the air pressure A1 discharged from the first cleaning device unit 200, the cleaning liquid, and the residue 6a of the solder 6 are discharged to the lower portion of the mask 1.

6 and 7, the air pressure A1, the cleaning liquid (not shown), and the residues of the solder 6 are provided to the second cleaning device unit 300 provided below the mask 1. 6a) falls and the air pressure A1, the cleaning liquid (not shown), and the residue of the solder 6 through the suction pipe 303 penetrated through the pipe hole 304 of the second cleaning device unit 300. 6a is inhaled.

The suction pipe 303 is connected to the pressure pipe 302, and the pressure pipe 302 receives the suction pressure A2 through an external device (not shown) and supplies it to the suction pipe 303. .

The suction pipe 303 is provided in the suction housing 301 and evenly distributes the suction pressure A2 on the upper surface of the suction housing 301.

At this time, as shown in Figure 3, the wiper 500 of the wiper device 400 is wound around the outer periphery of the second cleaning device 300, the second wiper roller of the wiper device 400 ( When the 402 is wound, the wiper 500 of the first wiper roller 401 is wound and unwound, and the wiper 500 is rotated along the outer circumference of the second cleaning device 300. The second wiper roller portion 402 is wound up.

At this time, as shown in FIG. 8, the residue 6a of the solder 6 attached to the hole 8 of the mask 1 is separated and removed, and the solder removed from the hole 8 of the mask 1 is removed. Residue 6a in (6) is also removed.

As described above, by configuring the first and second cleaning device portions for removing solder residues on the upper and lower portions of the mask, it is possible to further improve the cleaning function of the mask, and to wash even small and dense products regardless of the size of the substrate. It can be effective.

The cleaning apparatus of the screen printer of the present invention described above is not limited to the above-described embodiments and drawings, and various substitutions, modifications, and changes can be made without departing from the technical spirit of the present invention. It will be apparent to those of ordinary skill in the art.

As described above, according to the cleaning apparatus of the screen printer according to the present invention,

By constructing the first and second cleaning device parts for cleaning the solder residue on the upper and lower parts of the mask, the cleaning function of the mask can be improved, and the mask can be cleaned even in small and high density products regardless of the size of the substrate. After washing, the remaining solder residue is removed by the wiper device provided on the upper and lower portions of the mask, thereby further improving the cleaning function of the mask.

Claims (7)

In the cleaning apparatus of the screen printer for cleaning the residue of the cream solder provided in the mask, A first cleaning device unit disposed above the mask to discharge air pressure and a cleaning liquid supplied from an external device to an upper surface of the mask to remove the residue of the solder attached to the hole of the mask; A second cleaning device unit provided below the mask to suck air debris from the hole and the air pressure of the first cleaning device unit and the cleaning liquid through the holes of the mask; And And a wiper device portion rotatably mounted on an outer circumference of the first and second cleaning device portions to remove solder residues and remaining residues removed from the holes of the mask. According to claim 1, wherein the first cleaning device unit, The supply housing and the receiving space is formed, A supply pipe mounted to an upper surface of the supply housing to supply the air pressure and the cleaning liquid supplied from an external device into the supply housing; At least one discharge pipe provided in the supply housing and connected to the supply pipe to discharge the air pressure and the washing liquid evenly to the bottom surface of the housing; And at least one pipe hole formed on a lower surface of the supply housing and penetratingly coupled to the discharge pipe. The washing apparatus of claim 2, wherein the pipe hole is provided to be elongated in the longitudinal direction of the supply housing, and the discharge pipe is fitted into the hole at a predetermined interval. According to claim 1, wherein the second cleaning device unit, the suction housing is formed with a receiving space, A pressure pipe mounted on a lower surface of the suction housing to absorb the air pressure and the cleaning liquid passing through the mask and to provide suction pressure to discharge the solder dregs separated from the hole of the mask; At least one suction pipe provided in the suction housing and connected to the suction pipe and distributing the suction pressure evenly on the upper surface of the housing; And at least one pipe hole formed on an upper surface of the suction housing and penetratingly coupled to the suction pipe. The cleaning apparatus of claim 4, wherein the pipe holes are formed at regular intervals along the longitudinal direction of the suction housing, and the suction pipes are fitted into the holes. The method of claim 1, wherein the wiper device unit, the first wiper roller unit is provided in the adjacent position of the first and second cleaning device for supplying the wiper to the appearance of the first and second cleaning device, The wiper, which is provided at a position adjacent to the first wiper roller part and supplied from the first wiper roller part, rotates along the outer periphery of the first and second cleaning devices, and remains with the residue removed from the hole of the mask. Cleaning device for a screen printer, characterized in that consisting of a second wiper roller portion wound to remove the debris. In the cleaning apparatus of the screen printer for cleaning the residue of the cream solder provided in the mask, The air pressure, which is provided on the upper part and the upper part of the mask, and the suction pressure and the cleaning liquid are sprayed on the upper and lower surfaces of the mask to remove the residue of the solder attached to the hole of the mask, and the air Cleaning device portions for passing pressure and the cleaning liquid through the holes of the mask and sucking the separated solder; And And a wiper device part rotatably mounted to the outer circumference of the cleaning device parts to remove the solder dregs removed from the hole of the mask and the remaining dregs.

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