JP2003077987A - Substrate holding stage cleaning device and its cleaning method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate holding stage cleaning device and its cleaning method for preventing damage of a substrate by removing dust particles on a stage holding the substrate. SOLUTION: A vacuum nozzle 13 connected to a vacuum source 40 and an arm 12 provided with a brush 14 move on the substrate holding stage 2, and the brush 14 rubs to remove the dust particles on the stage 2. At the same time, the dust particles on the stage 2 are removed by sucking and discharging the removed dust particles through the vacuum nozzle 13 connected to the vacuum source.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate holding stage cleaning device and a substrate holding stage cleaning method, and in particular, when a semiconductor substrate for a semiconductor device is transported or processed in a semiconductor manufacturing factory, foreign matter is not left on the substrate holding stage. The present invention relates to a substrate holding stage cleaning device and a substrate holding stage cleaning method that prevent damage to a substrate due to the presence of the substrate holding stage.

[0002]

2. Description of the Related Art A problem that occurs when a substrate is held on a stage in a conventional substrate transfer apparatus will be described with reference to FIG. FIG. 9 is a diagram showing a conventional method for cleaning a substrate holding stage, (1) is a schematic cross-sectional view showing a state in which foreign matter is sandwiched between the substrate holding stage and the substrate, and (2).
FIG. 4 is a schematic perspective view of removing foreign matter with a waste cloth. Regarding each symbol, 2 is a substrate holding stage, 4 is a substrate,
6 is a foreign substance, 90 is a conventional substrate holding device, and 92 is a measuring terminal.

As shown in (1) of FIG. 9, the back surface of the substrate 4 is attracted onto the stage 2 by negative pressure, so that a load is applied in the direction of arrow Q. Alternatively, when a load is applied from above the substrate 2 by a measurement terminal 92 such as a probe card, a load is similarly applied in the direction of arrow Q. When the foreign matter 6 does not exist, the load applied to the substrate is substantially evenly distributed over the entire surface of the substrate 4, so that there is no fear of damage or the like. However, when the foreign matter 6 exists, the load on the substrate 4 where the foreign matter 6 exists Since the load is concentrated, the substrate 4 may be warped or damaged by pressure. The foreign matter 6 is solder, substrate dust, dust, or general dust, and its diameter is often about 0.001 to 0.1 mm. The breakage of the substrate 4 is a crack, a flaw, a break, or the like.

In order to prevent such damage to the substrate,
Conventionally, the stage was manually cleaned by human hands. As shown in (2) of FIG. 9, this cleaning was a complicated and time-consuming operation that was manually performed while visually confirming with a waste cloth 94 and ethanol. For example, 1 by skilled personnel
It took about 20 minutes to complete the work, and the substrate processing had to be stopped during that time. Therefore, the presence of the foreign matter 6 on the stage 2 is one of the factors that reduce the throughput of the substrate manufacturing apparatus.

Further, since the cleaning work of the stage is a manual work, it is necessary to open the inside of the equipment, which can be done only by the person in charge of the equipment, and it is dangerous for an unfamiliar operator. There was a problem. Further, when cleaning is performed by the above method, secondary dust may be generated, and there is a risk that dust may be scattered to other places of the apparatus.

In order to solve such a problem, for example, in Japanese Unexamined Patent Publication No. 8-330217, a grindstone is rotatably driven on a holder of a substrate to polish the holder surface, and after the polishing is completed, the grindstone is retracted by a moving means. There is disclosed a cleaning device that removes generated dust by sucking air in the vicinity of the holder surface by the suction means. However, when the rotary grindstone is used, the stage may be damaged or the plating may be peeled off by polishing with the grindstone. Furthermore, since the electrical characteristics of the stage surface are changed by polishing with a grindstone, a measurement defect may occur. Moreover, when the scraps scraped to rotate the grindstone are scattered and cannot be sucked completely, the scraps scraped may adversely affect the product.

[0007]

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a semiconductor manufacturing facility in which foreign matter is present on a stage on which a substrate is held.
An object of the present invention is to provide a substrate holding stage cleaning device and a cleaning method thereof that remove the foreign matter and prevent the substrate from being damaged on the stage.

[0008]

The above object can be achieved by a substrate transfer apparatus according to the present invention described below. That is, in the substrate holding stage cleaning device according to claim 1, an arm provided with a vacuum nozzle connected to a vacuum source and a brush is movably provided, and the arm is moved so that the brush holds the holding surface of the substrate holding stage. It is characterized in that the operation of rubbing the foreign matter to remove the foreign matter and the operation of sucking the removed foreign matter with the vacuum nozzle are performed in parallel.

With this structure, the arm moves on the substrate holding stage, the brush removes the foreign matter on the stage by rubbing, and the removed foreign matter is sucked by the vacuum nozzle connected to the vacuum source. The foreign matter on the stage can be effectively removed because it is sent out of the stage.

According to a third aspect of the present invention, in the substrate holding stage cleaning device, an arm having a compressed gas nozzle connected to a compressed gas source and a brush is movably provided, and the arm is moved so that the brush holds the substrate. The operation of rubbing the holding surface of the stage to remove the foreign matter and the operation of scattering and / or guiding the removed foreign matter with the compressed gas from the compressed gas nozzle are performed in parallel.

With such a structure, the arm moves on the substrate holding stage so that the brush removes the foreign matter on the stage while rubbing the foreign matter on the stage.
It is scattered and / or guided by the compressed gas ejected through the compressed gas nozzle connected to the compressed gas source, and is effectively removed from the stage.

Further, in the substrate holding stage cleaning device according to a fifth aspect, an arm provided with a compressed gas nozzle connected to a compressed gas source, a vacuum nozzle connected to a vacuum source, and a brush is movably provided. An operation in which the arm moves and the brush rubs a holding surface of the substrate holding stage to remove foreign matter; and an operation in which the removed foreign matter is scattered and / or guided by the compressed gas from the compressed gas nozzle, It is characterized in that the operation of sucking the scattered and / or guided foreign matter by the vacuum nozzle is performed in parallel.

With such a structure, the arm moves on the substrate holding stage so that the brush removes the foreign matter on the stage while rubbing it and ejects the foreign matter through the compressed gas nozzle connected to the compressed gas source. While the compressed gas is scattered and / or guided, at the same time, the scattered or induced foreign matter is sent to the outside of the stage by negative pressure through a vacuum nozzle connected to a vacuum source, so that the foreign matter on the stage Can be effectively removed.

Further, in the method of cleaning a substrate holding stage according to claim 7, a vacuum nozzle connected to a vacuum source,
An arm provided with a brush is moved on the substrate holding stage, the brush rubs the holding surface of the substrate holding stage to remove foreign matter, and an operation of sucking the removed foreign matter with the vacuum nozzle. The feature is that they are performed in parallel. With such a method, the operation of the invention according to claim 1 is executed.

Further, in the substrate holding stage cleaning method according to the present invention, an arm having a compressed gas nozzle connected to a compressed gas source and a brush is moved on the substrate holding stage, and the brush is moved to the substrate holding stage. The operation of rubbing the holding surface of to remove foreign matter and the operation of scattering and / or guiding the removed foreign matter by the compressed gas nozzle are performed in parallel. With such a method, the operation of the invention according to claim 3 is executed.

Further, in the substrate holding stage cleaning method according to the ninth aspect, an arm having a compressed gas nozzle connected to a compressed gas source, a vacuum nozzle connected to a vacuum source, and a brush is provided on the substrate holding stage. The operation of moving the brush to remove foreign matter by rubbing the holding surface of the substrate holding stage, the operation of scattering and / or guiding the removed foreign matter by the compressed gas nozzle, and the scattered and / or guided foreign matter Is performed in parallel with the operation of sucking with the vacuum nozzle. With such a method, the operation according to the fifth aspect of the invention is executed.

[0017]

BEST MODE FOR CARRYING OUT THE INVENTION First Embodiment (Claim 1) An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic side view of a substrate holding stage cleaning device according to the present invention. 2A and 2B are schematic views of the substrate holding stage cleaning device according to the present invention, in which (1) is a schematic top view and (2) is a schematic front view. Figure 3
FIG. 4 is a schematic view showing a vacuum solenoid portion of the substrate holding stage cleaning device according to the present invention.

The reference numerals will be described. 1 is a substrate holding stage cleaning device, 2 is a substrate holding stage, 10 is a cleaning arm portion, 12 is an arm, and 13 is a vacuum nozzle 13.
Is a brush, 15 is a vacuum hose, 16 is a dust removing filter, 17 is a vacuum solenoid, 20 is an arm rotating means, 21 is a motor shaft, 22 and 23 are gears, 2
4 is a belt, 25 is an arm rotating shaft, 26 is a motor, 27
Is a detection object, 28 is a base point sensor, 29 is an inversion sensor, and 40 is a vacuum source. As shown in FIG. 1, this embodiment includes a cleaning arm unit 10 that sucks dust by negative pressure and sends it to the outside, and an arm rotating unit 20 that rotates the cleaning arm unit 10.

The cleaning arm unit 10 includes an arm 12
And the vacuum nozzle 13 arranged on the arm 12.
A brush 14, a vacuum hose 15, a dust removing filter 16, and a vacuum solenoid 17. The arm rotating means 20 includes a motor 26, a motor shaft 21 that transmits a driving force of the motor, and a motor-side gear 22.
, A belt 24, an arm-side gear 23, and an arm rotating shaft 25. In FIG. 1, the brush 14 and the surface of the stage 2 are illustrated as being separated from each other, but in reality, the brush 14 may be in a position to rub the stage 2, or may be rubbed only when moving on the stage 2. May be done.

With this configuration, the brush 14 of the cleaning arm portion 10 moved by the arm rotating means 20 moves the surface of the substrate holding stage 2 onto the arm rotating shaft 2.
While rubbing on the stage 2 with the rotation of 5, foreign substances existing there are removed. The removed foreign matter passes through the vacuum nozzle 13 by negative pressure and is sent out through the vacuum pipe 15. Thus, the foreign matter on the stage 2 is removed from the stage 2 to the outside. The operation will be described in detail with reference to FIGS.

FIG. 4 is a schematic top view showing the operation of the substrate holding stage cleaning device according to the present invention. FIG. 5 shows the arm rotating means 2 of the substrate holding stage cleaning device according to the present invention.
0 is a schematic view showing 0, (1) is a schematic top view, (2) is a schematic side view, and (3) is a schematic bottom view. Figure 6
6 is a flowchart of an operation sequence of the substrate holding stage cleaning device according to the present invention. Explaining the symbols, 3
Is a table, 33 is a push button switch, and 34 is an operation panel.

As shown in FIG. 4, the stage 2 is movably mounted on the table 3. First, arrow A in FIG.
As shown in, the stage 2 is manually moved to the cleaning arm unit 10. This is the operation flow (a) point in the operation flowchart of FIG. This movement may also be movement using automatic means such as a motor (not shown).

Next, the operator pushes the push button switch 33 provided on the operation panel 34 for starting cleaning (point of operation flow b). As a result, the motor 26 rotates in the normal direction (operation flow point c), and the vacuum solenoid 17 turns on.
(Operation flow point d), the vacuum source 40 is opened.

The forward rotation of the motor 26 causes the arm rotation shaft 25 to rotate counterclockwise as indicated by arrow B. As a result, the cleaning arm 12 starts to rotate horizontally in the B direction. At the same time, the brush 14 begins to suck dust through the vacuum nozzle 13 while sliding on the stage 2.

As shown in FIGS. 1, 4 and 5,
A detection object 27 is attached to the lower part of the arm rotation shaft 25. It is determined whether or not the detection object 27 has moved to the position of the reversal sensor 29, and if it has moved to the position of the reversal sensor 29, it is determined whether or not the reversal sensor 29 is ON (operation flow point e), and it is turned ON. In this case, the vacuum solenoid 17 is turned off (operation flow point f). In this case, and when all sensors are OFF (operation flow g
Point), the motor 26 rotates in reverse (point of operation flow h), and the vacuum solenoid 17 turns on (operation flow i).
point). Then, suction of dust is started again.

The arm 12 moves toward the base point 28, which is the original position, in the clockwise direction as indicated by the arrow C while sucking the foreign matter on the stage 2. At this time, foreign matters and the like removed from the stage 2 by the brush 14 are sucked into the vacuum hose 15 by the negative pressure from the vacuum source 40 through the vacuum nozzle 13, sent out, and filtered by the dust removal filter 16. .

The negative pressure from the vacuum source 40 is controlled by the vacuum solenoid 17. As the vacuum source, a vacuum line normally used in a semiconductor device manufacturing factory can be used, or a separate vacuum source may be provided. The diameter of the vacuum nozzle 13 may be changed along the longitudinal direction of the arm in order to make the negative pressure constant or to adjust it.

When the detected object 27 returns to the base point sensor 28 (operation flow j point), the base point sensor detects it, the motor 26 and the vacuum solenoid 17 are turned off (operation flow point k), the vacuum is turned off, and the motor is turned off. 26
Will stop.

In this way, the arm 12 performs a cleaning process while moving back and forth once. Further, the arm 12 can be set so as to complete the cleaning by repeatedly reciprocating a plurality of times in order to clean the stage 2.

The arm 12 may be set so as to be always located at the base point after the cleaning process is completed. A sequence circuit diagram of the above operation is shown in FIG. 7, and an operation sequence time chart is shown in FIG.

Here, the brush 14 is preferably a conductive material, for example, a metal material. This is to prevent foreign matter from adhering to the brush 14 due to static electricity. The brush 14 may be a dielectric material made of synthetic resin, for example. This is because when it is better to attach the foreign matter to the brush 14, it is attached to the brush 14 by static electricity.

When the vacuum source 40 is provided with means having a filter function corresponding to the filter 16,
Alternatively, if the filter is unnecessary, it can be omitted.
Further, the diameter of the nozzle may be changed along the longitudinal direction of the arm in order to make the ejection pressure constant or to be adjusted.

Second Embodiment (Claim 3) In the second embodiment, an arm having a compressed gas nozzle connected to a compressed gas source and a brush is movably provided.
The operation of moving the arm to move the brush by rubbing the holding surface of the substrate holding stage to remove foreign matter and the operation of scattering and / or guiding the removed foreign matter with the compressed gas from the compressed gas nozzle are performed in parallel. The substrate holding stage cleaning device is characterized by being performed as follows.

In this embodiment, a compressed gas source is used instead of the vacuum source 40 in the first embodiment, and a compressed gas nozzle is used instead of the vacuum nozzle 13. Therefore, it is preferable that a compressed gas solenoid is used instead of the vacuum solenoid 17 and there is a portion related to the filter 16, but it is also possible to omit it.

With such a structure, the brush 14 rubs the stage 2 to remove the foreign matter, and the removed foreign matter is scattered and / or guided by the compressed gas to remove the foreign matter from the stage 2.

Third Embodiment (Claim 5) The third embodiment has an arm provided with a compressed gas nozzle connected to a compressed gas source, a vacuum nozzle connected to a vacuum source, and a brush. An operation of removing the foreign matter by moving the arm by moving the arm and rubbing the holding surface of the substrate holding stage, and scattering and / or guiding the removed foreign matter with the compressed gas from the compressed gas nozzle. The apparatus for cleaning a substrate holding stage is characterized in that the above-mentioned operation and the operation of sucking the scattered and / or guided foreign matter by the vacuum nozzle are performed in parallel.

The present embodiment comprises the vacuum source 40, the compressed gas source, the vacuum nozzle 13 and the compressed gas nozzle in the above-mentioned first and second embodiments.
In addition, a vacuum solenoid 17, a compressed gas solenoid, and a filter 1 attached to the vacuum solenoid
6 is provided, and a filter attached to the compressed gas solenoid may be further provided. However, the filter may be omitted if it can be omitted.

With such a structure, the brush 14 rubs the stage 2 to remove the foreign matter, and at the same time, the removed foreign matter is scattered and scattered by the compressed gas ejected through the compressed gas nozzle connected to the compressed gas source. The foreign matter on the stage 2 is effective by simultaneously and / or guiding the foreign matter scattered and / or guided to the outside of the apparatus by negative pressure via the vacuum nozzle 13 connected to the vacuum source 40. Can be removed.

Brush 14 of the substrate holding stage cleaning device
May be a conductive material or a dielectric material. This is to prevent foreign matter from adhering to the brush or to adhere to the brush if necessary.

Fourth Embodiment (Claim 7) In the fourth embodiment, an arm equipped with a vacuum nozzle connected to a vacuum source and a brush is moved on a substrate holding stage, and the brush is moved. The substrate holding stage cleaning method is characterized in that an operation of removing foreign matter by rubbing a holding surface of the substrate holding stage and an operation of sucking the removed foreign matter with the vacuum nozzle are performed in parallel. That is, in the configuration of the first embodiment, the operation of the brush rubbing the holding surface of the substrate holding stage to remove the foreign matter and the operation of sucking the removed foreign matter with the vacuum nozzle are performed in parallel. This is a method of cleaning a substrate holding stage, which is characterized in that it is performed. With such a method, the operation of the invention according to claim 1 is executed.

Fifth Embodiment (Claim 8) In the fifth embodiment, an arm having a compressed gas nozzle connected to a compressed gas source and a brush is moved on a substrate holding stage, and the brush is moved. Cleaning the substrate holding stage, wherein the operation of rubbing the holding surface of the substrate holding stage to remove the foreign matter and the operation of scattering and / or guiding the removed foreign matter by the compressed gas nozzle are performed in parallel. Method.
That is, in the configuration of the second embodiment, the operation of the brush rubbing the holding surface of the substrate holding stage to remove foreign matter and the removed foreign matter scattered and / or scattered by the compressed gas nozzle.
Alternatively, the substrate holding stage cleaning method is characterized in that the guiding operation is performed in parallel. With such a method, the operation of the invention according to claim 3 is executed.

Sixth Embodiment (Claim 9) The sixth embodiment comprises an arm provided with a compressed gas nozzle connected to a compressed gas source, a vacuum nozzle connected to a vacuum source, and a brush. The operation of moving the brush on the substrate holding stage so that the brush rubs the holding surface of the substrate holding stage to remove foreign matter, the operation of scattering and / or guiding the removed foreign matter by the compressed gas nozzle, and the scattering and / or Alternatively, the substrate holding stage cleaning method is characterized in that an operation of sucking the guided foreign matter with the vacuum nozzle is performed in parallel. That is, in the configuration of the third embodiment, an operation of the brush rubbing the holding surface of the substrate holding stage to remove foreign matter, and an operation of scattering and / or guiding the removed foreign matter by the compressed gas nozzle, The substrate holding stage cleaning method is characterized in that the operation of sucking the scattered and / or guided foreign matter by the vacuum nozzle is performed in parallel. With such a method, the operation according to the fifth aspect of the invention is executed.

[0043]

As described in detail above, the substrate holding stage cleaning device according to the present invention can achieve the following effects. That is, according to the substrate holding stage cleaning device of the first aspect and the substrate holding stage cleaning method of the seventh aspect, the arm moves over the substrate holding stage to cause the brush to rub and remove the foreign matter on the stage, and at the same time. The vacuum nozzle connected to the vacuum source sucks the foreign matter and sends it to the outside of the apparatus, so that the foreign matter on the stage can be effectively removed.

According to the substrate holding stage cleaning device of the third aspect and the substrate holding stage cleaning method of the eighth aspect, the arm moves over the substrate holding stage, and the brush rubs and removes foreign matter on the stage. Then
At the same time, the foreign matter on the stage can be effectively removed by scattering and inducing the foreign matter by the compressed gas jetted through the compressed gas nozzle connected to the compressed gas source.

According to the substrate holding stage cleaning device of the fifth aspect and the substrate holding stage cleaning method of the ninth aspect, the arm moves on the substrate holding stage, and the brush rubs and removes foreign matter on the stage. Then
At the same time, the foreign matter is sprayed and guided by the compressed gas jetted through the compressed gas nozzle connected to the compressed gas source, and in parallel, the scattered foreign matter or the foreign matter is guided through the vacuum nozzle connected to the vacuum source. The foreign matter on the stage can be effectively removed by sending it out of the apparatus by negative pressure.

[Brief description of drawings]

FIG. 1 is a schematic side view of a substrate holding stage cleaning device according to the present invention.

2A and 2B are schematic views of a substrate holding stage cleaning device according to the present invention, where FIG. 2A is a schematic top view and FIG. 2B is a schematic front view.

FIG. 3 is a schematic view showing a vacuum solenoid portion of a substrate holding stage cleaning device according to the present invention.

FIG. 4 is a schematic top view showing the operation of the substrate holding stage cleaning device according to the present invention.

FIG. 5 is a schematic view showing an arm rotating means 20 of the substrate holding stage cleaning device according to the present invention, (1) is a schematic top view, (2) is a schematic side view, and (3) is a schematic bottom view. Is.

FIG. 6 is an operation sequence flowchart of the substrate holding stage cleaning device according to the present invention.

FIG. 7 is an operation sequence circuit diagram of the substrate holding stage cleaning device according to the present invention.

FIG. 8 is an operation sequence time chart of the substrate holding stage cleaning device according to the present invention.

FIG. 9 is a diagram showing a conventional method for cleaning a substrate holding stage, (1) is a schematic cross-sectional view showing a state in which foreign matter is sandwiched between the substrate holding stage and the substrate, and (2) is a waste cloth. It is a typical perspective view which removes a foreign material.

[Explanation of symbols]

1 ... Substrate holding stage cleaning device, 2 ... Stage, 1
0 ... Cleaning arm part, 12 ... Arm, 13 ...
... vacuum nozzle 13 ... brush, 15 ... vacuum hose, 16 ... filter, 17 ... vacuum solenoid, 20 ... arm rotating means, 21 ... motor shaft, 22 and 23 ... gear, 24 ... belt, 25 ...
... Arm rotation axis, 26 ... Motor, 40 ... Vacuum source

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H01L 21/304 644 H01L 21/304 644Z 645 645Z

Claims (9)

[Claims] 1. An operation in which an arm provided with a vacuum nozzle connected to a vacuum source and a brush is movably provided, and the brush is rubbed against a holding surface of a substrate holding stage to remove foreign matter by moving the arm. A substrate holding stage cleaning device, characterized in that the operation of sucking the removed foreign matter with the vacuum nozzle is performed in parallel. 2. The arm includes an arm body (reference numeral 12 in the illustrated example), and is rotatably provided along an upper surface of a table on which the plate-shaped substrate holding stage is arranged. The vacuum nozzles are provided over substantially the entire length of the arm body, and the vacuum nozzles are arranged on both sides in the width direction of the arm body at appropriate intervals along the length direction of the arm body. The substrate stage cleaning device according to claim 1. 3. An arm provided with a compressed gas nozzle connected to a compressed gas source and a brush is movably provided, and the arm is moved so that the brush rubs the holding surface of the substrate holding stage to remove foreign matter. An apparatus for cleaning a substrate holding stage, wherein an operation and an operation of scattering and / or guiding the removed foreign matter with the compressed gas from the compressed gas nozzle are performed in parallel. 4. The arm is provided with an arm body (reference numeral 12 in the illustrated example), and is rotatably provided along an upper surface of a table on which the plate-shaped substrate holding stage is arranged. The compressed gas nozzles are provided over substantially the entire longitudinal direction of the arm body, and the compressed gas nozzles are arranged on both sides in the width direction of the arm body at appropriate intervals along the longitudinal direction of the arm body. The substrate stage cleaning device according to claim 3. 5. An arm provided with a compressed gas nozzle connected to a compressed gas source, a vacuum nozzle connected to a vacuum source, and a brush is movably provided, and the arm is moved so that the brush moves the substrate holding stage. An operation of rubbing the holding surface of the foreign matter to remove foreign matter, an operation of scattering and / or guiding the removed foreign matter with the compressed gas from the compressed gas nozzle, and a foreign matter thus scattered and / or guided to the vacuum nozzle. An apparatus for cleaning a substrate holding stage, which is characterized by performing the suction operation in parallel with the above. 6. The arm includes an arm body (reference numeral 12 in the illustrated example), is rotatably provided along an upper surface of a table on which the plate-shaped substrate holding stage is arranged, and the brush is The compressed gas nozzles are provided over substantially the entire longitudinal direction of the arm body, and the compressed gas nozzles are arranged on one side or both sides in the width direction of the arm body at appropriate intervals along the longitudinal direction of the arm body. 6. The substrate stage cleaning apparatus according to claim 5, wherein is disposed on one side or both sides in the width direction of the arm body at appropriate intervals along the longitudinal direction of the arm body. 7. An operation of moving an arm equipped with a vacuum nozzle connected to a vacuum source and a brush on a substrate holding stage, the brush rubbing a holding surface of the substrate holding stage to remove foreign matter, A method for cleaning a substrate holding stage, wherein an operation of sucking the removed foreign matter with the vacuum nozzle is performed in parallel. 8. An operation of moving an arm having a compressed gas nozzle connected to a compressed gas source and a brush on a substrate holding stage, the brush rubbing a holding surface of the substrate holding stage to remove foreign matter. A substrate holding stage cleaning method, characterized in that the operation of scattering and / or guiding the removed foreign matter by the compressed gas nozzle is performed in parallel. 9. An arm provided with a compressed gas nozzle connected to a compressed gas source, a vacuum nozzle connected to a vacuum source, and a brush is moved on a substrate holding stage, and the brush holds the holding surface of the substrate holding stage. To remove foreign matter by rubbing the same, scattering and / or guiding the removed foreign matter with the compressed gas nozzle, and sucking the scattered and / or induced foreign matter with the vacuum nozzle in parallel. A method for cleaning a substrate holding stage, which is characterized in that