JPH0936076A - Washing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a washing device for properly and positively washing the surface of a wafer and at the same time achieving a high washing efficiency. SOLUTION: A washing device for scrubbing and washing the surface of an object 2 to be washed has a first brush 10 which is arranged so that it rotates while being in contact with the surface of the object to be washed and a second brush 13 which is arranged so that it rotates in contact with the specific site of the first brush 10. The contact part between the first brush 10 and the second brush 13 is set away from the object 2 to be washed. It has a washing liquid nozzle 14 which is arranged at the upper portion of the contact part between the first brush 10 and the second brush 13 and suction nozzles 16 and 17 which are arranged near the contact part. By rotating the second brush 13, a foreign object on the first brush 10 can be eliminated.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor wafer processing apparatus, and more particularly to a brush scrubber, for example, an apparatus for scrubbing and cleaning the surface of a semiconductor wafer used for cleaning processing in a semiconductor device manufacturing process. It is a thing.

[0002]

2. Description of the Related Art A semiconductor device manufacturing process includes a plurality of processes in which various substances are applied to the surface of a semiconductor wafer (hereinafter referred to as a wafer), adhered thereto, or heat-treated. In these steps, various kinds of contamination may occur or remain on the wafer surface. Moreover, when a wafer is processed by various devices, a large amount of foreign matter adheres to the back surface of the wafer. Therefore, each step is provided with a cleaning step for removing various contaminants and foreign substances by making full use of physical and chemical methods. As one of the basic cleaning methods in this cleaning step, there is a wafer processing apparatus that performs brush cleaning with pure water.

Conventionally, there has been known a semiconductor wafer processing apparatus as disclosed in, for example, Japanese Utility Model Laid-Open No. 64-18731. Here, the wafer processing apparatus will be described with reference to FIGS. As shown in the figure, in the conventional semiconductor wafer processing apparatus, the wafer 2 is fixed to the rotary table 1 by vacuum suction or a pin chuck and rotated, and the cylindrical brush 3 is curved along the lower axis thereof. Is placed in contact with the surface of the wafer 2. Then, in this state, pure water 5 having a high degree of cleanliness is appropriately jetted from the water injection nozzle 4 onto the wafer 2, and the adhered material removed by this is drained by centrifugal force to clean the entire surface of the wafer 2. is there.

After cleaning the wafer 2, the cylindrical brush 3 has a shaft 6
Is rotated around to the cleaning position 7. Pure water is supplied onto the brush 3 by the water injection nozzle 8 while rotating the brush 3 at this position, and a hook-shaped cleaning aid 9
By contacting the brush 3 and the brush 3, the deposits on the brush 3 are washed away.

[0005]

In the conventional semiconductor wafer processing apparatus, when the surface of the wafer 2 is scrubbed and cleaned by the brush 3, the adhered matter scraped off from the surface of the wafer 2 adheres to the brush 3. Therefore, after the wafer 2 is cleaned, the brush 3 is cleaned by the cleaning aid 9 and the water injection nozzle 8 at the cleaning position 7.
The deposits are removed. This is intended to improve the cleanliness of the brush 3 and prevent the next wafer 2 from being contaminated.

However, there is a risk that the adhered matter scraped off from the surface of the wafer 2 adheres to the brush 3 again, and adheres again to the wafer 2 being processed after one rotation of the brush 3. As described above, no consideration has been given to the fact that the conventional apparatus significantly impairs the cleaning efficiency.

Therefore, an object of the present invention is to provide a cleaning apparatus which properly and surely cleans a wafer surface and realizes high cleaning efficiency.

[0008]

A cleaning device of the present invention is a cleaning device for scrubbing the surface of an object to be cleaned, and is a first device arranged to rotate while contacting the surface of the object to be cleaned. And a second brush arranged so as to rotate while coming into contact with a predetermined portion of the first brush, and a contact portion of the first brush and the second brush is It is set at a position separated from the cleaning object.

Further, in the cleaning apparatus of the present invention, a cleaning liquid nozzle arranged above the contact portions of the first brush and the second brush, and a suction nozzle arranged in the vicinity of the contact portions. Is to have.

Further, in the cleaning apparatus of the present invention, the first brush is configured to be movable outward from the central portion of the object to be cleaned.

[0011]

According to the present invention, when the surface of the object to be cleaned is cleaned by the first brush, the foreign substances attached to the brush are simultaneously removed. That is, the second brush is brought into contact with a part of the first brush for cleaning the surface of the object to be cleaned,
By rotating the second brush, the foreign matter attached to the first brush can be removed. Thereby, even if the adhered matter scraped from the surface of the object to be cleaned adheres to the first brush, it can be prevented from adhering to the object to be cleaned again.

Further, the first brush and the second brush are brought into contact with each other at a position separated from the object to be cleaned, whereby the first brush
It is possible to prevent the foreign matter from reaching the cleaning target side when removing the foreign matter attached to the brush. As described above, the cleaning mechanism for preventing reattachment of foreign matter is provided, and the cleaning efficiency of the object to be cleaned can be improved.

Further, according to the present invention, the foreign matter is completely removed by providing the cleaning liquid nozzle and the suction nozzle for sucking the foreign matter from the brush in the vicinity of the contact portion of the first brush and the second brush. can do. Furthermore, when scrubbing the object to be cleaned with the first brush, the cleaning efficiency can be increased by moving the object to be cleaned outward from the central portion.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of a cleaning apparatus according to the present invention will be described below with reference to FIGS.

FIG. 1 is a front view of the cleaning apparatus of the present invention, and FIG. 2 is a side view of the cleaning apparatus of the present invention. 1 and 2, in the device of the present invention, a wafer 2 as an object to be cleaned is used.
Is provided with a rotary table 1 capable of holding the water, and a water injection nozzle 4 sprays pure water 5 having a high degree of cleanness onto a wafer 2 arranged on the rotary table 1. The rotating table 1
Is rotated by a drive motor (not shown).

The apparatus of the present invention comprises a first brush 10 arranged so as to be in direct contact with a part of the surface of the wafer 2. The first brush 10 is preferably a belt-shaped brush, and in this example, it is attached to two rotating bodies 11 and 12. The rotating bodies 11 and 12 may be synchronously rotated by a drive unit such as a drive motor (not shown), or one of them may be configured as a drive side and the other as a driven side.
The first brush 10 wrapped around the rotating bodies 11 and 12 rotates while coming into contact with the wafer 2 on the rotating body 11 side as in the illustrated example.

A second brush 13 for cleaning the first brush 10 is provided on the rotating body 12 side. This second
The brush 13 is configured as a rotary brush and rotates in the direction of the arrow shown. The second brush 13 is arranged so as to contact a part of the belt-shaped first brush 10,
The contact portions between the two are set at positions separated from the wafer 2 by a predetermined distance. A cleaning liquid nozzle 14 is disposed above the contact portion between the first brush 10 and the second brush 13, and is discharged below the second brush 13 so as to face the cleaning liquid nozzle 14 substantially. The liquid recovery table 15 is arranged. Further, suction nozzles 16 and 17 are arranged so as to vertically face each other at a close position so as to sandwich the contact portion between the first brush 10 and the second brush 13.

In the cleaning apparatus of the present invention, when the surface of the wafer 2 is scrubbed by the first brush 10, foreign matters adhering between the bristles of the first brush 10 are scraped out by the second brush 13. Be done. In this case, the scraped foreign matter is made to flow down to the drainage recovery table 15 by the cleaning liquid ejected from the cleaning liquid nozzle 14, and at the same time, sucked by the suction nozzles 16 and 17. Thereby, the first brush 10 can be always kept clean, and the cleaning efficiency of the wafer 2 can be significantly improved. The suction nozzles 16 and 17 not only suck the foreign matter but also prevent the cleaning liquid from scattering to the outside. Further, the cleaning liquid nozzle 14 and the suction nozzles 16 and 17 are separated from the wafer 2 as described above, and also in this respect, it is possible to prevent foreign matters and the like from reattaching to the wafer 2.

FIG. 3 is a front view of a modified example of the device of the present invention. In FIG. 3, the shaft portions of the two rotating bodies 11 and 12 are connected to an arm 18 that is connected to a rotary drive source.
Are connected via. By driving the arm 18, the lower part of the rotating body 11, which is in contact with the surface of the wafer 2 that is the object to be cleaned adsorbed on the rotating table 1, moves from the center of the wafer 2 to the outer peripheral portion (in the direction of the arrow in the figure). It is configured to be able to move continuously toward. When the arm 18 is driven, a link mechanism or the like as shown in the drawing may be additionally provided so that the arm 18 can be operated via the link mechanism. According to this example, when cleaning the wafer 2, by moving the rotating body 11 outward from the center of the wafer 2, the second brush 1
The removal ability of the wafer 2 with respect to the adhered matter by 3 is improved,
The wafer 2 can be cleaned more efficiently.

The scope of the present invention is not limited to the above embodiment, and the design can be changed within the scope of the present invention. For example, the number of suction nozzles 16 and 17 is not limited to two, but may be three or more, and the arrangement thereof is not limited. Further, in the above-mentioned embodiment, the case of cleaning the semiconductor wafer has been described, but the present invention can be effectively applied to the case of cleaning the surface of another object to be cleaned, and the same effect as that of the above-mentioned embodiment can be obtained. be able to.

[0021]

As described above, according to the present invention, a belt-shaped brush is put around a plurality of rotating bodies and rotated, and a part of the brush is brought into contact with the surface of the object to be cleaned. While cleaning the above, remove the deposits on the brush in other parts. By attaching a cleaning mechanism having a function of preventing the removed adhered matter from adhering to the cleaned object again, the adhered matter of the cleaned object can be efficiently removed, and the cleaning effect can be remarkably improved.

[Brief description of drawings]

FIG. 1 is a front view of an embodiment of a cleaning device of the present invention.

FIG. 2 is a side view of an embodiment of the cleaning apparatus of the present invention.

FIG. 3 is a front view showing a modified example of the cleaning device of the present invention.

FIG. 4 is a front view of a conventional semiconductor wafer processing apparatus.

FIG. 5 is a perspective view of a conventional semiconductor wafer processing apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 rotary table 2 wafer 4 water injection nozzle 5 pure water 10 first brush 11,12 rotating body 13 second brush 14 cleaning solution nozzle 15 drainage recovery table 16,17 suction nozzle

Claims (3)

[Claims] 1. A cleaning device for scrubbing the surface of an object to be cleaned, comprising: a first brush arranged to rotate while contacting the surface of the object to be cleaned; and a predetermined one of the first brushes. A second brush arranged to rotate while contacting the part, wherein the contact portions of the first brush and the second brush are set at positions separated from the object to be cleaned. Cleaning device characterized by. 2. The cleaning device according to claim 1, wherein the cleaning liquid nozzle is disposed above the contact portions of the first brush and the second brush, and the suction is disposed in the vicinity of the contact portions. A cleaning device comprising: a nozzle. 3. The cleaning apparatus according to claim 1, wherein the first brush is configured to be movable outward from a central portion of the object to be cleaned.