JP2009218249A - Wafer cleaning equipment and production process of semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide wafer cleaning equipment which can remove polymer or contamination surely with chemical or deionized water, and to provide a production process of a semiconductor device. <P>SOLUTION: Wafer cleaning equipment comprises a wafer holding mechanism 1 for holding a semiconductor wafer 3, a rotary mechanism for rotating the wafer holding mechanism 1, a chemical nozzle 5 or a deionized water nozzle 4 provided above the wafer holding mechanism 1 and delivering chemical or deionized water to the surface of the semiconductor wafer 3, and a chemical holding tool 6 arranged on the outside of the wafer holding mechanism 1 to cover the bevel portion of the semiconductor wafer 3 and holding the chemical or deionized water temporarily at the bevel portion. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a wafer cleaning apparatus and a semiconductor device manufacturing method, and more particularly to a wafer cleaning apparatus and a semiconductor device manufacturing method capable of reliably removing a polymer or a foreign substance with a chemical solution.

  A conventional single wafer cleaning apparatus supplies chemical liquid to the surface of a semiconductor wafer in a semiconductor manufacturing process, cleans the polymer adhering to the surface of the semiconductor wafer with the chemical liquid, and then rotates the semiconductor wafer to remove the chemical liquid. The semiconductor wafer is removed from the surface.

  However, in the above-described conventional wafer cleaning apparatus, the chemical liquid may flow to the outside of the semiconductor wafer before the chemical liquid is applied to the bevel portion (outer peripheral portion of the wafer) of the semiconductor wafer, and the chemical solution may accumulate on the bevel portion of the semiconductor wafer. Absent. For this reason, the polymer adhering to the bevel portion of the semiconductor wafer could not be reliably removed.

  In another conventional wafer cleaning apparatus, a polymer adhering to a bevel portion of a semiconductor wafer is processed by a brush scrub cleaning technique, and the polymer is removed by physical force (see, for example, Patent Document 1).

JP-A-6-45302 (paragraph 0011, FIG. 2)

  As described above, the conventional wafer cleaning apparatus has a problem that the polymer remains on the bevel portion of the semiconductor wafer because the polymer attached to the bevel portion of the semiconductor wafer cannot be reliably removed.

  Further, in the other conventional wafer cleaning apparatus, since the polymer attached to the bevel portion of the semiconductor wafer is removed by the brush with the brush, there is a problem that particles are generated even if the polymer is removed. Moreover, when removing a polymer, the removal efficiency can be improved by using a chemical solution such as a polymer stripping solution rather than a brush scrub.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a wafer cleaning apparatus and a semiconductor device manufacturing method capable of reliably removing a polymer or a foreign substance with a chemical solution or pure water. .

In order to solve the above problems, a wafer cleaning apparatus according to the present invention includes a wafer holding mechanism for holding a semiconductor wafer,
A rotating mechanism for rotating the wafer holding mechanism;
A chemical nozzle or pure water nozzle that is provided above the wafer holding mechanism and discharges the chemical liquid or pure water to the surface of the semiconductor wafer;
A holding jig that is disposed outside the wafer holding mechanism and covers the bevel portion of the semiconductor wafer, and temporarily holds the chemical or pure water on the bevel portion;
It is characterized by comprising.

  According to the wafer cleaning apparatus of the present invention, the bevel portion of the semiconductor wafer is covered with a holding jig, and the bevel portion is temporarily held by the chemical solution or pure water on the bevel portion of the semiconductor wafer that is difficult to clean. The polymer or foreign matter adhering to can be reliably removed with the chemical solution or pure water.

  Moreover, in the wafer cleaning apparatus according to the present invention, the holding jig has a holding part for temporarily holding a chemical solution or pure water, and the internal shape of the holding part has a U-shaped cross section. The holding portion may include an upper surface member, a lower surface member, and a connecting member that connects them.

In the wafer cleaning apparatus according to the present invention, the inner surface of the upper surface member and the inner surface of the lower surface member may be substantially parallel to each other.
In the wafer cleaning apparatus according to the present invention, the inner surface of the lower surface member may be inclined downward.
In the wafer cleaning apparatus according to the present invention, the inner surface of the upper surface member may be inclined upward or downward.

  Further, in the wafer cleaning apparatus according to the present invention, the inner surface of the upper surface member is a scatter that includes a convex portion for preventing the chemical solution or the pure water from being scattered from the inside of the holding portion to the surface of the semiconductor wafer. It is also possible that a prevention part is provided.

  In the wafer cleaning apparatus according to the present invention, the connecting member may be provided with an opening for discharging the chemical solution or the pure water out of the holding unit.

A method of manufacturing a semiconductor device according to the present invention includes a step of holding a semiconductor wafer by a wafer holding mechanism and rotating the semiconductor wafer together with the wafer holding mechanism;
Supplying a chemical or pure water to the surface of the semiconductor wafer;
A holding jig is disposed so as to cover the bevel portion of the semiconductor wafer, and the bevel portion of the semiconductor wafer is cleaned with the chemical solution or the pure water while temporarily holding the chemical solution or the pure water on the holding jig. And the process of
It is characterized by comprising.

  According to the method for manufacturing a semiconductor device of the present invention, the bevel portion of the semiconductor wafer is covered with the holding jig, so that the polymer or foreign matter adhering to the bevel portion of the semiconductor wafer that is difficult to clean can be surely secured with chemicals or pure water. Can be removed.

A method of manufacturing a semiconductor device according to the present invention includes a step of holding a semiconductor wafer by a wafer holding mechanism and rotating the semiconductor wafer together with the wafer holding mechanism;
Supplying a chemical to the surface of the semiconductor wafer;
Placing a holding jig so as to cover the bevel portion of the semiconductor wafer, and cleaning the bevel portion of the semiconductor wafer with the chemical solution while temporarily holding the chemical solution in the holding jig;
Suspending the supply of the chemical solution, supplying pure water to the surface of the semiconductor wafer, and rinsing the bevel portion of the semiconductor wafer with the pure water while temporarily holding the pure water in the holding jig; ,
Separating the holding jig from the bevel portion of the semiconductor wafer, stopping the supply of the pure water, and drying the surface of the semiconductor wafer;
It is characterized by comprising.

Embodiments of the present invention will be described below with reference to the drawings.
A wafer cleaning apparatus according to an embodiment of the present invention will be described with reference to FIGS. 1, 3, and 5A.
1A and 3A are cross-sectional views schematically showing a wafer cleaning apparatus according to an embodiment of the present invention. FIGS. 1B and 3B are FIGS. FIG. 4 is a plan view of the wafer cleaning apparatus shown in FIG. FIG. 5A is a cross-sectional view showing a chemical holding jig of the wafer cleaning apparatus shown in FIGS.

  As shown in FIGS. 1 and 3, the wafer cleaning apparatus has a wafer holding mechanism 1 that holds a semiconductor wafer 3, and the wafer holding mechanism 1 is attached to one end of a rotating shaft 2. A rotary drive mechanism (not shown) such as a motor is attached to the other end of the rotary shaft 2, and the rotary shaft 2 is rotated by this rotary drive mechanism.

  A chemical holding jig 6 that temporarily holds a chemical or pure water is disposed outside the wafer holding mechanism 1. The chemical liquid holding jig 6 includes a chemical liquid holding part 9 that holds a chemical liquid or pure water on the bevel portion 3 a of the semiconductor wafer 3 and a support part 8 that supports the chemical liquid holding part 9. The chemical liquid holding unit 9 has a U-shaped cross section as shown in FIG. 5A, and the plane has a shape along the outer periphery of the semiconductor wafer 3 as shown in FIG. Therefore, when the chemical solution holding jig 6 is moved to the position shown in FIG. 3 by a moving mechanism (not shown), the bevel portion 3 a of the semiconductor wafer 3 is covered with the chemical solution holding portion 9.

  Above the wafer holding mechanism 1, a chemical solution nozzle 5 that discharges the chemical solution is disposed, and the chemical solution is discharged onto the surface of the semiconductor wafer 3 by the chemical solution nozzle 5. A pure water nozzle 4 is disposed above the wafer holding mechanism 1, and pure water is discharged onto the surface of the semiconductor wafer 3 by the pure water nozzle 4.

  Next, a process of cleaning a semiconductor wafer with a chemical solution by the wafer cleaning apparatus according to the embodiment of the present invention will be described with reference to FIGS.

  First, as shown in FIG. 1, with the wafer holding mechanism 1 holding the back surface of the semiconductor wafer 3 by suction, the rotary shaft 2 is rotated by the rotation driving mechanism to move the semiconductor wafer 3 together with the wafer holding mechanism 1 to an arrow. Rotate as in 7.

  Next, as shown in FIG. 2, the chemical solution nozzle 5 is moved above the center of the semiconductor wafer 3, and the chemical solution is discharged from the chemical solution nozzle 5 to the center of the surface of the semiconductor wafer 3. The discharged chemical solution is spread from the center of the surface of the semiconductor wafer 3 toward the outer periphery by the rotation of the semiconductor wafer 3. Thereby, the surface of the semiconductor wafer 3 is cleaned with the chemical solution. The processing time is about 1 to 300 seconds.

  Next, as shown in FIG. 3, the rotation speed of the semiconductor wafer 3 is lowered to about 10 to 1000 rpm, the chemical holding jig 6 is brought close to the bevel portion 3 a of the semiconductor wafer, and the bevel portion 3 a is covered with the chemical holding portion 9. . As a result, the chemical solution blown outward from the bevel portion 3a of the semiconductor wafer 3 by the centrifugal force is temporarily held and stored by the chemical solution holding portion 9, and the bevel portion 3a is washed by the stored chemical solution. The time for this chemical treatment is about 1 to 300 seconds. The chemical solution temporarily stored in the chemical solution holding unit 9 is blown to the outside of the chemical solution holding unit 9.

  Next, as shown in FIG. 4A, the discharge of the chemical solution from the chemical solution nozzle 5 is stopped, and the chemical solution nozzle 5 is moved from the upper center of the semiconductor wafer 3 to the outside. At this time, the chemical solution holding jig 6 is not moved.

  Next, as shown in FIG. 4B, the pure water nozzle 4 is moved above the center of the semiconductor wafer 3, and pure water is discharged from the pure water nozzle 4 to the center of the surface of the semiconductor wafer 3. The discharged pure water is spread from the center of the surface of the semiconductor wafer 3 toward the outer periphery by the rotation of the semiconductor wafer 3. Then, the pure water blown outward from the bevel portion 3a of the semiconductor wafer 3 by the centrifugal force is temporarily held and collected by the chemical solution holding portion 9, and adheres to the bevel portion 3a and the wafer outer peripheral back surface by the stored pure water. The removed chemical is removed. The rinsing time is about 1 to 300 seconds. The pure water temporarily stored in the chemical solution holding unit 9 is blown to the outside of the chemical solution holding unit 9.

  Next, as shown in FIG. 4C, the chemical holding jig 6 is moved away from the bevel portion 3a of the semiconductor wafer. As a result, the state in which the chemical solution is temporarily accumulated in the bevel portion 3a of the semiconductor wafer 3 and the bevel portion 3a is cleaned is switched to the normal rinse treatment state. The rinsing time is about 1 to 300 seconds.

  Next, as shown in FIG. 4D, the discharge of pure water from the pure water nozzle 4 is stopped, the pure water nozzle 4 is moved from the upper center of the semiconductor wafer 3 to the outside, and the semiconductor wafer 3 is rotated. The speed is increased to about 3000 to 6000 rpm, and the semiconductor wafer 3 is dried. Thereafter, the rotation of the wafer holding mechanism 1 is stopped.

  According to the above embodiment, in the steps shown in FIGS. 3 to 4B, cleaning is performed by bringing the chemical holding jig 6 close to the bevel portion 3a of the semiconductor wafer and covering the bevel portion 3a with the chemical holding portion 9. It is possible to reliably remove the polymer, foreign matter or particles adhering to the bevel portion 3a of the semiconductor wafer which is difficult to perform.

  Moreover, in the said embodiment, a special washing | cleaning flow is not required as washing | cleaning of the bevel part 3a, and even if it uses the conventional washing | cleaning flow, a bevel part can also be fully wash | cleaned. Further, the chemical solution or pure water that has cleaned the surface of the semiconductor wafer 3 is stored in the chemical solution holding unit 9 to clean the bevel portion 3a, so that the chemical solution or pure water is reused. Therefore, the cost of the chemical solution or pure water can be reduced.

  The present invention is not limited to the above embodiment, and can be implemented with various modifications. For example, when a wafer cleaning apparatus is used for the purpose of removing particles adhering to the semiconductor wafer 3, it is possible to perform only pure water rinsing after the step shown in FIG. The chemical holding jig 6 is preferably made of a material having excellent chemical resistance and moisture resistance such as PFA and PTFE, but various materials can be used as long as they have resistance to the chemical used. . Further, depending on the shape of the chemical holding jig 6, the distance between the bevel portion 3a of the semiconductor wafer 3 and the chemical holding unit 9, the discharge amount of the chemical or pure water, the rotation speed of the semiconductor wafer 3, and the like are appropriately set appropriately. It is preferable to carry out the adjustment.

  Moreover, in the said embodiment, although the internal shape of the chemical | medical solution holding | maintenance part 9 is made into the cross-sectional U shape as shown to FIG. 5 (A), it is not limited to this, A chemical | medical solution or a pure water is hold | maintained temporarily. Various shapes can be used as long as the shape can be changed. For example, the shapes shown in FIGS. 5B to 5F can be used.

5B to 5F are cross-sectional views showing modifications of the chemical liquid holding jig.
In the chemical liquid holding jig shown in FIG. 5B, the same parts as those in the chemical liquid holding jig shown in FIG.

  The internal shape of the chemical liquid holding part 9a has a U-shaped cross section composed of an upper surface member 19a, a lower surface member 19b, and a connecting member 19c for connecting them. The upper surface member 19a has an internal shape inclined upward, and the lower surface member 19b has an internal shape inclined downward.

In the chemical solution holding jig shown in FIG. 5C, the same parts as those in the chemical solution holding jig shown in FIG.
The inner surface of the upper surface member 19a and the inner surface of the lower surface member 19b of the chemical liquid holding portion 9b are substantially parallel to each other, and the connecting member 19c has an opening for discharging the chemical liquid or pure water to the outside of the chemical liquid holding portion 9b. 10a and 10b are provided.

In the chemical solution holding jig shown in FIG. 5D, the same parts as those in the chemical solution holding jig shown in FIG.
The inner surface of the upper surface member 19a of the chemical solution holding portion 9c is provided with a scattering prevention portion 119a formed of a convex portion, and this scattering prevention portion 119a splashes the chemical solution or pure water from the inside of the chemical solution holding portion to the surface of the semiconductor wafer. This is to prevent this from happening. Further, the lower surface member 19b of the chemical liquid holding portion 9c has the same shape as that shown in FIG. Thereby, the chemical solution or pure water can be easily released from the inside of the chemical solution holding unit 9 c to the lower side of the outer peripheral portion of the semiconductor wafer 3.

In the chemical solution holding jig shown in FIG. 5E, the same parts as those in the chemical solution holding jig shown in FIG.
No opening is provided in the connecting member 19c of the chemical liquid holding part 9d.

In the chemical liquid holding jig shown in FIG. 5 (F), the same parts as those in the chemical liquid holding jig shown in FIG.
The upper surface member 19a of the chemical solution holding part 9e has an inner surface inclined downward.

  In the modified examples shown in FIGS. 5B to 5F, the same effects as those of the above embodiment can be obtained. Moreover, it is also possible to combine the shape of the chemical | medical solution holding jig shown to FIG. 5 (A)-(F) mutually.

BRIEF DESCRIPTION OF THE DRAWINGS The method to wash | clean a semiconductor wafer with the wafer cleaning apparatus by embodiment of this invention is shown, Comprising: (A) is sectional drawing which shows a wafer cleaning apparatus typically, (B) is a top view of a wafer cleaning apparatus. Sectional drawing which shows a wafer cleaning apparatus typically, Comprising: The next process of FIG. 1A and 1B show a method for cleaning a semiconductor wafer, wherein FIG. 1A is a cross-sectional view schematically showing a wafer cleaning apparatus, and FIG. 1B is a plan view of the wafer cleaning apparatus. The figure which shows the flow of the process of mounting an element on a surface mounting board. (A)-(D) is a sectional view showing a method for cleaning a semiconductor wafer and schematically showing a wafer cleaning apparatus. (A) is sectional drawing which shows the chemical | medical solution holding jig of the wafer cleaning apparatus shown in FIGS. 1-4, (B)-(F) is sectional drawing which shows the modification of a chemical | medical solution holding jig.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Wafer holding mechanism, 2 ... Rotating shaft, 3 ... Semiconductor wafer, 3a ... Bevel part, 4 ... Pure water nozzle, 5 ... Chemical solution nozzle, 6 ... Chemical solution holding jig, 7 ... Arrow, 8 ... Support part, 9 ... Chemical solution holding portion, 10a, 10b ... opening, 19a ... upper surface member, 19b ... lower surface member, 19c ... connecting member, 119a ... scattering prevention portion

Claims (9)

A wafer holding mechanism for holding a semiconductor wafer;
A rotating mechanism for rotating the wafer holding mechanism;
A chemical nozzle or pure water nozzle that is provided above the wafer holding mechanism and discharges the chemical liquid or pure water to the surface of the semiconductor wafer;
A holding jig that is disposed outside the wafer holding mechanism and covers the bevel portion of the semiconductor wafer, and temporarily holds the chemical or pure water on the bevel portion;
A wafer cleaning apparatus comprising:   In Claim 1, the said holding jig has a holding part which hold | maintains a chemical | medical solution or a pure water temporarily, The cross-section has a U-shaped cross section, and the said holding part is an upper surface. A wafer cleaning apparatus comprising a member, a lower surface member, and a connecting member for connecting them.   3. The wafer cleaning apparatus according to claim 2, wherein an inner surface of the upper surface member and an inner surface of the lower surface member are substantially parallel to each other.   3. The wafer cleaning apparatus according to claim 2, wherein an inner surface of the lower surface member is inclined downward.   5. The wafer cleaning apparatus according to claim 2, wherein an inner surface of the upper surface member is inclined upward or downward.   6. The convex portion for preventing the chemical liquid or the pure water from scattering from the inside of the holding portion to the surface of the semiconductor wafer on the inner surface of the upper surface member according to claim 2. A wafer cleaning apparatus, comprising a scattering prevention unit.   7. The wafer cleaning apparatus according to claim 2, wherein the connecting member is provided with an opening for discharging the chemical solution or the pure water to the outside of the holding unit. 8. Holding a semiconductor wafer by a wafer holding mechanism, and rotating the semiconductor wafer together with the wafer holding mechanism;
Supplying a chemical or pure water to the surface of the semiconductor wafer;
A holding jig is disposed so as to cover the bevel portion of the semiconductor wafer, and the bevel portion of the semiconductor wafer is cleaned with the chemical solution or the pure water while temporarily holding the chemical solution or the pure water on the holding jig. And the process of
A method for manufacturing a semiconductor device, comprising: Holding a semiconductor wafer by a wafer holding mechanism, and rotating the semiconductor wafer together with the wafer holding mechanism;
Supplying a chemical to the surface of the semiconductor wafer;
Placing a holding jig so as to cover the bevel portion of the semiconductor wafer, and cleaning the bevel portion of the semiconductor wafer with the chemical solution while temporarily holding the chemical solution in the holding jig;
Suspending the supply of the chemical solution, supplying pure water to the surface of the semiconductor wafer, and rinsing the bevel portion of the semiconductor wafer with the pure water while temporarily holding the pure water in the holding jig; ,
Separating the holding jig from the bevel portion of the semiconductor wafer, stopping the supply of the pure water, and drying the surface of the semiconductor wafer;
A method for manufacturing a semiconductor device, comprising:

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