JP4831059B2 - Unnecessary parts collection device - Google Patents

Description

  The present invention relates to an unnecessary part collecting apparatus that collects parts that are no longer needed in the production process of an electronic component mounting apparatus (part mounter or bonding apparatus).

Parts separated from a semiconductor wafer by dicing are mounted on a substrate or the like through appearance inspection in a production process in an electronic component mounting apparatus. Parts in which defects such as chips or cracks are found by visual inspection are removed from the production line and collected as unnecessary parts. As an apparatus for collecting unnecessary parts, an apparatus for sucking and collecting unnecessary parts at a predetermined position is known (see Patent Documents 1 and 2).
JP 2007-220754 A JP 11-354990 A

  The apparatus described in Patent Document 1 is an apparatus that collects defective parts generated in a bonding apparatus. When a part adsorbed on a nozzle is a defective part, the nozzle and the collection part are relatively moved, and the collection part It is configured to suck and collect defective parts by making the inside negative pressure. When the defective parts in the recovery unit become full, it is necessary to temporarily stop the operation of the bonding apparatus and carry out the defective parts in the recovery unit. Therefore, in order to reduce the frequency of replacement, it is necessary to use a recovery unit with a large capacity. It is advantageous. However, since the collection unit is disposed within the movement range of the nozzle, there is a limit to increasing the capacity of the collection unit.

  The apparatus described in Patent Document 2 is an apparatus that collects parts remaining in a bulk feeder. A tube that sucks out parts from the bulk feeder and a tube connected to a vacuum pump are connected to one case, and one of the tubes The part sucked out from the other tube is collected in the case by vacuum suction inside the case. However, an air flow is generated in the case by vacuum suction, and the parts that have already been collected may be rolled up, so that fragments and dicing dust generated by the contact between the components ride on the air current and are sucked by the vacuum pump. These dusts are captured by the filter of the vacuum pump, but there is a problem that the life of the filter is shortened and the replacement cost is increased due to generation of a large amount.

  SUMMARY OF THE INVENTION An object of the present invention is to provide an unnecessary parts collecting apparatus that can reduce the volume of a collecting unit and reduce the running cost.

  The unnecessary part recovery apparatus according to claim 1 is an unnecessary part recovery apparatus in an electronic component mounting apparatus provided with a nozzle that sucks and transfers a part, and has a suction port for suctioning the unnecessary part. And a part storage container having an opening on the upper side, a first pipe having an inner diameter capable of passing through the part extending from the part collection part, and a pipe connected to the negative pressure applying means at the upper end A second pipe having a parts storage container mounting portion for mounting the opening of the parts storage container at a lower end, a valve for opening and closing the pipe connected to the negative pressure applying means, and a control for controlling opening and closing of the valve Provided with a filter part that does not allow parts to pass through the second pipe line but allows ventilation, and the first pipe line is disposed at a position below the filter part and above the part storage container mounting part. Connected.

The unnecessary part recovery apparatus according to claim 2 is the unnecessary part recovery apparatus according to claim 1, wherein the suction port of the part recovery part is in a state where the tip of the nozzle remains adsorbing the part. It had an inner diameter that could be inserted.

  According to the present invention, the collecting part for collecting unnecessary parts from the nozzle and the container for storing the parts are separated, and these are connected by the first pipe having an inner diameter through which the parts can pass. In addition, the volume of the recovery unit can be kept small, and the parts storage container can be arranged at a relatively large volume in a place where space is not limited. In addition, since the airflow generated when collecting unnecessary parts does not affect the parts storage container, fragments and dicing dust generated by contact between parts are not carried on the airflow to the filter section, and the life of the filter The replacement cost does not increase due to the shortening.

  Embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a configuration diagram of an unnecessary part collecting device according to an embodiment of the present invention, FIG. 2 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention, and FIG. 3 is an electronic component mounting according to the embodiment of the present invention. It is a control block diagram of an apparatus.

  First, an unnecessary part collecting apparatus according to an embodiment of the present invention will be described with reference to FIG. The unnecessary parts collecting device includes a parts collecting part 2 having a suction port 1 for sucking parts P which are no longer needed in the production process of an electronic parts mounting apparatus (a parts mounter or a bonding apparatus), and an opening 3 above. It is connected to the part storage container 4 having, the first pipe line 5 having an inner diameter through which the part P extending from the part collection part 2 can pass, and the pipe line 7 connected to the vacuum source 6 at the upper end and the parts at the lower end A second conduit 9 having a component storage container mounting portion 8 for mounting the opening 3 of the storage container 4, a valve 10 for opening and closing the conduit 7 connected to the vacuum source 6, and a control for controlling the opening and closing of the valve 10. The second pipe 9 is provided with a filter part 12 that does not allow parts to pass but allows ventilation, and is located below the filter part 12 and above the part storage container mounting part 8. The pipe line 5 is connected. The filter unit 12 includes a filter 12a that captures dust in the air, dicing dust attached to the component P, and the like, and a mesh 12b that does not allow the component P to pass through. The filter unit 12 meshes the component P that has been sucked from the suction port 1. It captures at 12b and does not touch the filter 12a.

  The nozzle 13 is connected to the conduit 14 connected to the vacuum source 6 and the conduit 16 connected to the pressure source 15 via the conduit switching unit 17, and can be selectively connected to either the vacuum source 6 or the pressure source 15. It is like that. The nozzle 13 in a state of being connected to the vacuum source 6 which is a negative pressure applying means for maintaining the inside of the pipes 7 and 14 at a negative pressure can adsorb and hold the component P at the tip portion where the adsorption hole 18 is provided. Is possible. Further, the nozzle 13 in a state connected to the pressure source 15 which is a positive pressure applying means for maintaining the inside of the pipe line 16 at a positive pressure can detach the component P adsorbed on the tip portion by vacuum break.

  The suction port 1 of the component collection unit 2 has an inner diameter that can be inserted with the tip of the nozzle 13 adsorbing the component P. When collecting the component P, the nozzle that adsorbs and holds the component P. The vacuum break is performed with the tip of 13 inserted through the suction port 1. Since the component P is detached from the nozzle 13 inside the component recovery unit 2, it can be reliably recovered.

The control device 11 controls the opening / closing of the valve 10 and the switching of the pipe switching unit 17 when the component P is collected. When the parts P that are no longer necessary in the production process are transferred to the parts collection unit 2, the pipe switching unit 17 is switched so that the nozzle 13 is connected to the vacuum source 6. Then, when the tip of the nozzle 13 that sucks and holds the component P is inserted into the suction port 1, the nozzle 13 is disconnected from the vacuum source 6 and connected to the pressure source 15. Switch. The valve 10 is opened at the same timing or slightly before and after this, and the vacuum source 6 and the second conduit 9 are connected. As a result, an air flow is generated from the component recovery unit 2 through the first conduit 5 to the upper end of the second conduit 9, and the component P detached from the tip of the nozzle 13 by vacuum breakage is discharged from the suction port 1. Suction is performed up to the lower end of the filter portion 12 provided in the second conduit 9. Thereafter, when the valve 10 is closed and the application of the negative pressure is stopped, the inside of the second conduit 9 is released to the atmospheric pressure, so that the part P sucked up to the lower end of the filter unit 12 is its own weight and the lower part storage container 4 Fall into. If the nozzle 13 completely closes the suction port 1, the component P cannot be sucked. Therefore, the tip of the nozzle 13 is inserted so as not to block the suction port 1, or a notch is formed in the inner periphery of the suction port 1. It is necessary to provide ventilation.

  As described above, the control device 11 controls the recovery operation of the component P in the electronic component mounting device by controlling the opening and closing of the valve 10 and the switching of the pipe switching unit 17 at a predetermined timing. Since the parts storage container 4 is mounted in an airtight state on the parts storage container mounting portion 8 via the seal 19, the negative pressure applied in the second conduit 9 affects the air in the parts storage container 4. Will not affect. Therefore, even if a plurality of parts P collected in the parts storage container 4 are stored, these parts P can maintain a static state regardless of the negative pressure. Dicing dust, pieces of parts P, etc. are captured by the filter 12a, so that the life of the filter 12a is shortened and the replacement cost is not increased.

  The first pipeline 5 may be connected to the second pipeline 9 at a position below the filter unit 12 and above the component storage container mounting unit 8. In order to avoid the influence of the air flow generated toward the upper end of the second conduit 9, the first conduit 5 is connected to the second conduit 9 at a higher position so that the distance from the component storage container 4 is further increased. It is preferable to keep it long.

  Next, an electronic component mounting apparatus according to an embodiment of the present invention will be described with reference to FIGS. 2 and 3, the electronic component mounting apparatus 21 includes a component supply stage 22, a substrate holding stage 23, a component inspection stage 24, a pickup unit 25, a transfer head unit 26, a paste supply unit 27, And a camera unit 29 (29a, 29b, 29c, 29d).

  The linear motion unit 28 is a linear motor including a stator 28a and two movers 28b, and these movers 28b move in a horizontal direction along guide rails 28c attached horizontally to the stator 28a. The transfer head unit 26 and the paste supply unit 27 are respectively attached to the side surfaces of the mover 28b and can move horizontally together with the mover 28b.

  The pick-up unit 25 is attached to the lower surface of the linear motion unit 28, and moves an arm having a nozzle 36 at the tip for sucking and holding the component P in the horizontal and vertical directions.

  The substrate holding stage 23 holds the substrate 30 in a horizontal posture on the upper surface and moves horizontally to position the component mounting position of the substrate 30 at a predetermined work position. The paste supply unit 27 and the transfer head unit 26 apply the paste to the component mounting position of the substrate 30 at the work position and mount the component.

  The component inspection stage 24 horizontally moves the moving table 31 attached to the upper part in a direction orthogonal to the moving direction of the pickup unit 25 and the transfer head unit 26. On the moving table 31, the component relay table 32 and the component collection unit 2 are placed side by side in the moving direction of the moving table 31. The component supply stage 22 horizontally holds an adhesive sheet 33 on which a wafer 34 cut into a plurality of components is attached, and the wafer 34 is positioned so that an arbitrary component is located at a pickup position vertically above an ejector mechanism (not shown). Move horizontally.

  The camera unit 29 includes a first camera 29 a disposed above the component supply stage 22, a second camera 29 b disposed above the component relay table 32, and a third camera disposed above the substrate holding stage 23. 29c and a fourth camera 29d attached to the moving table 31. The first camera 29 a images the component P on the component supply stage 22. The second camera 29b images the parts on the parts relay table 32 from above. The third camera 29c images the position recognition mark 30a on the substrate 30. The fourth camera 29d images from below the parts adsorbed by the nozzle 13 attached to the transfer head unit 26 so as to be movable up and down.

  The control device 11 controls the operation of the valve 10 and the pipe switching unit 17 of the unnecessary component collecting device, and also supplies the component supply stage 22, the substrate holding stage 23, the component inspection stage 24, the pickup unit 25, the transfer head unit 26, and the paste. Operation control of each drive system of the supply unit 27, the linear motion unit 28, and the camera unit 29 is performed. Further, the control device 11 processes the images picked up by the respective cameras of the camera unit 29 to recognize the positions of the substrate 30 and the parts P, and further inspect the chip of the parts P, etc. To control.

  In the electronic component mounting apparatus according to the embodiment of the present invention, operation control of each drive unit is performed in the following procedure. As preparation for component mounting, the position recognition mark 30a of the board 30 is first imaged by the third camera 29c, the position of the board 30 is recognized based on the imaging data, and the component mounting position of the board 30 is positioned at the work position. Next, the paste discharged from the syringe 35 is applied to the component mounting position of the substrate 30 positioned at the work position. Further, the part P of the wafer 34 is imaged by the first camera 29a, and the position of the part P to be picked up is recognized by the control device 11 and positioned at the pickup position. For component mounting, an arbitrary component is first picked up from the wafer 34 by the nozzle 36 of the pickup unit 25 and mounted on the component relay table 32. Next, the second camera 29b images the component from above, and performs position recognition of the component and appearance inspection on the upper surface side of the component based on the imaging data. When a defect such as chipping or cracking is found in the component, the component is sucked by the nozzle 13 and sucked into the suction port 1 of the component collecting unit 2. When the component is a non-defective product, it is adsorbed by the nozzle 13 and mounted at the paste application position on the substrate 30, that is, the component mounting position.

  The parts storage container 4 is disposed at a location that does not interfere with the operation of each drive system, in this case, at the corner that is accessed when the operator operates the parts mounting device 21. The parts storage container 4 and the parts collection part 2 are connected by the extended first pipe line 5. The part (parts collection unit 2) that collects parts P that are no longer necessary on the production line is separated from the part (parts storage container 4) that stores them, and the parts storage container 4 can be easily accessed by the operator. By arranging the parts in place, it is possible to use the parts storage container 4 having a relatively large capacity without being restricted by space, and the frequency of container replacement can be reduced.

  In the embodiment of the present invention, the component P in which a defect such as chipping or cracking is found on the component relay table 32 is transferred to the component recovery unit 2 by the nozzle 13 of the transfer head unit 26. The nozzle 36 may be used for transfer. That is, the nozzle to be transferred to the component recovery unit 2 is not limited to the nozzle 13 of the transfer head unit 26 but may be the nozzle 36 of the pickup unit 25. The position recognition of the parts and the appearance inspection of the parts are not limited to the parts mounted on the part relay table 32 but may be performed on the parts held by the nozzle 13 of the transfer head unit 26. In this case, the part held by the nozzle 13 of the transfer head unit 26 is imaged from below by the fourth camera 29d.

According to the present invention, it is possible to realize an unnecessary component recovery apparatus that can reduce the volume of the recovery unit and reduce the running cost, and is thus particularly useful in an electronic component mounting apparatus that mounts components on a substrate.

The block diagram of the collection | recovery apparatus of the unnecessary parts in embodiment of this invention The perspective view of the electronic component mounting apparatus in embodiment of this invention Control block diagram of electronic component mounting apparatus in an embodiment of the present invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Suction port 2 Parts collection | recovery part 3 Opening part 4 Parts storage container 5 1st pipe line 6 Vacuum source 9 2nd pipe line 10 Valve | bulb 11 Control apparatus 12 Filter part 13 Nozzle P Parts

Claims (2)

A device for collecting unnecessary parts in an electronic component mounting apparatus equipped with a nozzle for sucking and transferring parts,
A negative part at the upper end, a parts collection part having a suction port for sucking unnecessary parts, a parts storage container having an opening in the upper part, a first pipe line having an inner diameter that allows passage of parts extending from the part collection part, A second conduit having a component storage container mounting portion that is connected to a conduit connected to the pressure applying means and has an opening of the component storage container at the lower end, and a conduit connected to the negative pressure applying means are opened and closed. And a control means for controlling opening and closing of the valve,
A filter part that does not allow parts to pass through the second pipe line but allows ventilation is provided, and the first pipe line is connected to a position below the filter part and above the part storage container mounting part. Unnecessary parts collection device.   2. The unnecessary part collecting apparatus according to claim 1, wherein the suction port of the part collecting part has an inner diameter that allows the nozzle tip to be inserted in a state where the tip of the nozzle is sucking the part.

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