JP3900269B2 - Component mounting method and component mounting apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention performs image processing on various chip-like components (hereinafter simply referred to as “components”) such as semiconductor chips arranged in a tray which is a part of a component supply apparatus, and performs semiconductor image processing on semiconductor wafers and electronic circuits. The present invention relates to a component mounting method and a component mounting apparatus for positioning and fixing a substrate such as a substrate (hereinafter simply referred to as “substrate”) at a predetermined mounting position, and particularly to the component transfer apparatus. .
[0002]
[Prior art]
First, a component mounting apparatus according to an aspect of a prior application for which the present applicant has applied for a patent will be described, and the configuration and operation thereof will be described with reference to the drawings.
[0003]
FIG. 11 is a top view of a component mounting apparatus according to an aspect of a prior application for which the present applicant has applied for a patent, as viewed from above. FIG. 12 is a side view of the component mounting apparatus shown in FIG. 13 is a side view of the component mounting apparatus shown in FIG. 11 as viewed from the arrow B side, and FIG. 14 is an operation principle diagram of the component suction nozzle in the component transfer apparatus.
[0004]
Note that the semiconductor chip S will be described as a component to be mounted. The semiconductor chip S is a chip-shaped chip before a package divided from a semiconductor wafer on which many identical integrated circuits are formed in a predetermined arrangement, and is called a so-called IC chip.
[0005]
In the figure, reference numeral 1C indicates a conventional component mounting apparatus as a whole. The one shown in the figure is usually called a flip chip bonder, and is an apparatus for mounting various parts S on a substrate P in a predetermined pattern via an adhesive material. Equipped with mounting function, heating and pressurizing function.
[0006]
As shown in FIGS. 11 to 13, the component mounting apparatus 1C includes the following components. That is, the base 10, the tray device 20, the component transfer device 30, the bonding device 40, the work stage device 50, the camera device 60, the control device 70, and the like are included.
[0007]
The base 10 includes a horizontal surface plate 11 serving as a reference surface, and a control device 70 and various mechanisms are incorporated therein. However, some control devices 70 are provided outside the base 10.
[0008]
The tray device 20 includes a Y table 22 whose position can be adjusted in the direction of the Y axis 21, and has a function of aligning the components S on the Y tape 22 in a predetermined arrangement and fixing the tray 23 that houses the components. The component S is accommodated with its electrode side facing upward. The type of component S to be accommodated may be one type or a plurality of different types.
[0009]
The component transfer device 30 includes a drive device 31 portion and a component suction nozzle 32 portion. The driving device 31 is configured on a surface plate 33 fixed on the surface plate 11. A rail 34 (FIG. 11) is laid on the surface plate 33, and a drive device 31 is mounted on the rail 34 so as to be movable in the X-axis direction where the tray device 20 and the bonding device 40 are present. Further, as shown in FIG. 14, the drive device 31 further includes a lifting mechanism in which the component suction nozzle 32 can move in the vertical direction indicated by an arrow Z, and a component suction nozzle as indicated by an arrow θ. A reversing mechanism (not shown) for reversing the 32 portion is incorporated.
[0010]
The component suction nozzle 32 is composed of a reversing arm 35 and a spindle 36 having a base end connected to the drive device 31 and a nozzle 37 attached to the tip of the component S (see FIGS. 12 and 12). 13).
[0011]
The component suction nozzle 32 reverses the front and back surfaces of the component S sucked and taken out from the tray 23 by the nozzle 37 when the reversing arm 35 is reversed, and is attached to the bonding head 45 of the bonding head portion 43 of the bonding apparatus 40 described later. It has a function to deliver.
[0012]
The bonding apparatus 40 includes a support plate 41 that is vertically attached to the surface plate 11, a Z-axis table 42 that is supported by the support plate 41, and a bonding head unit 43. The bonding head unit 43 is mounted on the Z-axis table 42. The bonding head portion 43 is composed of a rotating shaft 44 and a bonding head 45 that is exchangeably fixed below the rotation shaft 44 (FIG. 12).
[0013]
The bonding head unit 43 sucks and receives the component S inverted by the component transfer device 30 by the bonding head 45 when it is in the upper position, and lowers the bonding head 45 to suck and hold it. The component S is placed on a predetermined position of the substrate P on the work stage device 50, which will be described later, via an adhesive or the like, and is fixed and mounted by pressurization and overheating.
[0014]
The work stage device 50 includes an XY table 53 whose position can be adjusted in the X-axis 51 and Y-axis 52 directions, and has a function of fixing the substrate P on which the component S is to be mounted on the XY table 53.
[0015]
The camera device 60 can enter and exit between the bonding head 45 and the substrate P on the XY table 53, recognizes the camera 61 that recognizes the electrode surface of the component S, and the position of the substrate P on which the component S is to be mounted, The position information data is fed back to the control device 70 to rotate the camera 61, or used to move and control the XY table 53 of the work stage device 50 in the X-axis direction and / or the Y-axis direction.
[0016]
The control device 70 includes a microcomputer, and in addition to the functions described above, the XY table 23 of the tray device 20, the component transfer device 30, the bonding device 40, the work stage device 50, and the camera device according to the sequence in which the component S is mounted. A function of controlling a part or the whole of the component mounting apparatus 1C such as 60 is provided.
[0017]
In the component mounting apparatus 1C configured as described above, as shown in FIG. 14, as a general operation, the component transfer device 30 moves toward the tray 23, the component suction nozzle 32 descends, The nozzle 37 attached to the tip end adsorbs the electrode surface side of the predetermined component S from the tray 23, and then raises it, reverses the reversing arm 35 by the reversing mechanism, and rotates the component sucking nozzle 32. The front and back surfaces of the component S are reversed. In this state, the component transfer device 30 moves to the bonding head portion 42 of the bonding device 40, and brings the component S vacuumed by the nozzle 37 below the bonding head 45 of the bonding head portion 43. When this movement is completed, the component suction nozzle 32, and thus the nozzle 37, moves upward toward the bonding head 45 as indicated by the arrow Z, and is reversed to the lower surface of the bonding head 45 by the vacuum suction force. The component S is vacuum-sucked, while the vacuum suction of the component of the nozzle 37 is stopped and the component S is delivered to the bonding head 45.
[0018]
After moving the component transfer device 30 in the X-axis direction and confirming that it has moved out of the area of the bonding device 40, the camera 61 of the camera device 60 is fixed to the bonding head 45 and the work stage device 50. Move between and.
[0019]
The camera 61 recognizes an image of the electrode pattern of the component S held by the bonding head 45 and the electrode land pattern on the substrate P, and controls position information (deviation information) as to whether or not their positions match. The calculation is performed by a computer incorporated in the apparatus 70, and the result is output to the work stage apparatus 50 as feedback data. Based on this data, the XY table 53 of the work stage device 50 is finely moved and positioned so that the electrode of the component S matches the electrode pad position at a predetermined position on the substrate P.
[0020]
Next, the bonding head 45 adsorbing the component S is lowered, and the component S is mounted in a state where it is precisely positioned at a predetermined position on the substrate P.
[0021]
Although the operation of the component mounting apparatus 1C is described as a general operation, there are various types of the component S, and there are various sizes and shapes, and therefore the component transfer apparatus. The 30 nozzles 37 are switched according to the type, size, and shape of the part S.
[0022]
[Problems to be solved by the invention]
However, the component transfer apparatus 30 in the conventional component mounting apparatus 1 </ b> C configured as described above includes a total of three axes: a component reversal θ axis, a component suction / delivery Z axis, and a rectilinear X axis.
[0023]
Although not shown, an arm floating mechanism constituted by a buffer guide 1 axis and a preload spring for sucking and mounting the component S is built in the Z axis. as a result,
1. Drive shafts increase, control becomes complicated, and costs increase at the same time
2. As the moving parts increase, the backlash increases and the parts delivery accuracy deteriorates.
3. When it is necessary to cover the component suction nozzle 32 with a cover in order to handle parts that do not like dust, it is difficult to completely cover and suck the components.
There is a problem such as.
[0024]
The present invention is intended to solve such a problem. The component adsorbing means of the component transfer device is constituted by a single axis of reversing or turning, and is controlled by the control device. An object of the present invention is to obtain a component mounting method and a component mounting apparatus capable of performing a series of operations of picking up and delivering.
[0025]
[Means for Solving the Problems]
Therefore, in order to solve the above problem, in the component mounting method according to the first aspect of the present invention, the component supply means in which the component to be mounted on the board is accommodated face up, and the component from the component supply means A substrate mounting means for supporting a substrate mounted at a predetermined position, and a component for receiving a component from the component supply means face down and mounting at a predetermined position on the substrate supported by the substrate mounting means A component mounting apparatus comprising: a mounting unit; a component mounting unit that includes a component suction unit that sucks a component in a face-up state from the component supply unit; Is approaching in a slightly upward state rather than a horizontal state until immediately before adsorbing the component accommodated in the component supply means in a face-up state, and adsorbs the component Time is the horizontal state, adsorbs the component Without adding a twist Inverted, approached in a slightly downward state from the horizontal state until just before delivery to the component mounting means, and when transferring to the component mounting means, it is controlled to be in the horizontal state and transfers the predetermined component It is characterized by that.
[0026]
In the component mounting apparatus according to the second aspect of the present invention, there is provided a component supply unit in which a component to be mounted on the substrate is accommodated face-up, and a substrate on which the component from the component supply unit is mounted at a predetermined position. Supporting substrate placing means, guide means extending horizontally from the component supplying means to the vicinity of the substrate placing means, and located above the substrate placing means, the components from the component supplying means face down The component mounting means for receiving and mounting at a predetermined position on the substrate supported by the substrate mounting means, guided by the guide means, and sucking the components accommodated in the face-up state to the component supply means When the component is sucked, the component sucking unit is reversed, and the component sucking unit delivered to the component mounting unit is guided by the guide unit. Until just before the adsorbing components are housed in a face-up state in the input unit close at slightly upward state from the horizontal state, it becomes horizontal state when adsorbing the component, the component suction means to adsorb the component Without adding a twist The control means is configured to be reversed and approached in a slightly downward state from a horizontal state until immediately before delivery to the component mounting means, and to be controlled to be in a horizontal state when delivered to the component mounting means. Yes.
[0027]
The component suction means includes a rotating shaft and a tip of the rotating shaft. And the base end is tangential to the outer periphery. It is characterized by comprising an attached component adsorption arm and a rotation motor for rotating the component adsorption arm.
[0028]
Furthermore, a floating mechanism is incorporated in the component suction means.
[0029]
According to a fifth aspect of the present invention, there is provided a component mounting apparatus for supporting a substrate on which a component to be mounted on a substrate is accommodated face-up, and a substrate on which a component from the component supply device is mounted at a predetermined position. A component mounting unit that is positioned above the substrate mounting unit, receives components from the component supply unit face down, and is mounted at a predetermined position on the substrate supported by the substrate mounting unit Means for sucking a component housed face-up in the component supply means, and when the component is sucked, the component suction means is rotated and reversed at the same time, and delivered to the component mounting means, Immediately before the component adsorbing means adsorbs the component accommodated in the component supply means in a face-up state, the component adsorbing means approaches in a slightly upward state from the horizontal state and adsorbs the component. Time is the horizontal state, the component suction means to adsorb the component Without adding a twist The control means is configured to be reversed and approached in a slightly downward state from a horizontal state until immediately before delivery to the component mounting means, and to be controlled to be in a horizontal state when delivered to the component mounting means. Yes.
[0030]
The component suction means includes a swing arm, a component suction means attached to the tip of the swing arm, a swing motor that rotates the swing arm, and a rotation motor that rotates the component suction means. The swing motor is disposed at a position sufficiently below the swing arm.
[0031]
Furthermore, a floating mechanism is incorporated in the component suction means.
[0032]
Therefore, according to the component mounting method and the component mounting apparatus of the present invention, the component suction unit picks up the component without contacting the component supply unit and the component accommodated therein, and contacts the sucked component with the component mounting unit. Without passing to the component mounting means.
[0033]
By configuring the component suction means of the component mounting apparatus with one reversal axis and controlling it by the control device, a series of operations of picking up, picking up and delivering the component from the component supply means can be performed.
[0034]
Furthermore, by incorporating a floating mechanism in the component suction means, the component can be mounted on the substrate without damaging the component.
[0035]
Further, since the floating mechanism is built coaxially with the reversing rotation shaft, the component suction arm can be floated with little backlash, and the component can be delivered with high accuracy. Good parts delivery accuracy means that when processing an image for subsequent mounting position correction of the process, processing near the center of the processing area that is not affected by aberrations, etc., is possible. This leads to improved accuracy.
[0036]
Furthermore, since the backlash is small, it is possible to pick up a part having a contact prohibition area such as an imager with high positional accuracy, and it is possible to prevent scratches and chipping due to collet contact.
[0037]
Still further, by making the reversing direction of the reversing arm coincide with the direction of the transfer axis of the rectilinear movement, the transfer distance can be shortened by twice the reversing arm length, and the transfer time can be shortened. Even when the turning angle of the transfer shaft is 90 °, the turning radius can be reduced by the length of the reversing arm, and the rigidity at the operating point can be increased.
[0038]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a component mounting apparatus according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings. Note that the embodiments described below are preferred specific examples of the present invention, and thus various technically preferable limitations are given. However, the scope of the present invention is particularly limited in the following description. Unless there is a description of limitation, it should be noted in advance that the present invention is not limited to these forms.
[0039]
FIG. 1 is a side view of a partial configuration of a component mounting apparatus according to a first embodiment of the present invention, FIG. 2 is a top view of a component transfer apparatus portion in the component mounting apparatus shown in FIG. 1, and FIG. FIG. 4A is a side view thereof, FIG. 4B is a partial cross-sectional side view taken along the line BB in FIG. 4A, and FIG. 4 is the component shown in FIG. FIG. 5 is an operation explanatory view of the component mounting apparatus shown in FIG. 1, and FIG. 6 is a component mounting apparatus according to the second embodiment of the present invention. 7 is a top view of the component transfer apparatus, FIG. 7 is a partially sectional side view of the component transfer apparatus shown in FIG. 6 on the BB line, and FIG. 8 is a front view as viewed from the arrow C shown in FIG. FIG. 10 is a cross-sectional side view of an arm floating mechanism incorporated in a swing arm portion, and FIG. It is a diagram for describing operation of the component transfer device in the component mounting apparatus of the second embodiment.
[0040]
First, the component mounting apparatus according to the first embodiment of the present invention will be described with reference to FIGS. 1 to 5. First, the component mounting apparatus according to the first embodiment will be described with reference to FIGS. 1 to 4.
[0041]
In FIG. 1, reference numeral 1A indicates the component mounting apparatus according to the first embodiment of the present invention. This component mounting apparatus 1A is configured as a so-called ultrasonic flip chip bonder, and, as shown in FIG. 2, a component reversing device 133 described later is of a straight type, and the component reversing device 133 and the X axis The (transfer) motor 135 is a system in which a commonly used guided ball screw is driven by a motor.
[0042]
The component mounting apparatus 1A includes a base 110, a tray device 120, a component transfer device 130, a bonding device 140, a work stage device 150, a first camera device 160, a second camera, and the like, similarly to the conventional component mounting device 1C. It consists of a camera device 170, a control device 180, and the like.
[0043]
The base 110 includes a horizontal surface plate 111 serving as a reference surface, and a control device 180 and various mechanisms are incorporated therein. However, the control device 180 may be provided outside the base 110.
[0044]
The tray device 120 includes a θ table 122 that is rotated by a θ motor 121 installed on the surface plate 111 from below, a horizontal X-axis rail 124 that is driven by an X-axis motor 123 assembled on the θ table 122, and a side surface thereof. A Y-axis rail 126 driven by the assembled Y-axis motor 125, a saddle 127 attached to the X-axis rail 124, a post 128 fixed vertically to the saddle 127, and horizontally attached to the post 128 The stage 129 is configured to be movable in the X-axis direction and the Y-axis direction and to be rotatable.
[0045]
A tray T in which a plurality of components S to be mounted are stored in a predetermined arrangement is placed horizontally on the stage 129 and fixed.
[0046]
As shown in FIG. 2, the component transfer device 130 includes an X-axis rail 131 supported horizontally by a plurality of columns (not shown) vertically attached to the base 110, and the X-axis rail 131. , An L-shaped slider 132, a component reversing device 133 which is a feature of the present invention, and a cover 134 which covers the X-axis rail 131. The configuration and structure of the component reversing device 133 will be described later with reference to FIGS.
[0047]
The bonding apparatus 140 includes a bonding head 141 using ultrasonic waves as a bonding means, a linear guide 142, and the like. The linear guide 142 is supported by a support member (not shown) perpendicular to the base 110, and the bonding head 141. Is guided by the linear guide 142 and moves up and down in the Z-axis direction. Further, a suction nozzle (not shown) is provided on the lower surface of the bonding head 141, and receives and holds the component S from the component reversing device 133 by suction. Furthermore, the bonding head 141 incorporates an ultrasonic oscillation power supply (not shown), and the bonding to the electrode land on the substrate P is performed by using ultrasonic energy to be bonded by the horn 143 that vibrates at a high frequency generated by the ultrasonic oscillation power supply. Is done with its junction energy.
[0048]
The work stage device 150 includes a θ table 152 rotated by a θ motor 151 installed on the surface plate 111 from below, and a horizontal X-axis rail (not shown) driven by an X-axis motor 153 assembled thereon. An X-axis table 154 to be guided, a Y-axis rail 156 driven by a Y-axis motor 155 assembled on the upper surface thereof, a Y-axis table 157 horizontally assembled to the Y-axis rail 156, and the Y-axis table 157 The stage 158 is configured so as to be movable in addition to being movable in the X-axis direction and the Y-axis direction.
[0049]
On the horizontal plane of the stage 158, a substrate P on which a plurality of components S are mounted in a predetermined arrangement is placed and fixed. On the substrate P, electrode lands (not shown) and the like are formed in an arrangement corresponding to the electrodes of the component S to be mounted.
[0050]
The second camera device 170 is composed of an X-axis and a Y-axis that move in a horizontal direction (not shown). The camera 171 is guided by an X-axis rail 172 by driving an X-axis motor 173, and the bonding head 141. An image of the electrode of the component S adsorbed by the bonding head 141 and the electrode land at the mounting position on the substrate P when the component S enters and exits between the substrates P on which the component S is to be mounted and enters between the two. The position information (deviation information) indicating whether or not the positions match is calculated by a computer incorporated in the control device 180, and the result is output as feedback data to the work stage device 150. With this data, the θ table 152, the X-axis table 154, and the Y-axis table 157 of the work stage device 150 are finely moved and controlled so that the electrode of the component S matches the electrode land position at a predetermined position on the substrate P. Is positioned.
[0051]
Next, the component reversing device 133 will be described with reference to FIGS. The component reversing device 133 is supported by the slider 132 and moves on the X-axis line 131 indicated by an arrow X on the X-axis rail 131 toward the tray device 120 and toward the bonding device 140. This movement is performed by the X-axis motor 135. Reference numeral 136a denotes an origin sensor for the slider 132, reference numeral 136b denotes a (+) side limit sensor for the slider 132, and 136c denotes the same (−) side limit sensor. Those descriptions are omitted.
[0052]
The component reversing device 133 is fixed to the component adsorbing arm 1332 and the slider 132 to which the base end portion is attached in the tangential direction of the outer peripheral portion of the reversing shaft 1331 as shown in an enlarged manner in FIGS. A reversing motor 1334 having a built-in encoder and whose rotational speed is decelerated by a speed reducer 1333, a rotating shaft 1337 fixed to a spindle 1335 of the reversing motor 1334 with a screw 1336 and rotating integrally with the spindle 1335. Two rotation bearings 1338 fitted between the rotating shaft 1337 and the reversing shaft 1331 with a predetermined interval in the axial direction, and a stopper pin attached to the outer periphery of the rotating shaft 1337 1339, a stopper block 1340 with which a stopper pin 1339 disposed below the reversing shaft 1331 contacts, a reversing shaft 331 and the rotation shaft 1337 and the multiplying passed tension coil spring 1342, inversion axis 1331 side of the spring hook 1341, and a like limit sensor 1343 is disposed below the stopper block 1340.
[0053]
A component suction nozzle N is attached to the tip of the component suction arm 1332 in a replaceable manner, and a component suction path 1344 is formed by drilling in the center of the component suction arm 1332 (FIG. 3A). It is mounted and connected to the opening 1346 of the component suction path formed at the center of the moving shaft 1345. The component suction path of the rotating shaft 1345 is connected to an external air pipe 1348 via a rotatable joint 1347 having a built-in pipe.
[0054]
In the configuration of the component reversing device 133, the two rotation bearings 1338, the tension coil spring 1342, the stopper pin 1339, and the stopper block 1340 are members constituting an arm floating mechanism.
[0055]
Next, the operation of the component mounting apparatus 1A according to the first embodiment of the present invention will be described with reference to FIG.
[0056]
First, a component S such as a semiconductor chip is housed in the tray T face-up, that is, with the electrodes facing upward, and is placed and fixed on the stage 129 of the tray device 120 having a built-in operation axis of XYθ. In this case, the part S is supplied with the position corrected roughly by the first camera device 160.
[0057]
Next, the component reversing device 133 of the component transfer device 130 sucks, inverts, and turns the component S face-up on the tray T fixed on the stage 129, and uses the ultrasonic wave as a bonding means. It is transferred to the bonding head 141 of 140 face down, that is, with the electrode side down.
[0058]
The component S delivered face-down to the bonding head 141 is accurately applied to a predetermined position of the substrate P on the work stage device 150 containing the XYθ operation axis by the second camera device 170 having upper and lower visual fields. Position corrected and implemented. Position correction is performed on the XYθ axes of the work stage apparatus 150, and component mounting is performed on the Z axis built in the bonding apparatus 140.
[0059]
Further, the bonding and mounting of the component S to the substrate P is performed by converting ultrasonic energy into bonding energy by a horn 143 that is driven by an ultrasonic oscillation power source (not shown) and vibrates at a high frequency. Done.
[0060]
FIG. 5 shows four possible orientations of the component suction nozzle N attached to the tip of the component suction arm 1332 in the component reversing device 133 during actual operation of the component mounting apparatus 1A. The respective states are A, B, C, and D. If the angle of the component suction nozzle N is 0 °, the angle of the B state is reversed by about 2 °, the angle of the C state is reversed by 182 °, and the angle of the D state is about 180 °. The state of A is a posture in which the component S is picked up face-up from the tray T on the component supply stage 14, and the state of B is a major feature of the present invention. The component suction nozzle N is a mechanism of the component supply stage 129 and the tray T. Shows the posture to avoid interference with the parts supply stage 129 The state of C is also a major feature of the present invention, indicating a posture that avoids interference with the bonding head 141, a posture that approaches or moves away from the bonding head 141, and The posture is a posture in which the component S is delivered to the bonding head 141 with the face down.
[0061]
The angle 2 ° in the state B and the angle 182 ° in the state C may be the minimum angles that avoid interference with other mechanisms in a state where the component suction nozzle N sucks the component S. This is because the smaller the angle, the shorter the transfer time of the component S.
[0062]
In the present invention, since the floating mechanism as described above is incorporated, even if some excessive rotational force is applied to the reversing shaft 1331, the elasticity of the tension coil spring 1342 coaxial with the rotating shaft 1337 is buffered. Due to the components, when parts are delivered, impacts on the parts due to the sandwiching between the tray T and the parts suction nozzle N can be prevented, so that the parts S are not damaged by scratches, chipping, etc. The impact on the component due to the sandwiching between N and the bonding head 141 can also be prevented, and similarly, the component S is prevented from being damaged by scratching, chipping and the like.
[0063]
The interval between the stopper pin 1339 and the stopper block 1340 is a mechanism that regulates the extension of the tension coil spring 1342.
[0064]
Further, since the floating mechanism is configured such that the reversing shaft 1331 and the rotating shaft 1337 are coaxially arranged via the rotating bearing 1338, the reversing shaft 1331 can be floated with little backlash, and the high-precision component S can be realized. Can be delivered. The high component delivery accuracy enables processing near the center of the processing area that is not affected by aberrations when performing image processing for mounting position correction in subsequent processes, and in turn improves component mounting accuracy. It leads to
[0065]
In addition, the fact that there is little backlash makes it possible to pick up a part having a contact-prohibited area such as an imager with high positional accuracy, and can prevent scratches and chipping caused by collet contact.
[0066]
As described above, the component reversing device 133 according to the present invention controls the component suction arm 1332 with one axis of the reversing shaft 1331 by teaching the series of operations to a computer built in the control device 80. A series of operations of picking up the component S from the tray T and delivering it to the bonding head 141 can be realized.
[0067]
In the component mounting apparatus 1A of the first embodiment, the X-axis motor 135 and the drive mechanism of the component transfer apparatus 130 are one of dust generation sources, and these are mounted above the tray apparatus 120. Therefore, the chance that the parts accommodated in the tray T are contaminated with the dust increases. In particular, if dust adheres to the contact prohibited area of a part having a contact prohibited area such as an imager, this becomes a defective product. Therefore, it is preferable to suppress dust adhesion to this component as much as possible regardless of which component is mounted on the substrate P.
[0068]
The component mounting apparatus 1B according to the second embodiment of the present invention shown in FIGS. 6 to 10 is an example of an apparatus configured to suppress the adhesion of dust to this component as much as possible.
[0069]
The component mounting apparatus 1B according to the second embodiment of the present invention shown in FIGS. 6 to 10 is an example of an apparatus configured to suppress the adhesion of dust to this component as much as possible.
Hereinafter, a component mounting apparatus 1B according to a second embodiment of the present invention will be described with reference to FIGS. The overall configuration of the component mounting apparatus is not shown in these drawings. Et Although only the component transfer device 230 is shown, the tray device 120, the bonding device 140, and the work stage attached to the surface of the surface plate 111 on the mount 110 of the component mounting device 1A of the first embodiment. The apparatus 150, the first camera apparatus 160, the second camera apparatus 170, and the apparatus corresponding to the control apparatus 180 housed in the gantry 110 are still provided. Therefore, for convenience, reference numeral 1B is assigned. Thus, it is distinguished from the component mounting apparatus 1A of the first embodiment.
[0070]
First, the configuration of the component transfer device 230 of the component mounting apparatus 1B will be described. This component transfer device 230 prevents dust from adhering as much as possible to the component S accommodated in the tray T and the component S picked up from the tray T, and also to the substrate P on the work stage device 150. As shown in FIGS. 6 to 8, the swivel motor portion 231 swivels the swivel arm portion 232 in a horizontal state over a predetermined angular range between the tray T and the substrate P as shown in FIGS. , So that it can be reversed. In this component transfer device 230, the swing motor portion 231 and the swing arm portion 232 are separated, and the swing motor portion 231 is almost the same as the XYθ axis table portion of the tray device 120, the XYθ table portion of the work stage device 150, and the like. A lower position at the same level is disposed below the swing arm portion 232 via the swing shaft 2313 and below the tray T or the substrate P.
[0071]
The swing motor 2311 of the swing motor unit 231 includes an encoder and a speed reducer that decelerates the rotation speed, and is supported by the frame 2312. The swing shaft 2313 of the swing motor 2311 is fixed to the upper surface of the frame 2312 perpendicularly. The upper end of the swivel arm 232 is fixed to a bracket 234 for the swivel motor 233 and supports the swivel arm 232 so that it can swivel in a horizontal state.
[0072]
The swivel arm portion 232 includes the rotation motor 233, the bracket 234 to which the rotation motor 233 is fixed on one side surface, a sleeve 235 fixed to the other side surface of the bracket 234, and one end within the sleeve 235. The rotary shaft 236 is rotatably supported, and a component suction portion 237 connected to the other tip portion.
[0073]
A hollow path 2332 is formed at the center of the rotation shaft 2331 of the rotation motor 233, and the rotation shaft 236 is a rotation in which a hollow path 2361 is formed at a portion closer to the sleeve 235 than the center of the bracket 234. The shaft 236 is connected. One end of the rotation shaft 236 is rotatably supported by the rotation bearing 2351 at both ends inside the sleeve 235.
[0074]
Through holes 2352 (FIGS. 6 and 7) are formed on both sides of the sleeve 235 near the bracket 234, and discharge pipes 2353 (FIG. 6) are connected to the through holes 2352, respectively. In addition, it is structured to be able to suck and discharge dust when it is generated from a floating mechanism formed in a component suction portion 237 which will be described later, so that the cleaning is achieved.
[0075]
In addition, a suction pipe leading to the hollow path 2332 is connected to the outer end portion of the rotation motor 233. The other end of the suction pipe is connected to a vacuum source (not shown), and is configured so that a predetermined part S can be sucked by the nozzle N through the hollow path 2332 and the hollow path 2361 by suction. At the time of this suction, dust generated from the bearing of the rotation motor 233 and the like is also discharged to the outside from the suction pipe 2333, so that the cleaning is achieved.
[0076]
Needless to say, the rotation shaft 2331 of the rotation motor 233 and its hollow path 2332 and rotation shaft 236 and its hollow path 2361 and the rotation shaft 2381 in the component suction portion 237 described later with reference to FIG. The hollow path 2384 is configured to be integrally connected with a screw or the like in a straight line. Reference numeral 2334 denotes a power cord for the rotation motor 233.
[0077]
Next, the configuration and structure of the component suction portion 237 will be described with reference to FIG. 9 showing the component suction portion 237 shown in FIG.
[0078]
The component suction portion 237 includes a component suction nozzle 238 and a nozzle bearing portion 239 that pivotally supports the component suction nozzle 238.
[0079]
The component suction nozzle 238 has an integral structure including a rotating shaft 2381 and a disk-shaped nozzle mounting / reversing portion 2382 formed at the tip of the rotating shaft 2381, and the nozzle mounting portion 2383 is formed at one location of the nozzle mounting / reversing portion 2382. Has been. A hollow path 2384 having one end connected to the hollow path 2361 of the rotation shaft 236 is formed in the central portion of the rotation shaft 2381 in the axial direction, and the other end is the center central portion of the nozzle mounting reversal portion 2382. It extends to a hollow path 2385 that communicates with the nozzle mounting portion 2383 in a radial direction from one point of its tip. A nozzle N (FIG. 10) suitable for the component S to be sucked is attached to the nozzle mounting portion 2383 so as to be replaceable.
[0080]
The rotating shaft 2381 is pivotally supported by two rotating bearings 2391 disposed in the nozzle bearing portion 239 with a predetermined interval.
[0081]
An arm floating mechanism corresponding to the arm floating mechanism in the component mounting apparatus 1A of the first embodiment is also provided in the component mounting apparatus 1B of the second embodiment. As shown in FIG. 9, it is formed on the same side end surface of the two rotation bearings 2391, the rotation side hook 241 formed on one end surface of the rotation shaft 2381, and the nozzle bearing portion 239. The fixed side hook 242, the tension coil spring 243 spanned between the rotation side hook 241 and the fixed side hook 242, and the inner peripheral surface of the nozzle bearing portion 239 on the side facing the tension coil spring 243 side with a predetermined width. A concave stopper 2392 (FIG. 9A) formed, and a stopper pin 2386 (FIG. 9A) formed on the outer periphery of the rotating shaft 2381, inserted into the concave stopper 2392, and moved by a predetermined amount of movement. It is composed of
[0082]
This arm floating mechanism also has the same function as the arm floating mechanism in the component mounting apparatus 1A of the first embodiment. The function is that the stopper pin 2386 press-fitted into the rotating shaft 2381 is pulled by the coil spring 243 and the nozzle bearing portion. When the load is applied to the operating point of the component suction nozzle 238, the rotating shaft 2381 and the nozzle bearing portion 239 are assembled so as to maintain a relative position when no load is applied by pressing against the inner wall of the concave stopper 2392 of 239. The tension coil spring 243 bends and the arm floating function is activated. The floating pressure can be freely set by selecting the tension coil spring 243.
[0083]
Next, the operation of the component mounting apparatus 1B of the second embodiment will be described with reference to FIG.
[0084]
As shown in FIG. 10, when the turning motor unit 231 is operated, the turning arm unit 232 is turned counterclockwise within a horizontal plane as shown by the arrow R about the turning shaft 2313 and then clockwise. To do. When the nozzle N is in the state shown in the drawing, it turns counterclockwise as indicated by the arrow R to the position where the tray T exists, and picks up one component S accommodated in a face-up state from the tray T. Next, the nozzle N reverses and turns clockwise as indicated by the arrow R to the position where the substrate P is present, and the bonding head 141 of the bonding apparatus 140 using ultrasonic waves as the bonding means receives the face-down. hand over. Hereinafter, the mounting of the component S on the board P is the same as that of the component mounting apparatus 1A of the first embodiment, and thus the description is omitted. However, the angle at which the nozzle N attracts the component S and the angle until the nozzle N approaches the tray T are omitted. Alternatively, the angle of the nozzle N until it moves away from the tray T and approaches the bonding head 141, and the angle when the component S is transferred from the nozzle N to the bonding head 141 are shown in FIG. Since the states A, B, C, and D are the same, detailed description thereof is omitted.
[0085]
As described above, the component mounting apparatus 1B according to the present embodiment also controls the swing arm section 232 by the swing motor section 231 by teaching the series of operations to a computer built in the control apparatus 80. Further, the reversal of the component suction nozzle 238 can be controlled by the rotation motor 233, and a series of operations of picking up the component S from the tray T and delivering it to the bonding head 141 can be realized.
[0086]
As is apparent from the above description, a series of operations of picking up and delivering the component S can be realized by controlling the single rotation shaft with the control unit.
[0087]
【The invention's effect】
As is clear from the above description, the component mounting apparatus of the present invention is
1. The control is simple because the number of axes is small, and the device can be manufactured at low cost.
2. The amount of play during operation is reduced, the accuracy of the component suction part (pickup nozzle) is improved, and dust and chipping can be prevented when handling parts with non-contact areas such as imagers.
3. By reducing backlash during operation and improving the accuracy of parts delivery, it is possible to perform processing at the center of the angle of view with less aberration when performing image processing for position correction with a camera in the subsequent process, and the joining position of parts Improve accuracy
4). By making the swivel direction of the swivel arm coincide with the parts transfer direction, it is possible to subtract a distance twice the swivel radius from the travel distance, and as a result, the travel distance can be shortened. Since it is performed at the same time, the time for parts delivery can be shortened
5). By combining the pivoting moving shaft with the pivoting reversal shaft of the present invention, the dust generation location becomes only the respective rotating sliding portion, dust suction is easy, and the device can be cleaned.
Many excellent effects are obtained.
[Brief description of the drawings]
FIG. 1 is a top view of a partial configuration of a component mounting apparatus according to a first embodiment of the present invention.
2 is a top view of a component transfer device portion in the component mounting apparatus shown in FIG. 1; FIG.
3 shows a component reversing device in the component transfer device shown in FIG. 2. FIG. 3A is a front view thereof, and FIG. 3B is a partial sectional side view taken along line BB of FIG. .
4 is an enlarged cross-sectional view of the floating mechanism as viewed from an arrow C incorporated in the component reversing device shown in FIG. 3;
FIG. 5 is an operation explanatory diagram of the component mounting apparatus shown in FIG. 1;
FIG. 6 is a top view of a component transfer apparatus in a component mounting apparatus according to a second embodiment of the present invention.
7 is a partial cross-sectional side view on the line BB of the component transfer apparatus shown in FIG. 6;
8 is a front view seen from an arrow C shown in FIG. 7. FIG.
FIG. 9 is a cross-sectional side view of an arm floating mechanism incorporated in a swing arm unit.
FIG. 10 is an operation explanatory diagram of a component transfer apparatus in the component mounting apparatus according to the second embodiment of the present invention.
FIG. 11 is a top view of a component mounting apparatus according to an aspect of a prior application for which the present applicant has applied for a patent, as viewed from above.
12 is a side view of the component mounting apparatus shown in FIG. 11 as viewed from the arrow A side.
13 is a side view of the component mounting apparatus shown in FIG. 11, viewed from the arrow B side.
FIG. 14 is an operation principle diagram of a component suction nozzle in the component transfer apparatus.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1A ... Component mounting apparatus of 1st Embodiment of this invention, 110 ... Base, 120 ... Tray apparatus, 129 ... Stage, 130 ... Component transfer apparatus, 131 ... X-axis rail, 133 ... Component reversing apparatus, 135 ... X Axis motor, 1331 ... reversing shaft, 1332 ... component suction arm, 1334 ... reversing motor, 1335 ... spindle, 1337 ... rotating shaft, 1338 ... rotating bearing, 1342, 243 ... tension coil spring, 1343 ... limit sensor, 140 ... bonding Device 141 bonding head 150 working stage device 158 stage 160 first camera device 170 second camera device 230 component transfer device in component mounting device of second embodiment of the present invention 231... Turning motor unit, 2311. Turning motor, 2312... Frame, 2313. 2314 ... Sleeve, 232 ... Swivel arm, 233 ... Rotating motor, 2332, 2361, 2384 ... Hollow path, 234 ... Bracket, 235 ... Sleeve, 236 ... Rotating shaft, 237 ... Part suction part, 238 ... Part suction nozzle , 2381 ... rotating shaft, 2382 ... nozzle mounting reversing part, 239 ... nozzle bearing part, 2391 ... rotating bearing, N ... nozzle, P ... substrate, S ... component, T ... tray

Claims (7)

A component supply means for accommodating components to be mounted on the board face-up, a substrate mounting means for supporting a substrate on which a component from the component supply means is mounted at a predetermined position, and a component from the component supply means Component mounting means for receiving face down and mounting at a predetermined position on the board supported by the board mounting means, and picking up the components in face-up state from the component supply means and reversing the component mounting means In the component mounting device equipped with component adsorption means that delivers the component adsorbed on the face down,
The component adsorbing means approaches in a slightly upward state rather than the horizontal state until immediately before adsorbing the component accommodated in the component supplying means in a face-up state, and when adsorbing the component, the component adsorbing means is in a horizontal state. It is controlled so that it is attracted and reversed without adding a twist, and is approached in a slightly downward state from the horizontal state until just before being delivered to the component mounting means, and when it is delivered to the component mounting means, it is in a horizontal state. A component mounting method comprising transferring the predetermined component. Component supply means for accommodating components to be mounted on the board face up,
Substrate mounting means for supporting a substrate on which the component from the component supply means is mounted at a predetermined position;
Guide means extending horizontally from the component supply means to the vicinity of the substrate mounting means;
Component mounting means positioned above the substrate mounting means, receiving components from the component supply means face down, and mounting them at a predetermined position on the substrate supported by the substrate mounting means;
A component suction unit that is guided by the guide unit and sucks the component housed in the component supply unit in a face-up state; when the component is sucked, the component suction unit is reversed and delivered to the component mounting unit;
When the component adsorbing means guided by the guide means approaches the component supplying means in a slightly upward state from the horizontal state until immediately before adsorbing the components accommodated in the face-up state, When the component is picked up in the horizontal state, the component sucking unit is reversed without adding a twist, and is approached in a slightly downward state from the horizontal state until it is transferred to the component mounting unit, and is transferred to the component mounting unit. And a control means for controlling to be in a horizontal state at the time. The component adsorption means is
A pivot axis;
A component suction arm having a distal end portion of the rotating shaft and a proximal end portion attached to the outer peripheral portion thereof in a tangential direction ;
The component mounting apparatus according to claim 2, further comprising: a rotation motor that rotates the component suction arm.   The component mounting apparatus according to claim 3, wherein a floating mechanism is further incorporated in the component suction means. Component supply means for accommodating components to be mounted on the board face up,
Substrate mounting means for supporting a substrate on which the component from the component supply means is mounted at a predetermined position;
Component mounting means positioned above the substrate mounting means, receiving components from the component supply means face down, and mounting them at a predetermined position on the substrate supported by the substrate mounting means;
Adsorbing components housed face-up in the component supplying means, and adsorbing the components, the component adsorbing means is rotated and reversed at the same time, and the component adsorbing means delivered to the component mounting means,
The component adsorbing means approaches in a slightly upward state rather than the horizontal state until immediately before adsorbing the component accommodated in the component supplying means in a face-up state, and when adsorbing the component, the component adsorbing means is in a horizontal state. When adsorbed, the component adsorbing means is reversed without adding a twist, and is approached slightly downward from the horizontal state until just before being delivered to the component mounting means, and when it is delivered to the component mounting means, it is in a horizontal state. And a control means for controlling the component mounting apparatus. The component adsorption means is
A swivel arm;
Component suction means attached to the tip of the swivel arm;
A turning motor for turning the turning arm;
A rotation motor for rotating the component suction means,
The component mounting apparatus according to claim 5, wherein the swing motor is disposed at a position sufficiently below the swing arm.   The component mounting apparatus according to claim 6, wherein a floating mechanism is further incorporated in the component suction means.

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