JP2002223097A - Method and device for mounting component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a component mounting device whose installation area is small and mounting efficiency is high. SOLUTION: A component mounting device for mounting a component on a mounting body is provided with a head table part 23, which is rotated and driven intermittently, and a plurality of head parts 37A to 37D. The head parts 37A to 37D are disposed in the head table part 23 and each of which has a component holding mechanism 39. Head driving parts 38A to 38D move the head parts 37A to 37D linearly to the head table part 23.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting apparatus for mounting a component such as an electronic component on an object to be mounted such as a circuit board.
The present invention relates to a component mounting method executed by the component mounting apparatus.

[0002]

2. Description of the Related Art FIGS. 4 and 5 show an example of a conventional component mounting apparatus (rotary head type). The component mounting apparatus includes a component supply unit 1 having a plurality of component supply units 1a, a rotary head 2 having a plurality of suction nozzles 2a, and being intermittently driven by a predetermined angle by an index unit 3, and a circuit board 4. XY table 6 to be placed
And a component recognizing unit 7 and a component discarding unit 8.

By the rotation of the rotary head 2, each suction nozzle 2 a corresponds to the position corresponding to the component supply unit 1 (component holding position), the position corresponding to the component recognition unit 7 (component recognition position), and the circuit board 4. It sequentially moves to a position (component mounting position) and a position corresponding to the component discarding unit 8 (component discarding position).

First, at the component holding position, the suction nozzle 2a descends, and sucks and holds the electronic component 9 automatically supplied from any one of the component supply units 1a of the component supply unit 1. Since the position of the rotary head 2 in the horizontal direction (X direction and Y direction) is fixed, the component supply unit 1 linearly moves in the X direction by a drive motor (not shown), so that the suction nozzle 2a at the component holding position is On the other hand, one of the component supply units 1a is positioned.

Next, at the component recognition position, the electronic component 9 held by the suction nozzle 2a is imaged by the component recognizing section 7, and the quality of the holding posture of the electronic component 9 is determined based on the imaged image. . In addition, based on the captured image, a preset mounting position of the electronic component 9 on the circuit board 4, and a mounting posture of the electronic component 9 on the circuit board 4,
The movement amount of the XY table 6 and the rotation amount (correction amount) of the suction nozzle are calculated. The XY table 6 moves in the X and Y directions based on the calculated movement amount. Further, the suction nozzle 2a rotates by a predetermined angle around its axis based on the calculated rotation amount.

At the component mounting position, the suction nozzle 2a descends, and the electronic component 9 is mounted at a predetermined position on the circuit board 4. Further, at the component disposal position, the suction nozzle 2a descends, and the electronic component 9 whose holding posture is determined to be defective at the component recognition position is disposed of in the component disposal unit 8.

FIGS. 6 and 7 show another example (robot type) of the conventional component mounting apparatus. This component mounting apparatus includes a pair of heads 11A and 11B each having a plurality of suction nozzles 11a.
B can move linearly on the guide rails 12A and 12B, respectively. In addition, each head 11A, 1
1B, component supply units 13A and 13B having a plurality of component supply units 13a, and component recognition units 14A and 14
B and component disposal units 17A and 17B are provided.
The circuit board 4 is fixed to the board positioning section 18.

The heads 11A, 11B move linearly on the guide rails 12A, 12B to sequentially move to a component holding position, a component recognition position, a component mounting position, and a component disposal position.

First, in the component holding position, the head 11
After A and 11B move in the Y direction to position the suction nozzle 11a with respect to the corresponding component supply unit 13a,
The suction nozzle 11a descends to suck and hold the electronic component 9 supplied from the component supply unit 13a. This operation is repeated for each suction nozzle 11a.

Next, at the component recognition position, the component recognition unit 14
A and 14B image the electronic component 9 held by the suction nozzle 11a. Also, based on the captured image,
The determination of whether or not the holding posture of the electronic component 9 is good and the calculation of the movement amount of the head units 11A and 11B and the rotation amount of the suction nozzle 11a in consideration of the mounting position and the mounting posture of the electronic component 9 are executed. The head units 11A and 11B move in the X and Y directions based on the calculated movement amount. Further, the suction nozzle 11a rotates by a predetermined angle around its axis based on the calculated rotation amount.

At the component mounting position, the suction nozzle 11a
Moves down to mount the electronic component 9 at a predetermined position on the circuit board 4. In addition, at the component disposal position, the suction nozzle 11a descends, and the electronic component 9 whose holding posture is determined to be defective is disposed of in the component disposal units 17A and 17B.

The individual heads 11A and 11B operate as described above, respectively.
It is necessary to prevent 1B interference. Therefore, when one of the two head units 11A and 11B is performing the component suction operation at the component holding position and the component recognition operation at the component recognition position, the other is the component mounting operation at the mounting position and the component discarding position. And a component discarding operation in.

[0013]

In the rotary head type component mounting apparatus shown in FIGS. 4 and 5, the position of the rotary head 2 in the horizontal direction (X direction and Y direction) is fixed as described above. When the component supply unit 1 moves in the X direction, the component supply unit 1a is positioned with respect to the suction nozzle 2a at the component holding position. Therefore, the component supply unit 1 needs to be able to move in a relatively large moving range R from the position indicated by the solid line to the position indicated by the dotted line in the drawing. Then, in order to secure the movement range R of the component supply unit 1, an area (installation area) required for installing the component mounting apparatus becomes large. In general, the area of a factory where the component mounting apparatus is used is limited, so that the installation area of the component mounting apparatus is preferably as small as possible. In other words, if the installation area of the component mounting device is large, the productivity per unit area of the factory decreases. Further, in this component mounting apparatus, the large component supply unit 1 frequently reciprocates, so that the operation noise is large.

On the other hand, the robot type component mounting apparatus shown in FIGS. 6 and 7 has the following problems. First, the operations of the heads 11A and 11B cannot be performed simultaneously at all of the component holding position, the component recognition position, and the component disposal position. While one of the heads 11A performs the component suction operation and the component recognition operation, the other head 11B performs the component mounting operation and the component discarding operation. Since the time required for the operation is longer than the time required for the other head 11B for the component mounting operation and the component discarding operation, the head unit 11B needs to wait until the operation of the head unit 11A ends to prevent interference. Similarly, when the head unit 11B performs the component suction operation and the component recognition operation and the head unit 11A performs the component mounting operation and the component discarding operation, the head unit 11A waits until the operation of the head unit 11B ends. There is a need to. From these points, the component mounting apparatuses shown in FIGS. 6 and 7 have low mounting efficiency.

Further, as described above, the head parts 11A, 1
In order to prevent 1B interference, it is necessary to wait one of these operations until the other operation is completed, and the control program needs to realize such complicated control. Also, in the component suction operation, the individual head units 11A,
A plurality of suction nozzles 11a included in 11B suck the same electronic component 9 supplied from the same component supply unit 13a, and a case where each suction nozzle 11a suctions a different component 9 supplied from a different component supply unit 13a. Therefore, it is necessary to largely change the control program according to the layout of the component supply units 13A and 13B, that is, the type, the number, and the arrangement of the component supply units 13a included in the component supply units 13A and 13B. In these respects, the component mounting apparatus has a complicated control program.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems in the conventional component mounting apparatus, and has a reduced installation area, reduced noise, improved mounting efficiency, and simplified control programs in the component mounting apparatus. The task is to achieve

[0017]

SUMMARY OF THE INVENTION A first aspect of the present invention is a component mounting apparatus for mounting a component on an object to be mounted, the head table being intermittently driven to rotate, and arranged on the head table. A plurality of head units each having a component holding mechanism, a head driving unit that linearly moves each head unit with respect to the head table unit, and a plurality of component supply units that automatically supply the components held by the component holding mechanism. A component recognizing unit that has a fixed and installed component, a component recognizing unit that recognizes a component held by the component holding mechanism for position correction, and a cover for mounting the component held by the component holding mechanism. A mounting member positioning portion for positioning the mounting member, wherein each of the head portions is provided with the component supply portion, the component recognition portion, and the shape mounting member position by intermittent rotation of the head table portion. Sequentially moved to a position corresponding to the fit portion,
The linear movement of each head unit relative to the head table by the head drive unit includes at least a linear movement in a direction coinciding with the arrangement direction of the component supply unit when the head unit is at a position corresponding to the component supply unit, Provided is a component mounting device.

In the component recognition apparatus according to the present invention, each of the heads disposed on the head table moves linearly in the direction corresponding to the component supply unit arrangement direction when located at a position corresponding to the component supply unit. The component supply unit is fixedly installed. Therefore, there is no need to secure a moving range of the component supply unit, and the installation area of the entire apparatus can be reduced.

Also, since the component supply unit is fixed and does not move, noise during operation of the apparatus can be reduced.

Further, since a plurality of heads are arranged on the head table which is driven intermittently, each head can be simultaneously operated at a position corresponding to the component holding unit, the component recognition unit and the component mounting unit. And the mounting efficiency is high.

Further, since the respective heads are disposed on the same head table, there is no need to prevent interference between the heads by a control program. Further, even when the layout of the component supply unit is changed, it can be dealt with only by changing the control of the linear movement of the head unit in the component supply unit. Therefore, in the component recognition device of the present invention, the control program can be simplified.

It is preferable that each of the head sections includes a plurality of the component holding mechanisms. The component holding mechanism may be a suction nozzle or a mechanical chuck.

The head drive section linearly moves the head section with respect to the head table section only in a direction corresponding to the arrangement direction of the component supply unit when the head section is at a position corresponding to the component supply section. It may be the one that causes it.

Further, the head drive section includes a head drive section which moves the head section in a direction coinciding with the arrangement direction of the component supply unit when the head section is located at a position corresponding to the component supply section, and in a direction orthogonal to this direction. The section may be moved linearly with respect to the head table section. The head drive unit includes, for example, a ball screw and a servomotor that drives the ball screw.

A second invention is a component mounting method for mounting a component on an object to be mounted, wherein a plurality of heads each having a component holding mechanism and a plurality of heads each having a component holding mechanism are provided on a head table portion driven intermittently. A head drive unit for linearly moving with respect to the head table unit; a component supply unit having a plurality of component supply units for automatically supplying components; a component recognition unit; and a mounted body positioning unit. The intermittent rotation of the head table unit causes the plurality of head units to move from the component supply unit to the mounted object positioning unit via the component recognition unit, respectively, when the head unit is at a position corresponding to the component supply unit. Moving the head portion linearly in a direction coinciding with the arrangement direction of the component supply unit to position the component holding mechanism with respect to the component supply unit; The component supplied from the unit is held by the component holding mechanism, and when the head is at a position corresponding to the component recognition unit, the component held by the component holding mechanism by the component recognition unit is subjected to position correction. In order to mount the component held by the component holding mechanism on the mounted body held by the mounted body positioning unit when the image is taken and the head unit is at a position corresponding to the mounted body positioning unit. To provide a component mounting method.

[0026]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention shown in the drawings will be described in detail. (First Embodiment) FIGS. 1 and 2 show a component mounting apparatus 21 according to a first embodiment of the present invention. The component mounting apparatus 21 includes a head table 23 on a base 22,
A component supply unit 24, a component recognition unit 26, a mounted object positioning unit 27, and a component disposal unit 28 are provided.

The head table section 23 is formed of a disk disposed above the base 22 so that its axis extends in the vertical direction. An index unit 31 fixed to the base 22 by a frame 29 is disposed above the head table 23. As is well known, the index unit 31 is driven by a motor 33, and the rotating shaft 31a rotates intermittently at a predetermined angle. The head table section 23 is connected to the lower end of the rotation shaft 31a of the index unit 31 at the center C thereof. Therefore, as shown by an arrow A in FIG. 1, the head table section 23 is intermittently driven to rotate by the index unit 31. In the present embodiment, one rotation angle of the head table unit 23 is 90 degrees. The motor 33 for driving the index unit 31 includes:
An encoder 34 for detecting the rotation angle position of the head table 23 is connected. This encoder 34
Transmits the detected rotation angle to the controller 36.

Near the outer peripheral edge of the lower surface of the head table section 23, the head sections 37A to 37D and the head driving section 3 are provided.
Four sets of 8A to 38D are arranged at 90 degree intervals with respect to the center C. The head sections 37A to 37D are each provided with five suction nozzles (component holding mechanisms) 39 arranged in a line.
It has. As schematically shown in FIG.
7A to 37D, for each suction nozzle 39, a motor 41 for raising and lowering the suction nozzle 39;
42 for rotating the motor about its own axis
And a pump 43 for vacuum-suctioning the suction nozzle 39 in order to suction-hold the component at the tip of the suction nozzle 39. The motors 41 and 42 have encoders 4
4, 46 are connected respectively.

The head driving units 38A to 38D are provided with ball screws 47 screwed to the corresponding head units 37A to 37D.
And the servo motor 4 that rotationally drives the ball screw 47
8 is provided. Accordingly, when the ball screw 47 is rotationally driven by the servo motor 48, the arrow B in FIG.
As shown at 1 and B2, the heads 38A to 38D linearly move on the ball screw 47 with respect to the head table 23 in accordance with the rotation direction of the ball screw 47. The servomotor 48 has a head portion 37A on the ball screw 47,
An encoder 49 for detecting the position of 37D is connected. The encoder 49 detects the detected head unit 3
The positions of 8A to 38D are transmitted to the controller 36.

The direction in which the ball screws 47 of the head driving units 38A to 38D extend, that is, the head driving units 38A to 38D
The direction of the linear movement of the head units 37A to 37D driven by 8D is set as follows. That is,
As described later, the component supply unit 24 includes a plurality of component supply units 24a, and the component supply ports 24b of the component supply units 24a are arranged in a line on a straight line extending in the X direction as shown in FIG. And the head parts 37A to 37D
The heads 37A to 37D move in the component supply unit 2 direction.
4 is set so as to coincide with the arrangement direction of the component supply ports 24b of the component supply units 24a when located at a position corresponding to the component supply unit 24. Further, the head portions 37A to 37D
The direction of the linear movement of these heads 37A to 37D
Is aligned with the arrangement direction of the plurality of suction nozzles 39 included in the nozzle.

The component supply unit 24 is fixedly installed on a fixed base 51 provided on the base 22, and does not linearly move in any of the XYZ directions in the drawing and does not rotate. The component supply unit 24 includes a plurality of component supply units 24.
a is mounted. Each component supply unit 24a, when driven by the motor 52, automatically supplies the electronic component 53 toward the component supply port 24b as shown by an arrow D in FIG. The component supply ports 24b of the component supply unit 24a mounted on the component supply unit 24 are arranged in a line (X direction). The component supply port 24b is located below the heads 37A to 37D located at positions corresponding to the component supply unit 24.

The component supply unit 24a includes, for example,
Parts feeder, stick feeder, bulk feeder and the like. The type, number, and arrangement of the component supply units 24a mounted on the component supply unit 24 are determined by the electronic component 5
3 can be replaced according to the type of the circuit board 54 to be mounted.

The component recognition unit 26 includes a recognition camera 26a, 26b for capturing an image of the electronic component 53 sucked and held by the suction nozzle 39, and an optical system 26c for causing an image to be incident on each of the recognition cameras 26a, 26b. It has. The image of the electronic component 53 captured by the recognition cameras 26a and 26b is transmitted to a controller 36 described later.

The mounted member positioning section 27 includes a movable table 56 on which a circuit board 54 as a mounted member is mounted and held, a ball screw 57 having the movable table 56 connected to the tip thereof, and a ball screw 57. A servo motor 58 for rotational driving is provided. Therefore, when the ball screw 57 is rotationally driven by the servo motor 58,
As shown by arrows E1 and E2 in FIG.
With 4, the movable table 56 advances or retracts with respect to the center of the head table section 23. An encoder 59 for detecting the position of the movable table in the Y direction is connected to the servomotor 58.

The direction in which the ball screw 57 extends, that is, the direction in which the movable table 56 moves, is one of the heads 37A to 37D, as shown in FIG.
7, the head drive units 38A to 38A
The extension direction is set to the direction perpendicular to the direction in which the heads 37A to 37D extend linearly. Therefore, the position of the electronic component 53 sucked and held by the suction nozzle 39 in the X direction with respect to the circuit board 54 is determined by the head units 37A to 37A.
The position in the Y direction can be adjusted by the linear movement of the movable table 56.

The component discarding section 28 is formed of a box for discarding the electronic component 53 whose recognition is poor.

The controller 36 schematically shown in FIGS. 1 and 2 executes the control program to control the motors 33 and 41 based on the input signals of various sensors including the encoders 34, 44, 46, 49 and 59. , 42, 48,
The operation of the component mounting device 21 including 52 is controlled.

Next, the operation of the component mounting apparatus 21 will be described. First, the circuit board 54 is loaded onto the movable table 56 of the mounted member positioning section 27 by the board transfer device 61 schematically shown in FIG.
Fixed to

When the head table section 23 is intermittently driven to rotate by the index unit 31 as shown by the arrow A, the head sections 37A to 37D move to the position corresponding to the component supply section 24 (the component holding position ST1) and the component Recognition unit 26
(Component recognition position ST2), a position corresponding to the mounted body positioning unit 27 (component mounting position ST3), and a position corresponding to the component discarding unit 28 (component discarding position ST).
Move sequentially to 4).

In the component holding position ST1, the head 3
7A to 37D move linearly on the ball screw 47, and position the plurality of suction nozzles 39 with respect to the corresponding component supply port 24b of the component supply unit 24a. After this positioning, the suction nozzle 39 descends to hold the electronic component 53 by suction. When the suction holding is completed, the suction nozzle 39 moves up to the initial position. By repeating the above operation, the electronic components 53 are suction-held by the suction nozzles 39 of the head units 37A to 37D.

At the component recognition position ST2, the recognition cameras 26a and 26b of the component recognition unit 26 photograph the electronic component 53 sucked and held by the suction nozzle 39, and transmit the captured image to the controller 36. The controller 36 determines whether the holding posture of the electronic component 53 is good based on the received image. Further, the controller 36 controls the captured image,
Based on a preset mounting position of the electronic component 53 on the circuit board 54 and a mounting posture of the electronic component 53 on the circuit board 54, the moving amount of the movable table 56, the moving amount of the head units 37A to 37D, and the suction. The rotation amount (correction amount) of the nozzle 39 is calculated.

From the rotation of the head table 23 to the movement of the heads 37A to 37D from the component recognition position ST2 to the component mounting position ST3, the controller 36
, The suction nozzle 39 rotates by a predetermined angle around its axis.

At the component mounting position ST3, the head 3
The electronic components 53 sucked by the suction nozzles 39A to 37D are mounted on the circuit board 54 on the movable table 56. That is, the movable table 56 moves in the Y direction based on the movement amount calculated by the controller 36. The heads 37A to 37D move in the X direction based on the movement amount calculated by the controller 36. Thereafter, the suction nozzle 39 descends to mount the electronic component 53 at a predetermined position on the circuit board 54. After the mounting is completed, the suction nozzle 39
Rises to the initial position. The above operation is performed for each suction nozzle 39.
Is repeated.

At the component disposal position ST4, the electronic component 5 whose holding posture is determined to be defective by the component recognition unit 26 is determined.
3 is discarded by the component discarding unit 28. That is, by moving the head units 37A to 37D in the Y direction, the suction nozzle 39 having the holding posture defect is positioned above the component disposal unit 28, and then the suction nozzle 39 descends. The electronic component 53 is released and dropped from the suction nozzle 39 to the component disposal section 28.

Each of the heads 37A to 37D is located at the component holding position ST1, component recognition position ST2, component mounting position ST.
3, and the operation at the component disposal position ST4 is repeated a predetermined number of times, whereby all the predetermined electronic components 53 are mounted on the circuit board 54. Thereafter, the circuit board 54 is moved by the board transfer device 61 to the movable table 56 of the mounted body positioning portion 27.
It is carried out from.

As described above, the component mounting apparatus 2 of the present embodiment
In 1, the head units 37A to 37D disposed on the head table unit 23 are controlled by head driving units 38A to 38D.
At the component supply position ST1, the component supply unit 24 is fixedly installed because the component supply unit 24 moves linearly in a direction coincident with the arrangement direction of the component supply unit 24a. Therefore, unlike the rotary type component mounting apparatus shown in FIGS.
There is no need to secure the movement range of the device 4, and the installation area of the entire apparatus can be reduced.

For example, suppose that the component supply unit has 150 component supply units at a pitch of 16 mm. In this case, in the case of the rotary type component mounting apparatus shown in FIGS. 4 and 5, the size of the component supply section is about 2.4 m, and the moving range needs to be about 5 m which is twice or more of this dimension. Then, in order to secure this moving range, the installation area of the apparatus becomes large. On the other hand, in the component mounting apparatus of the present embodiment, only the installation area corresponding to the dimension of the component supply unit needs to be secured, and the installation area can be reduced.

Unlike the rotary head type component mounting apparatus, the component supply unit 24 is fixed and does not move, so that noise during operation of the apparatus can be reduced.

Further, since a plurality of heads 37A to 37B are arranged on the head table 23 which is driven intermittently, each head is different from the robot type component mounting apparatus shown in FIGS. 37A to 37D are the component holding position ST1, the component recognition position ST2, the component mounting position ST3,
And at the parts disposal position ST4. In this regard, the component mounting apparatus 21 of the present embodiment has a high mounting efficiency.

Further, since each of the heads 37A to 37D is disposed on the same head table 23, unlike the robot type component mounting apparatus, the heads 37A to 37D are provided.
It is not necessary to prevent the interference between .about.37D with a control program executed by the controller 36. Further, even when the layout of the component supply unit 24, that is, the type, the number, and the arrangement of the component supply units 24a included in the component supply unit 24 are changed, unlike the robot-type component mounting apparatus, the component supply unit 24a at the component holding position ST1. Head part 37A ~
This can be dealt with simply by changing the 37D linear movement control. Therefore, in the component recognition device 21 of the present embodiment, the control program can be simplified.

(Second Embodiment) FIG. 3 shows a component mounting apparatus 21 according to a second embodiment of the present invention. This second
The component mounting device 21 according to the embodiment includes a head driving unit 38.
The structures of A to 38D are different from those of the first embodiment. That is, the head units 37A to 37D are moved in the first direction that coincides with the arrangement direction of the component supply ports 24b of the component supply unit 24a when the head table unit 23 is at the component holding position ST1.
In addition to the ball screw 47 and the servomotor 48 for linearly moving the head drive units 38A to 38D,
Another ball screw 147 and a servo motor 148 for linearly moving the ball screw 47 and the servo motor 48 in a direction orthogonal to the first direction are provided. The servo motor 148 is connected to an encoder 149 for detecting the positions of the ball screw 47 and the servo motor 48 on the ball screw 147, that is, the positions of the heads 37A to 37D in the extending direction of the ball screw 147. The encoder 149 detects the head units 37A to 37A
The position of D is transmitted to the controller 36.

In the component mounting apparatus according to the second embodiment, as described above, each of the heads 37A to 37D is
3 can be moved linearly in two directions orthogonal to each other.

Since the other configuration and operation of the second embodiment are the same as those of the first embodiment, the same components are denoted by the same reference numerals and description thereof is omitted.

The present invention is not limited to the above embodiment, and various modifications are possible. For example, the head unit may include a mechanical chuck as the component holding mechanism instead of the suction nozzle. Further, the component disposal section may include a transport conveyor for transporting the component with the poor recognition from the apparatus.

[0055]

As is apparent from the above description, in the component mounting apparatus according to the present invention, when the head is located at a position corresponding to the component supply unit, each head unit disposed on the head table unit is connected to the component supply unit. The component supply unit moves linearly in a direction coinciding with the arrangement direction, and the component supply unit is fixedly installed. Therefore, it is not necessary to secure the moving range of the component supply unit, and it is possible to reduce the installation area of the entire apparatus and reduce noise during operation of the apparatus.

Since a plurality of heads are arranged on the head table which is driven intermittently, each head can be simultaneously operated at a position corresponding to the component holding unit, the component recognition unit and the component mounting unit. Thus, the mounting efficiency can be improved.

Further, since each head section is disposed on the same rotary head, it is not necessary to prevent interference between the head sections by a control program. Further, even when the layout of the component supply unit is changed, it can be dealt with only by changing the control of the linear movement of the head unit in the component supply unit. In these respects, the component recognition device of the present invention can simplify the control program.

[Brief description of the drawings]

FIG. 1 is a plan view showing a component mounting apparatus according to a first embodiment of the present invention.

FIG. 2 is a view of the component mounting apparatus according to the first embodiment of the present invention as viewed in the direction of arrow II in FIG. 1;

FIG. 3 is a plan view showing a component mounting apparatus according to a second embodiment of the present invention.

FIG. 4 is a plan view showing an example of a conventional component mounting apparatus.

FIG. 5 is a front view showing an example of a conventional component mounting apparatus.

FIG. 6 is a plan view showing another example of the conventional component mounting apparatus.

FIG. 7 is a plan view showing another example of the conventional component mounting apparatus.

[Explanation of symbols]

 23 Head Table Unit 24 Component Supply Unit 24a Component Supply Unit 24b Component Supply Port 26 Component Recognition Unit 26a, 26b Recognition Camera 26c Optical System 27 Mounted Body Positioning Unit 28 Component Discard Unit 31 Index Unit 33, 41, 42, 52 Motor 34 , 44, 46, 49, 59, 149 Encoder 36 Controller 37A, 37B, 37C, 37D Head unit 38A, 38B, 38C, 38D Head drive unit 39 Suction nozzle 47, 57, 147 Ball screw 48, 58, 148 Servo motor 53 Electronic Components 54 Circuit board 56 Movable table 61 Board transfer device

 ──────────────────────────────────────────────────の Continuing on the front page (72) Minoru Yamamoto 1006 Kazuma Kadoma, Kadoma City, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. Inside the company (72) Inventor Hiroshi Ota 1006 Kadoma, Kadoma, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. 3F072 AA14 GA03 GA10 GD09 GE05 KC01 KC07 KC10 KC12 KC17 5E313 CC04 CD02 CD06 DD00 EE03 EE24 EE25 EE37 FF24 FF28

Claims (6)

[Claims] 1. A component mounting apparatus for mounting a component on an object to be mounted, comprising: a head table section that is intermittently driven to rotate; and a plurality of head sections provided on the head table section and each having a component holding mechanism. A head drive unit that linearly moves each head unit with respect to the head table unit; and a plurality of component supply units that automatically supply components held by the component holding mechanism, wherein the component supply unit is fixedly installed. A component recognition unit that recognizes a component held by the component holding mechanism for position correction, and a mounted body positioning unit that positions the mounted body to mount the component held by the component holding mechanism. The respective head units are sequentially moved to positions corresponding to the component supply unit, the component recognition unit, and the positioning unit for the shape-mounted object by intermittent rotation of the head table unit. The linear movement of each head unit with respect to the head table by the head drive unit is a linear movement in a direction coinciding with the arrangement direction of the component supply unit when the head unit is at a position corresponding to the component supply unit. A component mounting device including at least. 2. The component mounting apparatus according to claim 1, wherein each of said head units includes a plurality of said component holding mechanisms. 3. The component holding mechanism is a suction nozzle.
The component mounting device according to claim 1. 4. The head drive unit moves the head unit relative to the rotary head unit only in a direction coinciding with the arrangement direction of the component supply unit when the head unit is at a position corresponding to the component supply unit. The component mounting apparatus according to claim 1, wherein the component mounting apparatus moves linearly. 5. The head drive unit includes: a head unit configured to move a head in a direction coinciding with an arrangement direction of the component supply unit when the head unit is at a position corresponding to the component supply unit, and in a direction orthogonal to the direction. The component mounting apparatus according to any one of claims 1 to 3, wherein the part is moved linearly with respect to the rotary head part. 6. A component mounting method for mounting a component on an object to be mounted, comprising: a head table section driven intermittently; a plurality of head sections each having a component holding mechanism; and each head section being a head table section. A head drive unit for linearly moving the head table unit; a component supply unit having a plurality of component supply units for automatically supplying components; a component recognition unit; and a mounted body positioning unit. By the intermittent rotation, the plurality of heads are respectively moved from the component supply unit to the mounted object positioning unit via the component recognition unit, and when the head unit is at a position corresponding to the component supply unit, the component supply is performed. After the head portion is linearly moved in a direction coinciding with the arrangement direction of the units to position the component holding mechanism with respect to the component supply unit, the component supply unit The components supplied by the component holding mechanism are held by the component holding mechanism. When the head unit is at a position corresponding to the component recognition unit, the component held by the component holding mechanism by the component recognition unit is used for position correction. When the head unit is at a position corresponding to the mounted body positioning unit, the component held by the component holding mechanism is mounted on the mounted body held by the mounted body positioning unit. Component mounting method.