JP2007201060A - Electronic part mounting equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide electronic part mounting equipment capable of precisely aligning a part mounting head, with a simple structure. <P>SOLUTION: The electronic part mounting equipment mounts an electronic part on a substrate; and comprises a rotatable arm 2 whose one end is pivoted, and an arm rotation driver 3 which is arranged in the direction across the rotational moving range of the arm 2. The arm 2 is attached with a part mounting head 5 which is movable in its lengthwise direction, and comprises a head driver 6 which shifts the part mounting head 5. The arm 2 is connected to the arm rotation driver 3 by way of a link slidable in the direction across the rotational moving range of the arm 2. The arm 2 is rotated as the arm rotation driver 3 makes the link slide. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an electronic component mounting apparatus for mounting an electronic component on a substrate, and more particularly to an electronic component mounting apparatus that performs a two-dimensional operation by rotating an arm and sliding a component mounting head.

In general, an electronic component mounting apparatus that moves and mounts electronic components such as ICs and transistors from a component supply unit to a predetermined position on a substrate is used. The electronic component mounting apparatus has a component mounting head that picks up and conveys an electronic component. The electronic component mounting apparatus uses an XY robot that moves the component mounting head in the X direction and the Y direction, which are two orthogonal directions in a horizontal plane. Move dimensionally. The component mounting head is moved to the component supply unit by the XY robot to suck the electronic component, and is further moved to a predetermined position on the substrate by the XY robot to mount the electronic component on the substrate. As such an electronic component mounting apparatus, for example, there is an apparatus described in Patent Document 1.
JP-A-8-116200

  It is necessary to arrange electronic components on a substrate with high accuracy. Therefore, in an XY robot used for moving a component mounting head, it is necessary that there is no wobbling in two directions. In particular, the component mounting head is fixed to the tip of the moving table in the Y direction, and in order to be able to move stably along with the movement of the moving table in the X direction, It is necessary to make the structure of the moving table large. Thus, in the conventional electronic component mounting apparatus, the apparatus becomes large and expensive.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide an electronic component mounting apparatus capable of highly accurate positioning of a component mounting head with a simple structure.

In order to solve the above problems, an electronic component mounting apparatus according to the present invention is an electronic component mounting apparatus for mounting an electronic component on a substrate.
An arm that is pivotally supported at one end and an arm rotation drive unit that is disposed in a direction crossing the range of rotation of the arm;
A component mounting head that is movable in the longitudinal direction is attached to the arm, and has a head drive unit that moves the component mounting head, and the arm is a linkage that is slidable in a direction that traverses the rotational movement range of the arm. The arm rotation drive unit is connected to the arm rotation drive unit via a portion, and the arm rotation drive unit rotates the arm as the link unit slides.

  In the electronic component mounting apparatus according to the present invention, the component mounting head includes a suction head capable of sucking the electronic component, and the suction head can adjust the orientation of the electronic component according to the rotation angle position of the arm. It is configured to be rotatable with respect to the component mounting head.

  Furthermore, in the electronic component mounting apparatus according to the present invention, the linkage part includes a linear guide that is slidable in the longitudinal direction of the arm, and a bearing part that rotatably connects the arm rotation driving part and the linear guide. It is configured as a feature.

  The electronic component mounting apparatus according to the present invention includes an arm that is pivotally supported at one end and an arm rotation drive unit that is disposed in a direction crossing the range of rotation of the arm. A component mounting head that is movable in the longitudinal direction is mounted, and the arm is connected to the arm rotation drive unit via a linkage unit that is slidable in a direction crossing the range of rotation of the arm, and the arm rotation drive unit is linked. By rotating the arm as the part slides, one end of the arm is pivotally supported and only the other end is rotated. Therefore, the arm can be stably supported with a simple structure. In addition, since the arm can be rotated by the arm rotation drive unit that performs the sliding operation, the arm can be stably rotated, and as a result, high-precision component mounting can be performed with a simple structure. it can.

  Further, according to the electronic component mounting apparatus of the present invention, the component mounting head includes the suction head that can suck the electronic component, and the suction head can adjust the orientation of the electronic component according to the rotation angle position of the arm. By being rotatable with respect to the component mounting head, the electronic component can be adjusted to an appropriate orientation even when a rotating arm is used.

  Furthermore, according to the electronic component mounting apparatus according to the present invention, the linkage portion includes a linear guide that is slidable in the longitudinal direction of the arm, and a bearing portion that rotatably connects the arm rotation driving portion and the linear guide. The arm rotation drive unit can smoothly rotate the arm by causing the linkage unit to slide in the direction crossing the range of movement of the arm.

  Embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a plan view of the electronic component mounting apparatus according to the present embodiment, and FIG. 2 is a front view of the electronic component mounting apparatus according to the present embodiment. The electronic component mounting apparatus according to the present embodiment picks up the electronic component 60 from the component supply unit 10 disposed on the table 1 and is on the substrate 61 mounted on the substrate transport unit 11 that is also disposed on the table 1. The electronic component 60 is moved and mounted at a predetermined position.

  As shown in FIGS. 1 and 2, the electronic component mounting apparatus according to the present embodiment includes an arm 2 that is pivotally supported at one end by a table 1 and is rotatable in a planar manner, and a rotational movement of the arm 2 on the table 1. The arm 2 is provided with a long and narrow arm rotation drive unit 3 arranged in a direction crossing the range. Further, the arm 2 is provided with a component mounting head 5 which is movable in the longitudinal direction thereof, and as shown in FIG. And the arm rotation drive unit 3 are connected via a linkage unit 4.

  The arm 2 is rotatably supported by the table 1 via the shaft support portion 20, and can rotate within a predetermined angle range around the shaft support portion 20 in a state parallel to the plane of the table 1. The arm 2 can be rotated in a range from an angular position indicated by a solid line to an angular position indicated by an imaginary line in FIG. As shown in this figure, the component mounting head 5 moves in the circumferential direction around the shaft support 20 as the arm 2 rotates. Therefore, the arm 2 can move over its entire width when the component mounting head 5 is at the position of the component supply unit 10, and when the component mounting head 5 is at the position of the substrate transport unit 11, It can be rotated within an angular range that can move across the region.

  The arm rotation drive unit 3 is long and linear as a whole, and is disposed in a direction crossing the range of rotation of the arm 2 and is exposed from the surface and moves along the longitudinal direction of the arm rotation drive unit. A movable table 3a, an arm drive motor 3b provided at one end of the guide unit 3, a screw screw (not shown) provided inside and rotatable by the arm drive motor 3b, and a screw screw provided on the table 3a. It is mainly composed of a matching ball screw (not shown) and a groove 3c for guiding the moving table 3a. With the above configuration, when the arm drive motor 3b is operated, the movable table 3a slides along the longitudinal direction of the arm rotation drive unit 3.

  The linkage part 4 that connects the arm 2 and the arm rotation drive part 3 is rotatable with respect to the arm 2 and slidable in the longitudinal direction, and is rotatable with respect to the arm rotation drive part 3a. It is what is said.

  FIG. 4 shows an enlarged perspective view of the vicinity of the linkage part 4. As shown in this figure, the linkage part 4 includes a linear guide part 42 slidable along the longitudinal direction of the arm 2, and a bearing part 41 that rotatably connects the linear guide part 42 and the arm rotation driving part 3. It is configured.

  A link guide rail 22 is provided on the lower surface of the arm 2 in the vicinity of the link portion 4, and the linear guide portion 42 of the link portion 4 can slide in the longitudinal direction of the arm 2 along the link portion guide rail 22. it can. The bearing portion 41 includes two rotating members that can rotate with respect to each other. One rotating member is fixed to the linear guide portion 42, and the other rotating member is a moving base 3 a of the arm rotation driving unit 3. It is fixed to. With these configurations, when the arm drive motor 3b of the arm rotation drive unit 3 slides the movable table 3a in a direction across the rotation range of the arm, the linkage unit 4 fixed to the movable table 3a also slides integrally. The arm 2 connected via the bearing portion 41 and the linear guide portion 42 of the linkage portion 4 rotates about the shaft support portion 20 while changing the angle and the longitudinal position with respect to the moving base 3a. In this way, the arm 2 is pivoted about the shaft support portion 20 as the arm rotation drive unit 3 slides on the linkage unit 4.

  Further, the arm 2 can be rotated in a range from an angular position indicated by a solid line to an angular position indicated by an imaginary line in FIG. Therefore, the arm 2 can move over its entire width when the component mounting head 5 is at the position of the component supply unit 10, and when the component mounting head 5 is at the position of the substrate transport unit 11, It can be rotated within an angular range that can move across the region.

  The component mounting head 5 that is movable in the longitudinal direction of the arm 2 is mounted on the head mounting portion 31 that is movable with respect to the head base 30, a head mounting portion 31 that is movable up and down with respect to the head base 30, and the head mounting portion 31. A suction head 32 that sucks the electronic component 60 is provided, and the head 31 can move up and down with respect to the head mounting portion 31 and can also rotate.

  The head base 30 is engaged with a head guide rail 2a provided on the side surface of the arm 2 along the longitudinal direction thereof, and can slide along the longitudinal direction of the arm along the head guide rail 2a. Further, a head base drive motor 2b is built in a position near the shaft support portion 20 of the arm 2, and a screw screw (not shown) that can be rotationally driven by the head base drive motor 2b is provided inside the arm 2. When a ball screw (not shown) provided in the base 30 is provided and the head base drive motor 2b is operated, the head base 30 can be slid through the screw screw and the ball screw. In other words, the arm 2 and the head base 30 constitute a head driving unit that moves the component mounting head 5.

  The component mounting head 5 sucks the electronic component 60 by the component supply unit 10 by the sliding operation in the longitudinal direction of the arm 2 of the head base 30 and the rotating operation of the arm 2 accompanying the sliding operation of the arm rotation driving unit 3. The suction head 32 can be moved two-dimensionally within a range where the electronic component 60 is mounted on the substrate 61. Since the arm 2 is pivotally supported at one end and rotated at the other end, it can be stably supported and driven with a simple structure, and a movable table that is slid by the arm rotation drive unit is connected via the linkage unit 4. Since the arm 2 is connected to the arm 2 and the arm 2 is rotated by the sliding operation of the linkage part 4, the suction head 32 can be operated in a planar manner with a simple configuration while stably supporting the arm 2. .

  The head base 30 is provided with a substrate position detection camera 38. The board position detection camera 38 detects the lower part of the head base 30 as an image. The board position detection camera 38 detects an outer shape and an M pattern at a predetermined position of the board 61 as an image, and the component mounting head 5 is attached to the board 61 by an image recognition method. Used to accurately align with respect to the other.

  FIG. 5 shows an enlarged front view of the component mounting head 5. The head mounting portion 31 is connected to a mounting portion vertical drive motor 36 provided on the head base 30 via a screw portion 37, and the head base 30 is connected via the screw portion 37 in accordance with the operation of the mounting portion vertical drive motor 36. It is designed to move up and down.

  Three suction heads 32 are attached to the head mounting portion 31, and a head vertical drive motor 33 is provided above each suction head 32. The suction head 32 can move up and down with respect to the head mounting portion 31 by the operation of the head vertical drive motor 33. Further, the suction head 32 can suck air at the distal end portion 32a, and thereby the electronic component 60 can be sucked.

  Further, the head mounting portion 31 is provided with a head rotation drive motor 34, and the three suction heads 32 can be rotated via the belt 35. Each suction head 32 is provided with a pulley 32b at the same height as the pulley 34a provided on the rotation shaft of the head rotation drive motor 34, and the belt 35 is hung on these pulleys 32b and 34a, so that the head The rotation drive motor 34 and each suction head 32 are linked.

  FIG. 6 is an enlarged bottom view of the component mounting head. As shown in this figure, the pulley 34a of the head rotation drive motor 34 and the pulley 32b of each suction head 32 are arranged in a line, and between the pulleys 32b and 34a, the head mounting portion 31 is rotatable. A pressing rotation shaft 39 is provided. The belt 35 is hung on the pulleys 32b and 34a, and between the pulleys 32b and 34a, the belt 35 is pressed inward by the pressing rotary shaft 39 and is in a tensioned state. When the motor 34 rotates in this state, the pulley 32b rotates via the belt 35, and the suction heads 32 rotate simultaneously. The suction head 32 is rotated with respect to the head mounting portion 31 in order to accurately adjust the orientation of the sucked electronic component 60.

  As the arm 2 rotates, the direction of the suction head 32 changes at any time depending on the rotation angle position of the arm 2. The arrangement of the electronic component 60 on the substrate 61 requires not only an accurate position but also an accurate orientation. Therefore, when the suction head 32 sucks the electronic component 60 and when the electronic component 60 is mounted on the substrate 61 from the suction head 32, the rotation angle position of the arm 2 is detected, and the suction head 32 is rotated accordingly. By rotating the drive motor 34 to change the direction, the electronic component 60 is set in a predetermined direction.

  Next, recognition of the electronic component 60 sucked by the suction head 32 will be described. As shown in FIGS. 1 and 2, the component recognition camera 50 is attached to the arm 2 so that the component recognition camera 50 faces upward between the tip on the component supply unit 10 side and the attachment position of the linkage unit 4. Further, the upper end of the component recognition camera 50 is below the tip 32a of the suction head 32 in the component mounting head 5, and when the component mounting head 5 moves from the component supply unit 10 to the substrate 61 of the substrate transport unit 11, The electronic component 60 sucked by the suction head 32 can be photographed from below.

  The position of the component recognition camera 50 on the arm 2 is not limited to the above, and may be between the end of the component supply unit 10 on the substrate 61 side and the end of the substrate 61 on the component supply unit 10 side. More precisely, in a range in which the suction head 32 slides along the arm 2 as the head base 30 moves, a range for the suction head 32 to suck the electronic component 60 of the component supply unit 10, and a suction head Except for the range 32 for mounting the electronic component 60 on the substrate 61, the suction head 23 in the slide movement range of the suction head 32 between them may be attached to a position on the arm 2 where the image can be taken.

  The component recognition camera 50 is mounted on a camera mounting portion 51 that is fixed so as to hang down from the arm 2, and is disposed at a position that does not interfere with the component mounting head 5. In this case, since the lower end portion of the component recognition camera 50 extends below the upper surface of the table 1, the camera storage groove 12 is formed on the table 1 so as not to interfere with the component recognition camera 50. The camera storage groove 12 is formed on the upper surface of the table 1 over a range that does not interfere with the component recognition camera 50 in any of the rotation ranges of the arm 2.

  Further, a light source 52 is provided on the upper part of the component recognition camera 50 so as to surround the component recognition camera 50, so that the electronic component 60 passing above the component recognition camera 50 can be irradiated with light.

  By taking an image of the electronic component 60 with the component recognition camera 50, a displacement of the suction position and a displacement of the electronic component 60 with respect to the nozzle 32 (planar electronic component rotational displacement) are detected. The displacement of the suction position and orientation of the electronic component 60 with respect to the nozzle 32 is the displacement of the position and orientation angle in the X and Y directions from the center of the electronic component 60 when the nozzle 32 attracts the electronic component 60 in the component supply unit 10. When the electronic component 60 is mounted on the substrate 61, the displacement detected by the component recognition camera 50 is corrected and aligned, so that the electronic component 60 is positioned with high accuracy with respect to the substrate 61. Can be installed together.

  Since the component recognition camera 50 is provided between the component supply unit 10 side and the substrate 61 side in the arm 2, while the component mounting head 5 picks up the electronic component 60 from the component supply unit 10 and moves it to the substrate 61. It is in a position that must pass through. Therefore, it is not necessary to cause the arm 2 to perform an operation for component recognition, and the arm 2 can rotate the suction head 32 to the mounting position of the electronic component 60 on the substrate 61 immediately after picking up the electronic component 60. Since it suffices to move to the angular position, the electronic component 60 can be mounted at high speed.

  The electronic component mounting apparatus of the above embodiment operates as follows. The arm 2 operates according to a program installed in the microcomputer of the apparatus. The arm rotation driving unit 3 and the head driving unit 6 follow the program so that the suction head 32 is positioned at a position where the predetermined electronic component 60 positioned at a predetermined position of the component supply unit 10 can be sucked. Move. While the head base 30 moves on the arm 2, the head mounting portion 31 is moved upward by the mounting portion vertical drive motor 36, and the suction head 32 moves to the component recognition camera 50 when the head base 30 moves. There is no collision.

  When the suction head 32 reaches a position where the predetermined electronic component 60 can be sucked and the movement of the arm 2 and the head base 30 is completed, the head mounting portion 31 is moved to a predetermined position by the mounting portion vertical drive motor 36, and the electronic by the suction head 32. The component 60 is lowered to the preparation position for execution. Next, the suction head 32 at a position where the predetermined electronic component 60 can be sucked is lowered by the head vertical drive motor 33 to suck the predetermined electronic component 60, and then the suction head 32 is raised by the head vertical drive motor 33. At this time, the angle of the arm 2 is stored, and this angle indicates the angle of the direction of the suction head 32 with respect to the arm 2.

  When the three suction heads 32 each complete the suction of the electronic component 60, the head mounting portion 31 is raised by the mounting portion vertical drive motor 36. The angle data of the arm 2 is stored for each suction head 32. The arm rotation drive unit 3 and the head drive unit 6 follow the program to move the suction head 32 to the component mounting position on the substrate 61 so as to mount each sucked component 60 on the substrate 61. 30 is driven.

  When the head base 30 moves on the arm 2, the suction head 32 of the component mounting head 5 passes over the component recognition camera 50. At this time, the first one of the suction heads 32 is the center position of the component recognition camera 50. When it reaches, it stops for a short time required for shooting. At the time of this stop or before the stop, the suction head 32 that sucks the electronic component 60 is rotated by the head rotation drive motor 34 based on the angle data and positioned parallel to the arm 2. In this state, the state of the electronic component 60 is photographed by the component recognition camera 50, and the positional deviation and orientation deviation of the electronic component 60 are measured and stored as data from the image. When this operation is completed for the three suction heads 32, the head base 30 resumes sliding on the arm 2 and stops when reaching the target position, and the head mounting portion 31 is prepared by the mounting portion vertical drive motor 36. Lower to position. At this time, the substrate position detection camera 38 captures a predetermined position of the substrate 60 and confirms the substrate 61 or the mounting position of the substrate 61. The angle of the arm 2 at this time is also measured.

  The angle of the arm 2 and the position of the head base 30 are finely adjusted from the data obtained from the image of the substrate position detection camera 38 and the positional deviation data of the electronic component 60 on the suction head 32, and the angle of the arm 2 and the suction Based on the data of the deviation of the direction of the electronic component 60 on the head 32, the head rotation driving motor 34 rotates the suction head 32 to adjust the direction.

  Next, the first component suction head 32 is lowered by the head vertical drive motor 33 and is raised after the electronic component 60 is attached on the substrate 61. 3 When the same operation is repeated for this suction head 32, one cycle of operation is completed. However, the individual operations do not necessarily have to be performed in the above order, and the order may be partially changed or omitted. For example, the position adjustment of the suction head 32 before photographing with the component recognition camera 50 is performed. The orientation of the suction head 32 may be adjusted in combination with the angle data of the arm 2 before mounting the electronic component 60 on the substrate 61.

  Since the component recognition camera 50 is provided between the component supply unit 10 side and the substrate 61 side in the arm 2, while the component mounting head 5 picks up the electronic component 60 from the component supply unit 10 and moves it to the substrate 61. It is in a position that must pass through. Therefore, it is not necessary to cause the arm 2 to perform an operation for component recognition, and the electronic component 60 can be mounted at a high speed.

  Although the embodiment of the present invention has been described above, the application of the present invention is not limited to this embodiment, and can be applied in various ways within the scope of its technical idea. For example, the head drive mechanism of the head drive unit 6 described above or the arm drive mechanism of the arm drive unit 7 is not limited to the above configuration, and a general linear slide mechanism, a belt drive mechanism, and other general mechanisms may be used. Applicable.

It is a top view of the electronic component mounting apparatus in this embodiment. It is a front view of the electronic component mounting apparatus in this embodiment. It is the top view which showed the state which the arm rotated from the state of FIG. It is an expansion perspective view near a linkage part. It is an enlarged front view of a component mounting head. It is an enlarged bottom view of a component mounting head.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Table 2 Arm 3 Arm rotation drive part 3a Moving stand 4 Linking part 5 Component mounting head 6 Head drive part 10 Component supply part 11 Substrate conveyance part 20 Shaft support part 30 Head base (a part of head drive part)
31 Head mounting portion 32 Adsorption head 41 Bearing portion 42 Linear guide 50 Component recognition camera 60 Electronic component 61 Substrate

Claims (3)

In an electronic component mounting apparatus for mounting electronic components on a substrate,
An arm that is pivotally supported at one end and an arm rotation drive unit that is disposed in a direction crossing the range of rotation of the arm;
A component mounting head that is movable in the longitudinal direction is attached to the arm, and has a head drive unit that moves the component mounting head, and the arm is a linkage that is slidable in a direction that traverses the rotational movement range of the arm. An electronic component mounting apparatus, wherein the electronic device mounting apparatus is connected to the arm rotation driving unit via a portion, and rotates the arm as the arm rotation driving unit slides on the linkage unit.   The component mounting head includes a suction head that can suck an electronic component, and the suction head is rotatable with respect to the component mounting head so that the orientation of the electronic component can be adjusted according to the rotation angle position of the arm. The electronic component mounting apparatus according to claim 1.   3. The electronic device according to claim 1, wherein the linkage portion includes a linear guide that is slidable in a longitudinal direction of the arm, and a bearing portion that rotatably connects the arm rotation driving unit and the linear guide. Component mounting equipment.

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