KR20070078068A - Electronic device mounting apparatus - Google Patents

Abstract

An electronic device mounting apparatus is provided to load a device with high precision by performing stably a rotating operation of an arm. An electronic device mounting apparatus mounts an electronic device on a substrate. The electronic device mounting apparatus includes a rotatory arm(2) supported by a shaft and an arm rotation driver(3) arranged across a rotating range of the arm. A device mounting head(5) is installed in a longitudinal direction of the arm. The arm includes a head driver(6) for moving a device loading head. The arm is connected through a slidable relay unit to the arm rotation driver so that the arm rotation driver rotates the arm by sliding the relay unit.

Description

Electronic component mounting device {ELECTRONIC DEVICE MOUNTING APPARATUS}

1 is a plan view of an electronic component mounting apparatus according to the present embodiment;

2 is a front view of the electronic component mounting apparatus according to the present embodiment;

3 is a plan view showing a state in which the arm is rotated from the state of FIG. 1;

4 is an enlarged perspective view of the vicinity of the linkage;

5 is an enlarged front view of the component mounting head,

6 is an enlarged bottom view of the component mounting head.

※ Explanation of code for main part of drawing

1: Table 2: Arm

3: arm rotation drive part 3a: moving table

4: linking portion 5: component mounting head

6: head drive part 10: parts supply part

11: board | substrate conveyance part 20: shaft support part

30: head base portion (part of the head drive portion)

31 head mounting portion 32 suction head

41: bearing part 42: linear guide

50: part recognition camera 60: electronic components

61: substrate

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus for mounting an electronic component on a substrate, and more particularly, to an electronic component mounting apparatus that performs two-dimensional operation by rotating the arm and sliding the component mounting head.

BACKGROUND ART Electronic component mounting devices for moving and mounting electronic components such as ICs and transistors to a predetermined position on a substrate from a component supply portion are generally used. The electronic component mounting apparatus has a component mounting head which absorbs and conveys electronic components, and is two-dimensionally by an XY robot which moves the component mounting head in the X and Y directions, which are two directions orthogonal to each other in the horizontal plane. Move it. The component mounting head moves to the component supply part by the XY robot to attract the electronic component, and then moves to the predetermined position on the substrate by the XY robot to mount the electronic component on the substrate. As such an electronic component mounting apparatus, there exist some which were described in patent document 1, for example.

[Patent Document 1]

Japanese Patent Application Laid-Open No. 8-116200

The arrangement of the electronic components on the substrate needs to be performed with high accuracy, and therefore, in the XY robot used for the movement of the component mounting head, it is necessary to have no rattling in two directions. In particular, the component mounting head is fixed to the distal end of the movement table in the Y direction, and in order to enable it to move stably in accordance with the movement of the movement table in the X direction, it is necessary to make the structure of the movement table in the X direction large. . As described above, in the conventional electronic component mounting apparatus, the apparatus has become large and expensive.

This invention is made | formed in view of the said subject, and an object of this invention is to provide the electronic component mounting apparatus which can perform high precision positioning of a component mounting head with a simple structure.

In order to solve the said subject, the electronic component mounting apparatus which concerns on this invention is an electronic component mounting apparatus which mounts an electronic component on a board | substrate,

One end of which is axially supported and freely rotatable, and an arm pivot drive unit arranged in a direction crossing the rotational movement range of the arm,

The arm is provided with a component mounting head freely movable in the longitudinal direction thereof, the arm having a head driving portion for moving the component mounting head, and the arm pivots through the linkage freely sliding in a direction crossing the rotational movement range of the arm. The arm pivoting drive unit rotates the arm as the arm pivoting drive unit slides the linkage unit.

In addition, the electronic component mounting apparatus according to the present invention, wherein the component mounting head is provided with a suction head that is free to suck the electronic component, the suction head is the component so that the direction of the electronic component can be adjusted according to the rotation angle position of the arm It is comprised characterized by being rotatable with respect to a mounting head.

Moreover, the electronic component mounting apparatus which concerns on this invention is comprised, The said link part consists of the linear guide which slides freely in the longitudinal direction of the arm, and the bearing part which rotatably connects the arm rotation drive part and a linear guide.

Embodiments of the present invention will be described in detail with reference to the drawings. 1, the top view of the electronic component mounting apparatus in this embodiment is shown, and FIG. 2 is the front view of the electronic component mounting apparatus in this embodiment. The electronic component mounting apparatus in this embodiment lifts the electronic component 60 from the component supply part 10 arrange | positioned on the table 1, and is mounted in the board | substrate conveyance part 11 arrange | positioned on the table 1 similarly. The electronic component 60 is moved and mounted to a predetermined position on the substrate 61.

As shown in FIG. 1, FIG. 2, in the electronic component mounting apparatus of this embodiment, the arm 2 of which the one end is axially supported by the table 1, and is rotatable planarly, and the arm 2 on the table 1 are shown. An elongate arm pivot drive section 3 arranged in a direction transverse to the pivoting range is provided, and the arm 2 is provided with a component mounting head 5 which is free to move in its longitudinal direction and is shown in FIG. 2. As described above, the arm 2 and the arm rotation drive unit 3 are connected via the linking unit 4.

The arm 2 is rotatably supported by the table 1 via the shaft support part 20, and can be rotated in a predetermined angle range about the shaft support part 20 in a state parallel to the plane of the table 1. have. The arm 2 can rotate in the range from the angle position shown by the solid line in FIG. 3 to the angle position shown by the imaginary line. As shown in this figure, the component mounting head 5 moves in the circumferential direction centering on the axial support part 20 as the arm 2 rotates. Therefore, the arm 2 can move over the full width when the component mounting head 5 is in the position of the component supply part 10, and the component mounting head 5 is in the position of the board | substrate conveyance part 11, and the arm 2 can be moved. At this time, it can rotate in the angular range which can be moved over the whole area | region of the board | substrate 61. FIG.

The arm rotation drive part 3 is long and linear as a whole, is arrange | positioned in the direction crossing the rotational movement range of the arm 2, is exposed from the surface, and moves freely along the longitudinal direction of the arm rotation drive part. On the arm drive motor 3b provided at one end of the base 3a, the guide part 3, the screw screw (not shown) installed inside, and rotatably driven by the arm drive motor 3b, and the moving table 3a. It is mainly composed of a ball screw (not shown) installed and screwed to the screw screw, and a groove 3c for guiding the moving table 3a. When the arm drive motor 3b is operated by the above structure, the movable stand 3a slides along the longitudinal direction of the arm rotation drive part 3.

The linkage part 4 which connects the arm 2 and the arm rotation drive part 3 is rotatable free with respect to the arm 2, and slides freely in the longitudinal direction, and is rotatable with respect to the arm rotation drive part 3a. It is.

4 shows an enlarged perspective view of the vicinity of the linkage section 4. As shown in this figure, the linkage part 4 freely connects the linear guide part 42 and the linear guide part 42 and the arm pivot drive part 3 which are free to slide along the longitudinal direction of the arm 2. The bearing part 41 is comprised.

A linkage guide rail 22 is provided on the lower surface near the linkage portion 4 of the arm 2, and the linear guide portion 42 of the linkage portion 4 is along the linkage guide rail 22. The arm 2 can slide in the longitudinal direction. The bearing part 41 consists of two rotational members which can rotate with each other, one rotational member is fixed to the linear guide part 42, and the other rotational member is movable table 3a of the arm rotational drive unit 3. It is fixed at. By these arrangements, when the arm drive motor 3b of the arm rotation drive unit 3 slides the movable table 3a in a direction crossing the rotation range of the arm, the linkage 4 fixed to the movable table 3a is provided. In addition, the arm 2 connected via the bearing part 41 and the linear guide part 42 of the linkage part 4 changes the angle and the longitudinal position with respect to the movable table 3a, and supports the shaft support part. It rotates around 20. In this way, the arm rotation drive part 3 slides the linkage part 4, and the arm 2 rotates about the axial support part 20. As shown in FIG.

Moreover, the arm 2 can be rotated in the range from the angle position shown by the solid line in FIG. 3 to the angle position shown by an imaginary line. Therefore, the arm 2 can move over the full width when the component mounting head 5 is in the position of the component supply part 10, and when the component mounting head 5 is in the position of the board | substrate conveyance part 11, It can rotate in the angle range which can be moved over the whole area | region of the board | substrate 61. FIG.

The component mounting head 5 which is movable freely in the longitudinal direction of the arm 2 includes a head base portion 30 which is provided with respect to the arm 2 and a head mounting portion 31 which is free to move up and down with respect to the head base portion 30. And a suction head 32 mounted on the head mounting portion 31 to suck the electronic component 60, the head 31 can move with respect to the head mounting portion 31, and at the same time, the rotation operation It is configured to do so.

The head base part 30 is engaged with the head guide rail 2a provided along the longitudinal direction of the arm 2, and can slide in the longitudinal direction of an arm by this. In addition, a head base driving motor 2b is built in a position close to the shaft support 20 of the arm 2, and a screw screw that can be rotatably driven by the head base driving motor 2b inside the arm 2. (Not shown) is provided, and a ball screw (not shown) installed inside the head foundation portion 30 is installed. When the head foundation driving motor 2b is operated, the head foundation is passed through a screw screw and a ball screw. The unit 30 can slide. That is, the head drive part which moves the component mounting head 5 by the arm 2 and the head base part 30 is comprised.

The component mounting head 5 is provided with a component supply part by a slide operation in the longitudinal direction of the arm 2 of the head base portion 30 and a rotation operation of the arm 2 according to the slide operation of the arm rotation drive unit 3. 10, the adsorption head 32 may be moved two-dimensionally in a range in which the electronic component 60 is adsorbed on the substrate 61 to mount the electronic component 60 on the substrate 61. Since the arm 2 is axially supported at one end and the other end is pivoted, the linkage unit 4 is provided with a movable table which can be stably supported and driven in a simple structure and slides by the arm pivoting drive. It is connected to the arm (2) via, so that the arm (2) is rotated by the slide operation of the linkage portion 4, while holding the arm (2) stably while the planar to the suction head (32) It can work.

The board base detection camera 38 is provided in the head base part 30. The board | substrate position detection camera 38 detects the lower side of the head base part 30 as an image, detects the external shape and M pattern of the predetermined position of the board | substrate 61 as an image, and is a component by the method of image recognition. It is used to accurately position the mounting head 5 with respect to the substrate 61.

5 shows an enlarged front view of the component mounting head 5. The head mounting portion 31 is connected via a mounting portion up and down drive motor 36 and a screw portion 37 provided on the head base portion 30, and the screw portion 37 is operated in accordance with the operation of the mounting portion up and down driving motor 36. It moves up and down with respect to the head base part 30 via (circle).

Three adsorption heads 32 are provided in the head mounting part 31, and the head up-and-down drive motor 33 is provided in the upper part of each adsorption head 32. As shown in FIG. The suction head 32 may move up and down with respect to the head mounting portion 31 by the operation of the head up and down drive motor 33. In addition, the suction head 32 can suck air from the tip end portion 32a, whereby the electronic component 60 can be sucked.

In addition, the head mounting drive 31 is provided with a head rotation drive motor 34, and the three suction heads 32 can be rotated via the belt 35. Each suction head 32 is provided with a pulley 32b at the same height as the pulley 34a provided on the rotation shaft of the head rotation drive motor 34, and the belt 35 is caught by these pulleys 32b and 34a. The head rotating drive motor 34 and each suction head 32 are linked with each other.

6 is an enlarged bottom view of the component mounting head. As shown in this figure, the pulley 34a of the head rotation drive motor 34 and the pulley 32b of each suction head 32 are arrange | positioned in a line, and between the pulleys 32b and 34a, a head mounting part ( A pressure rotating shaft 39 that is free to rotate about 31 is provided. The belt 35 is caught by the pulleys 32b and 34a, and is pressed inward by the pressure rotating shaft 39 between the pulleys 32b and 34a, and is in tension. When the motor 34 rotates in this state, the pulley 32b rotates via the belt 35, and each suction head 32 rotates simultaneously. The rotation of the adsorption head 32 with respect to the head mounting portion 31 is made to precisely adjust the direction of the adsorption electronic component 60.

As the arm 2 rotates, the direction of the suction head 32 changes from time to time by the rotational angle position of the arm 2. The arrangement in the substrate 61 of the electronic component 60 is required to be in the correct direction as well as the correct position. Therefore, when the suction head 32 sucks the electronic component 60 and when the electronic component 60 is attached to the board | substrate 61 from the suction head 32, the rotation angle position of the arm 2 is respectively adjusted. The electronic component 60 is detected in a predetermined direction by detecting and changing the direction by rotating the suction head 32 by the head rotation driving motor 34 accordingly.

Next, the recognition of the electronic component 60 adsorbed to the adsorption head 32 will be described. As shown in FIG. 1 and FIG. 2, the arm recognition part is provided so that the component recognition camera 50 may be upward between the front end of the component supply part 10 side, and the installation position of the link part 4. As shown in FIG. Moreover, the upper end of the component recognition camera 50 is lower than the front-end | tip 32a of the adsorption head 32 in the component mounting head 5, The component mounting head 5 is carried out from the component supply part 10, and the board | substrate conveyance part ( When moving to the board | substrate 61 of 11), the electronic component 60 adsorb | sucked by the adsorption head 32 can be imaged from the lower side.

The position on the arm 2 of the part recognition camera 50 is not limited to the above, but between the end portion on the substrate 61 side of the component supply portion 10 and the end portion on the component supply portion 10 side of the substrate 61. It is good if there is. More precisely, in the range in which the suction head 32 slides along the arm 2 as the head base 30 moves, the suction head 32 sucks the electronic component 60 of the component supply unit 10. And the suction head 23 in the slide movement range of the suction head 32 between the range except for the range for attaching the electronic component 60 to the substrate 61. It should just be provided in the position on the arm 2 as much as possible.

The part recognition camera 50 is attached to the camera mounting part 51 fixed so that it may descend vertically from the arm 2, and is arrange | positioned in the position which does not interfere with the part mounting head 5. In this case, since the lower end of the part recognition camera 50 extends below the upper surface of the table 1, the camera receiving groove 12 is formed in the table 1 so as not to interfere with the part recognition camera 50. It is. The camera accommodating groove 12 is formed in the upper surface of the table 1 over the range which does not interfere with the component recognition camera 50 in any of the rotation ranges of the arm 2.

In addition, the upper part of the part recognition camera 50, the light source 52 is installed upward so as to surround it, the light can be irradiated to the electronic component 60 passing through the upper part of the part recognition camera 50. .

By photographing the electronic component 60 with the component recognition camera 50, the deviation of the suction position and the deviation of the direction (rotational deviation of the planar electronic components) with respect to the nozzle 32 of the electronic component 60 are detected. . The deviation of the suction position and the direction of the electronic component 60 with respect to the nozzle 32 is X at the center of the electronic component 60 when the nozzle 32 sucks the electronic component 60 in the component supply section 10. And the positional shift in the Y direction and the shift in the directional angle, and when the electronic component 60 is mounted on the substrate 61, the shift detected by the component recognition camera 50 is corrected to position the electronic component 60. Can be mounted on the substrate 61 with high accuracy.

Since the part recognition camera 50 is provided between the component supply part 10 side and the board | substrate 61 side in the arm 2, the component mounting head 5 is connected from the component supply part 10 to the electronic component ( It is in the position which passes necessarily while lifting 60 and moving to the board | substrate 61. FIG. Therefore, the arm 2 does not need to be operated for component recognition, and the arm 2 immediately moves up the electronic component 60 to the mounting position of the electronic component 60 on the substrate 61. Since it is only necessary to move 32) to the movable rotation angle position, the electronic component 60 can be mounted at a high speed.

The electronic component mounting apparatus of this embodiment operates as follows. The arm 2 operates according to a program mounted in the microcomputer of the apparatus. The arm pivot drive unit 3 and the head drive unit 6 are configured to position the adsorption head 32 at a position capable of attracting a predetermined electronic component 60 located at a predetermined position of the component supply unit 10 according to a program. 2) and the head base 30 is moved. While the head base part 30 is moving on the arm 2, the head mounting part 31 is moved upward by the mounting part up-and-down drive motor 36, and when the head base part 30 moves, the suction head 32 does not collide with the part recognition camera 50.

When the adsorption head 32 reaches a position where the predetermined electronic component 60 can be adsorbed, and the movement of the arm 2 and the head base portion 30 is completed, the head mounting portion 31 is mounted up and down the driving motor 36. By this, the predetermined position is lowered to the ready position for performing the adsorption of the electronic component 60 by the adsorption head 32. Next, the suction head 32 at a position capable of absorbing the predetermined electronic component 60 is lowered by the head up and down driving motor 33 to suck the predetermined electronic component 60, and then the head up and down driving motor ( 33, the suction head 32 is raised. At this time, the angle of the arm 2 is stored, but this angle represents the angle of the direction of the suction head 32 with respect to the arm 2.

When the three adsorption heads 32 complete the adsorption of the electronic component 60, the head mounting part 31 is raised by the mounting part up-and-down drive motor 36. As shown in FIG. With respect to each suction head 32, data of the angle of the arm 2 is stored. The arm pivot drive unit 3 and the head drive unit 6 move the suction head 32 to the component mounting position on the substrate 61 so that the respective components 60 adsorbed according to the program are mounted on the substrate 61. The arm 2 and the head base 30 are driven.

When the head foundation 30 moves on the arm 2, the suction head 32 of the component mounting head 5 passes through the top of the component recognition camera 50, but at this time, the first of the suction head 32 When one reaches the center position of the part recognition camera 50, it pauses for some time required for photography. At the time of stop or before stop, the suction head 32 which has sucked the electronic component 60 is rotated by the head rotation drive motor 34 and positioned in parallel with the arm 2 on the basis of the data of the angle. The state of the electronic component 60 is image | photographed by the component recognition camera 50 in that state, and the position shift and direction shift of the electronic component 60 are measured and stored from the image as data. When this operation is completed for the three suction heads 32, the head base portion 30 resumes the slide on the arm 2 and stops when the desired position is reached, and the head mounting portion is mounted by the mounting portion up and down driving motor 36. (31) lowers to the ready position. At this time, the board | substrate position detection camera 38 photographs the predetermined position of the board | substrate 60, and confirms the board | substrate 61 or the mounting position of the board | substrate 61. FIG. Moreover, the angle of the arm 2 at this time is also measured.

The angle of the arm 2 and the position of the head base portion 30 are finely adjusted from the data obtained from the image of the substrate position detection camera 38 and the data of the position shift of the electronic component 60 on the suction head 32, Moreover, the head rotation drive motor 34 rotates the adsorption head 32 based on the data of the deviation of the angle of the arm 2 and the direction of the electronic component 60 on the adsorption head 32, and the direction is adjusted.

Next, the first component adsorption head 32 is lowered by the head up and down drive motor 33 to raise the electronic component 60 onto the substrate 61. One cycle of operation is completed when the same operation is repeated and completed for the suction head 32. However, all of the operations must be performed in the above order, and the order may be partially changed or omitted, for example, the position adjustment of the suction head 32 before the photographing by the part recognition camera 50 is performed. 2 may be omitted, and the direction of the suction head 32 may be adjusted in combination with the angle data of the arm 2 before the electronic component 60 is mounted on the substrate 61.

Since the part recognition camera 50 is provided between the component supply part 10 side and the board | substrate 61 side in the arm 2, the component mounting head 5 is connected from the component supply part 10 to the electronic component ( It is in the position which passes necessarily while lifting 60 and moving to the board | substrate 61. FIG. Therefore, it is not necessary to make the arm 2 operate for component recognition, and the electronic component 60 can be mounted at high speed.

As mentioned above, although embodiment of this invention was described, application of this invention is not limited to this embodiment, It can apply variously within the range of the technical idea. For example, the head drive mechanism of the head drive section 6 or the arm drive mechanism of the arm drive section 7 described above is not limited to the above-described configuration, but may be a general linear slide mechanism, a belt drive mechanism, or other general mechanisms. Can be applied.

According to the electronic component mounting apparatus according to the present invention, an arm having one end supported by a shaft and freely rotatable, and an arm rotation driving unit arranged in a direction crossing the rotational range of the arm, the arm includes a component freely movable in the longitudinal direction thereof. The mounting head is installed, and the arm is connected to the arm rotational drive via a slide free linkage in the direction crossing the rotational range of the arm, and the arm rotates as the arm rotational drive slides the linkage so that the arm is at one end. Since the shaft is supported and only the other end is rotated, the arm can be stably supported in a simple structure, and the arm can be rotated by the arm rotation drive unit which slides, so that the rotation of the arm can be stabilized. We can perform and, as a result, perform high precision parts installation with simple structure can do.

Moreover, according to the electronic component mounting apparatus which concerns on this invention, a component mounting head is provided with the adsorption head which can adsorb | suck an electronic component, and a adsorption head is attached to a component mounting head so that the direction of an electronic component can be adjusted according to the rotation angle position of an arm. Even when an arm that rotates by rotating freely is used, the electronic component can be adjusted in an appropriate direction.

In addition, according to the electronic component mounting apparatus according to the present invention, the linkage portion is composed of a linear guide slide freely in the longitudinal direction of the arm, and a bearing portion for rotatably connecting the arm rotational drive portion and the linear guide, the arm rotational drive portion of the linkage portion of the arm The arm can be smoothly rotated by performing a slide operation in a direction crossing the rotational movement range.

Claims (3)

An electronic component mounting apparatus for mounting an electronic component on a substrate, One end of which is axially supported and freely rotatable, and an arm pivot drive unit arranged in a direction crossing the rotational movement range of the arm, The arm is provided with a component mounting head freely movable in the longitudinal direction thereof, the arm having a head driving portion for moving the component mounting head, and the arm pivots through the linkage freely sliding in a direction crossing the rotational movement range of the arm. And the arm pivoting drive pivots the arm as the arm pivoting drive slides the linkage. The method of claim 1, The component mounting head has a suction head free to suck the electronic component, the suction head is rotatable free relative to the component mounting head to adjust the direction of the electronic component according to the rotation angle position of the arm. Mounting device. The method of claim 1, And the linking portion comprises a linear guide slidable in the longitudinal direction of the arm, and a bearing portion for rotatably connecting the arm pivoting drive portion and the linear guide.

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