KR890004245Y1 - Automatic bonding device of semiconductor chip - Google Patents

Automatic bonding device of semiconductor chip Download PDF

Info

Publication number
KR890004245Y1
KR890004245Y1 KR2019860014769U KR860014769U KR890004245Y1 KR 890004245 Y1 KR890004245 Y1 KR 890004245Y1 KR 2019860014769 U KR2019860014769 U KR 2019860014769U KR 860014769 U KR860014769 U KR 860014769U KR 890004245 Y1 KR890004245 Y1 KR 890004245Y1
Authority
KR
South Korea
Prior art keywords
chip
bonding
semiconductor chip
arm
rotated
Prior art date
Application number
KR2019860014769U
Other languages
Korean (ko)
Other versions
KR880006986U (en
Inventor
윤인철
Original Assignee
삼성항공산업 주식회사
이동복
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성항공산업 주식회사, 이동복 filed Critical 삼성항공산업 주식회사
Priority to KR2019860014769U priority Critical patent/KR890004245Y1/en
Publication of KR880006986U publication Critical patent/KR880006986U/en
Application granted granted Critical
Publication of KR890004245Y1 publication Critical patent/KR890004245Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75753—Means for optical alignment, e.g. sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/759—Means for monitoring the connection process
    • H01L2224/75901—Means for monitoring the connection process using a computer, e.g. fully- or semi-automatic bonding

Abstract

내용 없음.No content.

Description

반도체 칩 자동본딩 장치Semiconductor chip automatic bonding device

도면은 본 고안의 사시도.Figure is a perspective view of the present invention.

* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

1 : 검출기 2 : 카메라1: detector 2: camera

3 : 테이블베이스 4 : 지지대3: table base 4: support

5 : 전등 6 : 테이블5: light fixture 6: table

7,8,12 : 모터 9 : 칩7,8,12: motor 9: chip

10 : 투명시이트 11 : 웨이퍼 홀더10 transparent sheet 11 wafer holder

13 : 인터페이스회로 14 : 연산처리회로13 interface circuit 14 operation processing circuit

15 : 구동제어회로 16 : 아암구동부15: drive control circuit 16: arm drive unit

17 : 아암축 18,18' : 본딩아암17: arm axis 18,18 ': bonding arm

19 : 아암부 20 : 칩 흡착구19: arm part 20: chip suction port

본 고안은 반도체 칩 자동 본딩 장치로서 특히 3개의 본딩아암을 구비하고 칩을 흡착하기전에 칩의 선별, 칩의 위치정보등을 하여 본딩 작업속도를 증가시킬 수 있는 반도체 칩 자동 본딩 장치에 관한 것이다.The present invention relates to a semiconductor chip automatic bonding apparatus, in particular, having three bonding arms, and capable of increasing the bonding work speed by selecting chips, positioning information of chips, etc. before adsorbing chips.

반도체 제조공정에 있어서 리이드 프레임상에는 반도체 칩을 정확하게 본딩하기 위해서는 칩 공급 테이블위에 얹힌 칩들중에서 한개의 칩을 본딩장치의 아암 끝에 달린 흡착구로 흡착하여 제조라인상에 정열된 리이드 프레임의 기판상에 원하는 위치와 원하는 각도로 옮겨놓은후 본딩하게 되는데, 기존의 본딩 장치들은 하나의 아암을 갖으며 영상 인식장치를 이용하여 반도체 칩을 인식 흡착한 다음 칩을 리이드 프레임상으로 이송한후 정확한 본딩 위치 조절을 위하여 예비 정열장치를 사용하여 칩을 정열하여 리이드 프레임에 본딩하도록 되어 있다. 그러나 이와같은 종래의 장치는 하나의 아암으로 칩을 흡착, 전열, 본딩하기 때문에 시간이 많이 걸리며 매우 비능뉼적이었다.In the semiconductor manufacturing process, in order to accurately bond a semiconductor chip on a lead frame, one of the chips placed on the chip supply table is sucked by a suction hole attached to the arm end of the bonding apparatus, and a desired position is placed on the lead frame substrate arranged on the manufacturing line. After bonding to the desired angle and bonding, the existing bonding devices have one arm and recognize and adsorb the semiconductor chip by using the image recognition device, and then transfer the chip onto the lead frame for accurate bonding position adjustment. The pre-aligner is used to align the chips and bond them to the lead frame. However, such a conventional device is time-consuming and very inefficient because of adsorption, heat transfer, and bonding of chips with one arm.

본 고안의 목적은 이와같은 종래의 칩 본딩장치의 한계점을 극복하고 보다 능률적인 본딩 작업이 가능하도록하는 칩 본딩장치.An object of the present invention is to overcome the limitations of such a conventional chip bonding device and chip bonding device to enable more efficient bonding operation.

특히 3개의 아암을 갖는 회전가능한 아암부, 위치 변환 가능한 테이블위에 놓인 회전 가능한 칩 공급판, 상기 아암부, 테이블 및 칩 고급판을 구동하는 장치를 제어하기 위한 영상인식장치, 연산 및 제어장치등을 구비하는 반도체 칩 본딩장치를 제공하는 것이다.In particular, a rotatable arm part having three arms, a rotatable chip supply plate placed on a position changeable table, an image recognition device for controlling the arm part, a table and a chip advanced plate, an image recognition device, a calculation and a control device It is to provide a semiconductor chip bonding apparatus provided.

이하 도면에 따라서 본 고안의 한 실시예를 상세히 설명하기로 한다. 구동장치(16)에 의하여 회동되는 아암축(17)에 서로 120°간격을 두고 부착되어 있는 3개의 아암(18)을 가지는 본딩 아암부(19)의 아래쪽에 모타(12)에 의하여 회전되는 웨이퍼 홀더(11)가 모타(7)(8)에 의하여 XY방향 이동가능한 테이블(6)위에 회전 가능하게 설치되어있다. 상기 웨이퍼홀더(11)의 상판에는 반도체 칩(9)이 놓이는 투명 시이트(10)가 마련되어 있고, 그 위쪽에는 카메라(2)로 부터 영상신호를 전달받아 디지탈 신호로 변환하는 검출기(1)가 지지대(4)에 설치되어 있다.Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings. The wafer rotated by the motor 12 below the bonding arm portion 19 having the three arms 18 attached to the arm shaft 17 rotated by the driving device 16 at 120 ° intervals. The holder 11 is rotatably mounted on the table 6 movable in the XY direction by the motors 7 and 8. The upper plate of the wafer holder 11 is provided with a transparent sheet 10 on which the semiconductor chip 9 is placed, and a detector 1 for receiving a video signal from the camera 2 and converting it into a digital signal is supported thereon. It is installed in (4).

상기 검출기(1)는 인터페이스회로(13)를 거쳐 연산처리회로(14)에 연결되며, 연산처리회로(14)는 한편으로는 구동제어회로(15)를 거쳐 모타(7)(8)(12)에, 다른 한편으로는 아암축(17)을 회동시키는 아암구동장치(16)에 연결된다. 미설명부호 3은 테이블베이스, 5는 전등, 20은 칩 흡착구이다.The detector 1 is connected to the arithmetic processing circuit 14 via an interface circuit 13, and the arithmetic processing circuit 14 is on the one hand a motor 7, 8, 12 via a drive control circuit 15. ), On the other hand, is connected to an arm drive device 16 for rotating the arm shaft 17. Reference numeral 3 denotes a table base, 5 a lamp, and 20 a chip suction hole.

이와같이 구성된 본 고안의 작용효과를 살펴보면 다음과 같다. 투명시이트(10)위에 놓인 반도체 칩(9)의 양불양, 위치, 방향을 카메라(2)가 포착하여 검출기(1)로 보내면 상기 칩에 대한 아날로그 신호는 검출기(1)에서 디지탈 신호로 변한된 후 인터페이스 회로(13)를 거쳐 연산처리장치(14)로 보내어진다.Looking at the effect of the present invention configured as described above are as follows. When the camera 2 captures the quantity, position and direction of the semiconductor chip 9 placed on the transparent sheet 10 and sends it to the detector 1, the analog signal for the chip is converted into a digital signal at the detector 1. After that, it is sent to the arithmetic processing unit 14 via the interface circuit 13.

연산처리장치(14)에서는 칩에 대한 상기의 데이타를 입력받아 불량한 칩으로 식별되면 다음 칩이 카메라 인식 위치로 이송되도록 하며, 정상적인 칩인 경우는 위치오차 및 방향오차에 따른 칩의 x,y방향으로의 이송되어야 할 거리, 회전해야 할 각도등을 연산 처리한 다음, 제어신호를 구동 제어회로(15)에 보내어 모터(7)(8)(12)를 구동시켜 칩이 원하는 위치에 원하는 각도로 놓이도록 한다. 제자리에 놓인 칩을 본딩 아암(18)이 그 칩흡착구(20)로 흡착하게되면 연산처리장치(14)와 연결된 아암 구동장치에 의하여 본딩 아암부의 아암축(17)이 120°회전되어 본딩 아암(18)의 칩 흡착구(20)가 반도체 저조라인(미도시)위에 대기하고 있던 리이드 프레임의 기판 위로 이동되고 잡고있던 칩을 기판위에 내려놓고 본딩시킨다.The operation processor 14 receives the above data about the chip, and if the chip is identified as a bad chip, moves the next chip to the camera recognition position. After calculating the distance to be transferred, the angle to be rotated, etc., the control signal is sent to the drive control circuit 15 to drive the motors 7, 8 and 12 to place the chip at the desired position at the desired position. To be. When the bonding arm 18 sucks the chip in place into the chip suction hole 20, the arm shaft 17 of the bonding arm portion is rotated by 120 ° by an arm driving device connected to the processing unit 14, thereby bonding the bonding arm. The chip suction port 20 of 18 is moved onto the substrate of the lead frame which is waiting on the semiconductor storage line (not shown), and the chip held by the chip is placed on the substrate and bonded.

한편 본딩 아암(18)의 회전과 동시에 다른 본딩 아암(도면에 안나타남) 이 투명시이트(10)위로 회전되어 다시 칩의 위치 및 방향 조정 과정이 반복된다.On the other hand, at the same time as the bonding arm 18 is rotated, another bonding arm (not shown) is rotated on the transparent sheet 10 to repeat the position and orientation adjustment process of the chip.

본 고안에 의한 장치는 3개의 본딩 아암을 구비하고 있으므로 하나의 아암에서 칩의 위치와 방향을 조절하여 칩을 흡착하는 동안 다른 아암에서는 칩 본딩작업을 동시에 진행할수 있으므로 칩 본딩작업 속도가 현저히 증가된다.Since the device according to the present invention has three bonding arms, the chip bonding operation is significantly increased because the chip bonding operation can be simultaneously performed on the other arm while the chip is attracted by adjusting the position and direction of the chip on one arm. .

Claims (1)

리이드 프레임에 반도체 칩을 본딩하기 위하여 칩흡착구를 그 선단에 갖춘 본딩 아암부, 반도체 칩 공급테이블을 구비하는 것에 있어서, 상기 본딩 아암부(19)는 구동장치(16)에 의해 회동되는 아암축(17)에 달린 3개의 아암(18)을 가지며, 모타(12)에 의하여 회전되는 웨이퍼 홀더(11)가 모타(7)(8)에 의하여 XY방향 이동가능한 테이블(6)위에 회전가능하게 설치되며, 상기 웨이퍼 홀더(11)의 위쪽에는 영상인식장치(2)(1)가 설치되어 한편으로는 연산처리회로(14), 구동제어회로(15)를 거쳐 모타(7)(8)(12)에, 다른 한편으로는 연산제어회로(14), 아암구동장치(16)에 결선되어 있는 것을 특징으로 하는 반도체 칩 자동본딩 장치.In order to bond a semiconductor chip to a lead frame, the bonding arm part provided with the chip suction opening at the front-end | tip, and a semiconductor chip supply table WHEREIN: The said bonding arm part 19 is the arm shaft rotated by the drive device 16. A wafer holder 11 having three arms 18 attached to 17 and rotated by a motor 12 is rotatably mounted on a table 6 movable in the XY direction by the motors 7 and 8. The image recognition device (2) (1) is provided above the wafer holder (11), and on the other hand, the motor (7) (8) (12) via the operation processing circuit (14) and the drive control circuit (15). On the other hand, the semiconductor chip automatic bonding apparatus is connected to the operation control circuit (14) and the arm driving device (16).
KR2019860014769U 1986-09-26 1986-09-26 Automatic bonding device of semiconductor chip KR890004245Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019860014769U KR890004245Y1 (en) 1986-09-26 1986-09-26 Automatic bonding device of semiconductor chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019860014769U KR890004245Y1 (en) 1986-09-26 1986-09-26 Automatic bonding device of semiconductor chip

Publications (2)

Publication Number Publication Date
KR880006986U KR880006986U (en) 1988-05-31
KR890004245Y1 true KR890004245Y1 (en) 1989-06-26

Family

ID=19255929

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019860014769U KR890004245Y1 (en) 1986-09-26 1986-09-26 Automatic bonding device of semiconductor chip

Country Status (1)

Country Link
KR (1) KR890004245Y1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004084296A1 (en) * 2003-03-17 2004-09-30 Phicom Corporation Probe positioning and bonding device and probe bonding method
KR101290307B1 (en) * 2011-12-13 2013-07-26 주식회사 아이. 피. 에스시스템 Apparatus for Bonding Chip

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030079502A (en) * 2002-04-04 2003-10-10 한동희 Bonding equipment for chips of flat panel display and bonding method using the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004084296A1 (en) * 2003-03-17 2004-09-30 Phicom Corporation Probe positioning and bonding device and probe bonding method
KR101290307B1 (en) * 2011-12-13 2013-07-26 주식회사 아이. 피. 에스시스템 Apparatus for Bonding Chip

Also Published As

Publication number Publication date
KR880006986U (en) 1988-05-31

Similar Documents

Publication Publication Date Title
KR100303960B1 (en) Die-bonding machine
KR20090114369A (en) Device for mounting a flip-chip on a substrate
JP3301347B2 (en) Apparatus and method for mounting conductive ball
KR890004245Y1 (en) Automatic bonding device of semiconductor chip
JP3420073B2 (en) Component supply apparatus and method
JP3497078B2 (en) Die bonder
JPS6136938A (en) Bonding device for semiconductor device
JP2000150970A (en) Light emitting device bonding method and equipment
JP3747515B2 (en) Chip mounting device
JPH0763117B2 (en) Electronic component suction control device
JPH06268050A (en) Die bonding device
JP2000103031A (en) Apparatus for printing solder on wafer
JP3570126B2 (en) Chip mounting equipment
JPH08162502A (en) Electronic part mounter
JPH0213934B2 (en)
KR20030024511A (en) Head part of led die bonder
JPS5917975B2 (en) automatic wireless bonding equipment
JP3129161B2 (en) Chip mounting device and mounting method
JP2001332586A (en) Method and apparatus for manufacturing semiconductor device
JP2815471B2 (en) Electronic component mounting equipment
JP2001015533A (en) Pellet-bonding apparatus and pellet take-out mechanism used in the apparatus
KR940000743B1 (en) Method of detecting bonding pattern of semiconductor
JPH03293800A (en) Method and device for mounting electronic part
KR19980022944A (en) Electronic Component Mounting Device
JPH10313197A (en) Electronic component positioning device for surface mount

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application