CN107452643B - Substrate flattening apparatus and semiconductor manufacturing method using the same - Google Patents
Substrate flattening apparatus and semiconductor manufacturing method using the same Download PDFInfo
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- CN107452643B CN107452643B CN201610378204.8A CN201610378204A CN107452643B CN 107452643 B CN107452643 B CN 107452643B CN 201610378204 A CN201610378204 A CN 201610378204A CN 107452643 B CN107452643 B CN 107452643B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Abstract
The invention provides a substrate flattening apparatus and a semiconductor manufacturing method using the same. The substrate flattening apparatus includes: a base; one end of the rotating arm is rotatably connected with the base; and a disk assembly connected to the other end of the rotary arm, wherein the disk assembly moves downward as the rotary arm rotates in a vertical plane, such that a disk surface of the disk assembly is superposed on a substrate carried on a rotary chuck, and a vertical downward pressure is applied to the substrate to press the substrate flatly onto the rotary chuck.
Description
Technical Field
The invention relates to a substrate flattening device, in particular to a substrate flattening device for a semiconductor process.
Background
With the progress of technology, the electronic devices are miniaturized and refined, so that the semiconductor process tends to be complicated. For example, a semiconductor substrate is subjected to a plurality of processes such as grinding, machining, etching, and high temperature heating to form an integrated circuit in an electronic device. In addition, when a substrate is subjected to a cleaning or etching process, the substrate is generally fixed to a spin chuck (spin chuck) by vacuum suction or edge clamping, and is rotated at a high speed and a cleaning or etching liquid is sprayed thereon.
However, when the substrate is subjected to the above-mentioned processes of polishing, machining and high temperature, the substrate may be deformed due to the influence of mechanical force or thermal stress. Particularly, for a thin substrate (e.g., a silicon wafer or a glass substrate), after various processing and high temperature processes, the substrate is more likely to be deformed seriously, so that the whole substrate exhibits irregular warpage. Therefore, when the substrate with warp deformation is subjected to cleaning or etching processes, the substrate is not smoothly placed on the spin chuck, and the spin chuck cannot smoothly vacuum-adsorb the substrate to be fixed thereon by the vacuum chuck. Or the warped edge of the substrate may interfere with the chuck jaws of the spin chuck, causing the chuck jaws to not successfully clamp and secure the substrate to the spin chuck.
Accordingly, there is a need for an apparatus to improve the contact surface between the substrate and the spin chuck, so that the substrate can be smoothly placed on the spin chuck, and the spin chuck can smoothly fix the substrate thereon by the fixing mechanism.
Disclosure of Invention
In order to solve the above-mentioned problems of the prior art, an object of the present invention is to provide a substrate flattening apparatus, which applies an appropriate pressure to a substrate placed on a rotating chuck through a specific mechanism to tightly press the warped substrate against the rotating chuck, so that the rotating chuck can smoothly fix the substrate thereon through a fixing mechanism (e.g., a vacuum chuck or a clamping jaw).
To achieve the above object, the present invention provides a substrate pressing apparatus, comprising: a base; one end of the rotating arm is rotatably connected with the base; and a disk assembly connected to the other end of the rotating arm, wherein the disk assembly moves downward as the rotating arm rotates in a first rotating direction, such that a disk surface of the disk assembly is stacked on a substrate carried on a rotating chuck, and a vertically downward pressure is applied to the substrate, thereby flatly pressing the substrate onto the rotating chuck.
In one preferred embodiment of the present invention, the disk-shaped component comprises: a connection pad having one surface engaged with the other end of the rotation arm through a universal joint, and adjusting a coupling angle between the connection pad and the rotation arm through the universal joint so that the disk assembly is maintained at a horizontal position with respect to the substrate when the disk assembly is stacked on the substrate; and the brush disc is fixed on the other surface of the connecting disc through a plurality of fixing bolts.
In one preferred embodiment of the present invention, a buffer spring is sleeved on a part of the fixing pins for buffering the vertical downward pressure exerted on the substrate by the disk-shaped component.
In one preferred embodiment of the present invention, the brush plate comprises at least one row of bristles arranged in an annular array, and the plate-shaped member is in contact with the base plate through the at least one row of bristles to apply the vertically downward pressure to the base plate.
In one preferred embodiment of the present invention, the brush disk comprises an inner row of bristles and an outer row of bristles arranged in an annular array, and the outer row of bristles is located opposite to the outer edge of the base plate.
In one preferred embodiment of the present invention, the rotating arm is rotatably connected to the base by a rotating power device, and the rotating power device includes a rotating pneumatic cylinder or a rotating motor.
In one preferred embodiment of the present invention, the spin chuck is a vacuum chuck.
In one preferred embodiment of the present invention, the spin chuck is an edge-gripping spin chuck.
The present invention also provides a semiconductor manufacturing method, comprising: placing a substrate on a rotating chuck; providing a substrate flattening device, which comprises a base, a rotating arm and a disk-shaped component, wherein one end of the rotating arm is rotatably connected with the base, and the disk-shaped component is connected with the other end of the rotating arm; controlling the rotating arm of the substrate flattening equipment to rotate towards a first rotating direction so that the disk-shaped assembly moves downwards jointly; and controlling a disc surface of the disc-shaped component to be superposed on the substrate and applying a vertically downward pressure to the substrate, thereby flatly pressing the substrate onto the rotary chuck.
In one preferred embodiment of the present invention, the substrate is vacuum-adsorbed on the spin chuck; and wherein after controlling the disc-type assembly to be stacked on the substrate and applying a vertically downward pressure to the substrate, the method further comprises: and judging whether the vacuum adsorption value between the substrate and the disc-shaped assembly reaches a preset value, if so, controlling the rotating arm of the substrate flattening equipment to rotate towards a second rotating direction so that the disc-shaped assembly moves upwards jointly and further leaves the surface of the substrate, and if not, controlling the disc-shaped assembly to continuously apply the vertical downward pressure on the substrate until the vacuum adsorption value between the substrate and the disc-shaped assembly reaches the preset value.
In one preferred embodiment of the present invention, the spin chuck is an edge-gripping spin chuck; and wherein after controlling the disc-type assembly to be stacked on the substrate and applying a vertically downward pressure to the substrate, the method further comprises: and judging whether the substrate is flatly pressed on the edge-clamping type rotary chuck, if so, controlling a clamping jaw of the edge-clamping type rotary chuck to clamp and fix the edge of the substrate, and controlling the rotating arm of the substrate flattening equipment to rotate towards a second rotating direction so that the disk-shaped component moves upwards jointly and further leaves the surface of the substrate, and if not, controlling the disk-shaped component to continuously apply the vertical downward pressure on the substrate until the substrate is flatly pressed on the edge-clamping type rotary chuck.
Drawings
FIG. 1 shows a schematic perspective view illustrating a substrate flattening apparatus in accordance with a first preferred embodiment of the present invention;
FIG. 2 is a schematic view illustrating the substrate pressing apparatus of FIG. 1 pressing and stacking a substrate;
FIG. 3 shows an exploded view of a part of the disk assembly of the substrate flattening apparatus of FIG. 1;
FIG. 4 shows a schematic view of the substrate flattening apparatus of FIG. 1 being used to flatten a substrate carried on another carrier mechanism; and
fig. 5 shows a flowchart of a method for using the substrate flattening apparatus of fig. 1 for manufacturing semiconductors.
Detailed Description
In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.
Referring to fig. 1, a schematic perspective view of a substrate flattening apparatus 100 according to a first preferred embodiment of the present invention is shown. The substrate pressing apparatus 100 includes a base 110, a rotary arm 120, and a disk assembly 130. One end of the base 110 may be fixed on the ground or mounted on a transfer mechanism, and the substrate flattening apparatus 100 is transferred to an operating position by the transfer mechanism. As shown in fig. 1, the rotating arm 120 is substantially L-shaped and has a first end 121 and a second end 122. The first end 121 of the rotating arm 120 is rotatably connected to the base 110 by a rotating power device 150, and the second end 122 of the rotating arm 120 is connected to the disk assembly 130, wherein the rotating power device 150 can be a rotating pneumatic cylinder (as shown in fig. 1) or a rotating motor. As shown in fig. 1, the rotary power device 150 can be covered by a cover 160 to prevent people from accidentally touching or prevent dust from contaminating the rotary power device 150. For clarity of the rotary power unit 150, in fig. 1, the cover 160 is transparent/translucent, such as made of a transparent/translucent plastic material. It is known to those skilled in the art that the cover 160 may also be opaque, such as made of an opaque plastic material or metal.
Referring to fig. 1 and fig. 2, fig. 2 is a schematic diagram illustrating an operation of the substrate pressing apparatus 100 of fig. 1 pressing and stacking a substrate 300. The substrate 300 is preferably a thin substrate used in a semiconductor process, such as a silicon wafer, a glass substrate, and the like. Generally, after the substrate 300 is subjected to a plurality of processes such as polishing, machining, and high-temperature heating, the substrate 300 is easily warped and deformed. Therefore, when the substrate 300 is placed on the spin chuck (spin chuck)200 by a robot arm, the substrate 300 is not flatly attached to the spin chuck 200. In view of the above, in the present invention, after the substrate 300 is placed on the spin chuck 200, the substrate flattening apparatus 100 is activated accordingly. And, the rotating arm 120 is controlled by the rotating power device 150 to rotate in a first rotating direction R1 on a vertical plane, which in turn causes the disk assembly 130 to move downward, thereby stacking a disk of the disk assembly 130 on the substrate 300 and applying a vertical downward pressure F to the substrate 300. Through the above operation, the warped portion of the substrate 300 can be effectively flattened so as to achieve the effect of smoothly attaching the substrate 300 to the spin chuck 200. Next, the spin chuck 200 may vacuum-chuck the substrate 300 by a plurality of vacuum chucks (not shown) communicating with the vacuum suction line 210 to effectively fix the substrate 300 to the spin chuck 200.
Referring to FIG. 3, an exploded view of a component of the disk assembly 130 of the substrate flattening apparatus 100 of FIG. 1 is shown. The disk-type member 130 includes a connecting disk 131, a brush disk 132, and an intermediate disk 133. The connecting disc 131 is connected to the second end 122 of the rotating arm 120. More specifically, one side of the connecting disc 131 is connected to the second end 122 of the rotating arm 120 through a universal joint 140. It can be understood that the universal joint 140 is arranged to effectively adjust the connection angle between the connection disc 131 and the rotation arm 120, so that when the disk assembly 130 is stacked on the substrate 300 (as shown in fig. 2), the disk assembly 130 is kept at a horizontal position relative to the substrate 300 as a whole, and thus the disk assembly 130 can evenly apply the vertical downward pressure F to the whole substrate 300 through the disk surface of the brush disk 132, so as to avoid the substrate 300 from being broken due to uneven single-edge force.
As shown in fig. 1 and 3, the brush plate 132 of the disk-type assembly 130 includes an inner row of bristles 1324 and an outer row of bristles 1322 arranged in an annular array. The disk assembly 130 is in contact with the base plate 300 through the inner row of bristles 1324 and the outer row of bristles 1322 to apply the vertically downward pressure force F to the base plate 300. In the preferred embodiment of the present invention, the amount of warp deformation of the base plate 300 can be effectively absorbed by selecting the bristles having elasticity to contact the base plate 300. That is, when the bristles of the inner row of bristles 1324 and the outer row of bristles 1322 contact the substrate 300, the bristles are elastically deformed according to the buckling deformation amount of the corresponding position of the substrate 300, so that the vertically downward pressure F applied to the substrate 300 by the disk-shaped component 130 is effectively buffered, and the substrate 300 is prevented from being broken due to an excessively high single-point stress. It will be appreciated that the number of bristles shown in figure 1 is merely illustrative and that the number of bristles may vary in different embodiments depending on the size of the corresponding substrate, for example, only a single row of bristles arranged in an annular array, or more than three rows of bristles arranged in an annular array may be provided. Preferably, the outermost bristles (e.g., the outer row of bristles 1322) are positioned relative to the outer edge of the base plate 300.
As shown in fig. 3, the disk type assembly 130 assembles and fixes the connection disk 131, the brush disk 132, and the middle disk 133 by a plurality of first fixing bolts 171 and a plurality of second fixing bolts 172. Specifically, the connecting plate 131 is fixed on one surface of the middle plate 133 by the first fixing bolts 171, and a buffer spring 173 is sleeved on each first fixing bolt 171 for buffering the vertical downward pressure F applied by the disk assembly 130 on the substrate 300. Next, the brush plate 132 is fixed to the other surface of the middle plate 133 by the plurality of second fixing pins 172.
Referring to fig. 4, a schematic diagram of the substrate flattening apparatus 100 of fig. 1 is shown for flattening a substrate 300 carried on another carrying mechanism. In this embodiment, the carrier mechanism is an edge gripping spin chuck 400 that includes a plurality of jaws 410. When the substrate 300 is placed on the edge-grip spin chuck 400 by a robot arm, the plurality of jaws 410 are positioned away from the substrate 300. Then, when the substrate 300 is pressed by the substrate pressing apparatus 100, the plurality of clamping jaws 410 rotate toward the substrate 300, so as to clamp and fix the substrate 300 on the edge-clamping type spin chuck 400.
Referring to FIG. 5, a flowchart of a method for using the substrate flattening apparatus 100 of FIG. 1 for manufacturing semiconductors is shown. First, in step S11, a substrate 300 is placed on the spin chuck 200 by a robot, wherein the substrate 300 is preferably a thin substrate used in semiconductor process, such as a silicon wafer, a glass substrate, etc. Next, step S12 is performed to provide the substrate flattening apparatus 100, and the substrate flattening apparatus 100 is disposed at an operating position corresponding to the spin chuck 200. As described above, the substrate flattening apparatus 100 includes a base 110, a rotating arm 120, and a disk assembly 130, wherein one end of the rotating arm 120 is rotatably connected to the base 110, and the other end of the rotating arm 120 is connected to the disk assembly 130. Next, in step S13, the rotating arm 120 of the substrate pressing apparatus 100 is controlled to rotate in a vertical plane in a first rotating direction R1 (as shown in fig. 2), so that the disk-shaped component 130 moves downward jointly. Next, step S14 is performed to control the disk of the brush disk 132 of the disk-shaped component 130 to be superposed on the substrate 300, and to apply a vertically downward pressure F to the substrate 300, thereby effectively flattening the warp-deformed portion of the substrate 300.
In the present embodiment, the spin chuck 200 is a vacuum chuck 200. It is understood that, in general, a vacuum chuck, a vacuum suction line 210 (shown in fig. 2) and a vacuum value sensor for detecting a vacuum value are generally disposed on the vacuum chuck type spin chuck 200. Therefore, after controlling the vertical downward pressure F applied to the substrate 300 by the disk assembly 130, the method may further include step S15, performing vacuum suction on the substrate 300 by a plurality of vacuum chucks in communication with the vacuum suction line 210, so as to effectively fix the substrate 300 to the spin chuck 200. And determining whether the vacuum suction value between the substrate 300 and the disk assembly 130 reaches a predetermined value by a value measured by a vacuum value sensor, if so, controlling the rotating arm 120 of the substrate flattening apparatus 100 to rotate in a second rotating direction (i.e., a direction opposite to the rotating direction of the first rotating direction R1) so that the disk assembly 130 moves upward and away from the surface of the substrate 300 jointly. If not, the disk assembly 130 is controlled to continue applying the vertical downward pressure F to the substrate 300 until the vacuum absorption value between the substrate 300 and the disk assembly 130 reaches the predetermined value. In addition, when the substrate flattening apparatus 100 of the present invention is used to flatten the substrate 300 carried by the edge-gripping spin chuck 400 (as shown in fig. 4), it is possible to determine whether the substrate 300 has been flatly pressed against the edge-gripping spin chuck 400 by the substrate flattening apparatus 100 by providing a suitable sensor on the edge-gripping spin chuck 400, and then controlling the clamping jaws 410 to rotate toward the substrate 300, so as to clamp and fix the edge of the substrate 300 on the edge-gripping spin chuck 400, and controlling the rotating arm 120 of the substrate flattening apparatus 100 to rotate toward a second rotating direction, so as to jointly move the disk-shaped component 130 upward and away from the surface of the substrate 300. If not, the disk assembly 130 is controlled to continue applying the vertical downward pressure F to the substrate 300 until the substrate 300 is pressed flat against the edge-grip spin chuck 400.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of the present invention, and these improvements and modifications should also be construed as the protection scope of the present invention.
Claims (14)
1. A substrate flattening apparatus, comprising:
a base;
one end of the rotating arm is rotatably connected with the base; and
a disk assembly connected to the other end of the rotary arm, wherein the disk assembly moves downward as the rotary arm rotates in a first rotational direction, such that a disk surface of the disk assembly is stacked on a substrate carried on a rotary chuck and a vertically downward pressure is applied to the substrate, thereby flatly pressing the substrate onto the rotary chuck; and
wherein the disk-shaped member comprises a brush disk comprising at least one row of bristles arranged in an annular array, the disk-shaped member being in contact with the base plate through the at least one row of bristles to apply the vertically downward pressure to the base plate.
2. The substrate flattening apparatus of claim 1, wherein the disk assembly comprises:
a connection pad having one surface engaged with the other end of the rotation arm through a universal joint, and adjusting a coupling angle between the connection pad and the rotation arm through the universal joint so that the disk assembly is maintained at a horizontal position with respect to the substrate when the disk assembly is stacked on the substrate; and
the brush disc is fixed on the other surface of the connecting disc through a plurality of fixing bolts.
3. The substrate flattening apparatus of claim 2, wherein a cushioning spring is positioned partially over said plurality of pegs to cushion said vertical downward pressure exerted on said substrate by said disk assembly.
4. The substrate flattening apparatus of claim 1, wherein the brush disc includes an inner row of bristles and an outer row of bristles arranged in an annular array, with the outer row of bristles being positioned relative to the outer edge of the substrate.
5. The substrate flattening apparatus of claim 1, wherein the pivot arm is rotatably coupled to the base by a rotary power device comprising a rotary pneumatic cylinder or a rotary motor.
6. The substrate flattening apparatus of claim 1, wherein the spin chuck is a vacuum suction spin chuck.
7. The substrate flattening apparatus of claim 1, wherein the spin chuck is an edge-grip spin chuck.
8. A method of manufacturing a semiconductor, comprising:
placing a substrate on a rotating chuck;
providing a substrate flattening device, which comprises a base, a rotating arm and a disk-shaped component, wherein one end of the rotating arm is rotatably connected with the base, and the disk-shaped component is connected with the other end of the rotating arm;
controlling the rotating arm of the substrate flattening equipment to rotate towards a first rotating direction so that the disk-shaped assembly moves downwards jointly; and
controlling a disc surface of the disc-shaped member to be superposed on the base plate and applying a vertically downward pressure to the base plate, thereby flatly pressing the base plate onto the rotary chuck, wherein the disc-shaped member comprises a brush disc comprising at least one row of bristles arranged in an annular array, and the disc-shaped member is in contact with the base plate through the at least one row of bristles to apply the vertically downward pressure to the base plate.
9. The semiconductor manufacturing method of claim 8, wherein the disk-type component comprises:
a connection pad having one surface engaged with the other end of the rotation arm through a universal joint, and adjusting a coupling angle between the connection pad and the rotation arm through the universal joint so that the disk assembly is maintained at a horizontal position with respect to the substrate when the disk assembly is stacked on the substrate; and
the brush disc is fixed on the other surface of the connecting disc through a plurality of fixing bolts.
10. The semiconductor manufacturing method according to claim 9, wherein a buffer spring is provided on a part of the fixing pins for buffering the vertical downward pressure applied to the substrate by the disk-shaped member.
11. The semiconductor manufacturing method of claim 8, wherein the brush disk includes an inner row of bristles and an outer row of bristles arranged in an annular array, and the outer row of bristles is located relative to an outer edge of the substrate.
12. The semiconductor manufacturing method according to claim 8, wherein the rotary arm is rotatably connected to the base by a rotary power device comprising a rotary pneumatic cylinder or a rotary motor.
13. The semiconductor manufacturing method according to claim 8, wherein the substrate is vacuum-sucked on the spin chuck; and wherein after controlling the disc-type assembly to be stacked on the substrate and applying a vertically downward pressure to the substrate, the method further comprises:
and judging whether the vacuum adsorption value between the substrate and the disc-shaped assembly reaches a preset value, if so, controlling the rotating arm of the substrate flattening equipment to rotate towards a second rotating direction so that the disc-shaped assembly moves upwards jointly and further leaves the surface of the substrate, and if not, controlling the disc-shaped assembly to continuously apply the vertical downward pressure on the substrate until the vacuum adsorption value between the substrate and the disc-shaped assembly reaches the preset value.
14. The semiconductor manufacturing method according to claim 8, wherein the spin chuck is an edge-gripping spin chuck; and wherein after controlling the disc-type assembly to be stacked on the substrate and applying a vertically downward pressure to the substrate, the method further comprises:
and judging whether the substrate is flatly pressed on the edge-clamping type rotary chuck, if so, controlling a clamping jaw of the edge-clamping type rotary chuck to clamp and fix the edge of the substrate, and controlling the rotating arm of the substrate flattening equipment to rotate towards a second rotating direction so that the disk-shaped component moves upwards jointly and further leaves the surface of the substrate, and if not, controlling the disk-shaped component to continuously apply the vertical downward pressure on the substrate until the substrate is flatly pressed on the edge-clamping type rotary chuck.
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| CN201610378204.8A CN107452643B (en) | 2016-05-31 | 2016-05-31 | Substrate flattening apparatus and semiconductor manufacturing method using the same |
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| CN201610378204.8A CN107452643B (en) | 2016-05-31 | 2016-05-31 | Substrate flattening apparatus and semiconductor manufacturing method using the same |
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| CN107452643B true CN107452643B (en) | 2020-11-13 |
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| CN111319967B (en) * | 2018-12-13 | 2022-02-15 | 北京华文永康科技有限公司 | Bowl taking machine |
| CN109746881A (en) * | 2018-12-28 | 2019-05-14 | 深圳市华星光电半导体显示技术有限公司 | Baseplate carrier |
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