CN101728300A - Novel non-vacuum adsorption wafer clamping mechanism - Google Patents
Novel non-vacuum adsorption wafer clamping mechanism Download PDFInfo
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- CN101728300A CN101728300A CN200810228373A CN200810228373A CN101728300A CN 101728300 A CN101728300 A CN 101728300A CN 200810228373 A CN200810228373 A CN 200810228373A CN 200810228373 A CN200810228373 A CN 200810228373A CN 101728300 A CN101728300 A CN 101728300A
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Abstract
The invention relates to a novel non-vacuum adsorption wafer clamping mechanism belonging to the field of semiconductors. The novel non-vacuum adsorption wafer clamping mechanism is a wafer clamping mechanism arranged on semiconductor equipment and used during the rotating and processing of a wafer and especially used in an occasion which needs to protect the central figure area of the wafer and an occasion which can not supply vacuum or is inconvenient to use vacuum adsorption. The wafer clamping mechanism is provided with a mechanism body and a minitype lever mechanism, wherein the periphery of the mechanism body of the wafer clamping mechanism is provided with the minitype lever mechanism used for clamping the wafer to be processed. When a centrifuge rotates at a high speed, the clamping mechanism tightly clamps the wafer without generating the problems of wafter offset and desquamation during high-speed rotation. The wafer clamping mechanism has wide application range, is almost suitable for wafers in all shapes and sizes and only needs to change the position of the minitype lever mechanism and the size and the shape of a base with an annular bottom surface when the size and the shape of the processed wafer are changed.
Description
Affiliated technical field
The present invention relates to semiconductor applications, be specially a kind of novel antivacuum absorption wafer carrier mechanism, in semi-conductor industry, employed wafer-supporting platform when needing rotation processing, when the technological requirement wafer surface can not directly contact with wafer-supporting platform, or when being not easy to vacuum suction is provided, can use structure of the present invention to carry out the clamping of wafer, guarantee that rotation processing can normally carry out.
Background technology
Needs along with the development and the design of semiconductor technology have many arts demands to carry out two-sided even glue developing now, and the process island to wafer when this just requires to process can not contact.The central area of traditional direct contact wafer of vacuum suction mode meeting, therefore in two-sided even glue developing technology, just become inapplicable, this just needs, and design is a kind of not to need vacuum suction, and contact area is little, and contact point will be avoided the fixture of center process island.
Summary of the invention
In order to satisfy the designing requirement of device, need carry out two-sided even glue developing to wafer, this just need can only carry out on small area the clamping operation of wafer.The object of the present invention is to provide a kind of novel antivacuum absorption wafer carrier mechanism, it is not use vacuum, and the mechanism that only on several points of Waffer edge, carries out the clamping operation, this mechanism is contact wafer technology graphics field not, the reliability height skew can not occur and fall situation such as sheet when the centrifuge high speed rotating.
The technical solution adopted for the present invention to solve the technical problems is:
A kind of antivacuum absorption wafer carrier mechanism, this wafer carrier mechanism are provided with mechanism body and miniature Du's linkage, are provided with the miniature leverage that is used to clamp wafer to be processed around the mechanism body of wafer carrier mechanism.
Described wafer to be processed is installed on the mechanism body, and the edge of wafer to be processed contacts with mechanism body, and miniature leverage links to each other with mechanism body by miniature lever support, and miniature leverage and miniature lever support are hinged.
Described mechanism body is the loop configuration that has the bottom surface, and the mechanism body bottom is provided with gyroaxis, and the top inner surface of mechanism body is the ledge structure that is used to hold wafer to be processed.
Described each miniature leverage comprises microgravity bead, miniature lever support, miniature lever, miniature lever is articulated on the miniature lever support, the miniature lever end of pin joint one side is connected with the microgravity bead, and the miniature lever end of pin joint opposite side and wafer to be processed are pressed and touched.
The miniature lever of described pin joint opposite side is the square bar, and the briquetting that is used for clamping wafer to be processed is housed in the end of square bar.
Described miniature leverage is two or more, evenly distributes on mechanism body.
Principle of the present invention is as follows:
The antivacuum absorption wafer carrier mechanism of the present invention has adopted miniature leverage, and when centrifuge rotated, outwards moved the lower end of lever, and the upper end moves inward, and the edge of wafer is tightly pushed down in the upper end of lever.There is a circle planar annular on the surface of mechanism body, adds man-hour, and Waffer edge contacts with annular plain film, and the shape of planar annular is consistent with the wafer outline, and narrower in width, can avoid the center wafer protected field.The microgravity bead produces centrifugal force in the centrifuge rotation, outwards move in the lower end that drives miniature lever construction, regulates the quality of bead, can regulate the centrifugal force of bead when the centrifuge maximum speed, prevents the damage wafer because centrifugal force is excessive.
The invention has the beneficial effects as follows:
1, the present invention can not use vacuum firm being fixed on the rotary centrifuge of wafer.
The centrifugal force that produces when 2, mechanism of the present invention relies on the centrifugal unit high speed rotating is by leverage transmission, fixed wafer.
3, the bead weight that the present invention can the adjustment (adjusting) lever downside is regulated thrust, can be because of the excessive wafer that damages by pressure of the centrifugal force of the too high generation of rotating speed.
Description of drawings
Fig. 1 is a principle schematic of the present invention.
Among the figure, 1: the microgravity bead; 2: miniature lever state when normal centrifuge does not rotate; 3: wafer to be processed; 4: mechanism body; 5: miniature lever support; 6: miniature leverage; 7: miniature lever; 8: briquetting; 9: gyroaxis.
Embodiment
The present invention is further described below in conjunction with drawings and Examples.
As shown in Figure 1, the antivacuum absorption wafer carrier mechanism of the present invention, mainly comprise mechanism body 4 and miniature Du's linkage 6, be provided with the miniature leverage 6 that is used to clamp wafer 3 to be processed around the mechanism body 4 of wafer carrier mechanism, miniature leverage 6 evenly distributes on mechanism body 4.
Described wafer to be processed 3 is installed on the mechanism body 4, and the edge of wafer 3 to be processed contacts with mechanism body 4, and miniature leverage 6 links to each other with mechanism body 4 by miniature lever support 5, and miniature leverage 6 and miniature lever support 5 are hinged.
Described mechanism body 4 is for having the loop configuration of bottom surface, mechanism body 4 bottoms are provided with gyroaxis 9, the centrifugal force that rotation by centrifugal driven by motor gyroaxis 9 produces clamps wafer 3 to be processed, and the top inner surface of mechanism body 4 is the ledge structure that is used to hold wafer 3 to be processed.Add man-hour, a circle planar annular of wafer to be processed 3 edges and mechanism body 4 inner surfaces contacts, and the shape of planar annular is consistent with the wafer outline, and narrower in width, can avoid the center wafer protected field.
Described miniature leverage 6 can be uniform for two or more, each miniature leverage 6 comprises microgravity bead 1, miniature lever support 5, miniature lever 7, miniature lever 7 is articulated on the miniature lever support 5, miniature lever 7 ends (outer end) of pin joint one side are connected with microgravity bead 1, miniature lever 7 ends of pin joint opposite side and wafer to be processed 3 are pressed and are touched, the miniature lever 7 of pin joint opposite side can be the square bar, and the briquetting 8 that is used for clamping wafer 3 to be processed is housed in the end of square bar.
Said " miniature leverage 6 " is high sensitivity mechanism, small power just can change the balance of lever, miniature leverage is meant that lever the first half length is less than 10mm, under the static situation of rotating shaft, the little the first half that overweights of the latter half, when rotary shaft rotating speed during greater than 10 rev/mins, the centrifugal force of generation can lift the latter half of lever, makes lever the first half push down wafer to be processed.
When mechanism body 4 is non-rotary, miniature lever state 2 when microgravity bead 1 and miniature leverage 6 are in normal centrifuge and do not rotate; When mechanism body 4 rotation, microgravity bead 1 produces centrifugal force, 1 outwards motion, because action of centrifugal force, the outside of miniature leverage 6 is lifted, and the inside of miniature leverage 6 is downward, wafer 3 to be processed being pressed on the mechanism body 4 tightly; When the mechanism body 4 miniature leverage 6 in the back miniature lever state 2 when getting back to normal centrifuge and not rotating that stops the rotation, wafer 3 to be processed can be removed, treat the thrust of processed wafer 3 when the quality of adjusting microgravity bead 1 can be regulated maximum speed, prevent because the excessive damage that causes wafer of pressure.
Embodiment result shows, the clamping of wafer when the present invention is applicable to the rotation processed wafer, and the occasion of the center wafer that especially needs protection graphics field, also can use can not provide vacuum or be inconvenient to use the occasion of vacuum suction.Be uniformly distributed with miniature leverage around this fixture, in the centrifuge high speed rotating, tightly clamp wafer, wafer is offset and falls the problem of sheet in the time of can not appearing at high speed rotating.This fixture scope of application is extensive, and the wafer of existing nearly all shape and size can use this fixture.When the wafer size of processing and shape when changing, only need to change the position of miniature leverage, and the size of bottom surface annular base and shape get final product.
Claims (6)
1. antivacuum absorption wafer carrier mechanism, it is characterized in that: this wafer carrier mechanism is provided with mechanism body and miniature Du's linkage, is provided with the miniature leverage that is used to clamp wafer to be processed around the mechanism body of wafer carrier mechanism.
2. according to the described antivacuum absorption wafer carrier mechanism of claim 1, it is characterized in that: described wafer to be processed is installed on the mechanism body, the edge of wafer to be processed contacts with mechanism body, miniature leverage links to each other with mechanism body by miniature lever support, and miniature leverage and miniature lever support are hinged.
3. according to the described antivacuum absorption wafer carrier mechanism of claim 1, it is characterized in that: described mechanism body is the loop configuration that has the bottom surface, the mechanism body bottom is provided with gyroaxis, and the top inner surface of mechanism body is the ledge structure that is used to hold wafer to be processed.
4. according to the described antivacuum absorption wafer carrier mechanism of claim 1, it is characterized in that: each miniature leverage comprises microgravity bead, miniature lever support, miniature lever, miniature lever is articulated on the miniature lever support, the miniature lever end of pin joint one side is connected with the microgravity bead, and the miniature lever end of pin joint opposite side and wafer to be processed are pressed and touched.
5. according to the described antivacuum absorption wafer carrier mechanism of claim 4, it is characterized in that: the miniature lever of described pin joint opposite side is the square bar, and the briquetting that is used for clamping wafer to be processed is housed in the end of square bar.
6. according to the described antivacuum absorption wafer carrier mechanism of claim 4, it is characterized in that: described miniature leverage is two or more, evenly distributes on mechanism body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810228373A CN101728300A (en) | 2008-10-29 | 2008-10-29 | Novel non-vacuum adsorption wafer clamping mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810228373A CN101728300A (en) | 2008-10-29 | 2008-10-29 | Novel non-vacuum adsorption wafer clamping mechanism |
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| Publication Number | Publication Date |
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| CN101728300A true CN101728300A (en) | 2010-06-09 |
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| CN200810228373A Pending CN101728300A (en) | 2008-10-29 | 2008-10-29 | Novel non-vacuum adsorption wafer clamping mechanism |
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Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101882590A (en) * | 2010-07-15 | 2010-11-10 | 南通富士通微电子股份有限公司 | Heating block device |
| CN102270592A (en) * | 2011-01-19 | 2011-12-07 | 沈阳芯源微电子设备有限公司 | Automatic fixing device of square substrate of semiconductor in rotation process |
| CN104551796A (en) * | 2014-12-15 | 2015-04-29 | 苏州欧美克合金工具有限公司 | Cover plate hole centrifugal turning clamp |
| US9227261B2 (en) | 2013-08-06 | 2016-01-05 | Globalfoundries Inc. | Vacuum carriers for substrate bonding |
| CN106466656A (en) * | 2016-08-29 | 2017-03-01 | 贵州玉屏科创互联生产力促进中心 | There is Oil press, the grease processing technique of operation module |
| CN106467858A (en) * | 2016-08-29 | 2017-03-01 | 贵州玉屏科创互联生产力促进中心 | Oil manufacture machine containing indicating module, fat processing method |
| CN106466657A (en) * | 2016-08-29 | 2017-03-01 | 贵州玉屏科创互联生产力促进中心 | Comprise new-type Oil press, the fat processing method of solenoid valve driving module |
| CN106467859A (en) * | 2016-08-30 | 2017-03-01 | 贵州省玉屏县金心笛油脂开发有限公司 | There is oil manufacture machine, the fat processing method of solenoid valve driving module and operation module |
| CN106475233A (en) * | 2016-08-29 | 2017-03-08 | 贵州玉屏科创互联生产力促进中心 | Include new-type oil manufacture machine, the oil expression method of solenoid valve driving module |
| CN106475231A (en) * | 2016-08-29 | 2017-03-08 | 贵州玉屏科创互联生产力促进中心 | New-type Oil press containing operation module, fat processing method |
| CN106479670A (en) * | 2016-08-29 | 2017-03-08 | 贵州省玉屏县金心笛油脂开发有限公司 | Oil press, grease processing technique |
| CN106475232A (en) * | 2016-08-29 | 2017-03-08 | 贵州玉屏科创互联生产力促进中心 | Include automatization's Oil press, the oil expression method of solenoid valve driving module |
| CN106475230A (en) * | 2016-08-29 | 2017-03-08 | 贵州省玉屏县金心笛油脂开发有限公司 | Oil equipment, milling process |
| CN106622682A (en) * | 2016-08-29 | 2017-05-10 | 贵州省玉屏县金心笛油脂开发有限公司 | Automatic oil manufacturing device and process |
| CN106622683A (en) * | 2016-08-29 | 2017-05-10 | 贵州省玉屏县金心笛油脂开发有限公司 | Automatic oil extraction facility and technology |
| CN106622684A (en) * | 2016-08-29 | 2017-05-10 | 贵州省玉屏县金心笛油脂开发有限公司 | Automatic oil pressing equipment and oil pressing process |
| CN106635399A (en) * | 2016-08-29 | 2017-05-10 | 贵州玉屏科创互联生产力促进中心 | Oil extracting facility comprising operation module and grease process |
| CN107243418A (en) * | 2016-08-29 | 2017-10-13 | 贵州玉屏科创互联生产力促进中心 | Oil manufacture machine, fat processing method containing operation module |
| CN109967480A (en) * | 2018-12-03 | 2019-07-05 | 杭州众硅电子科技有限公司 | It is a kind of for drying the fastening structure of wafer |
-
2008
- 2008-10-29 CN CN200810228373A patent/CN101728300A/en active Pending
Cited By (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101882590A (en) * | 2010-07-15 | 2010-11-10 | 南通富士通微电子股份有限公司 | Heating block device |
| CN101882590B (en) * | 2010-07-15 | 2013-01-09 | 南通富士通微电子股份有限公司 | Heating block device |
| CN102270592A (en) * | 2011-01-19 | 2011-12-07 | 沈阳芯源微电子设备有限公司 | Automatic fixing device of square substrate of semiconductor in rotation process |
| US9227261B2 (en) | 2013-08-06 | 2016-01-05 | Globalfoundries Inc. | Vacuum carriers for substrate bonding |
| CN104551796A (en) * | 2014-12-15 | 2015-04-29 | 苏州欧美克合金工具有限公司 | Cover plate hole centrifugal turning clamp |
| CN106475231A (en) * | 2016-08-29 | 2017-03-08 | 贵州玉屏科创互联生产力促进中心 | New-type Oil press containing operation module, fat processing method |
| CN106475232A (en) * | 2016-08-29 | 2017-03-08 | 贵州玉屏科创互联生产力促进中心 | Include automatization's Oil press, the oil expression method of solenoid valve driving module |
| CN106466657A (en) * | 2016-08-29 | 2017-03-01 | 贵州玉屏科创互联生产力促进中心 | Comprise new-type Oil press, the fat processing method of solenoid valve driving module |
| CN107243418A (en) * | 2016-08-29 | 2017-10-13 | 贵州玉屏科创互联生产力促进中心 | Oil manufacture machine, fat processing method containing operation module |
| CN106475233A (en) * | 2016-08-29 | 2017-03-08 | 贵州玉屏科创互联生产力促进中心 | Include new-type oil manufacture machine, the oil expression method of solenoid valve driving module |
| CN106466656A (en) * | 2016-08-29 | 2017-03-01 | 贵州玉屏科创互联生产力促进中心 | There is Oil press, the grease processing technique of operation module |
| CN106479670A (en) * | 2016-08-29 | 2017-03-08 | 贵州省玉屏县金心笛油脂开发有限公司 | Oil press, grease processing technique |
| CN106467858A (en) * | 2016-08-29 | 2017-03-01 | 贵州玉屏科创互联生产力促进中心 | Oil manufacture machine containing indicating module, fat processing method |
| CN106475230A (en) * | 2016-08-29 | 2017-03-08 | 贵州省玉屏县金心笛油脂开发有限公司 | Oil equipment, milling process |
| CN106622682A (en) * | 2016-08-29 | 2017-05-10 | 贵州省玉屏县金心笛油脂开发有限公司 | Automatic oil manufacturing device and process |
| CN106622683A (en) * | 2016-08-29 | 2017-05-10 | 贵州省玉屏县金心笛油脂开发有限公司 | Automatic oil extraction facility and technology |
| CN106622684A (en) * | 2016-08-29 | 2017-05-10 | 贵州省玉屏县金心笛油脂开发有限公司 | Automatic oil pressing equipment and oil pressing process |
| CN106635399A (en) * | 2016-08-29 | 2017-05-10 | 贵州玉屏科创互联生产力促进中心 | Oil extracting facility comprising operation module and grease process |
| CN106467859A (en) * | 2016-08-30 | 2017-03-01 | 贵州省玉屏县金心笛油脂开发有限公司 | There is oil manufacture machine, the fat processing method of solenoid valve driving module and operation module |
| CN109967480A (en) * | 2018-12-03 | 2019-07-05 | 杭州众硅电子科技有限公司 | It is a kind of for drying the fastening structure of wafer |
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Open date: 20100609 |