JPS5853887A - Method of mounting leadless electronic part on printed board or the like - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for bonding and attaching a chip-shaped glue-less electronic component having no lead wires to a desired position on a printed circuit board or the like.

When attaching a leadless electronic component to a printed circuit board or the like to form an electronic circuit, first attach the leadless electronic component to the desired position on the printed circuit board using adhesive, and then attach the electrodes of the leadless electronic component to the printed circuit board. It is common to solder a printed circuit that has already been formed on the board.

To do this, conventionally, a predetermined amount of adhesive is dotted on the printed circuit board at the location where the electronic components are to be attached.
It has been widely practiced to press and bond electronic components onto these adhesives. However, devices that apply adhesive to predetermined positions on printed circuit boards generally have drawbacks such as having a complicated structure or requiring a large amount of time to change setups when changing products. have. Furthermore, in addition to the station for bonding electronic components to the printed circuit board, a station for applying adhesive to the printed circuit board is required, which has the disadvantage that the entire apparatus cannot be configured compactly.

Therefore, as disclosed in Japanese Unexamined Patent Publication No. 56-66095, it was considered to apply adhesive to leadless electronic components instead of to printed circuit boards.

In other words, multiple leadless electronic components are housed in a magazine and adhesive is applied to them all at once.The magazine is then attached to a component mounting head and the relative position between the magazine and the printed circuit board is changed. While
The leadless electronic components inside the magazine are glued to the printed circuit board.

Although this makes the entire device considerably smaller, it still requires a station to apply adhesive to the leadless electronic components housed in the magazine, so the reality is that it is still not sufficient. .

Against this background, the present invention was made with the aim of further reducing the space required for applying adhesive, and the gist of the present invention is to attach leadless electronic components to printed circuit boards, etc. 1 to install on
After each electronic component is held in a chuck device, adhesive is dotted onto each held electronic component one by one, and after that, the electronic components are simply glued to the printed circuit board without being transferred. It is in.

In this way, it is only necessary to dispose a small adhesive spotting device in the middle of the movement path of the chuck device, and the entire device can be made significantly smaller than conventional ones. Furthermore, in a device that uses a chuck device to attach electronic components one by one to a printed circuit board, etc., it is common to perform the process of holding the electronic components in the chuck device and the process of attaching the electronic components to the printed circuit board at the same time and in parallel. However, it is possible to carry out an adhesive spotting process in parallel with these processes, and in this case there is no reduction in work efficiency due to dotting adhesive on each electronic component one by one. do not have. Also,
If the electronic components to be attached have different sizes, it is possible to apply an appropriate amount of adhesive to each electronic component.

Embodiments of the present invention will be described in detail below based on the drawings.

1 and 2 are external views of the electronic component mounting device.

In the figure, 2 is a bed, and a printed circuit board positioning device 4 is disposed on the bed 2. The printed circuit board positioning device 4 includes a pulse motor 6 and a pulse motor 8.
The holding plate 12 is moved in two mutually orthogonal axes directions by a motor and rotated around a vertical axis by a pulse motor 10, and a printed circuit board attached to this holding plate 12 is positioned at a predetermined position. However, since it is well known, detailed explanation will be omitted.

A main frame 14 is erected upward from the rear of the bed 2, and the head of the main frame 14 is bent at a right angle and extends above the printed circuit board positioning device 4. This main frame 14 incorporates the main mechanism of this device, which will be described in detail later, and the power for this main mechanism is transmitted from an electric motor 16 provided in the vertical part of the main frame 14 via a chino 18. The signal is transmitted to the intermediate shaft 20 , and from the intermediate shaft 20 to the input shaft 24 by the chino 22 . The electronic components to be mounted are arranged in the mounting order on one side edge of a plurality of pallets 26 that are pushed in a line by a pushing device (not shown), and are spaced intermittently by one pitch, that is, the distance between adjacent electronic components. This conveying device is described in detail in Japanese Patent Application No. 114.274/1982, and is not directly related to the present invention. Explanation will be omitted.

The main mechanical parts of this electronic component mounting device are shown in enlarged scale in FIGS. 3 and 4. In FIG. 8, a three-dimensional cam 82 having a cam groove 80 formed on the outer peripheral surface of a cylinder is fixed to the main frame 14, and this three-dimensional cam 32 has a hollow rotating shaft 36 with a disk portion 84 at the upper end. It is rotatably mounted via a bearing. Eight rollers 38 are attached to the disk portion 34 at equal angular intervals, and these rollers 38 are connected to the input shaft 24.
When the input shaft 24 rotates at a constant speed, the rotating shaft 86 is intermittently rotated by 1/8 rotation.

A rotating disk 42 is fixed to the lower end of the rotating shaft 36, and eight bushings 44 are arranged on this rotating disk 42 at equal angular intervals. A hollow ring 46 is inserted into each of these bushings 44 so as to be slidable in a direction closely parallel to the rotating shaft 36. A bracket 4 is attached to the upper end of each hollow iron 46.
Rollers 50 are attached via 8, and these rollers 50 are fitted into the cam grooves 30 of the three-dimensional cam 32. The cam groove 30 moves the hollow rond 46 from the highest position (retracted position) shown on the left side in FIG. 3 to the lowest position (forward position) shown on the right side while the rotary disk 42 makes half a rotation.
It is formed so that it can be moved in the axial direction up to.

A chuck 52 is attached to the lower end of each of the hollow rods 46. This chuck 52 is shown enlarged in FIGS. 5 and 6. A chuck mounting plate 54 is fixed to the lower end of the hollow rod 46, a cup-shaped member 56 is fixed to this chuck mounting plate 54 with bolts 58, and a chuck main body 60 is fixed to this cup-shaped member 56 with bolts 62. There is. A slot 64 is formed along the diameter at the lower end of the chuck body 60 as shown in FIG. There is. As is clear from FIG. 5, the claw 66 is provided with inward protrusions 70 facing each other at its lower end for gripping a leadless electronic component (hereinafter simply referred to as a chip) 69, and is provided with a tapered surface 72 on its back surface. . The tapered surface 72 is formed to form a part of a conical surface whose diameter increases toward the bottom.

A sleeve 74 is slidably fitted on the outside of the chuck body 60. This sleeve 74 is formed with a carefully parallel elongated hole 76, and a bottle 78 is fixed to the chuck body 60 by passing through this elongated hole.
4 is prevented from rotating, and the amount of movement in the axial direction is restricted to below a certain limit. The sleeve 74 has a tapered surface 80 on the inside of its lower end that corresponds to the tapered surface 72 of the claw 66.
and is biased downward (towards the tip of the chuck 52) by a coil spring 82, biasing the claw 66 in the direction of closing. When this sleeve 74 is pulled upwards by engaging a release member 86 with a 7 flange 84 formed at its upper end, the fill spring 82
is raised against the urging force of A coil spring 88 is disposed between a portion of the claw 66 above the pin 68 and the sleeve 74, and biases the claw 66 in the opening direction. Therefore, if sleeve 74 is raised, pawl 66
will open.

An elevating rod 90 is inserted into the hollow portion of the hollow rod 46 . A cylindrical member 92 is provided at the lower end of the lifting rod 90.
are fitted and fixed by pins 94. A through hole 96 passing through the center of the cylindrical member 92 is a stepped hole with a small diameter hole 98 at the lower end, and a suction tool 100 is slidably fitted into the small diameter hole 98 and a coil spring 1 is inserted into the small diameter hole 98.
It is urged downward by 02. Therefore, when the elevator 90 is lowered, the suction tool 100 has a pair of claws 660.
It will be made to stick out from between. This suction tool 100 has a head 104 with a slightly large diameter at the upper end, and a two-chamfered part 1 at the bottom.
06, which is prevented from protruding beyond a certain limit by the head 104 from the cylindrical member 92, and has two chamfered portions 1.
06 is prevented from rotating by being engaged with two anti-rotation plates 108 fixed to the lower end surface of the chuck body 60. A protrusion 110 that is thinner than the outer shape of the chip 69 to be sucked is protruded from the lower end of the double-chamfered portion 106, and two suction ports 114 are formed on the end surface 112 of this protrusion 110, as shown in FIG. ing.

The suction port 114 is communicated with the through hole 96 of the cylindrical member 92 through a passage 116 that runs vertically through the suction tool 100 . The through hole 96 includes a communication hole 118 formed in the radial direction of the cylindrical member 92, and an annular gap 12 formed between the cylindrical member 92, the chuck body 60, and the cup-shaped member 56.
0, as well as to the base 124 through a port 122 formed in the radial direction of the cup-shaped member 56.

As is clear from FIG. 3, the release member 86 for raising the sleeve 74 of the chuck 52 is a member having two arms extending in opposite directions at different height positions. It is fixed to the lower end of a lifting rod 126 that is slidably inserted into the hollow portion of the shaft 36. The upper end of the lifting iron 126 is connected to a connecting rod 128 and a bottle 18.
0.182 to one arm of lever 184. The lever 184 is rotatably supported by a shaft 136 fixed to the body frame 14, as best shown in FIG. is installed. The lever 134 is urged by a spring (not shown) to rotate counterclockwise in FIG. 8, and this urging force causes the roller to move toward the plate cam 188 (see FIG. 4) fixed to the input shaft 24. are in constant contact with. Therefore, as the plate cam 138 is rotated by the input shaft 24, the lever 134 is rotated by the shaft 136.
The rotary release member 86 is raised and lowered around the chuck 52 to grip and release the chip 69.

On the other hand, as is clear from FIG. 3, the lifting rod 90 for lifting and lowering the suction tool 100 of the chuck 52 is constantly urged upward by a spring 140, and has an engaging member 142 fixed to its upper end. . This engaging member 1
42 is a shaft 144 that is fixed to the main frame 14 when the chuck 52 is at the highest position as shown on the left side of FIG.
It engages with an engagement notch 148 in one arm of a lever 146 which is rotatably supported by. Chuck 5 again
2 is in its lowest position as shown on the right side of FIG. It engages with the engagement notch 154 of. The other arms of the levers 146 and 152 are connected to the levers 160 and 1 by connecting rods 156 and 158, respectively.
It is connected to one arm of 62. The lever 160 is rotatably supported by a shaft 164 fixed to the main frame 14, and a roller 168 is attached to the other arm via a bracket 166. The lever 160 is urged by a spring 176 to rotate clockwise in FIG. 3, and this urging force causes the roller 168 to contact the plate cam 172 fixed to the input shaft 24. The lever 162 is also rotatably supported by a shaft 136 and biased counterclockwise by a spring 174, and a roller 178 attached via a bracket 176 is connected to a plate cam 180 (FIG. 4) fixed to the input shaft 24. (see ) are kept in constant contact.

Further, the cap 124, which is communicated with the suction port 114 of the suction tool 100, is connected to a joint member 184 fixed to the rotary disk 42 by a hose 182 whose position is only shown by a two-dot chain line in FIG. .

As shown in FIG. 8, the rotary disk 42 is provided with eight through holes 186 that communicate with each joint member 184.
An annular member 188 is brought into close contact with the two through-holes 186 formed therein. The annular member 188 is pressed against the rotary disk 42 by a spring 190 and is fixed to the main frame 14. The annular member 188 is prevented from rotating together with the rotary disk 42 by a bolt 192.Three cap mounting holes 194, .

The caps attached to these cap mounting holes are connected to the vacuum device independently from each other, and while negative pressure is constantly supplied to the cap mounting hole 196 during device operation, the caps attached to the cap mounting holes 194 and Negative pressure is supplied to each of the caps 198 at a predetermined time, and positive pressure is also applied to the cap mounting hole 198 at a predetermined time. The cap mounting hole 196 is a groove 200 formed in the annular member 188.
This communicates with through holes 186 corresponding to the plurality of chucks 52 that move between the component receiving position indicated by A and the component mounting position indicated by B in FIG.

At the component receiving position A, the chuck 52 that has received the chip 69 is moved intermittently by a distance corresponding to 1/8 rotation of the rotary disk 42 until it reaches the component mounting position B. A component position correction device 202 as shown in FIG. 9 is provided at the exact center of the . That is, when the chip 69 is gripped by the pair of claws 66 of the chuck 52 as described above, it is positioned so that the center of the longitudinal direction coincides with the center of the suction tool 100, but the positioning of the chip 69 in the width direction is still difficult. Since this is not done, the center in the width direction can be made to coincide with the center of the suction tool 100 by the component position correction device 202.

The component position correction device 202 is supported by a bracket 204 fixed to the main frame 14.

A block member 206 is fixed on the bracket 204 as shown in FIG.
6 are formed with mutually orthogonal rectangular grooves 208 and 210. A pair of sliders 212 and 21 are provided in the rectangular groove 208.
4 are slidably fitted together and prevented from floating by a plate 215, and are further urged toward each other by a spring 216. These sliders 2
One positioning pawl 218 is attached to the top surface of each of the tips 12 and 214, facing each other. On the other hand, a rod-shaped cam member 220 is slidably fitted into the rectangular groove 210, and is prevented from floating by the plate 215. A pin 222 is provided upright on the side surface of the end portion of the cam member 240, and an engagement groove 226 formed at one end of a lever 224 as shown in FIG. 11 is engaged with this pin 222. The lever 224 has its central part attached to the support shaft 2.
The spring 2 is rotatably supported by the spring 28.
80 to rotate counterclockwise in FIG. . Thus, when cam 282 is rotated by shaft 234, lever 224 pivots about support shaft 228, causing cam member 220 to move longitudinally. The support shaft 228 is erected on a bracket (not shown) fixed to the main frame 14, and one end of the suspension ring 230 is also supported by the same bracket. Further, the shaft 234 is also rotatably supported by the same bracket, and the input shaft 234 is
It is designed to be rotationally driven by a gear 236 (see FIG. 4) fixed to. As is clear from FIG. 9, both side surfaces of the tip of the cam member 220 are inclined at the same angle with respect to the center line of the cam member 220 to form a cam surface 238. The tip surface is also inclined to correspond to this. Therefore, when the cam member 220 is moved forward, the slider 212,
214 is moved backward against the biasing force of the spring 216, and the interval between the positioning pawls 218 becomes wider, and conversely, when the cam member 220 is moved backward, the slider 212°2
14 is advanced by the biasing force of the spring 216, and the positioning claws 218 are brought closer to each other. As a result, the chip 69 held by the claws 66 of the chuck 52 is held between the pair of positioning claws 218, but these positioning claws 218 are always held by the cam member 2.
Since the tip 69 is moved symmetrically with respect to the center line of the tip 20, the center of the tip 69 in the width direction can be accurately aligned with the center of the suction tool 100.

The component position correction device 202 is provided with a chuck error detection device 240 for detecting a chuck error of the chip 69 by the chuck 52. That is, a small-diameter rod 242 is erected on the rear end surface of the slider 214, and the tip of the rod 242 is deeply chamfered to form a plate-like protrusion 244. On both sides of this plate-shaped projection 244, a photoelectric detector 252 is provided with a light emitter 248 and a light receiver 250 fixed to a bracket 246.
is installed. When the chip 69 is gripped by the chuck 52, the positioning claws 218 will pinch the chip 69 from both sides as the cam member 220 retreats.
When the chip 69 is not gripped by the chuck 52,
The positioning claw 218 moves further forward and the protrusion 1 of the suction tool 100
10 itself. Therefore, the amount of advance of the slider 214 in this case is greater than when the chip 69 is held by the chuck 52, and the plate-shaped protrusion 244 fixed to the slider 214 moves from the light emitter 248 of the photoelectric detector 252 to the light receiver 262. The light receiver 250 receives the light from the path of the light. The photoreceiver 250 then generates a chuck misdetection signal, which signal is provided to a blocking device to prevent activation of the adhesive spotting device.

This point will be explained in detail later.

In this manner, adhesive is applied to the chip 69 whose position has been corrected at the component position correction position C at the next adhesive application position. Adhesive spotting device 260 for that purpose
is the same bracket 20 as the above component position correction device 202.
It is located on 4. Another bracket 262 is mounted on the bracket 204, and a support shaft 264 is fixed to this bracket 262 with a nut 265. A dispenser arm 266 is rotatably supported on the support shaft 264, and one end of the dispenser arm 266 is connected to one arm of a lever 270 shown in FIG. 4 by a connecting rod 268'. ing. The lever 270 is rotatably supported by a shaft 136, and a roller attached to the other arm of the lever 270G is constantly engaged with a plate cam 272 fixed to the input shaft 24 by a spring (both not shown). I'm forced to. Therefore, when the plate cam 272 rotates with the rotation of the input shaft 24, the lever 270 is rotated around the shaft 136, and the dispenser arm 266 is rotated around the support shaft 264 via the connecting rod 268. It turns out.

A dispenser 274 is attached to the tip of the dispenser arm 266. The dispenser 274 is
As shown in Figures 12 and 18, there are two needles 2 at the tip.
76, and this dispenser 276 is used to apply the adhesive onto the chip 69.
4 is supplied through an adhesive supply channel 278 formed in the dispenser arm 266, that is, the adhesive supply channel 278 is formed longitudinally through the dispenser arm 266, as shown in FIG. An adhesive supply hose 280 is connected to this adhesive supply path 278.
A controlled amount of adhesive is supplied by a solenoid valve 282. The solenoid valve 282 is of a type that can be opened and closed at a high frequency of 10 to 20 times per second, and by controlling the number of times it operates according to the size of the tip 69 to which adhesive is to be applied, it can be opened and closed at a high frequency of 10 to 20 times per second. An appropriate amount of adhesive can be applied to each chip of different sizes.

The adhesive spotting device 260 normally operates as described above, but if the aforementioned chuck error detection device 240 detects that the chip 69 is not gripped by the chuck 52, the adhesive spotting device 260 operates as shown in FIG. Blocking device 2 as shown in
90 prevents operation. The arrangement position of this blocking device 290 is shown in FIG. 4, and its details are shown in FIG. 14. The blocking device 290 includes a cylindrical member 292 fixed to the main frame 14 , and a stopper member 296 is rotatably attached to a flat portion 294 formed at the tip of the cylindrical member 292 by a stepped screw 298 . The stopper member 296 is fixed to the flat part 294 by the spring 800.
It is maintained at a position in contact with a stopper pin 302 erected. The stopper member 2'16 also includes a solenoid 304 as an actuator for rotating the stopper member 296 against the biasing force of the spring 800.
6, and when the solenoid 304 is energized based on the chuck error detection signal, the stopper member 296 rotates to the position shown by the two-dot chain line in FIG. 14, and engages with the lever 270. It is designed to prevent its rotation.

The lever 270 includes an arm receiving the driving force from the plate cam 272 and an arm transmitting the driving force to the dispenser arm 266 via the connecting rod 268, as well as a stopper member 29.
6, and a stopper bolt (not shown) screwed into this arm is connected to the stopper member 2.
96.

A method for attaching the chip 69 to a printed circuit board using the apparatus configured as described above will be described below. The description will be made assuming that the printed circuit board has already been mounted on the holding board 12, the chips 69 to be mounted on the printed circuit board are supplied in order by the pallet 26, and that the mounting operation is in a steady state.

In FIG. 3, when the input shaft 24 is rotated at a constant speed, the rotary disk 42 is rotated intermittently by 178 rotations. ′
While the turntable 42 is rotating, the levers 184, 146,
152, 160, 162 and 270 are all stationary in the position shown in FIG. The rotary disk 42 is stopped when one of the eight chucks 52 reaches the component receiving position A2, the component position correction position C2, the adhesive spotting position, and the component mounting position B, respectively. At this time, the lifting rod 90 of the chuck 52 is located at the parts receiving position A and the parts mounting position B.
An engaging member 142 fixed to the upper end of each lever 1
46 and 152 into engagement notches 148 and 154.

When the input shaft 24 further rotates, the lever 184 engaged with the plate cam 188 rotates, and the elevating rod 126 and the release member 86 are raised. The release member 86 is raised (and the sleeve 74 is raised, and as a result the mold 66 is opened by the biasing force of the coil spring 88. Then, the lever 1 engaged with the plate cams 172 and 180, respectively) is opened.
60 and 162 rotate, the lifting rod 90 is lowered, the cylindrical member 92 and the suction tool 100 are lowered, and the suction tool 100 is made to protrude from between the open claws 66. Suction tool 10 of chuck 52 at component receiving position A
0 comes into contact with the chips 69 arranged on the pallet 26 in the mounting order. Even after the suction tool 100 contacts the chip 69, the elevating rod 90 and the cylindrical member 92
moves downward while compressing the coil spring 102, and the suction tool 100 is pressed against the chip 69 with a force equal to the biasing force of the coil spring 102.

After the chuck 52 is positioned at the parts receiving position A,
Since negative pressure is applied to the cap (not shown) attached to the cap mounting hole 194 by switching the valve (not shown), if the suction tool 100 is pressed against the chip C, the chip 6
9 is in a state where it is adsorbed by the suction tool lOO due to negative pressure. On the other hand, in the chuck 52 stopped at the component mounting position B, the chip 69 is pressed and bonded to a predetermined position on the printed circuit board on the positioning device 4 in parallel with the above operation.

As the input shaft 24 continues to rotate, the elevating rod 90 is raised. As a result, the chuck 52 is located at the parts receiving position A.
, the suction tool 100 suctions the chip 69 and ascends, but when the chuck 52 is located at the component mounting position B, the suction tool 100 ascends leaving the chip 69 on the printed circuit board. Immediately after the suction tool 100 descends and presses the chip 69 against the printed circuit board, the pulp connected to the cap mounting hole 198 is switched, the supply of negative pressure is cut off, and positive pressure is supplied instead. It is. Note that the positive pressure is supplied to quickly eliminate the negative pressure acting on the suction tool 100, and if a long cycle time is acceptable, the cap mounting hole 198 may only be opened to the atmosphere. .

If the input shaft 24 rotates further, the release member 86 will move to the lower surface 7.
Contact 2. From this state, the sleeve 74 is further lowered, and the pawls 66 are closed against the biasing force of the coil spring 88 by the action of the tenor surfaces 72), and the parts receiving position A
The chuck 52 located at the chin 1690 contacts both end surfaces of the chin 1690 and pinches it. In this case, the sleeve 74 is the chuck body 6.
0 with high precision, the claws 66 are always closed while maintaining a symmetrical state with respect to the center line of the suction tool 100. Therefore, even if the position at which the chip 69 is picked up by the suction tool 100 is slightly shifted by l/) in the chip's longitudinal direction, the claw 66 corrects this positional shift and then picks the chip. Note that since the clamping force is uniquely determined by the biasing force of the coil spring 82, there is no risk that the chip 69 will be damaged by excessive clamping force.

In parallel to the above-described operations performed at the component receiving position A and component mounting position B, the following operations are performed at the component position correction position C. When one of the eight chucks 52 is stopped at the component position correction position C, the cam 232 and the lever 224
As a result of this action, the cam member 220 in the forward position is once retracted and then returned to its original position. As a result, the sliders 212 and 214 are allowed to approach each other, and the positioning claws 21 fixed to these sliders
8 pinches the chip 69 held by the chuck 52 from both sides. As a result, the center of the chip 69 in the width direction is made to coincide with the center of the suction tool 100. chip 69
Since the longitudinal center of the chip 69 has already been aligned with the center of the suction tool 100 by the claw 66 of the chuck 52, the center of the chip 69 is completely aligned with the center of the suction tool 100 by the above operation.
This is Ω which will be made to coincide with the center of 0.

In parallel with the above operations being carried out at the component position correction position C, at the adhesive spotting position,
The following operations are performed. When the chuck 52 holding the chip 69 is stopped at this position, the cam 27
2. By the action of the lever 270 and the connecting body 268, the dispenser/serve arm 266 is rotated, and the needle 276 of the dispenser 274 attached to the tip thereof comes into contact with the tip 69. Since a predetermined amount of adhesive has been blown out on the end surface of this needle 276 after the previous adhesive spotting operation, this adhesive is dotted onto the tip 69 as shown in FIGS. 15 and 16. It will be worn. Note that the adhesive 277 is applied in such a state because when the chip 69 is pressed against the printed circuit board, part of the adhesive 277 protrudes to both sides of the chip 69, and the electrode part 810 of the chip 69 is
This is to prevent it from adhering to. When the adhesive 27-7 that has come off to both sides of the chip 69 is later irradiated with ultraviolet rays, it quickly hardens and fixes the chip 69 to the printed circuit board. It also has the effect of curing the adhesive 277 interposed between the substrate and the printed circuit board.

After the above operations at each position A, -B, C, and D are completed, even if the input shaft 24 further rotates, the lever 184,
146, 152, 160, 162, and 270 no longer rotate and remain stationary in the position shown in FIG. 8, and the rotary disk 42 starts rotating instead.

When the rotary disk 42 starts rotating, the through hole 186 comes off from the cap mounting hole 194 and the supply of negative pressure is momentarily cut off.
Since negative pressure is supplied from the cap mounting hole 196 in communication with the groove 200 during instant contact, there is no fear that the chip 69 will separate from the suction tool 100.

After the turntable 42 has rotated 1/8, and the pallet 26 has moved one pitch of the chips 69, they are stopped, and the operations detailed above are repeated, and the chips 69 are delivered one by one to the component receiving position A. The component is then transported to the component mounting position B and bonded to a predetermined portion of the printed circuit board.

The above is an explanation of the normal operation of the chuck 52 without chucking the chip 69, but if for some reason the chuck 52 reaches the component position correction position C without holding the chip 69, Since the positioning claws 218 do not pinch the chip 69 but instead pinch the protrusion 110 of the suction tool 100, the slider 214 is allowed to move forward a larger distance than usual. As a result, slider 214
A plate-like protrusion 244 formed integrally with the photoelectric detector 2
In order to move to a position where the light of 52 is not blocked, the chuck error detection device 240 issues a chuck error detection signal.

This signal is sent to the solenoid 304 of the blocking device 290 shown in FIG.
Rotate it to the position shown by the two-dot chain line. As a result, shi/<
The stopper bolt screwed onto the -270 arm is
Since the stopper member 296 comes into contact with the stopper member 296, regardless of the rotation of the plate cam 272 shown in FIG.
will not rotate. Therefore, the dispenser arm 266 also does not rotate, and the adhesive is prevented from being spotted on the end surface 112 and the suction port 114 of the suction tool 100 that does not grip the chip 69. Note that the chuck error detection signal is also sent to the control device that controls the entire device to stop the entire device, but since it takes a certain amount of time from detecting a chuck error to stopping the device. During this time, a blocking device 290 is provided to prevent the adhesive from being applied to the suction tool 100.

In the embodiment described in detail above, the dispenser 274 was equipped with two needles 276, but instead of this, one needle with a flat cross-sectional shape is used, and the 17th
It is also possible to apply the adhesive 312 in the state shown in the figure and FIG. 18. Furthermore, when a thermosetting adhesive is used instead of an ultraviolet curable adhesive as in the above embodiment, the adhesive is not necessarily applied to the chip 6.
There is no need to let the adhesive protrude to both sides of chip 6.
You may place only one point in the center of the number 9. Therefore, in this case, instead of the chuck 52, the
It is also possible to use a chuck of the type disclosed in No. 4, in which two pairs of claws grip the chip 69 from mutually orthogonal directions.

Further, in the embodiment, one dispenser 27
4, an appropriate amount of adhesive is applied to each chip 69 having a plurality of different sizes, but one dispenser is disposed at each of a plurality of chuck stop positions, and each The amount of adhesive supplied from each dispenser is constant, and the appropriate tip 6 is used for each dispenser.
By activating the dispenser only when the chuck holding the tip 9 stops at the dispenser position, it is also possible to apply the appropriate amount of adhesive to multiple types of chips with different sizes. It is. Furthermore, the adhesive spotting position is one, and a plurality of dispensers are arranged for that one spotting position, and a dispenser suitable for each of the chips 69 conveyed to the adhesive spotting position is provided. It is also possible to selectively operate the controller to apply an appropriate amount of adhesive to each chip 69 having a plurality of different sizes. .

Furthermore, the present invention can also be applied to an electronic component mounting device that has a different structure from the electronic component mounting device used in the above embodiments, and other examples may not be given in detail. It goes without saying that the present invention can be implemented in various modified forms without departing from the spirit of the invention.

[Brief explanation of the drawing]

FIG. 1 is a plan view of a mounting device for re-dressing electronic components that is preferably used in carrying out the present invention, and FIG. 2 is a front view of the same device. FIG. 3 is a side sectional view of the main part of the apparatus shown in FIGS. 1 and 2, and FIG. 4 is a plan sectional view of the main part. FIG. 5 is a vertical cross-sectional view of the chuck in the same device, FIG. 6 is a Vl-Vl cross-sectional view in FIG. 5, and FIG.
The figure is also an enlarged view of the bottom of the main part. FIG. 8 is a sectional view taken along the line ■-■ in FIG. 3. Figure 9 is similar to Figures 1 and 2.
FIG. 2 is a plan view of a component position correction device, a chuck error detection device, and an adhesive spotting device that are installed in the device shown in the figure. Figure 1θ is an X-/X cross-sectional view in Figure 9, and
FIG. 1 is a view taken in the direction of the ■ arrow in FIG. 9. Figure 12 is the 9th
13 is an enlarged cross-sectional view of the main part in FIG. 12. FIG. 14 is a front view of the blocking device installed in the apparatus of FIGS. 1 and 2. 1st
5 and 16 are views showing an example of how adhesive is applied to leadless electronic components, and FIGS. 17 and 18
The figure also shows another example. 4 Niblint board positioning device 12: Holding plate 26: Pallet 52: Chuck 66: Claw 69: Chip 100: Suction tool 114: Suction port 202: Component position correction device 240: Chuck error detection device 260: Glue spotting device 266: Dispenser arm 274: Dispenser 276 Two needles 277: Adhesive 282: Solenoid valve 290: Blocking device 296: Stopper member 804: Solenoid Applicant: Fuji Machine Manufacturing Co., Ltd. 6th sentence @7 7z uα ] 4 Fig. 15 @ 16 Fig. 31 ( 'a17 Fig. 18 Fig. 13: Fig. 14 14 ) 270 136 ↓ 94 2 barrels〈 98 〉296 06

Claims (3)

[Claims] (1) A step of holding leadless electronic components one by one in a chuck device, a step of dotting adhesive on each of the held leadless electronic components one by one, and a step of dotting the leadless electronic components onto which the adhesive has been dotted. The method includes the step of bringing the chuck device holding an electronic component close to a member to be bonded such as a printed circuit board, and pressing and bonding the leadless electronic component to a desired position of the member to be bonded. How to attach parts to printed circuit boards, etc. (2) A plurality of the chuck devices are arranged at equal intervals and are intermittently moved by a distance equal to the distance, and the three steps are performed in parallel at each stop position of the chuck device. The first claim is
Installation method described in section. (3) The leadless electronic components are of a plurality of different sizes, and the amount of adhesive spotted in the adhesive spotting step can be changed according to the size of each electronic component. An attachment method according to claim 1 or 2.